WO1986006243A1 - Process for the closing up of drill holes provided for in a printed circuit board - Google Patents

Process for the closing up of drill holes provided for in a printed circuit board Download PDF

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Publication number
WO1986006243A1
WO1986006243A1 PCT/DE1986/000165 DE8600165W WO8606243A1 WO 1986006243 A1 WO1986006243 A1 WO 1986006243A1 DE 8600165 W DE8600165 W DE 8600165W WO 8606243 A1 WO8606243 A1 WO 8606243A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
holes
printed circuit
mask
solder resist
Prior art date
Application number
PCT/DE1986/000165
Other languages
German (de)
French (fr)
Inventor
Kaspar Eidenberg
Original Assignee
Kaspar Eidenberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaspar Eidenberg filed Critical Kaspar Eidenberg
Publication of WO1986006243A1 publication Critical patent/WO1986006243A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the invention relates to a method for closing bores provided in a printed circuit board by applying a solder resist on at least one side of the printed circuit board.
  • Printed circuit boards on which printed circuits are formed are known. These circuit boards have active and passive holes. The components are inserted into the active holes. These are electrically connected with solder. As a result, the active bores are sealed in a vacuum-tight manner. The passive bores serve for the electrical connection of one side to the other side of the circuit board. It is also called a change from one level to the next. For this purpose, the passive holes remain open. They are not closed with solder. The electrical connection from one side to the other of the circuit board takes place, for example, with the so-called through-metallization.
  • the finished printed circuit boards are checked in various ways.
  • the printed circuit boards are pulled into an adapter with negative pressure and held there by the negative pressure. This negative pressure is destroyed by the passive bores which have remained open. To use this test method, the passive bores must therefore also be closed.
  • solder stop mask made of a photopolymer layer.
  • this layer is left tensioned over the holes.
  • a solder mask is a layer made of a so-called solder resist.
  • a solder stop varnish is a varnish which is applied to a printed circuit board according to a certain pattern. It prevents solder from sticking.
  • sealing the holes with a photopolymer layer is a very expensive process.
  • the object of the invention is to find a method for closing bores in a printed circuit board which can be carried out safely and inexpensively.
  • the solution to this problem arises according to the invention in that the bores are closed with a plug from the already mentioned solder stop lacquer.
  • This solder resist is expediently applied in a screen printing process.
  • the screen printing process has great experience and can be carried out inexpensively.
  • the diameter of the holes provided in the first mask should be slightly above the diameter of the holes to be closed. That for the graft desired or required volume can be adjusted with the thickness of the first mask. As the strength increases, the volume of the plugs increases and vice versa.
  • the speed and the extent to which the solder resist penetrates into the holes to be closed can be increased according to the invention by applying a vacuum to the other side of the circuit board.
  • a second mask with a hole pattern corresponding to the number and position of the holes to be closed is placed on the other side of the circuit board and a vacuum is applied, and thus the solder resist is pressed into the holes from one side is supported.
  • the screen used for the screen printing according to the invention and applied to the first mask must be very wide-meshed.
  • the solder resist should also have a high thixotropy. This ensures that it penetrates sufficiently quickly and deeply into the holes to be closed.
  • the amount of the solder resist is adjusted so that it fills at least half the depth of the bore.
