WO1993007728A1 - Ultrasonic wave probe - Google Patents
Ultrasonic wave probe Download PDFInfo
- Publication number
- WO1993007728A1 WO1993007728A1 PCT/JP1992/001304 JP9201304W WO9307728A1 WO 1993007728 A1 WO1993007728 A1 WO 1993007728A1 JP 9201304 W JP9201304 W JP 9201304W WO 9307728 A1 WO9307728 A1 WO 9307728A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit
- transmission
- ultrasonic probe
- reception
- vibrators
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 230000008054 signal transmission Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
- G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
- G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
- G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
- G01S15/8925—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
Definitions
- the present invention relates to a probe for an ultrasonic diagnostic apparatus. More specifically, the present invention relates to an ultrasonic probe in which electrical connection wiring between each piezoelectric vibrator and a signal transmitting / receiving circuit connected thereto is eliminated.
- a signal transmission / reception circuit is connected to each of the piezoelectric transducers of the ultrasonic probe, so that a drive signal is supplied to the piezoelectric transducer and a signal detected by the piezoelectric transducer is received.
- Fig. 5 shows an overview of an example of a conventional probe.
- 1 is a piezoelectric vibrator serving as a main body of the probe
- 2 is an electronic circuit connected to the piezoelectric vibrator 1
- both are connected by a connection conductor 3 such as an electric wire or a flexible board.
- FIG. 6 shows another conventional example, which also uses connection conductors such as print wiring.
- connection conductors such as print wiring.
- FIG. 6 the same parts as those in FIG. 5 are denoted by the same reference numerals.
- 4 is a common electrode of the piezoelectric vibrator 1
- 5 is a signal electrode of the piezoelectric vibrator 1.
- the connection between the piezoelectric vibrator of the probe and the integrated circuit was made by conductors, so when there were a large number of piezoelectric vibrators such as a two-dimensional vibrator array, the electrical wiring Power ⁇ increase, connection difficulty increases.
- An object of the present invention is to realize an L ⁇ ultrasonic probe that does not involve the wiring between the piezoelectric vibrator and the signal receiving and receiving circuit in the ultrasonic probe.
- the ultrasonic probe of the present invention is configured by bonding a transducer array and a semiconductor wafer having a transmitting / receiving circuit for the transducer array formed by an integrated circuit with a conductive adhesive.
- a signal transmitting / receiving circuit for each piezoelectric vibrator is formed by an integrated circuit in accordance with the arrangement of the signal electrodes of the piezoelectric vibrator of the ultrasonic probe, and each transmitting / receiving circuit comprises a semiconductor device.
- a conductive buried layer connected to the output terminal of the transmitting circuit and the input terminal of the receiving circuit is exposed on the side of the vibrator array where the wafer array is attached.
- FIG. 1 is a schematic view of an ultrasonic probe according to one example of the present invention.
- FIG. 2 is a conceptual diagram showing a detailed configuration of the ultrasonic probe of FIG.
- FIG. 3 is an example of the electrical configuration of the supersonic probe of FIG.
- FIG. 4 is a diagram showing an example of how to make the integrated circuit on the semiconductor chip in the ultrasonic probe of FIG.
- FIG. 5 is a diagram showing an example of a conventional supersonic transducer.
- FIG. 6 is a diagram showing another example of a conventional ultrasonic probe. The best way to tell the light
- FIG. 1 is a schematic view of an ultrasonic probe of a urn example of the present invention.
- reference numeral 1 denotes a piezoelectric vibrator, in which a large number of piezoelectric vibrators 1 are arranged in a two-dimensional matrix to form a two-dimensional leak detector array of an ultrasonic probe.
- Reference numeral 11 denotes a semiconductor wafer
- reference numeral 41 denotes individual integrated circuits (device ICs) formed on the wafer 11 in correspondence with the respective piezoelectric vibrators.
- Reference numeral 42 denotes a peripheral circuit connected to the element IC 41 and includes a control circuit, an adder circuit, and the like.
- the wafer 11 is bonded to a 2 ⁇ ⁇ 3 ⁇ 4 array of piezoelectric vibrators with a conductive adhesive or the like.
