WO1992013981A3 - Selective process for printed circuit board manufacturing - Google Patents

Selective process for printed circuit board manufacturing Download PDF

Info

Publication number
WO1992013981A3
WO1992013981A3 PCT/EP1992/000282 EP9200282W WO9213981A3 WO 1992013981 A3 WO1992013981 A3 WO 1992013981A3 EP 9200282 W EP9200282 W EP 9200282W WO 9213981 A3 WO9213981 A3 WO 9213981A3
Authority
WO
WIPO (PCT)
Prior art keywords
metallization
printed circuit
circuit board
board manufacturing
selective process
Prior art date
Application number
PCT/EP1992/000282
Other languages
French (fr)
Other versions
WO1992013981A2 (en
Inventor
Gomes Jose Manuel Goncalves
Lanca Rodrigues Ana P Teixeira
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Priority to JP4503962A priority Critical patent/JPH06505770A/en
Publication of WO1992013981A2 publication Critical patent/WO1992013981A2/en
Publication of WO1992013981A3 publication Critical patent/WO1992013981A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Abstract

A new family of palladium based metallization catalyst compositions is disclosed. These catalysts are used in a process for the selective deposition of a metal on a substrate when a metallization mask (i.e. a plating resist) is used over the substrate. Processes and compositions are also disclosed for manufacturing printed circuit boards, by using two metallization sequences, or one alone the latter comprising a so-called 'selective process'. The process and composition are generally employed for the electroless plating of substrates, namely the metallization of plastics, ceramics, anodized aluminum and other materials.
PCT/EP1992/000282 1991-02-08 1992-02-10 Selective process for printed circuit board manufacturing WO1992013981A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4503962A JPH06505770A (en) 1991-02-08 1992-02-10 Selective method for printed wiring circuit board manufacturing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/653,342 US5250105A (en) 1991-02-08 1991-02-08 Selective process for printing circuit board manufacturing
US653,342 1991-02-08

Publications (2)

Publication Number Publication Date
WO1992013981A2 WO1992013981A2 (en) 1992-08-20
WO1992013981A3 true WO1992013981A3 (en) 1992-11-26

Family

ID=24620465

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1992/000282 WO1992013981A2 (en) 1991-02-08 1992-02-10 Selective process for printed circuit board manufacturing

Country Status (4)

Country Link
US (1) US5250105A (en)
EP (1) EP0570432A1 (en)
JP (1) JPH06505770A (en)
WO (1) WO1992013981A2 (en)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5624479A (en) * 1993-04-02 1997-04-29 International Business Machines Corporation Solution for providing catalytically active platinum metal layers
JPH0711448A (en) * 1993-06-29 1995-01-13 Ishihara Chem Co Ltd Catalytic solution for electroless plating selective to copper-based material
US5498268A (en) * 1994-03-16 1996-03-12 Minnesota Mining And Manufacturing Company Abrasive articles and method of making abrasive articles
US5626972A (en) * 1994-06-02 1997-05-06 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5482788A (en) * 1994-11-30 1996-01-09 Baldwin Hardware Corporation Article having a protective coating simulating brass
US5478659A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5484663A (en) * 1994-11-30 1996-01-16 Baldwin Hardware Corporation Article having a coating simulating brass
US5478660A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5716760A (en) * 1995-05-16 1998-02-10 Motorola, Inc. Method for plating a substrate to eliminate the use of a solder mask
US5654108A (en) * 1995-05-22 1997-08-05 Baldwin Hardware Corporation Article having a protective coating simulating brass
CA2176892C (en) * 1995-05-22 2002-10-29 Stephen R. Moysan, Iii Article having a decorative and protective coating simulating brass
US5667904A (en) * 1995-05-22 1997-09-16 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5552233A (en) * 1995-05-22 1996-09-03 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5846598A (en) * 1995-11-30 1998-12-08 International Business Machines Corporation Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating
US6060176A (en) * 1995-11-30 2000-05-09 International Business Machines Corporation Corrosion protection for metallic features
US5693427A (en) * 1995-12-22 1997-12-02 Baldwin Hardware Corporation Article with protective coating thereon
US5783313A (en) * 1995-12-22 1998-07-21 Baldwin Hardware Corporation Coated Article
US6268016B1 (en) * 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
US5843538A (en) * 1996-12-09 1998-12-01 John L. Raymond Method for electroless nickel plating of metal substrates
US6004684A (en) * 1997-04-30 1999-12-21 Masco Corporation Article having a protective and decorative multilayer coating
US5952111A (en) * 1997-04-30 1999-09-14 Masco Corporation Article having a coating thereon
US5948548A (en) * 1997-04-30 1999-09-07 Masco Corporation Coated article
US6106958A (en) * 1997-04-30 2000-08-22 Masco Corporation Article having a coating
US5989730A (en) * 1997-04-30 1999-11-23 Masco Corporation Article having a decorative and protective multi-layer coating
US5985468A (en) * 1997-04-30 1999-11-16 Masco Corporation Article having a multilayer protective and decorative coating
US6033790A (en) * 1997-04-30 2000-03-07 Masco Corporation Article having a coating
US5879532A (en) * 1997-07-09 1999-03-09 Masco Corporation Of Indiana Process for applying protective and decorative coating on an article
US6268060B1 (en) 1997-08-01 2001-07-31 Mascotech Coatings, Inc. Chrome coating having a silicone top layer thereon
DE10018025A1 (en) * 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Production of solderable surface on circuit carriers in circuit board manufacture comprises preparing a dielectric substrate having copper structures, producing solderable surfaces, and forming functional surfaces in functional regions
TW569653B (en) * 2001-07-10 2004-01-01 Fujikura Ltd Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US7326669B2 (en) * 2001-09-20 2008-02-05 Honda Motor Co., Ltd. Substrate having catalyst compositions on surfaces of opposite sides
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
EP1737571B1 (en) * 2004-01-20 2016-06-22 Shell Internationale Research Maatschappij B.V. A method of restoring catalytic activity of a spent hydroprocessing catalyst
JP2006009130A (en) * 2004-06-29 2006-01-12 Ebara Corp Method and apparatus for processing substrate
US20050211564A1 (en) * 2004-03-29 2005-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and composition to enhance wetting of ECP electrolyte to copper seed
JP4559936B2 (en) * 2004-10-21 2010-10-13 アルプス電気株式会社 Electroless plating method and circuit forming method using this method
US7733659B2 (en) 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
JP5715748B2 (en) * 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Conditioner for electroless plating
JP2011097038A (en) * 2009-10-02 2011-05-12 Ibiden Co Ltd Ceramic wiring substrate and manufacturing method of the same
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
KR101184558B1 (en) * 2010-11-09 2012-09-19 삼성전기주식회사 Pre-treating agent for electroless metal plating and manufacturing method of circuit board using the same
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US9358618B2 (en) * 2013-07-29 2016-06-07 Globalfoundries Inc. Implementing reduced drill smear
JP6367606B2 (en) * 2013-09-09 2018-08-01 上村工業株式会社 Pretreatment agent for electroless plating, pretreatment method for printed wiring board using said pretreatment agent for electroless plating, and method for producing the same
RU2656233C1 (en) * 2017-10-02 2018-06-04 Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" Method of application of a chemical nickel coating on polyetherethercetone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3434867A (en) * 1965-06-28 1969-03-25 Ibm Method of etching urea-formaldehyde for making printing elements
GB1154152A (en) * 1965-06-01 1969-06-04 Photocircuits Corp Organic Seeding Composition
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431120A (en) * 1966-06-07 1969-03-04 Allied Res Prod Inc Metal plating by chemical reduction with amineboranes
US3798050A (en) * 1971-05-28 1974-03-19 Ppg Industries Inc Catalytic sensitization of substrates for metallization
DE2451217C2 (en) * 1974-10-29 1982-12-23 Basf Ag, 6700 Ludwigshafen Activation of substrates for electroless metallization