  • the method according to the invention can also be applied from the two sides of the printed circuit board. In this case, the bores are half-filled from each side and thus closed in a vacuum-tight manner.
  • Fig. 2 is an exploded perspective view of a circuit board during its manufacture, the the first mask with screen and doctor blade to be placed on it from above and the second mask to be applied to it from below,
  • FIG. 3 shows a partial illustration, partly in section, through the printed circuit board during its manufacture when the solder resist is applied
  • Fig. 4 is an illustration corresponding to FIG. 3 with additional use of the second mask on the underside of the circuit board and applying a vacuum and
  • FIG. 5 shows, on an enlarged scale, the representation of a region from FIG. 5 for better clarification of the process operations.
  • FIG. 1 shows in simplified form a printed circuit board 12 with its bores 14 remaining open. The connections of the schematically illustrated components 16 are inserted into these. 1 further shows the holes 18 to be closed. The conductor tracks 20 run between them. The holes 18 are metallized. The current can thus flow from a conductor track on the top to a conductor track on the underside of the printed circuit board 12. Fitting bores 22 are also provided in the corners of the printed circuit board 12. With these, it is kept in the correct position during its manufacture.
  • FIG. 2 shows the same printed circuit board 12 during its manufacture. All holes are still open.
  • the upper first mask 24 is located above the printed circuit board 12.
  • the lower second mask 26, which can be optionally applied, is located below the printed circuit board 12. Both masks 24 and 26 have holes 28 where the bores 18 to be closed are located .
  • the screen 30 is located directly on the upper mask 24.
  • FIG. 2 further shows the squeegee 32. It can be displaced within the frame 34. The solder resist, the is pressed by the doctor blade 32 into the bores .18 to be closed, is indicated at 36. In the printed circuit board 12, both the holes 14 and the holes 18 are still open.
  • Fig. 3 shows the practice of the method.
  • the printed circuit board 12 lies on a base 38.
  • the upper mask 24 with the holes 28 and the sieve 30 lie on the printed circuit board.
  • the through-metallization 40 of both the open bores 14 and the bores 18 to be closed is also shown.
  • the doctor blade 32 is pushed over the screen 30 in the direction of the arrow shown. He presses the solder resist 36 in front of him through the mesh of the screen 30 and through the holes 28 provided in the upper mask 24. These are located precisely over the holes 18 to be closed.
  • a plug 42 made of solder resist has been pressed into this. It fills approximately half the height of the bore 18.
  • the plug 42 has not yet reached this length in the hole 18 further to the left, above which the solder resist 36 is located.
  • solder resist 36 When using a thixotropic solder resist, it is still liquid when pressed into the bore 18. This facilitates its penetration into the bore 18.
  • the pressure exerted by the doctor blade 32 causes the upper stencil 28 with the screen 30 to be in front of and behind the doctor blade 32 slightly raised. They lie directly on the printed circuit board 12 only under the doctor blade 32.
  • the method can also be carried out from the other side, that is to say from below, as stated above.
  • the penetration of the plugs 42 into the bores 18 can be improved by applying a vacuum to the lower side of the printed circuit board 12. This is shown in FIG. 4.
  • the top of the base 38 is serrated. Channels 44 pass through the base 38.
  • the already mentioned second mask 26 lies on the grooved upper side of the base 38. It has holes 28 on the bores 18 to be closed.
  • the channels 44 are connected to a vacuum source. Via the grooves in the upper side of the base 38, the latter propagates as far as the holes 28 in the second mask 26 and thus into the bores 18 to be closed.
  • FIG. 5 shows the partial area from FIG. 4 on a larger scale, which is located on and somewhat to the left of the doctor blade 32.
  • the description of FIG. 4 relating to this part also applies to FIG. 5.

