WO1997017619A1 - Transporteur, changeur de position et dispositif de prelevement pour circuits integres - Google Patents
Transporteur, changeur de position et dispositif de prelevement pour circuits integres Download PDFInfo
- Publication number
- WO1997017619A1 WO1997017619A1 PCT/JP1995/002393 JP9502393W WO9717619A1 WO 1997017619 A1 WO1997017619 A1 WO 1997017619A1 JP 9502393 W JP9502393 W JP 9502393W WO 9717619 A1 WO9717619 A1 WO 9717619A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor device
- posture
- rail
- attitude
- horizontal
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Definitions
- the present invention generally relates to a semiconductor device, in particular, a typical example of an IC (semiconductor integrated circuit) for testing an IC in an IC tester (commonly referred to as an IC tester).
- an IC tester commonly referred to as an IC tester
- Ic handler semiconductor device transfer processing equipment
- DUT IC under test
- the present invention relates to an IC transfer device and an IC attitude conversion device used when performing an operation, and an IC removal device used when removing an IC from a magazine.
- IC dual in-line type
- any shape of package can be suctioned by the vacuum suction means, except that the IC package has a flat shape so that it can be easily suctioned by the vacuum suction means.
- the IC package has a flat shape so that it can be easily suctioned by the vacuum suction means.
- the rod-shaped magazine is a cylindrical body, it is possible to easily prevent the IC from spilling down by closing the openings at both ends. Therefore, at the distribution stage, a rod-shaped magazine is easier to handle. Therefore, it is safer and safer to handle ICs that can be stored in a magazine in a magazine as much as possible.
- the magazine is tilted, and the ICs are poured out of the slanted magazine and are reloaded into trays. For this reason, it is necessary to transfer the IC in the inclined position to the tray in the horizontal position, and the conversion of the position is a major obstacle.
- Figure 15 shows the proposed magazine and tray type horizontal transfer IC handler that was previously proposed.
- the configuration of the used magazine and tray transshipment part that is, the configuration of the posture conversion part is shown.
- the tray 21 for the user storing the IC under test is sent from the tray supply unit 20 to the tray conversion unit 30, and the user conversion is performed by the tray conversion unit 30.
- the transshipment of this IC is performed by the horizontal transport means 40. That is, the horizontal transfer means 40 is provided with a vacuum suction head 41, and the vacuum suction head 41 is moved up and down by the air cylinder 42, and is moved in the horizontal plane by the XY driving means (not shown). Is moved to an arbitrary position, and the IC is transferred from the user tray 21 to the test tray 31.
- the user tray 21 is a tray for storing the IC and distributing it in a factory or market. For this reason, it is made of a plastic material or the like, and the shape of the concave portion for storing the IC is made larger than the shape of the IC for storing the IC, so that the structure can be easily inserted and removed.
- the test tray 31 applies a high-temperature or low-temperature thermal stress to the IC under test in a path leading to the test section 10 of the IC test, and is made of a material that can withstand this thermal stress.
- a metal frame is provided with about 16 to 64 IC carriers each having a recess for accommodating IC.
- the IC carrier is made of a heat-resistant resin material.Once the IC under test is inserted, the IC is accurately positioned and gripped, the locking mechanism and the terminals of the locked IC are exposed on the back side of the IC carrier.
- the test unit 10 is provided with a function of contacting a test contact connected to the IC tester with the output terminal.
- Reference numeral 22 denotes a tray transport means for taking out the user tray 21 from the tray supply unit 20 and carrying the user tray 21 to the tray conversion unit 30.
- 50 indicates a magazine supply unit.
- bar-shaped magazines 51 are stacked and stored.
- the uppermost magazine 51 stored in the magazine supply unit 50 is taken out and placed on the elevating means 52.
- Lifting means 5 2 Is rotatably supported, and lifts one end side (right side in the illustrated example) of the magazine 51 placed by the rotating operation to hold the magazine 51 in an inclined posture.
- a movable stopper 52A is provided at the lower end of the elevating means 52 in the inclined state, and the IC of the IC is maintained until the magazine 51 is set to the predetermined inclined position g by the movable stopper 52A. Stop the spill.
- the magazine 51 is set at a predetermined inclined position and the magazine 51 is connected to the buffer rail 53 provided downstream thereof, the movable stopper 52A is released, and the IC is released from the magazine 51. Flows into the buffer rail 53.
- the buffer rail 53 also has a movable stopper 53A at the lower end.
- the movable stop 53 A performs an operation of receiving the IC located at the lowermost stage of the buffer rail 53.
- An escape rail 54 is provided downstream of the buffer rail 53 so as to move in a direction (lateral direction) perpendicular to the direction in which the IC flows.
- the escape rail 54 has, for example, four substantially parallel grooves for receiving ICs, and each time one IC is received in each groove, the escape rail 54 moves laterally to a total of four grooves. Receive IC.
