WO1992020754A1 - Epoxide-based adhesive - Google Patents
Epoxide-based adhesive Download PDFInfo
- Publication number
- WO1992020754A1 WO1992020754A1 PCT/US1992/001974 US9201974W WO9220754A1 WO 1992020754 A1 WO1992020754 A1 WO 1992020754A1 US 9201974 W US9201974 W US 9201974W WO 9220754 A1 WO9220754 A1 WO 9220754A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- weight
- epoxide
- parts
- component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0045—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or film forming compositions cured by mechanical wave energy, e.g. ultrasonics, cured by electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams, or cured by magnetic or electric fields, e.g. electric discharge, plasma
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/18—Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4511128A JPH06507664A (en) | 1991-05-16 | 1992-03-12 | Epoxide based adhesive |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70111991A | 1991-05-16 | 1991-05-16 | |
US701,119 | 1991-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1992020754A1 true WO1992020754A1 (en) | 1992-11-26 |
Family
ID=24816150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1992/001974 WO1992020754A1 (en) | 1991-05-16 | 1992-03-12 | Epoxide-based adhesive |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0585360A1 (en) |
JP (1) | JPH06507664A (en) |
CA (1) | CA2108260A1 (en) |
WO (1) | WO1992020754A1 (en) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0620259A2 (en) | 1993-04-15 | 1994-10-19 | Minnesota Mining And Manufacturing Company | Epoxy/polyester hot melt compositions |
WO1994029397A1 (en) * | 1993-06-16 | 1994-12-22 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
US5436063A (en) * | 1993-04-15 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Coated abrasive article incorporating an energy cured hot melt make coat |
US5964979A (en) * | 1997-08-15 | 1999-10-12 | 3M Innovative Properties Company | Sealing method and article |
WO1999057216A1 (en) * | 1998-05-01 | 1999-11-11 | Minnesota Mining And Manufacturing Company | Epoxy/thermoplastic photocurable adhesive composition |
US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
US6136398A (en) * | 1998-05-01 | 2000-10-24 | 3M Innovative Properties Company | Energy cured sealant composition |
US6228133B1 (en) | 1998-05-01 | 2001-05-08 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
US6274643B1 (en) | 1998-05-01 | 2001-08-14 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
US6297344B1 (en) * | 1996-07-23 | 2001-10-02 | Siemens Aktiengesellschaft | Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range |
WO2002079337A1 (en) * | 2001-03-29 | 2002-10-10 | 3M Innovative Properties Company | Structural bonding tapes and articles containing the same |
EP1710286A1 (en) | 2005-04-04 | 2006-10-11 | 3M Innovative Properties Company | Reinforcement Pad |
JP2007162019A (en) * | 1993-07-29 | 2007-06-28 | Hitachi Chem Co Ltd | Circuit connecting material and method for connecting circuit using the same |
US7575653B2 (en) | 1993-04-15 | 2009-08-18 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
WO2017174303A1 (en) | 2016-04-04 | 2017-10-12 | Tesa Se | Radiation-activatable pressure-sensitive adhesive tape having a dark reaction and use thereof |
US10508199B2 (en) | 2014-03-07 | 2019-12-17 | Henkel Ag & Co. Kgaa | Photocurable epoxy resin systems |
CN112011293A (en) * | 2019-05-28 | 2020-12-01 | 3M创新有限公司 | Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape, and battery pack |
WO2020240343A1 (en) * | 2019-05-28 | 2020-12-03 | 3M Innovative Properties Company | Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape, and battery pack |
CN112795345A (en) * | 2021-01-29 | 2021-05-14 | 浙江中特化工有限公司 | UV (ultraviolet) delayed curing adhesive and preparation method thereof |
US11352524B2 (en) | 2015-06-04 | 2022-06-07 | 3M Innovative Properties Company | Methods of bonding substrates together |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09176606A (en) * | 1995-12-22 | 1997-07-08 | Sumitomo Bakelite Co Ltd | Adhesive for fixing optical part |