Abstract

Closing up of passive drill holes (14, 18) provided for in a printed circuit board (12). To this effect a mask (24, 26) with screen (30) is laid on the printed circuit board that has been drilled through. At the points corresponding to the drill holes (14) that are to be filled, the mask (24, 26) has holes (28). With a doctor blade (32) solder fill varnish (36) is pressed through the holes in the screen (30) and in the mask (24) into the drill holes (18) as is done in the screen printing process. This pressing of the solder fill varnish into the drill holes (18) can be reinforced through the application of negative pressure from below on the printed circuit board (12).

Description

Verfahren zum Verschließen von in einer Leiterplatte vorge¬ sehenen BohrungenMethod for closing bores provided in a printed circuit board
Die Erfindung betrifft ein Verfahren zum Verschließen von in einer Leiterplatte vorgesehenen Bohrungen mit Auftragen eines Lötstoplackes auf mindestens eine Seite der Leiter¬ platte.The invention relates to a method for closing bores provided in a printed circuit board by applying a solder resist on at least one side of the printed circuit board.
Leiterplatten, auf denen gedruckte Schaltungen ausgebildet werden, sind bekannt. Diese Leiterplatten weisen aktive und passive Bohrungen auf. In die aktiven Bohrungen werden die Bauelemente eingesetzt. Diese werden mit Lot elektrisch an¬ geschlossen. Dadurch werden die aktiven Bohrungen vakuum¬ dicht verschlossen. Die passiven Bohrungen dienen zum elek¬ trischen Verbinden der einen mit der anderen Seite der Lei¬ terplatte. Man bezeichnet sie auch als Umsteiger von der einen zur nächsten Ebene. Hierzu bleiben die passiven Boh¬ rungen offen.Sie werden nicht mit Lot verschlossen. Die elektrische Verbindung von der einen zur anderen Seite der Leiterplatte erfolgt dabei zum Beispiel mit der sogenann¬ ten Durchmetallisierung.Printed circuit boards on which printed circuits are formed are known. These circuit boards have active and passive holes. The components are inserted into the active holes. These are electrically connected with solder. As a result, the active bores are sealed in a vacuum-tight manner. The passive bores serve for the electrical connection of one side to the other side of the circuit board. It is also called a change from one level to the next. For this purpose, the passive holes remain open. They are not closed with solder. The electrical connection from one side to the other of the circuit board takes place, for example, with the so-called through-metallization.
Die fertigen bestückten Leiterplatten werden auf verschie¬ dene Weise geprüft. Bei einem modernen Prüfverfahren wer¬ den die Leiterplatten mit Unterdr ck in einen Adapter gezo¬ gen und durch den Unterdruck in diesem gehalten. Dieser Un¬ terdruck wird durch die offen gebliebenen passiven Bohrun¬ gen zerstört. Zum Anwenden dieses Prüfverfahrens müssen da¬ her auch die passiven Bohrungen geschlossen werden.The finished printed circuit boards are checked in various ways. In a modern test method, the printed circuit boards are pulled into an adapter with negative pressure and held there by the negative pressure. This negative pressure is destroyed by the passive bores which have remained open. To use this test method, the passive bores must therefore also be closed.
Man hat versucht, die passiven Bohrungen auf einer Lötwelle zu schließen. Dabei können sich jedoch zwischen einem Löt¬ auge und einer angrenzenden Leiterbahn kleine Zinnperlen festsetzen. Dadurch kann unter einem Bauelement ein Kurz¬ schluß entstehen. Dieses Verfahren hat daher starke Nach¬ teile.An attempt was made to drill the passive holes on a solder wave close. However, small tin beads can get stuck between a soldering eye and an adjacent conductor track. This can result in a short circuit under a component. This process therefore has major disadvantages.
Man hat weiter versucht, die Bohrungen mit einer Lötstop¬ maske aus einer Fotopolymerschicht geschlossen zu halten. Hierzu beläßt man diese Schicht in gespanntem Zustand über den Bohrungen. Unter Lötstopmaske ist dabei eine Schicht aus einem sogenannten Lötstoplack zu verstehen. Ein Löt¬ stoplack ist ein Lack, der nach einem bestimmten Muster auf eine Leiterplatte aufgebracht wird. Er verhindert das Anhaften von Lot. Das Verschließen der Bohrungen mit einer Fotopolymerschicht ist jedoch ein sehr teures Verfahren.Attempts have also been made to keep the bores closed with a solder stop mask made of a photopolymer layer. For this purpose, this layer is left tensioned over the holes. A solder mask is a layer made of a so-called solder resist. A solder stop varnish is a varnish which is applied to a printed circuit board according to a certain pattern. It prevents solder from sticking. However, sealing the holes with a photopolymer layer is a very expensive process.
