WO1997015837A2 - Flexibly suspended heat exchange head for a dut - Google Patents
Flexibly suspended heat exchange head for a dut Download PDFInfo
- Publication number
- WO1997015837A2 WO1997015837A2 PCT/US1996/016930 US9616930W WO9715837A2 WO 1997015837 A2 WO1997015837 A2 WO 1997015837A2 US 9616930 W US9616930 W US 9616930W WO 9715837 A2 WO9715837 A2 WO 9715837A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat exchange
- dut
- module
- plate
- thermoconductive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/043,098 US6392431B1 (en) | 1996-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a DUT |
EP96936847A EP0857304A2 (en) | 1995-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a dut |
AU74670/96A AU7467096A (en) | 1995-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a dut |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3316895P | 1995-10-23 | 1995-10-23 | |
US60/033,168 | 1995-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997015837A2 true WO1997015837A2 (en) | 1997-05-01 |
WO1997015837A3 WO1997015837A3 (en) | 1997-05-29 |
Family
ID=21868907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/016930 WO1997015837A2 (en) | 1995-10-23 | 1996-10-23 | Flexibly suspended heat exchange head for a dut |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0857304A2 (en) |
AU (1) | AU7467096A (en) |
WO (1) | WO1997015837A2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5966940A (en) * | 1997-11-18 | 1999-10-19 | Micro Component Technology, Inc. | Semiconductor thermal conditioning apparatus and method |
GB2346703B (en) * | 1997-10-07 | 2002-06-19 | Reliability Inc | Burn-in board with adaptable heat sink device |
US6628132B2 (en) | 2001-08-10 | 2003-09-30 | Teradyne, Inc. | Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques |
US6717115B1 (en) | 2000-04-25 | 2004-04-06 | Teradyne, Inc. | Semiconductor handler for rapid testing |
WO2009046946A1 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electronic components in particular ic's with a heat conducting body |
WO2009046945A2 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electrical components in particular ic's |
EP1936663A3 (en) * | 2006-12-22 | 2009-07-22 | Espec Corp. | System for testing the durability of objects under thermally hard circumstances |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0341156A1 (en) * | 1988-05-06 | 1989-11-08 | Carrier S.A. | Device for supporting and thermally regulating a piece and semi-conductor circuit plates testing apparatus comprising such a device |
US4918928A (en) * | 1987-12-17 | 1990-04-24 | Kabushiki Kaisha Kobe Seikosho | Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature |
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US5148003A (en) * | 1990-11-28 | 1992-09-15 | International Business Machines Corporation | Modular test oven |
WO1994022029A1 (en) * | 1993-03-19 | 1994-09-29 | Ej Systems, Inc. | Burn-in module |
-
1996
- 1996-10-23 AU AU74670/96A patent/AU7467096A/en not_active Abandoned
- 1996-10-23 WO PCT/US1996/016930 patent/WO1997015837A2/en not_active Application Discontinuation
- 1996-10-23 EP EP96936847A patent/EP0857304A2/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US4918928A (en) * | 1987-12-17 | 1990-04-24 | Kabushiki Kaisha Kobe Seikosho | Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature |
EP0341156A1 (en) * | 1988-05-06 | 1989-11-08 | Carrier S.A. | Device for supporting and thermally regulating a piece and semi-conductor circuit plates testing apparatus comprising such a device |
US5148003A (en) * | 1990-11-28 | 1992-09-15 | International Business Machines Corporation | Modular test oven |
WO1994022029A1 (en) * | 1993-03-19 | 1994-09-29 | Ej Systems, Inc. | Burn-in module |
Non-Patent Citations (1)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 33, no. 12, May 1991, NEW YORK US, pages 85-86, XP000121597 "MODULE PROBE PACKAGE" * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2346703B (en) * | 1997-10-07 | 2002-06-19 | Reliability Inc | Burn-in board with adaptable heat sink device |
US5966940A (en) * | 1997-11-18 | 1999-10-19 | Micro Component Technology, Inc. | Semiconductor thermal conditioning apparatus and method |
US6717115B1 (en) | 2000-04-25 | 2004-04-06 | Teradyne, Inc. | Semiconductor handler for rapid testing |
US6628132B2 (en) | 2001-08-10 | 2003-09-30 | Teradyne, Inc. | Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques |
EP1936663A3 (en) * | 2006-12-22 | 2009-07-22 | Espec Corp. | System for testing the durability of objects under thermally hard circumstances |
WO2009046946A1 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electronic components in particular ic's with a heat conducting body |
WO2009046945A2 (en) * | 2007-10-05 | 2009-04-16 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electrical components in particular ic's |
WO2009046945A3 (en) * | 2007-10-05 | 2009-06-25 | Multitest Elektronische Syst | Plunger for holding and moving electrical components in particular ic's |
US8232815B2 (en) | 2007-10-05 | 2012-07-31 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electronic components in particular ICS |
US8303008B2 (en) | 2007-10-05 | 2012-11-06 | Multitest Elektronische Systeme Gmbh | Plunger for holding and moving electrical components |
Also Published As
Publication number | Publication date |
---|---|
AU7467096A (en) | 1997-05-15 |
WO1997015837A3 (en) | 1997-05-29 |
EP0857304A2 (en) | 1998-08-12 |
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