JP2000154352A (en) * | 1998-11-18 | 2000-06-06 | Sekisui Chem Co Ltd | Reactive hot melt adhesive composition and adhesion method |
JP2000212540A (en) * | 1999-01-28 | 2000-08-02 | Sekisui Chem Co Ltd | Reactive hot melt adhesive composition and adhesion |
JP2002047456A (en) * | 2000-07-31 | 2002-02-12 | Toppan Forms Co Ltd | Radically photocrosslinkable adhesive and adhesive sheet obtained by using the same |
JP2002047474A (en) * | 2000-07-31 | 2002-02-12 | Toppan Forms Co Ltd | Cationic photo-crosslinkable adhesive and adhesive sheet prepared therefrom |
JP4384509B2 (en) * | 2003-01-09 | 2009-12-16 | 積水化学工業株式会社 | Method for sealing organic electroluminescent element and organic electroluminescent element |
MX362993B (en) | 2012-02-06 | 2019-03-01 | Momentive Specialty Chem Inc | Epoxy resin formulations for textiles, mats and other fibrous reinforcements for composite applications. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2119810A (en) * | 1982-04-26 | 1983-11-23 | Grace W R & Co | UV and thermally curable, thermoplastic-containing compositions |
EP0124057A1 (en) * | 1983-04-29 | 1984-11-07 | DeSOTO, INC. | Optical glass fiber coated with cationically curable polyepoxide mixtures |
EP0227002A1 (en) * | 1985-12-20 | 1987-07-01 | Advanced Interconnection Technology, Inc. | Heat activatable adhesives for wire scribed circuit boards |
US4690957A (en) * | 1986-02-27 | 1987-09-01 | Mitsubishi Denki Kabushiki Kaisha | Ultra-violet ray curing type resin composition |
WO1991002038A1 (en) * | 1989-08-01 | 1991-02-21 | H.B. Fuller Company | Liquid thermosetting composition |
-
1992
- 1992-03-12 CA CA002108260A patent/CA2108260A1/en not_active Abandoned
- 1992-03-12 EP EP92912359A patent/EP0585360A1/en not_active Ceased
- 1992-03-12 JP JP4511128A patent/JPH06507664A/en active Pending
- 1992-03-12 WO PCT/US1992/001974 patent/WO1992020754A1/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2119810A (en) * | 1982-04-26 | 1983-11-23 | Grace W R & Co | UV and thermally curable, thermoplastic-containing compositions |
EP0124057A1 (en) * | 1983-04-29 | 1984-11-07 | DeSOTO, INC. | Optical glass fiber coated with cationically curable polyepoxide mixtures |
EP0227002A1 (en) * | 1985-12-20 | 1987-07-01 | Advanced Interconnection Technology, Inc. | Heat activatable adhesives for wire scribed circuit boards |
US4690957A (en) * | 1986-02-27 | 1987-09-01 | Mitsubishi Denki Kabushiki Kaisha | Ultra-violet ray curing type resin composition |
WO1991002038A1 (en) * | 1989-08-01 | 1991-02-21 | H.B. Fuller Company | Liquid thermosetting composition |
Non-Patent Citations (2)
Title |
---|
CHEMICAL PATENTS INDEX, BASIC ABSTRACTS JOURNAL Section Ch, Week 8518, 26 June 1985 Derwent Publications Ltd., London, GB; Class A, AN 85-107731/18 & JP,A,60 051 717 (MITSUBISHI ELECTRIC CORP) 23 March 1985 * |
CHEMICAL PATENTS INDEX, BASIC ABSTRACTS JOURNAL Section Ch, Week 8519, 3 July 1985 Derwent Publications Ltd., London, GB; Class A, AN 85-113545/19 & JP,A,60 055 069 (MITSUBISHI ELECTRIC CORP.) 29 March 1985 * |
Cited By (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0620259A3 (en) * | 1993-04-15 | 1994-12-28 | Minnesota Mining & Mfg | Epoxy/polyester hot melt compositions. |
US5436063A (en) * | 1993-04-15 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Coated abrasive article incorporating an energy cured hot melt make coat |
US5582672A (en) * | 1993-04-15 | 1996-12-10 | Minnesota Mining And Manufacturing Company | Method of preparing a coated abrasive article that incorporates an energy cured make coat |
US5776290A (en) * | 1993-04-15 | 1998-07-07 | Minnesota Mining And Manufacturing Company | Method of preparing a coated abrasive article by laminating an energy-curable pressure sensitive adhesive film to a backing |
US5834109A (en) * | 1993-04-15 | 1998-11-10 | Minnesota Mining And Manufacturing Company | Presized backing for a coated abrasive article |
US7575653B2 (en) | 1993-04-15 | 2009-08-18 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
EP0620259A2 (en) | 1993-04-15 | 1994-10-19 | Minnesota Mining And Manufacturing Company | Epoxy/polyester hot melt compositions |