Von diesem Stand der Technik ausgehend liegt der Erfindung die Aufgabe zugrunde, ein Verfahren zum Verschließen von Bohrungen in einer Leiterplatte zu finden, das sich sicher und kostengünstig durchführen läßt. Die Lösung für diese Aufgabe ergibt sich nach der Erfindung dadurch, daß die Bohrungen mit einem Pfropfen aus dem schon genannten Lδt- stoplack verschlossen werden. Zweckmäßig wird dieser Löt¬ stoplack im Siebdruckverfahren aufgebracht. Im Siebdruck¬ verfahren besitzt man große Erfahrung, und es läßt sich kostengünstig durchführen.Starting from this prior art, the object of the invention is to find a method for closing bores in a printed circuit board which can be carried out safely and inexpensively. The solution to this problem arises according to the invention in that the bores are closed with a plug from the already mentioned solder stop lacquer. This solder resist is expediently applied in a screen printing process. The screen printing process has great experience and can be carried out inexpensively.
In der praktischen Verwirklichung der Erfindung ist vorge¬ sehen, daß eine erste Maske mit einem der Zahl und der La¬ ge der zu verschließenden Bohrungen entsprechenden Lochmu¬ ster und einem Sieb auf der von der Leiterplatte abgewand¬ ten Seite auf diese aufgelegt, der Lötstoplack aufgebracht und mit einem Rakel in die Bohrungen hineingedrückt wird. Dabei sollte der Durchmesser der in der ersten Maske vor¬ gesehenen Löcher etwas über dem Durchmesser der zu ver¬ schließenden Bohrungen liegen. Das für die Pfropfen ge- wünschte oder erforderliche Volumen läßt sich mit der Stär¬ ke der ersten Maske einregeln. Bei ansteigender Stärke steigt das Volumen der Pfropfen und umgekehrt.In the practical implementation of the invention, it is provided that a first mask with a perforated pattern corresponding to the number and position of the holes to be closed and a sieve placed on the side facing away from the printed circuit board, the solder resist applied and pressed into the holes with a squeegee. The diameter of the holes provided in the first mask should be slightly above the diameter of the holes to be closed. That for the graft desired or required volume can be adjusted with the thickness of the first mask. As the strength increases, the volume of the plugs increases and vice versa.
Die Schnelligkeit und das Ausmaß, mit denen der Lötstop¬ lack in die zu verschließenden Bohrungen eindringt, läßt sich erfindungsgemäß durch Anlegen eines Unterdruckes auf die andere Seite der Leiterplatte erhöhen. Hierzu wird im einzelnen vorgeschlagen, daß eine zweite Maske mit einem der Zahl und der Lage der zu verschließenden Bohrungen entsprechenden Lochmuster auf die andere Seite der Leiter¬ platte aufgelegt und ein Vakuum angelegt wird und damit das Hineindrücken des Lötstoplackes in die Bohrungen von der einen Seite unterstützt wird.The speed and the extent to which the solder resist penetrates into the holes to be closed can be increased according to the invention by applying a vacuum to the other side of the circuit board. For this purpose, it is proposed in detail that a second mask with a hole pattern corresponding to the number and position of the holes to be closed is placed on the other side of the circuit board and a vacuum is applied, and thus the solder resist is pressed into the holes from one side is supported.
Das für den erfindungsgemäßen Siebdruck verwendete und auf die erste Maske aufgebrachte Sieb muß sehr grobmaschig sein. Der Lötstoplack soll weiter eine hohe Thixotropie aufwei¬ sen. Damit wird sichergestellt, daß er ausreichend schnell und tief in die zu verschließenden Bohrungen eindringt. Die Menge des Lötstoplackes wird so eingestellt, daß er minde¬ stens die halbe Tiefe der Bohrung ausfüllt. In einer Wei¬ terbildung kann das erfindungsgemäße Verfahren auch von den beiden Seiten der Leiterplatte aus angewendet werden. Hierbei werden die Bohrungen von jeder Seite zur Hälfte ge¬ füllt und damit vakuumdicht verschlossen.The screen used for the screen printing according to the invention and applied to the first mask must be very wide-meshed. The solder resist should also have a high thixotropy. This ensures that it penetrates sufficiently quickly and deeply into the holes to be closed. The amount of the solder resist is adjusted so that it fills at least half the depth of the bore. In a further development, the method according to the invention can also be applied from the two sides of the printed circuit board. In this case, the bores are half-filled from each side and thus closed in a vacuum-tight manner.
Am Beispiel der in der Zeichnung gezeigten Ausführungsform wird das erfindurigsgemäße Verfahren nun weiter beschrieben. In der Zeichnung ist:The method according to the invention will now be further described using the example of the embodiment shown in the drawing. In the drawing is:
Fig. 1 eine perspektivische Teilansicht einer fertigen Lei¬ terplatte,1 is a partial perspective view of a finished Lei¬ terplatte,
Fig. 2 eine auseinandergezogene perspektivische Darstellung einer Leiterplatte während ihrer Herstellung, der von oben auf sie aufzulegenden ersten Maske mit Sieb und Rakel und der von unten an sie anzulegenden zwei¬ ten Maske,Fig. 2 is an exploded perspective view of a circuit board during its manufacture, the the first mask with screen and doctor blade to be placed on it from above and the second mask to be applied to it from below,
Fig. 3 eine Teildarstellung, teilweise im Schnitt, durch die Leiterplatte während ihrer Herstellung beim Aufbrin¬ gen des Lötstoplackes,3 shows a partial illustration, partly in section, through the printed circuit board during its manufacture when the solder resist is applied,
Fig. 4 eine Darstellung entsprechend Fig. 3 mit zusätzlicher Verwendung der zweiten Maske auf der Unterseite der Leiterplatte und Anlegen eines Vakuums undFig. 4 is an illustration corresponding to FIG. 3 with additional use of the second mask on the underside of the circuit board and applying a vacuum and
Fig. 5 in vergrößertem Maßstab die Darstellung eines Gebie¬ tes aus Fig. 5 zur besseren Verdeutlichung der Ver¬ fahrensvorgänge.5 shows, on an enlarged scale, the representation of a region from FIG. 5 for better clarification of the process operations.
Fig. 1 zeigt vereinfacht eine Leiterplatte 12 mit -ihren of¬ fen bleibenden Bohrungen 14. In diese werden die Anschlüsse der schematisch dargestellten Bauteile 16 eingesteckt. Fig. 1 zeigt weiter die zu verschließenden Bohrungen 18. Zwischen diesen verlaufen die Leiterbahnen 20. Die Bohrungen 18 sind durchmetallisiert. Damit kann der Strom von einer Leiterbahn auf der Oberseite zu einer Leiterbahn auf der Unterseite der Leiterplatte 12 fließen. In den Ecken der Leiterplatte 12 sind noch Paßbohrungen 22 vorgesehen. Mit diesen wird sie bei ihrer Fertigung in der richtigen Lage gehalten.1 shows in simplified form a printed circuit board 12 with its bores 14 remaining open. The connections of the schematically illustrated components 16 are inserted into these. 1 further shows the holes 18 to be closed. The conductor tracks 20 run between them. The holes 18 are metallized. The current can thus flow from a conductor track on the top to a conductor track on the underside of the printed circuit board 12. Fitting bores 22 are also provided in the corners of the printed circuit board 12. With these, it is kept in the correct position during its manufacture.
Fig. 2 zeigt die gleiche Leiterplatte 12 während ihrer Her¬ stellung. Sämtliche Bohrungen sind noch offen. Über der Lei¬ terplatte 12 befindet sich die obere erste Maske 24. Unter der Leiterplatte 12 befindet sich die wahlweise anzulegende untere zweite Maske 26. Beide Masken 24 und 26 weisen dort, wo sich die zu verschließenden Bohrungen 18 befinden, Lö¬ cher 28 auf. Unmittelbar auf der oberen Maske 24 befindet sich das Sieb 30. Fig. 2 zeigt weiter den Rakel 32. Er ist innerhalb des Rahmens 34 verschiebbar. Der Lötstoplack, der durch den Rakel 32 in die zu verschließenden Bohrungen .18 gedrückt wird, ist bei 36 angedeutet. In der Leiterplatte 12 sind sowohl die Bohrungen 14 als auch die Bohrungen 18 noch offen.2 shows the same printed circuit board 12 during its manufacture. All holes are still open. The upper first mask 24 is located above the printed circuit board 12. The lower second mask 26, which can be optionally applied, is located below the printed circuit board 12. Both masks 24 and 26 have holes 28 where the bores 18 to be closed are located . The screen 30 is located directly on the upper mask 24. FIG. 2 further shows the squeegee 32. It can be displaced within the frame 34. The solder resist, the is pressed by the doctor blade 32 into the bores .18 to be closed, is indicated at 36. In the printed circuit board 12, both the holes 14 and the holes 18 are still open.
Fig. 3 zeigt die Ausübung des Verfahrens. Die Leiterplatte 12 liegt auf einer Unterlage 38. Auf der Leiterplatte lie¬ gen die obere Maske 24 mit den Löchern 28 und das Sieb 30 auf. Eingezeichnet ist weiter die Durchmetallisierung 40 sowohl der offenen Bohrungen 14 als auch der zu verschlie¬ ßenden Bohrungen 18. Im Betrieb wird der Rakel 32 in Rich¬ tung des eingezeichneten Pfeiles über das Sieb 30 gescho¬ ben. Dabei drückt er den vor ihm befindlichen Lötstoplack 36 durch die Maschen des Siebes 30 und durch die in der obe¬ ren Maske 24 vorgesehenen Löcher 28. Diese befinden sich ge¬ nau über den zu verschließenden Bohrungen 18. Wie dies für die rechts liegende Bohrung 18 angedeutet ist, ist ein Pfropfen 42 aus Lötstoplack in diese