- Reference numeral 43 denotes a common electrode of the piezoelectric vibrator 1 and a matching layer 44 is provided in contact with the common electrode. The transmission and reception of ultrasonic waves are performed through this acoustic matching layer toward the body located below in the figure.
- Reference numeral 45 denotes a signal line connecting the integrated circuit on the wafer 11 and the ultrasonic diagnostic apparatus main body.
- the surface of the semiconductor wafer on which the integrated circuit is built is covered with a suitable protective layer. Further, a backing material is provided thereon as required.
- FIG. 2 is a detailed view showing an example of the coupling state between one piezoelectric vibrator and the corresponding element IC.
- Figure 2 (a) is a cross-sectional view of a ship, and Figure 2 (mouth) is the corresponding target equivalent circuit diagram.
- the final output stage of the driving circuit of the piezoelectric vibrator is exemplified as an integrated circuit.
- Figure 2 In (a) 1 is a piezoelectric vibrator, 4 is its common electrode, and 5 is a signal electrode.
- Reference numeral 1 denotes a semiconductor wafer, which is bonded to the signal electrode 5 of the piezoelectric vibrator 1 with a conductive adhesive 12.
- the semiconductor wafer 11 has a resistor 15 and a transistor 23 to be connected to the piezoelectric vibrator. That is, the resistor 15 is formed as an n-type layer by phosphorus implantation between the insulation layers 13 and 14, and the transistor 23 is connected between the insulation layers 14 and 22 with the collector 19 and the base. Formed as an NPN transistor having 20 and emitter 21. One end of the resistor 15 and the collector 19 of the transistor 23 are connected by an aluminum wiring 17 provided on the oxide film 18. The other end of the resistor 15 is led to the power supply line. The base 20 of the transistor 23 is led to the drive signal source, and the emitter 21 is led to the ground potential point (ground) through the aluminum 24.
- a buried layer 16 of II is provided on the surface of the wafer 11 on the side of the piezoelectric vibrator, and it is exposed on the back surface of the wafer 11.
- This buried layer 16 is connected to the collector 19 of the transistor 23 inside the wafer 11.
- the exposed portion of the embedded layer 16 is electrically connected to the signal electrode 5 of the vibrator by the conductive adhesive 12. Thereby, the electrical connection between the driving transistor 23 and the piezoelectric vibrator 1 can be performed without using a lead wire.
- the buried layer 16 or another buried layer formed in the same manner is used to connect to the signal electrode of the input terminal of the piezoelectric vibrator 1 for receiving the detection signal of the piezoelectric vibrator 1.
- FIG. 3 is a diagram showing an example of an electrical configuration of an integrated circuit on the wafer 11 of the ultrasonic probe in FIG.
- the transmission control circuit 50, the AD converter 54, the delay circuit 55, the switch control circuit 56, and the adder circuit 57 are electric circuits included in the peripheral circuit 42. The configuration of these electric circuits is common to the normal configuration of the transmission / reception unit of the ultrasonic diagnostic apparatus.
- FIG. 4 is a diagram showing an example of a method of manufacturing an integrated circuit on a semiconductor substrate in an ultrasonic probe. Arrangement pitch of piezoelectric vibrator 1 on the original plate of semiconductor wafer (100 ⁇ 500 ⁇ m) Then, an I chip for the element as described above and its peripheral circuit are formed, and an IC chip block 61 corresponding to the matrix size of the oscillator array is cut out.
- the device ICs are built, as shown in the figure, for each device IC, for example, four identical electronic circuits 62 are made, and after the evaluation test, the normal electronic circuits 62 The connection of other electronic circuits is cut off by laser trimming technology or the like except for the individual. As a result, it is possible to improve the production of the semiconductor wafer in which the transmission / reception circuit is built.