- the length of the groove for receiving the IC corresponds to the length of the package of the IC, and by flowing the IC from the sofa rail 53, one IC is taken into one groove of the escape rail 54.
- the posture changing device 60 includes an arm 61 whose upper end is pivotally supported and has a rotation plane in a vertical plane, a driving means 63 supported by a lower end of the arm 61, and a lower part of the driving means 63.
- a vacuum suction head 62 supported so as to be able to reciprocate linearly and an arm 61 reciprocally rotate within a rotation angle ⁇ , for example, a rotary air cylinder 64 can be constituted.
- the driving means 63 may be, for example, an air cylinder. Reciprocate linearly in the axial direction of arm 61.
- Rotation angle 0 is parallel to the angle position where the end surface of the vacuum suction head 62 is parallel to the IC package plane supported by the escape rail 54 and the plane of the transfer stand 65 waiting on the horizontal plane. Is selected as the angle connecting between the angle positions.
- the vacuum suction head 62 sucks the IC at an angular position facing the IC supported by the escape rail 54, and the arm 61 is rotated by an angle 0 by the rotary air cylinder 64 in this sucked state. Is done.
- the posture of the IC is converted to the horizontal posture. In this state, the vacuum suction head 62 is moved downward by the driving operation of the driving means 63, and the IC is transferred to the transfer platform 65.
- a positioning recess is formed on the upper surface of the transfer stand 65 and is surrounded by an outwardly inclined surface with four sides facing upward. By dropping an IC into this positioning recess, the IC is placed next to the transfer path.
- the position of the IC with respect to the horizontal transfer means 70 located at the position is defined. That is, when receiving the IC from the posture conversion device 60, the transfer platform 65 moves in the direction of the arrow X and stops at the position of the transfer start point A of the horizontal transfer means 70. Above the transfer start point A, a vacuum suction head 71 is waiting. The vacuum suction head 71 adsorbs the IC and transports the IC to the tray conversion section 30, and drops the IC into the test tray 31. Therefore, defining the position of I C by the positioning concave portion of the transfer stand 65 is very useful for improving workability.
- the escape rail 54 provided downstream of the buffer rail 53 has, for example, about 4 to 8 IC storage grooves in the lateral direction (moving direction of the escape rail). Drop one IC from each buffer rail 53 into each groove of the book. In other words, every time one IC is dropped, the escape rail 54 is pitched horizontally one pitch at a time, and when the IC is dropped into all the IC storage grooves, the escape rail 54 is further moved in the horizontal direction. It is moved and the attitude conversion device 60 is operated. Therefore, the attitude conversion device 60 is also provided with 4 to 8 vacuum suction heads 62, and converts the attitude of 4 to 8 ICs at a time.
- the horizontal transfer means 70 also has 4 to 8 vacuum suction heads 71 and is configured to carry 4 to 8 ICs to the test tray 31 at one time. It is not limited to this number. As described above, in the tray / magazine dual-purpose IC handler proposed earlier, the IC under test supplied from the magazine 51 via the buffer rail 53 and the escape rail 54 is particularly connected to the test tray 31. Since the transfer stand 65 and the horizontal transfer means 70 are provided as the transfer means, there are disadvantages in that the number of components of the apparatus increases and the cost increases. In addition, since the transport path of the IC supplied from the magazine 51 becomes longer, the time required for transporting the IC becomes longer. As a result, there is a disadvantage that the test time of the IC housed in the magazine 51 becomes longer. Disclosure of the invention
- One object of the present invention is to provide a semiconductor device transport apparatus capable of shortening a test time of a semiconductor device under test supplied from a rod-shaped magazine for housing a semiconductor device, and a semiconductor device cooperating with the semiconductor device transport device S.
- the purpose is to provide a device attitude conversion device.
- Another object of the present invention is to provide a semiconductor device posture conversion device S that can relatively quickly convert the posture of a semiconductor device from an inclined posture to a horizontal posture.
- Still another object of the present invention is to provide a semiconductor device unloading apparatus capable of efficiently sending out semiconductor devices from a bar-shaped magazine for housing semiconductor devices while holding the magazine in a horizontal position.
- a rod-shaped semiconductor device storage magazine is inclined and supported, and the semiconductor device stored inside is naturally slid by this inclination, and the semiconductor device storage magazine is removed from the semiconductor device storage magazine.
- the posture of the discharged semiconductor device is converted into a horizontal posture by the posture conversion device S for converting the posture of the discharged semiconductor device from the inclined posture to the horizontal posture, and the semiconductor device in the horizontal posture is suctioned by the device suction means and horizontally moved.
- a semiconductor device transfer device in which the semiconductor device is moved onto a test tray by a transfer means, and the sucked semiconductor device is dropped into an arbitrary storage recess on the test tray.
- a semiconductor device posture changing means is provided at a lower end of a rod-shaped semiconductor device storage magazine supported in an inclined state.