hineingedrückt worden. Er füllt etwa die halbe Höhe der Bohrung 18 auf. In der weiter links liegenden Bohrung 18, über der sich gerade der Lötstoplack 36 befindet, hat der Pfropfen 42 noch nicht die¬ se Länge erreicht. Bei Verwendung eines thixotropen Lötstop¬ lackes ist dieser beim Hineindrücken in die Bohrung 18 noch flüssig.Dies erleichtert sein Eindringen in die Bohrung 18. Durch den durch den Rakel 32 ausgeübten Druck werden die obere Schablone 28 mit dem Sieb 30 vor und hinter dem Rakel 32 etwas angehoben. Nur unter dem Rakel 32 liegen sie un¬ mittelbar auf der Leiterplatte 12 auf.Fig. 3 shows the practice of the method. The printed circuit board 12 lies on a base 38. The upper mask 24 with the holes 28 and the sieve 30 lie on the printed circuit board. The through-metallization 40 of both the open bores 14 and the bores 18 to be closed is also shown. In operation, the doctor blade 32 is pushed over the screen 30 in the direction of the arrow shown. He presses the solder resist 36 in front of him through the mesh of the screen 30 and through the holes 28 provided in the upper mask 24. These are located precisely over the holes 18 to be closed. As is the case for the hole 18 on the right is indicated, a plug 42 made of solder resist has been pressed into this. It fills approximately half the height of the bore 18. The plug 42 has not yet reached this length in the hole 18 further to the left, above which the solder resist 36 is located. When using a thixotropic solder resist, it is still liquid when pressed into the bore 18. This facilitates its penetration into the bore 18. The pressure exerted by the doctor blade 32 causes the upper stencil 28 with the screen 30 to be in front of and behind the doctor blade 32 slightly raised. They lie directly on the printed circuit board 12 only under the doctor blade 32.
Falls Pfropfen 42 mit einer Länge von etwa der halben Höhe der Leiterplatte 12 nicht zum Verschließen der Bohrungen 18 ausreichen, kann das Verfahren, wie vorstehend angege¬ ben, auch von der anderen Seite, das heißt von unten, aus¬ geführt werden. Ebenso läßt sich das Eindringen der Pfrop¬ fen 42 in die Bohrungen 18 durch das Anlegen eines Unter¬ druckes an die untere Seite der Leiterplatte 12 verbessern. Dies zeigt Fig. 4. Die Oberseite der Unterlage 38 ist ge¬ rieft. Kanäle 44 treten durch die Unterlage 38 durch. Die bereits erwähnte zweite Maske 26 liegt auf der gerieften Oberseite der Unterlage 38 auf. An den zu verschließenden Bohrungen 18 weist sie Löcher 28 auf. Die Kanäle 44 sind an eine Unterdruckquelle angeschlossen. Über die Riefen in der Oberseite der Unterlage 38 pflanzt sich dieser bis zu den Löchern 28 in der zweiten Maske 26 und damit bis in die zu verschließenden Bohrungen 18 fort. Wenn nun der Rakel 32 über das Sieb 30 fährt und den Lδtstoplack 36 in die Bohrun¬ gen 18 drückt, werden die sich bildenden Pfropfen 42 zu¬ sätzlich durch den Unterdruck nach unten gezogen. Man er¬ kennt, daß der in Fig. 4 rechts befindliche Pfropfen 42 länger als sein Gegenstück in Fig. 3 ist.If the plug 42 with a length of approximately half the height of the printed circuit board 12 is not sufficient to close the bores 18, the method can also be carried out from the other side, that is to say from below, as stated above. Likewise, the penetration of the plugs 42 into the bores 18 can be improved by applying a vacuum to the lower side of the printed circuit board 12. This is shown in FIG. 4. The top of the base 38 is serrated. Channels 44 pass through the base 38. The already mentioned second mask 26 lies on the grooved upper side of the base 38. It has holes 28 on the bores 18 to be closed. The channels 44 are connected to a vacuum source. Via the grooves in the upper side of the base 38, the latter propagates as far as the holes 28 in the second mask 26 and thus into the bores 18 to be closed. If the doctor blade 32 now moves over the screen 30 and presses the solder stop lacquer 36 into the bores 18, the plugs 42 which are formed are additionally pulled downward by the negative pressure. It can be seen that the plug 42 on the right in FIG. 4 is longer than its counterpart in FIG. 3.
Fig. 5 zeigt in größerem Maßstab den Teilbereich aus Fig. 4, der sich am und etwas links vom Rakel 32 befindet. Die sich auf diesen Teil beziehende Beschreibung von Fig. 4 gilt auch für Fig. 5.FIG. 5 shows the partial area from FIG. 4 on a larger scale, which is located on and somewhat to the left of the doctor blade 32. The description of FIG. 4 relating to this part also applies to FIG. 5.
Die Abmessungen und die räumliche Zuordnung der verschiede¬ nen Teile in der Skizze sind nur schematisch und nicht ma߬ stäblich zu verstehen. The dimensions and the spatial assignment of the different parts in the sketch are to be understood only schematically and not to scale.