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/211,326 US5435313A (en) | 1991-10-08 | 1992-10-07 | Ultrasonic probe |
EP93906350A EP0607443B1 (en) | 1991-10-08 | 1992-10-07 | Ultrasonic wave probe |
DE69228820T DE69228820T2 (de) | 1991-10-08 | 1992-10-07 | Ultraschallwellensensor |
KR1019940700939A KR100263403B1 (ko) | 1991-10-08 | 1992-10-07 | 초음파 탐촉자(ultrasonic wave probe) |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3/260234 | 1991-10-08 | ||
JP3260234A JP3040554B2 (ja) | 1991-10-08 | 1991-10-08 | 超音波探触子 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993007728A1 true WO1993007728A1 (en) | 1993-04-15 |
Family
ID=17345221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1992/001304 WO1993007728A1 (en) | 1991-10-08 | 1992-10-07 | Ultrasonic wave probe |
Country Status (6)
Country | Link |
---|---|
US (1) | US5435313A (ja) |
EP (1) | EP0607443B1 (ja) |
JP (1) | JP3040554B2 (ja) |
KR (1) | KR100263403B1 (ja) |
DE (1) | DE69228820T2 (ja) |
WO (1) | WO1993007728A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0772891A1 (en) * | 1994-07-22 | 1997-05-14 | Lockheed Martin IR Imaging Systems, Inc. | Ultrasound imaging array |
AU771799B2 (en) * | 1997-02-07 | 2004-04-01 | Astra Aktiebolag | Single dose inhaler II |
EP2676459B1 (en) * | 2011-02-15 | 2022-03-30 | Fujifilm Dimatix, Inc. | Piezoelectric transducers using micro-dome arrays |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685595U (ja) * | 1993-05-20 | 1994-12-06 | 日本無線株式会社 | 超音波送受波器 |
US5957846A (en) * | 1995-06-29 | 1999-09-28 | Teratech Corporation | Portable ultrasound imaging system |
US5964709A (en) * | 1995-06-29 | 1999-10-12 | Teratech Corporation | Portable ultrasound imaging system |
US6248073B1 (en) | 1995-06-29 | 2001-06-19 | Teratech Corporation | Ultrasound scan conversion with spatial dithering |
US5590658A (en) * | 1995-06-29 | 1997-01-07 | Teratech Corporation | Portable ultrasound imaging system |
KR19990028651A (ja) * | 1995-06-29 | 1999-04-15 | ||
US8241217B2 (en) | 1995-06-29 | 2012-08-14 | Teratech Corporation | Portable ultrasound imaging data |
US7500952B1 (en) | 1995-06-29 | 2009-03-10 | Teratech Corporation | Portable ultrasound imaging system |
FR2740933B1 (fr) * | 1995-11-03 | 1997-11-28 | Thomson Csf | Sonde acoustique et procede de realisation |
US6102860A (en) * | 1998-12-24 | 2000-08-15 | Agilent Technologies, Inc. | Ultrasound transducer for three-dimensional imaging |
US6409669B1 (en) | 1999-02-24 | 2002-06-25 | Koninklijke Philips Electronics N.V. | Ultrasound transducer assembly incorporating acoustic mirror |
US6894425B1 (en) | 1999-03-31 | 2005-05-17 | Koninklijke Philips Electronics N.V. | Two-dimensional ultrasound phased array transducer |
US6936008B2 (en) * | 1999-08-20 | 2005-08-30 | Zonare Medical Systems, Inc. | Ultrasound system with cableless coupling assembly |
US6685645B1 (en) | 2001-10-20 | 2004-02-03 | Zonare Medical Systems, Inc. | Broad-beam imaging |
WO2001021072A1 (fr) * | 1999-09-17 | 2001-03-29 | Hitachi Medical Corporation | Sonde a ultrasons et appareil de diagnostic a ultrasons la contenant |
JP4519259B2 (ja) * | 2000-04-19 | 2010-08-04 | 株式会社東芝 | 2次元アレイ超音波プローブ及びその製造方法 |
US6640634B2 (en) * | 2000-03-31 | 2003-11-04 | Kabushiki Kaisha Toshiba | Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus |
DE10129456A1 (de) * | 2001-06-19 | 2003-01-09 | Fraunhofer Ges Forschung | Vorrichtung und Verfahren zur Erfassung und Analyse von Schallsignalen |
US6551248B2 (en) * | 2001-07-31 | 2003-04-22 | Koninklijke Philips Electronics N.V. | System for attaching an acoustic element to an integrated circuit |
JP4376533B2 (ja) * | 2003-03-25 | 2009-12-02 | パナソニック株式会社 | 超音波探触子 |
US7439656B2 (en) * | 2003-06-09 | 2008-10-21 | Koninklijke Philips Electronics N.V. | Method for designing ultrasonic transducers with acoustically active integrated electronics |
US7527591B2 (en) * | 2003-11-21 | 2009-05-05 | General Electric Company | Ultrasound probe distributed beamformer |
US7527592B2 (en) * | 2003-11-21 | 2009-05-05 | General Electric Company | Ultrasound probe sub-aperture processing |
US7431698B2 (en) * | 2004-01-13 | 2008-10-07 | Ge Medical Systems Global Technology Company, Llc | Apparatus and method for controlling an ultrasound probe |
US7254519B2 (en) * | 2004-09-24 | 2007-08-07 | The Boeing Company | Multi channel multiplexed inspection system and method |
US7874991B2 (en) | 2006-06-23 | 2011-01-25 | Teratech Corporation | Ultrasound 3D imaging system |
US7898905B2 (en) * | 2008-07-28 | 2011-03-01 | General Electric Company | Reconfigurable array with locally determined switch configuration |
US20120179044A1 (en) | 2009-09-30 | 2012-07-12 | Alice Chiang | Ultrasound 3d imaging system |
US10080544B2 (en) | 2008-09-15 | 2018-09-25 | Teratech Corporation | Ultrasound 3D imaging system |
JP5484440B2 (ja) * | 2009-03-04 | 2014-05-07 | 株式会社日立メディコ | 超音波診断装置、及び超音波探触子 |
US20100228130A1 (en) * | 2009-03-09 | 2010-09-09 | Teratech Corporation | Portable ultrasound imaging system |
JP5591549B2 (ja) * | 2010-01-28 | 2014-09-17 | 株式会社東芝 | 超音波トランスデューサ、超音波プローブ、超音波トランスデューサの製造方法 |
US8206307B2 (en) * | 2010-03-10 | 2012-06-26 | Dbmedx Inc. | Ultrasound imaging probe and method |
JP5259762B2 (ja) | 2011-03-24 | 2013-08-07 | 株式会社東芝 | 超音波プローブ及び超音波プローブ製造方法 |
JP6003466B2 (ja) * | 2012-09-25 | 2016-10-05 | セイコーエプソン株式会社 | 集積回路装置、超音波測定装置、超音波プローブ及び超音波診断装置 |
JP2014083281A (ja) * | 2012-10-25 | 2014-05-12 | Seiko Epson Corp | 超音波測定装置、ヘッドユニット、プローブ及び診断装置 |
KR102185362B1 (ko) * | 2013-10-08 | 2020-12-02 | 삼성전자주식회사 | 초음파 프로브 및 이를 포함한 의료 장치 |
FR3020957B1 (fr) * | 2014-05-19 | 2021-07-23 | Commissariat Energie Atomique | Dispositif cutane, notamment pour application medicale. |
US10447236B2 (en) * | 2015-12-11 | 2019-10-15 | Canon Medical Systems Corporation | Ultrasonic probe |
DE102021129855A1 (de) * | 2021-11-16 | 2023-05-17 | Infineon Technologies Ag | Ultraschallberührungssensor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61220597A (ja) * | 1985-03-26 | 1986-09-30 | Nec Corp | 超音波トランスジユ−サ |
JPS63196877A (ja) * | 1987-02-12 | 1988-08-15 | Agency Of Ind Science & Technol | 超音波トランスジユ−サ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8431413U1 (de) * | 1984-10-25 | 1986-08-14 | Siemens AG, 1000 Berlin und 8000 München | Ultraschall-Detektionssensor in Hybridaufbau mit zugehöriger Elektronikschaltung |
JP2545861B2 (ja) * | 1987-06-12 | 1996-10-23 | 富士通株式会社 | 超音波探触子の製造方法 |
US5176140A (en) * | 1989-08-14 | 1993-01-05 | Olympus Optical Co., Ltd. | Ultrasonic probe |
US5327895A (en) * | 1991-07-10 | 1994-07-12 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic diagnosing system using ultrasonic probe |
US5295487A (en) * | 1992-02-12 | 1994-03-22 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