- the semiconductor device under test is directly loaded on the test tray from the semiconductor device attitude conversion means. According to this configuration, the transport path of the semiconductor device can be shortened. As a result, the time required for IC testing can be reduced. In addition, since the configuration is simplified, costs can be reduced.
- a rod-shaped semiconductor device storage magazine is tilted and supported, and the semiconductor device stored therein is slid naturally by the tilt, thereby allowing the semiconductor device storage magazine to be slid.
- a semiconductor device attitude conversion device for discharging a semiconductor device from a semiconductor device and converting the attitude of the discharged semiconductor device from an inclined attitude to a horizontal attitude, wherein the semiconductor device storage magazine is provided downstream from the semiconductor device storage magazine.
- An escape rail is provided to separate the rows of semiconductor devices to be discharged one by one, and the semiconductor devices separated by the escape rail are fed into a posture conversion rail whose inclination gradually changes to a horizontal state. Convert the device's attitude to horizontal attitude, That the semiconductor device is adsorbed to the device suction means semiconductor devices posture converting device which is adapted to convey the test Bok ray is provided.
- a rod-shaped semiconductor device storage magazine is inclined and supported, and the semiconductor device stored therein is slid naturally by this inclination, thereby allowing the semiconductor device storage magazine to
- a semiconductor device attitude conversion device for discharging a semiconductor device from a semiconductor device and converting the attitude of the discharged semiconductor device from an inclined attitude to a horizontal attitude, wherein the semiconductor device storage magazine is provided downstream from the semiconductor device storage magazine.
- Escape rails are provided to separate the rows of semiconductor devices to be ejected one by one, and the semiconductor devices separated by these escape rails are sent to a posture-changing movable rail that has an inclined posture with its lower end pivotally supported.
- a semiconductor device attitude conversion apparatus is provided.
- a rod-shaped semiconductor device storage magazine is tilted and supported, and the semiconductor device stored therein is slid naturally by this inclination, thereby allowing the semiconductor device storage magazine to be slid.
- a semiconductor device attitude conversion device for discharging a semiconductor device from a semiconductor device and converting the attitude of the discharged semiconductor device from an inclined attitude to a horizontal attitude, wherein the semiconductor device storage magazine is provided downstream from the semiconductor device storage magazine.
- Escape rails are provided to separate the rows of semiconductor devices to be ejected one by one, and the semiconductor devices separated by these escape rails are sent to a posture-changing movable rail that has an inclined posture with its lower end pivotally supported.
- the attitude changing movable rail is rotated to a horizontal attitude to change the attitude of the semiconductor device to the horizontal attitude, and the horizontal attitude changing movable rail is moved away from the escape rail in the horizontal direction. Then, the semiconductor device in the horizontal position is sucked by the device sucking means and transported to the test tray.
- a rod-shaped semiconductor device storage magazine is inclined and supported, and the semiconductor device stored therein is slid naturally by this inclination, thereby allowing the semiconductor device storage magazine to be slid.
- a semiconductor device posture conversion concealment for converting the posture of the discharged semiconductor device from an inclined posture to a horizontal posture, wherein the semiconductor device storage magazine is provided downstream of the semiconductor device storage magazine.
- An escape rail is provided to separate the rows of semiconductor devices discharged from the device one by one, and the semiconductor device separated by this escape rail is converted into a posture-changing movable rail whose upper end is in a tilted posture.
- a rod-shaped magazine for storing semiconductor devices is supported by being inclined, and the semiconductor device housed therein is automatically inclined by this inclination.
- a semiconductor device storage device for causing the semiconductor device to be ejected from the magazine for storing semiconductor devices by sliding, and changing the posture of the discharged semiconductor device from an inclined posture to a horizontal posture.
- An escape rail that separates the rows of semiconductor devices discharged from the magazine for storing semiconductor devices into one by one is provided downstream of the device, and the semiconductor devices separated by this escape rail are received one by one, and the receiving position is accurately determined.
- Positioning means in an inclined position for good positioning is provided, and the semiconductor device in the inclined position supported by the positioning means is adsorbed by device adsorbing means rotatably supported in a vertical plane. Is rotated vertically to the horizontal plane, and the sucked half Provided is a semiconductor device posture conversion apparatus that converts a posture of a conductor device into a horizontal posture and conveys the semiconductor device in the horizontal posture to a test tray.
- a rod-shaped semiconductor device storage magazine is tilted and supported, and the semiconductor device stored therein is slid naturally due to the tilt, whereby the semiconductor device storage magazine is formed.
- the buffer rail in the inclined posture is located downstream of the semiconductor device storage magazine.
- a movable stopper is provided at the lower end of the buffer rail to control the semiconductor device located at the lower end to prevent the semiconductor device from flowing out and to discharge the semiconductor device from the buffer rail as necessary.
- At least one pair that rotates around the axis of rotation and is diametrically opposed downstream A rotating body for posture conversion provided with a rotating arm of the type described above, wherein when the one of the pair of rotating arms is arranged so as to have the same inclination angle as the inclination angle of the buffer rail, the other rotating arm Each of the rotating arms is connected to the downstream of the buffer rail so as to receive the semiconductor device having the inclined posture, so that each of the rotating arms has the same inclination angle as that of the rotating arm.