CN1056399C (en) * | 1993-06-16 | 2000-09-13 | 美国3M公司 | Electrically conductive adhesive compositions |
WO1994029397A1 (en) * | 1993-06-16 | 1994-12-22 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
JP4539644B2 (en) * | 1993-07-29 | 2010-09-08 | 日立化成工業株式会社 | Circuit connection material and circuit connection method using the connection material |
JP2007162019A (en) * | 1993-07-29 | 2007-06-28 | Hitachi Chem Co Ltd | Circuit connecting material and method for connecting circuit using the same |
US6297344B1 (en) * | 1996-07-23 | 2001-10-02 | Siemens Aktiengesellschaft | Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range |
US6287669B1 (en) | 1997-08-15 | 2001-09-11 | 3M Innovative Properties Company | Sealing method and article |
US5964979A (en) * | 1997-08-15 | 1999-10-12 | 3M Innovative Properties Company | Sealing method and article |
US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
US6258138B1 (en) | 1998-05-01 | 2001-07-10 | 3M Innovative Properties Company | Coated abrasive article |
US6274643B1 (en) | 1998-05-01 | 2001-08-14 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
US6228133B1 (en) | 1998-05-01 | 2001-05-08 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
US6136384A (en) * | 1998-05-01 | 2000-10-24 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
US6359027B1 (en) | 1998-05-01 | 2002-03-19 | 3M Innovative Properties Company | Coated abrasive article |
US6372336B1 (en) | 1998-05-01 | 2002-04-16 | 3M Innovative Properties Company | Coated abrasive article |
US6441058B2 (en) | 1998-05-01 | 2002-08-27 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
US6753359B2 (en) | 1998-05-01 | 2004-06-22 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
US6136398A (en) * | 1998-05-01 | 2000-10-24 | 3M Innovative Properties Company | Energy cured sealant composition |
US6057382A (en) * | 1998-05-01 | 2000-05-02 | 3M Innovative Properties Company | Epoxy/thermoplastic photocurable adhesive composition |
WO1999057216A1 (en) * | 1998-05-01 | 1999-11-11 | Minnesota Mining And Manufacturing Company | Epoxy/thermoplastic photocurable adhesive composition |
WO2002079337A1 (en) * | 2001-03-29 | 2002-10-10 | 3M Innovative Properties Company | Structural bonding tapes and articles containing the same |
EP1710286A1 (en) | 2005-04-04 | 2006-10-11 | 3M Innovative Properties Company | Reinforcement Pad |
US10508199B2 (en) | 2014-03-07 | 2019-12-17 | Henkel Ag & Co. Kgaa | Photocurable epoxy resin systems |
US11352524B2 (en) | 2015-06-04 | 2022-06-07 | 3M Innovative Properties Company | Methods of bonding substrates together |
US11773295B2 (en) | 2015-06-04 | 2023-10-03 | 3M Innovative Properties Company | Methods of bonding substrates together |
WO2017174303A1 (en) | 2016-04-04 | 2017-10-12 | Tesa Se | Radiation-activatable pressure-sensitive adhesive tape having a dark reaction and use thereof |
CN108884363A (en) * | 2016-04-04 | 2018-11-23 | 德莎欧洲股份公司 | The pressure sensitive adhesive tape of radiation activatable and application thereof with dark reaction |
US20190077997A1 (en) * | 2016-04-04 | 2019-03-14 | Tesa Se | Radiation-activatable pressure-sensitive adhesive tape having a dark reaction and use thereof |
CN108884363B (en) * | 2016-04-04 | 2021-10-15 | 德莎欧洲股份公司 | Radiation-activatable pressure-sensitive adhesive tapes with dark reaction and use thereof |
US11384261B2 (en) | 2016-04-04 | 2022-07-12 | Tesa Se | Radiation-activatable pressure-sensitive adhesive tape having a dark reaction and use thereof |
CN112011293A (en) * | 2019-05-28 | 2020-12-01 | 3M创新有限公司 | Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape, and battery pack |
WO2020240343A1 (en) * | 2019-05-28 | 2020-12-03 | 3M Innovative Properties Company | Curable pressure-sensitive adhesive composition, curable pressure-sensitive adhesive tape, and battery pack |
CN112795345A (en) * | 2021-01-29 | 2021-05-14 | 浙江中特化工有限公司 | UV (ultraviolet) delayed curing adhesive and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CA2108260A1 (en) | 1992-11-17 |
JPH06507664A (en) | 1994-09-01 |
EP0585360A1 (en) | 1994-03-09 |
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