-
1991
- 1991-10-08 JP JP3260234A patent/JP3040554B2/ja not_active Expired - Fee Related
-
1992
- 1992-10-07 EP EP93906350A patent/EP0607443B1/en not_active Expired - Lifetime
- 1992-10-07 US US08/211,326 patent/US5435313A/en not_active Expired - Fee Related
- 1992-10-07 WO PCT/JP1992/001304 patent/WO1993007728A1/ja active IP Right Grant
- 1992-10-07 KR KR1019940700939A patent/KR100263403B1/ko not_active IP Right Cessation
- 1992-10-07 DE DE69228820T patent/DE69228820T2/de not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61220597A (ja) * | 1985-03-26 | 1986-09-30 | Nec Corp | 超音波トランスジユ−サ |
JPS63196877A (ja) * | 1987-02-12 | 1988-08-15 | Agency Of Ind Science & Technol | 超音波トランスジユ−サ |
Non-Patent Citations (1)
Title |
---|
See also references of EP0607443A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0772891A1 (en) * | 1994-07-22 | 1997-05-14 | Lockheed Martin IR Imaging Systems, Inc. | Ultrasound imaging array |
EP0772891A4 (en) * | 1994-07-22 | 1999-11-03 | Loral Infrared & Imaging Syst | NETWORK FOR ULTRASONIC IMAGING |
AU771799B2 (en) * | 1997-02-07 | 2004-04-01 | Astra Aktiebolag | Single dose inhaler II |
EP2676459B1 (en) * | 2011-02-15 | 2022-03-30 | Fujifilm Dimatix, Inc. | Piezoelectric transducers using micro-dome arrays |
Also Published As
Publication number | Publication date |
---|---|
JPH05103397A (ja) | 1993-04-23 |
DE69228820T2 (de) | 1999-10-07 |
JP3040554B2 (ja) | 2000-05-15 |
EP0607443A1 (en) | 1994-07-27 |
EP0607443B1 (en) | 1999-03-31 |
EP0607443A4 (en) | 1995-01-25 |
KR100263403B1 (ko) | 2000-08-01 |
DE69228820D1 (de) | 1999-05-06 |
US5435313A (en) | 1995-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1993007728A1 (en) | Ultrasonic wave probe | |
US6551248B2 (en) | System for attaching an acoustic element to an integrated circuit | |
JP4660087B2 (ja) | 超微細加工超音波トランスデューサ装置用バッキング材 | |
JP4043882B2 (ja) | 可変の音響インピーダンスを有する超音波変換器ウェハー | |
US4404489A (en) | Acoustic transducer with flexible circuit board terminals | |
US6094988A (en) | Electrical coupling for piezoelectric ultrasound detector | |
WO2004021404A8 (en) | Ultrasonic imaging devices and methods of fabrication | |
US20080315331A1 (en) | Ultrasound system with through via interconnect structure | |
EP1944095A3 (en) | Device, system, and method for structural health monitoring | |
ATE538879T1 (de) | Hochauflösende intravaskuläre ultraschalltransducervorrichtung mit einem flexiblen substrat und methode zu seiner herstellung | |
CN103767732A (zh) | 超声波测量装置、探头单元、探测器及诊断装置 | |
JP2007513563A (ja) | 高減衰バッキングを備えたic取り付けセンサを実装する装置及び方法 | |
JPH07327299A (ja) | 超音波トランスジューサ | |
US20170317264A1 (en) | Ultrasonic transducer and method for manufacturing the same | |
JP2606249Y2 (ja) | 超音波探触子 | |
CN107144299A (zh) | 一种超声传感器 | |
JPH08307995A (ja) | 超音波探触子 | |
CN109952768B (zh) | 用于超声阵列的具有冗余连接点的柔性电路 | |
JPH0419858B2 (ja) | ||
JPS61245700A (ja) | 超音波探触子およびその製造方法 | |
JPH07124159A (ja) | 超音波プローブ及びその製造方法 | |
JP2945980B2 (ja) | 超音波探触子 | |
JP2977622B2 (ja) | 超音波による信号伝送機能を備えた半導体装置および超音波信号伝送方法 | |
JPH07274296A (ja) | 配列型の超音波探触子 | |
JPS61118099A (ja) | 超音波プロ−ブ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 08211326 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1993906350 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1993906350 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1993906350 Country of ref document: EP |