- the tilt posture of the semiconductor device supported by the rotating arm is converted into a horizontal posture, and the semiconductor device in the horizontal posture is sucked by the device suction means and transported to the test tray.
- An apparatus is provided.
- a rod-shaped semiconductor device storage magazine is inclined and supported, and the semiconductor device stored therein is slid naturally by this inclination, thereby allowing the semiconductor device storage magazine to
- the semiconductor device storage magazine is provided downstream of the semiconductor device storage magazine.
- a buffer rail with an inclined attitude is provided to hold a plurality of semiconductor devices discharged from the semiconductor device. The semiconductor device at the lowermost end of the semiconductor device held by the buffer rail is held down, and released as necessary.
- a movable stopper for ejecting the device is provided at a lower end of the buffer rail, and the buffer is A pair of rotary arms having a rotation axis at an angle obtained by dividing an angle between the axis of the semiconductor device storage magazine and the buffer rail and a horizontal plane into two equal parts, and diametrically opposed to each other.
- a rotation body for posture change is provided, and one of the rotation arms is connected to the lower end of the buffer rail, and the other rotation arm is provided with the other rotation arm when it is arranged on the same axis as the buffer rail.
- Each of the rotating arms is connected to the lower end of the buffer rail, and has an inner surface of the device when the semiconductor device is fed from the buffer rail.
- a device suction means for sucking is provided, and the attitude of the semiconductor device sucked by the device suction means is changed to a horizontal attitude by rotating the rotary arm by 180 °.
- a semiconductor device orientation conversion device is provided below the semiconductor device in this horizontal orientation, in which the semiconductor device separated from the device suction means is received in a horizontal attitude, and a position S determining means for regulating the receiving position S is provided.
- Equipment S is provided.
- a rod-shaped semiconductor device storage magazine is tilted and supported, and the semiconductor device stored therein is slid naturally by the tilt, thereby providing the semiconductor device storage magazine.
- a semiconductor device attitude conversion device for discharging a semiconductor device from a semiconductor device and converting the attitude of the discharged semiconductor device from an inclined attitude to a horizontal attitude, wherein the semiconductor device storage magazine is provided downstream from the semiconductor device storage magazine.
- Escape rails are installed in an inclined position to separate the semiconductor device rows to be discharged one by one.
- a movable stopper for holding the semiconductor device separated by the escape rail is provided on the escape rail; and a positioning means arranged in a horizontal posture at a downstream position of the escape rail is provided.
- the tip of the semiconductor device sent out by releasing the movable stopper abuts against the end wall of the positioning recess formed in the positioning means and is positioned so as to remain in an inclined posture.
- a conversion device is provided.
- a driving unit for sending a semiconductor device from a rod-shaped semiconductor device storage magazine supported in a horizontal posture, a buffer rail for storing a plurality of semiconductor devices extruded by the driving unit,
- a semiconductor device pick-up comprising: a movable stopper provided near an outlet of the buffer rail; and positioning means for receiving the semiconductor devices extruded from the buffer rail one by one and holding the semiconductor devices positioned in a horizontal position.
- An apparatus is provided.
- FIG. 1 is a schematic side view for explaining a configuration of a first embodiment of a posture conversion unit according to the present invention applied to a magazine / tray combined type IC handler.
- FIG. 2 is a perspective view showing in detail the arrangement relationship among the magazine, buffer rail, escape rail, and attitude changing rail shown in FIG.
- FIG. 3 is a schematic side view for explaining the configuration of the second embodiment of the attitude conversion unit according to the present invention.
- FIG. 4 is a perspective view showing in detail the arrangement relationship among the magazine, the buffer rail, the escape rail, and the movable rail for posture change shown in FIG.
- FIG. 5 is a schematic side view for explaining the configuration of a third embodiment of the attitude conversion unit according to the present invention.
- FIG. 6 is a schematic side view for explaining a configuration of a fourth embodiment of the attitude conversion unit according to the present invention.
- FIG. 7 is a schematic side view for explaining a configuration of a fifth embodiment of the attitude conversion unit according to the present invention.
- FIG. 8 is a schematic side view for explaining the configuration of the sixth embodiment of the attitude conversion unit according to the present invention.
- FIG. 9 is a plan view of FIG. 8 with a part removed.
- FIG. 10 is a schematic side view for explaining the configuration of a seventh embodiment of the attitude conversion unit according to the present invention.
- FIG. 11 is a right side view of FIG. 10 with a part removed.
- FIG. 12 is a schematic side view for explaining the configuration of the eighth embodiment of the attitude conversion unit according to the present invention.
- FIG. 13 is a plan view of FIG. 12 with a part removed.
- FIG. 14 is a schematic side view for explaining the configuration of an embodiment of the IC take-out device according to the present invention.