Claims

Patentansprüche Claims
1. Verfahren zum Verschließen von in einer Leiterplatte vor¬ gesehenen Bohrungen mit Auftragen eines Lötstoplackes auf mindestens eine Seite der Leiterplatte, dadurch gekenn¬ zeichnet, daß die Bohrungen mit einem Pfropfen aus Löt¬ stoplack verschlossen werden.1. A method for closing bores provided in a printed circuit board by applying a solder resist on at least one side of the printed circuit board, characterized in that the bores are closed with a plug made of solder resist.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß der Lötstoplack im Siebdruckverfahren aufgebracht wird.2. The method according to claim 1, characterized in that the solder resist is applied by screen printing.
3. Verfahren nach Anspruch 1 und 2, dadurch gekennzeichnet, daß eine erste Maske mit einem der Zahl und der Lage der zu verschließenden Bohrungen entsprechenden Lochmuster und einem Sieb auf der von der Leiterplatte abgewandten Seite auf diese aufgelegt, der Lötstoplack aufgebracht und mit einem Rakel in die Bohrungen hineingedrückt wird.3. The method according to claim 1 and 2, characterized in that a first mask with a hole pattern corresponding to the number and position of the holes to be closed and a sieve placed on the side facing away from the circuit board, the solder resist applied and with a squeegee is pressed into the holes.
4. Verfahren nach Anspruch 1 bis 3, dadurch gekennzeichnet, daß der Durchmesser der in der ersten Maske vorgesehenen Löcher etwas über dem Durchmesser der zu verschließenden Bohrungen liegt.4. The method according to claim 1 to 3, characterized in that the diameter of the holes provided in the first mask is slightly above the diameter of the holes to be closed.
5. Verfahren nach Anspruch 1 bis 4, dadurch gekennzeichnet, daß die Stärke der ersten Maske nach Maßgabe des für die Pfropfen gewünschten Volumens ausgewählt wird.5. The method according to claim 1 to 4, characterized in that the thickness of the first mask is selected in accordance with the volume desired for the plug.
6. Verfahren nach Anspruch 1 bis 5, dadurch gekennzeichnet, daß eine zweite Maske mit einem der Zahl und der Lage der zu verschließenden Bohrungen entsprechenden Lochmuster auf die andere Seite der Leiterplatte aufgelegt und ein Vakuum angelegt wird und damit das Hineindrücken des Lötstoplackes in die Bohrungen von der einen Seite un- terstützt wird.6. The method according to claim 1 to 5, characterized in that a second mask with a hole pattern corresponding to the number and position of the holes to be closed is placed on the other side of the circuit board and a vacuum is applied and thus the pushing in of the solder resist into the holes from one side and is supported.
7. Verfahren nach Anspruch 1 bis 6, gekennzeichnet durch die Verwendung eines Lötstoplackes mit einer hohen Thi- xotropie.7. The method according to claim 1 to 6, characterized by the use of a solder resist with a high thixotropy.
8. Verfahren nach Anspruch 1 bis 7, dadurch gekennzeichnet, daß es auf den beiden Seiten der Leiterplatte angewendet wird. 8. The method according to claim 1 to 7, characterized in that it is applied to the two sides of the circuit board.
PCT/DE1986/000165 1985-04-16 1986-04-15 Process for the closing up of drill holes provided for in a printed circuit board WO1986006243A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3514093.3 1985-04-16
DE19853514093 DE3514093A1 (en) 1985-04-16 1985-04-16 METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD

Publications (1)

Publication Number Publication Date
WO1986006243A1 true WO1986006243A1 (en) 1986-10-23

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EP (1) EP0217886A1 (en)
DE (1) DE3514093A1 (en)
WO (1) WO1986006243A1 (en)

Cited By (17)

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Publication number Priority date Publication date Assignee Title
US4982892A (en) * 1989-11-09 1991-01-08 International Business Machines Corporation Solder interconnects for selective line coupling
EP0329807B1 (en) * 1988-02-25 1993-03-31 Gebr. Schmid GmbH & Co. Circuit for processing electrical printed-circuit boards
FR2714567A1 (en) * 1993-12-28 1995-06-30 Thomson Hybrides Through hole plating process for hybrid circuits
US5825629A (en) * 1994-08-31 1998-10-20 International Business Machines Corporation Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
WO1999067978A1 (en) * 1998-06-24 1999-12-29 Vantico Ag Method for coating printed circuit boards or similar substrates
WO2000013474A1 (en) * 1998-09-02 2000-03-09 Hadco Santa Clara, Inc. Forming plugs in vias of circuit board layers and subassemblies
WO2000052974A1 (en) * 1999-03-04 2000-09-08 Daimlerchrysler Ag Method for producing circuit arrangements
FR2813216A1 (en) * 2000-08-28 2002-03-01 Novatec DEVICE FOR FILLING OPENING HOLES IN A SUBSTRATE
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
FR2837345A1 (en) * 2002-03-15 2003-09-19 Novatec Method of refilling the hollow grid of the printed circuit boards during the manufacture of IC chips, uses a mesh which rests on the substrate without any deformation, and which acts as a guide for the injection unit
US6793852B2 (en) 2000-05-31 2004-09-21 Ttm Advanced Circuits, Inc. Scavenging method
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6832714B2 (en) 2000-05-31 2004-12-21 Ttm Advanced Circuits, Inc. Heated filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6929975B2 (en) 2001-01-13 2005-08-16 Conti Temic Microelectronic Gmbh Method for the production of an electronic component
EP4328028A1 (en) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Filling holes of a component carrier structure with controllable and alignable movable medium applicator