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1154152A (en) * 1965-06-01 1969-06-04 Photocircuits Corp Organic Seeding Composition
US3434867A (en) * 1965-06-28 1969-03-25 Ibm Method of etching urea-formaldehyde for making printing elements
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material

Also Published As

Publication number Publication date
EP0570432A1 (en) 1993-11-24
JPH06505770A (en) 1994-06-30
WO1992013981A2 (en) 1992-08-20
US5250105A (en) 1993-10-05

Similar Documents

Publication Publication Date Title
WO1992013981A3 (en) Selective process for printed circuit board manufacturing
EP0475567B1 (en) Method for fabricating printed circuits
CA1262518A (en) Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein
US5318621A (en) Plating rate improvement for electroless silver and gold plating
CA2083197A1 (en) Use of imidazole-2-thione as complexing agent in displacement tin plating
GB1247991A (en) Improvements in the electroless metallizing of substrates
CA2211533A1 (en) Glass bonding layer for a ceramic circuit board support substrate
KR100841414B1 (en) Polyimide-metal laminated body and polyimide circuit board
EP0773710A4 (en) Flexible printed wiring board
US5436034A (en) Process for improving the adhesiveness of electrolessly deposited metal films
EP0153683A2 (en) Process for making circuit boards
EP0358480A3 (en) Process for producing multilayer printed wiring board
EP0263676A3 (en) Thin print etchable gold conductor composition
IT1254428B (en) SELECTIVE PROCESS FOR THE PRODUCTION OF PLATES IN PRINTED CIRCUITS
IL105753A0 (en) Printed circuit substrates
EP0726697A3 (en) Improved printed wiring board and method for preparing the same
GB1381243A (en) Method for metallizing substrates
WO2002004703A3 (en) Electroless rhodium plating
JPS54100931A (en) Electroless nickel plating
CA1162354A (en) Process for electroless metal plating of a polysulfone substrate
GB1164591A (en) mprovements in Metallization of Insulating Substrates
Duva et al. Electroless Plating Process
RU2040130C1 (en) Process of manufacture of two-side printed circuit boards
CA2122868A1 (en) Process for the Patterned Metallisation of Structured Printed Circuit Boards
Konishi et al. Electroless Plating Bath Composition and Method for Production Thereof

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CA JP KR

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU MC NL SE

AK Designated states

Kind code of ref document: A3

Designated state(s): CA JP KR

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU MC NL SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1992903944

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1992903944

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: CA

WWR Wipo information: refused in national office

Ref document number: 1992903944

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1992903944

Country of ref document: EP