- FIG. 15 is a schematic side view for explaining the configuration of the magazine / tray combined type IC handler of the prior application.
- FIG. 1 shows the configuration of a first embodiment of a posture conversion unit according to the present invention applied to a magazine and tray type horizontal transfer system IC handler.
- the tray for user 21 is conveyed from the tray supply unit 20 to the tray conversion unit 30 by the tray conveyance unit 22, and the tray conversion unit 30 is used to test the user tray 21 from the user tray 21.
- the configuration of the portion for reloading the IC under test in 1 is the same as that of the conventional example described with reference to FIG.
- an attitude conversion device 160 is provided in proximity to the tray conversion unit 30, and the test IC in the inclined attitude is directly converted into the horizontal attitude by the attitude conversion apparatus 160, and the test tray 3 is moved by the horizontal transfer means. This is configured so as to be loaded into the unit 1, and this point and the configuration of the posture conversion unit 160 are particularly characterized.
- the attitude conversion device 160 is constituted by an attitude conversion rail 161.
- the attitude conversion rail 16 1 has the same inclination as that of the magazine 51 on the side (upstream side) that is in contact with the escape rail 54 that constitutes the escape mechanism, and therefore the inclination of the escape rail 54.
- FIG. 2 shows the relationship between the escape rail 54, the magazine 51, the buffer rail 53, and the attitude conversion level 161, in detail.
- the example of FIG. 2 shows a case in which four IC storage grooves 54 B are provided on the escape rail 54.
- a movable stopper 54A is provided at the lower end of each IC housing «54», and the IC under test poured from the buffer rail 53 by the movable stopper 54A is provided in each groove 5 of the escape rail 54. Supported within 4B.
- the escape rail 54 moves in the arrow X direction by one pitch of the IC storage groove 54B by, for example, a pulse motor PM.
- each IC storage groove 54B is received in each IC storage groove 54B.
- the escape rail 54 further moves in the direction of the arrow X, and comes into contact with the upper end of the posture conversion rail 161 constituting the posture conversion device 160.
- the movable stopper 54A is moved downward to be pulled into the IC storage groove 54B and held on the escape rail 54.
- the IC under test is poured into the upper end of the attitude conversion rail 16 1.
- the poured IC is gradually changed from an oblique posture to a horizontal posture according to the inclination of the posture conversion rail 161 while sliding on the posture conversion rail 161 by its own weight.
- the lower end of the attitude conversion rail 16 1 is closed, so that the I C slid under its own weight has its package end abutting on this closed end. Therefore, the position can be accurately defined by the closed end portion, as well as the posture-converted I.
- the alignment is performed at the lower end of the attitude conversion rail 161, so that the IC is transferred from the lower end of the attitude conversion rail 161 to the test tray 31 (see Fig. 1).
- a horizontal transfer means 40 for transferring the IC from the user tray 21 to the test tray 31 in the tray conversion section 30 can be used.
- the test tray 31 stopped in the tray conversion unit 30 Since the attitude conversion device 160 is arranged close to the device, the horizontal transport means 40 is also used as a transport means for transporting both the IC supplied from the user tray 21 and the IC supplied from the magazine 51. Can be.
- the vacuum suction head 41 of the horizontal transfer means 40 aligns the IC stopped at the lower end of the attitude conversion rail 16 1 with the center of gravity g of the IC and the axial center position ⁇ of the suction head 41.
- the IC can be reliably loaded on the test tray 31 by aligning the position at the lower end of the attitude conversion rail 16 1.
- FIG. 3 shows a configuration of a second embodiment of the attitude conversion unit according to the present invention.
- the posture conversion device 160 is constituted by a posture conversion movable rail 162 and an air cylinder 163 for rotating the posture conversion movable rail 162. It is configured.
- the posture changing movable rail 16 2 is provided on the downstream side of the escape rail 54, and in this embodiment, the downstream side of the posture changing movable rail 16 2 is pivotally supported, and the upstream side can rotate vertically.
- the vertical movement of the attitude changing movable rail 16 2 on the upstream side is performed by the air cylinder 16 3, and is indicated by the diagonal position fi shown in the figure facing the lower end of the escape rail 54 and the virtual line. It is turned to the horizontal position. That is, the IC is received from the escape rail 54 on the movable rail 16 for posture change at a diagonal position facing the lower end of the escape rail 54, and then the posture is changed by the driving force of the air cylinder 163. Rotate the movable rail 16 2 to the horizontal position to make the received IC take a horizontal position. Therefore, the posture of IC is changed from the oblique posture to the horizontal posture.
- FIG. 4 shows the relationship between the escape rail 54, the magazine 51, the buffer rail 53, and the movable rail 162 for posture change in detail.
- the escape rail 54 and the posture changing movable rail 162 have four IC storage grooves 54B and four IC receiving rails, respectively.
- the escape rail 54 moves to the position upstream of the posture changing movable rail 162, and the movable stopper 54A moves.