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DE19842590A1 (en) * 1998-09-17 2000-04-13 Daimler Chrysler Ag Process for the production of circuit arrangements
DE102005011545A1 (en) * 2005-03-10 2006-09-21 Lpkf Laser & Electronics Ag Method for contacting printed conductors of a printed circuit board

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US4478882A (en) * 1982-06-03 1984-10-23 Italtel Societa Italiana Telecomunicazioni S.P.A. Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer
FR2551618A1 (en) * 1983-09-02 1985-03-08 Inf Milit Spatiale Aeronaut Process for manufacturing a printed circuit having buried layers and printed circuit obtained by such a process.

Cited By (27)

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Publication number Priority date Publication date Assignee Title
EP0329807B1 (en) * 1988-02-25 1993-03-31 Gebr. Schmid GmbH & Co. Circuit for processing electrical printed-circuit boards
US4982892A (en) * 1989-11-09 1991-01-08 International Business Machines Corporation Solder interconnects for selective line coupling
US5308928A (en) * 1989-11-09 1994-05-03 International Business Machines Corporation Soldering interconnects for selective line coupling
FR2714567A1 (en) * 1993-12-28 1995-06-30 Thomson Hybrides Through hole plating process for hybrid circuits
US5825629A (en) * 1994-08-31 1998-10-20 International Business Machines Corporation Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment
WO1999067978A1 (en) * 1998-06-24 1999-12-29 Vantico Ag Method for coating printed circuit boards or similar substrates
US6517895B1 (en) 1998-06-24 2003-02-11 Vantico Inc. Method of coating both sides of printed circuit boards having holes
WO2000013474A1 (en) * 1998-09-02 2000-03-09 Hadco Santa Clara, Inc. Forming plugs in vias of circuit board layers and subassemblies
US6276055B1 (en) 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6282782B1 (en) 1998-09-02 2001-09-04 Hadco Santa Clara, Inc. Forming plugs in vias of circuit board layers and subassemblies
WO2000052974A1 (en) * 1999-03-04 2000-09-08 Daimlerchrysler Ag Method for producing circuit arrangements
US6820798B1 (en) 1999-03-04 2004-11-23 Conti Temic Microelectronic Gmbh Method for producing circuit arrangments
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US7066378B2 (en) 2000-05-31 2006-06-27 Ttm Advanced Circuits, Inc. Filling device
US6995321B2 (en) 2000-05-31 2006-02-07 Honeywell Advanced Circuits Etched hole-fill stand-off
US6793852B2 (en) 2000-05-31 2004-09-21 Ttm Advanced Circuits, Inc. Scavenging method
US6797224B2 (en) 2000-05-31 2004-09-28 Ttm Advanced Technologies, Inc. Heated filling method
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
US6832714B2 (en) 2000-05-31 2004-12-21 Ttm Advanced Circuits, Inc. Heated filling device
US6840425B2 (en) 2000-05-31 2005-01-11 Ttm Advanced Circuits, Inc. Scavenging system
FR2813216A1 (en) * 2000-08-28 2002-03-01 Novatec DEVICE FOR FILLING OPENING HOLES IN A SUBSTRATE
WO2002019782A1 (en) * 2000-08-28 2002-03-07 Novatec S.A. Collective method for flush filling of through holes in a substrate
US6929975B2 (en) 2001-01-13 2005-08-16 Conti Temic Microelectronic Gmbh Method for the production of an electronic component
FR2837345A1 (en) * 2002-03-15 2003-09-19 Novatec Method of refilling the hollow grid of the printed circuit boards during the manufacture of IC chips, uses a mesh which rests on the substrate without any deformation, and which acts as a guide for the injection unit
EP4328028A1 (en) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Filling holes of a component carrier structure with controllable and alignable movable medium applicator

Also Published As

Publication number Publication date
DE3514093A1 (en) 1986-10-23
EP0217886A1 (en) 1987-04-15

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