- the lower end of the movable rail 162 for posture conversion is closed by a closing plate 162A, and the position of the IC is aligned by the tip of the package of the IC abutting the closing plate 162A.
- drive the air cylinder 16 3 to lower the upstream side of the attitude changing movable rail 16 2 downward, and when the horizontal position is reached, drive the air cylinder 16 3 Stop.
- the posture changing movable rails 16 2 are maintained in a horizontal posture.
- the vacuum suction head 41 of the horizontal transfer means 40 is moved to the upper part of the movable rail 162 for posture change, and the IC is sucked and carried into the test tray 31.
- the test tray 3 1 (see FIG. Horizontal transfer means 40 for transferring ICs from the user tray 21 to the test tray 31 in the tray conversion section 30 can also be used as a horizontal transfer means for transferring ICs to the IC.
- the vacuum suction head 41 of the horizontal transfer means 40 aligns the IC stopped at the lower end of the attitude changing movable rail 16 2 with the center of gravity S of the IC and the axial center position of the suction head 41.
- the IC can be reliably loaded on the test tray 31 by alignment at the lower end of the posture changing movable rail 16 2 because the IC can be sucked in a state where the IC is held.
- FIG. 5 shows the configuration of a third embodiment of the attitude conversion unit according to the present invention.
- the attitude changing device 160 is provided with an attitude changing movable rail 162 having the same configuration as that of the second embodiment and an air for rotating the attitude changing movable rail 162.
- the movable rail for attitude change 1 6 2 mounted on the transfer platform 1 6 4 receives the IC under test from the escape rail 5 4 in its inclined position S, and after being turned to the horizontal position S, the transfer table 1 6 4 is moved toward the tray converter 30 by a small distance by the air cylinder 16 4 A. Thereafter, the vacuum suction head 41 of the horizontal transfer means 40 is moved to the upper part of the movable rail 16 2 for posture change to suck the I C and carried into the test tray 31.
- tray conversion After converting the movable rails 1 6 2 for attitude conversion to the horizontal attitude, tray conversion Moving the vacuum suction head 41 of the horizontal transfer means 40 sufficiently close to the predetermined position g of the IC under test on the movable rail 162 for posture change if it is moved a short distance in the direction approaching the part 30 Is obtained. That is, in the second embodiment shown in FIGS. 3 and 4, when the posture changing movable rail 162 is turned to the horizontal posture, the position of the posture changing movable rail 16 A part of it is placed under the escape rail 54. For this reason, the escape rail 54 may hinder the approach of the horizontal transfer means 40 to the top surface of the movable rail 162 for changing the attitude. However, according to the configuration of the third embodiment, the escape rail 54 escapes. The rail 54 does not hinder the approach of the horizontal transport means 40 at all. The other configurations and operations are the same as those in the second embodiment, and thus description thereof will be omitted.
- FIG. 6 shows the configuration of a fourth embodiment of the attitude conversion unit according to the present invention.
- the attitude conversion device 160 includes an attitude conversion movable rail 162 and an air cylinder 1 for rotating the attitude conversion movable rail 162.
- the upstream side of the attitude changing movable rail 16 2 is pivotally supported, and the downstream side is vertically rotated by an air cylinder 16 3. It is configured to be moved. According to this configuration, when the posture changing movable rail 16 2 is rotated to the horizontal posture, the upstream side of the posture changing movable rail 16 2 does not enter the lower side of the escape rail 54. For this reason, unlike the case of the third embodiment shown in FIG.
- FIG. 7 shows a configuration of a fifth embodiment of the attitude conversion unit according to the present invention.
- the attitude converting device 160 includes a fixed rail 165, an arm 61 whose upper end is pivotally supported and has a rotation plane in a vertical plane, and the arm 61 having a predetermined rotation angle. And a rotary air cylinder 64, for example.
- an air cylinder 42 for linearly reciprocating the vacuum suction head 41 of the horizontal transfer means 40 is supported.
- the air cylinder 42 and the vacuum suction head 41 of the horizontal transfer means 40 can be reciprocally driven within a predetermined rotation angle range. It is.
- the fixed rail 16 5 is fixed to the downstream side of the escape rail 54 with the same inclination posture as that of the escape rail 54.
- the lower end of the fixed rail 165 is closed, and a function for aligning the position of the IC poured from the escape rail 54 is added.
- the vacuum suction head 41 which is supported and moved by the horizontal transfer means 40, moves the air cylinder 42, which linearly reciprocates the head 41, between the solid line position S shown in FIG.
- the air cylinder 42 and the horizontal conveying means 40 via the arm 61 and the rotary air cylinder 64 so that the air cylinder 42 can rotate by a predetermined angle. It reciprocates between the position and the imaginary line position as shown by the arrow in the figure.
- the horizontal transfer means 40 moves the vacuum suction head 41 to a position slightly downstream of the fixed rail 165, for example.
- the rotary air cylinder 64 is driven to rotate the vacuum suction head 41 in a counterclockwise direction (upward), and the end surface of the vacuum suction head 41 is fixed to the fixed rail 16 5.
- the IC package supported by is rotated in a position parallel to the plane of the IC package.
- the air cylinder 42 is driven to extrude the vacuum suction head 41 so that the vacuum suction head 41 is inclined. Attract IC on fixed rail 1 65 in posture.
- the air cylinder 42 is driven again to retract the vacuum suction head 41 by a predetermined distance, and then the rotary air cylinder 64 is driven to rotate the vacuum suction head 41 clockwise. To return to the vertical position, and convert the position of the sucked IC to the horizontal position.
- the vacuum suction head 41 is horizontally moved by the horizontal transfer means 40 and stopped at a predetermined position above the tray conversion unit 30 while the IC in the horizontal posture is being sucked.
- the air cylinder 42 is driven to push out the vacuum suction head 41, the IC suction is released, and the IC is dropped into the test tray 31 stopped at the tray converter 30. . Therefore, according to this embodiment, the change of the attitude of the IC and the transfer of the IC to the test tray 31 can be performed at the same time, and the IC can be efficiently loaded on the test tray 31.
- the other configurations and operations are the same as those in the second embodiment, and thus description thereof will be omitted. FIGS.
- FIG. 8 and 9 show the configuration of a sixth embodiment of the attitude conversion unit according to the present invention.
- a substantially cross-shaped plane provided with four rotating arms 166A, 166B, 166C, and 166D protruding outward in the diametric direction at an angular interval of 90 ° about the rotation axis.
- the attitude converting device 160 is constituted by a shape-changing attitude rotating body and a pulse motor 167 for rotating the attitude-changing rotating body by a predetermined angle (90 ° in this embodiment).
- each rotating arm is a pair of diametrically opposed rotating arms 166A, 1668 and 166 (3, 166D, which are spaced apart by an angle of 180 ° about the rotation axis.
- each of the pair of diametrically opposed rotating arms is tilted so that one of the inclinations coincides with the axis of the buffer rail 53 in the extending direction, and the other rotating arm maintains a horizontal posture.
- the same upward tilt angle is given to the arm, so to satisfy this condition, the plane of the body around the rotation axis of the rotation body for posture change rotates in a state inclined from the horizontal plane as shown in Fig. 8. It is supported to
- Each rotary arm 166 A, 166 B, 166 C, 166 D has an IC storage recess for storing the IC under test, and each rotary arm is rotated by the pulse motor 167 to a position aligned with the buffer rail 53. Then, one IC is poured from the buffer rail 53 into the IC housing recess of each rotating arm, and the IC can be received. Also, each rotating arm has 180. In the rotated position S, the IC in the IC storage recess takes a horizontal posture, so that the IC can be sucked by the vacuum suction head 41 of the horizontal transfer means 40 (see FIG. 3). Therefore, the IC can be carried into the test tray 31 by the horizontal carrying means 40.
- a guide 168 is provided on the periphery of the rotary arms 166A to 166D to prevent the IC from jumping out due to centrifugal force when the rotation body for posture change rotates. After the IC is sucked by the vacuum suction head 41 of the horizontal transfer means 40, the IC does not exist in the IC housing recess of the rotating arm of the posture changing rotating body, so the guide 168 is provided as shown in FIG.
- the rotating arms 166A to 166D have an escape rail in addition to the posture changing function. It can have 54 functions.
- the buffer rail 53 can be used to suppress the most downstream IC.
- One movable stopper 53A may be provided. When the movable stopper 53 A is moved downward to release the I C that has been held down, the I C flows into the I C storage recess of the rotating arm at the opposing position S.
- the movable stopper 53 A When the flow of I C stops, the movable stopper 53 A is returned to its original position, and the I C at the most downstream position of the buffer rail 53 is suppressed. In this state, by rotating the rotary arm by the pulse motor 167, the IC stored in the rotary arm can be rotated. For example, mechanical rotation with the IC stored in the buffer rail 53 is possible. Even if there is a connection (a state in which the packages are connected to each other with burrs, etc.), this can be removed.
- the escape rail 54 provided for separating the ICs one by one can be omitted, the time for the IC to move through the escape rail 54 can be omitted. it can.
- the configuration is simplified.
- the posture of the IC can be changed at a high speed and transferred to the test tray 31, thereby improving workability.
- FIGS. 10 and 11 show the configuration of a seventh embodiment of the attitude conversion unit according to the present invention.
- the attitude conversion device 1660 is constituted by the air cylinder 172.
- Each of these rotary arms 1666A and 1666B has an IC storage section for receiving the IC along the leg (from the upper bottom to the lower base).
- the rotating arm (166 A) that moves upward is arranged on the same axis as the extension axis of the magazine 51, and the other rotating arm (166 B) is positioned below. It is rearranged in a horizontal posture at the position of the part.
- the IC is discharged from the magazine 51 with the terminal surface (the surface from which the terminal protrudes) of the IC facing upward and the rear surface (the surface on which the terminal does not protrude) downward, and rotated through the buffer rail 53.
- Vacuum suction heads are provided in the IC housings of the rotating arms 1666A and 1666B respectively.
- the 169 A and 169 B are attached, and the back of the IC that has been poured into the IC storage unit is sucked and held. As a result, the IC is firmly held, and does not jump out to the outside when the posture changing rotating body rotates.
- Rotating arms 1666A and 1666B are rotary air cylinders with IC absorbed
- Positioning means 170 is arranged at the lower position where the rotating arm that has sucked the IC has rotated 180 °, and the IC converted to the horizontal posture is a predetermined distance from the S determining means 170 At the same time.
- the suction force of the vacuum suction head (169 B in the figure) that is sucking the IC is temporarily interrupted, and the IC is dropped into the concave portion 171 of the positioning means 170.
- the positioning means 170 has a plurality of recesses 171 in the tangential direction of the rotating circle of the posture changing rotating body, and in the arrangement direction of these recesses 171, Therefore, it is supported so that it can move in the tangential direction.
- the rotary arms 1668 and 1666B reciprocate 180 ° in rotation by the rotational driving force of the rotary air cylinder 172. Therefore, the ICs are alternately supplied from the rotating arms 1666 A and 1666 B to the concave portions 17 1 of the positioning means 170. Each time one IC is supplied, the positioning means 170 moves by one row of the recesses 171, and sends an empty recess to the lower position where the rotating arm 16668 or 166B arrives.
- the positioning means 170 moves to a position apart from the lower position of the rotating arms 1666A and 1666B, although not particularly shown. At that position, the IC is delivered to the horizontal transport means 40 (see Fig. 3).
- the horizontal transport means 40 transports the IC stored in the concave portion 17 1 of the positioning means 170 to the test tray by the above-described operation.
- reference numerals 17A and 173B denote hoses for connecting the vacuum suction heads 169A and 169B to a vacuum suction source.
- the rotary arms 1666A and 1666B were caused to reciprocate by 180 ° by the rotary driving force of the rotary air cylinder 172.
- 166B may be rotated by 180 ° in either direction.
- the escape rail 54 provided to separate the ICs one by one can be omitted, the time for the IC to move through the escape rail 54 can be omitted. Can be simplified. Furthermore, since the rotation type is used, the posture of the IC can be changed at a high speed and transferred to the test tray 31, thereby improving workability.
- FIGS. 12 and 13 show the configuration of an eighth embodiment of the attitude conversion unit according to the present invention.
- a posture conversion device 160 is constituted by positioning means 170 for receiving an IC directly from the inclined escape rail 54 and converting it to a horizontal posture, and positioning the IC.
- the movable stopper 54A is provided with an extension projection 54C protruding downstream. That is, although the IC taken in from the buffer rail 53 to the escape rail 54 is in an inclined posture, the IC in this inclined posture is obliquely dropped into the concave portion 171 of the positioning means 170 as it is.
- the IC moves on the extension protrusion 54C protruding to the downstream side of the movable stopper 54A of the escape rail 54 and drops into the recess 171 of the positioning means 170.
- the positioning means 170 is moved in the direction of the arrow X shown in Figs. 12 and 13 while the front end side of the IC is in contact with the positioning wall of the recess 171, and the rear end side of the IC is moved.
- the IC is converted to a horizontal position and is positioned by the recess 17 1.
- an IC accommodating groove 54B capable of receiving eight ICs is juxtaposed.
- the escape rail 54 is moved horizontally by one pitch.
- the escape rail 54 is moved to the upper part of the positioning means 170, and the movable stopper 54A provided in each IC storage groove 54B is moved. Pull down to drain the IC.
- the I C is dropped by the extension projecting piece 54 C in a posture in which the tip side of the recess 17 1 of the positioning means 170 hits the tip side wall surface.
- the rear end of the IC When the front end of the IC is in contact with the side wall of the front end of the recess 171, the rear end of the IC remains on the projecting piece 54C, and the IC stops in an inclined posture (the state shown in Fig. 12). ).
- the position determining means 170 in the direction of the arrow X By moving the position determining means 170 in the direction of the arrow X in this state, the entire IC can be dropped into the concave portion 171.
- the escape rail 54 or the movable stopper 54A may be moved in the direction opposite to the direction of the arrow X.
- the IC in the concave portion 171 is transported to the test tray by a horizontal transport means (not shown).
- the operation of carrying eight ICs from the positioning means 170 to the test tray at one time by the horizontal transfer means is the same as in each of the embodiments described above, and therefore the description thereof is omitted.
- FIG. 14 shows the configuration of an embodiment of an IC extraction device S according to the present invention.
- the IC unloading device S arranges the magazine 51 in a horizontal position, and moves the IC driving piece 17 3 through a longitudinal slit formed on the upper surface side of the magazine 51 arranged in the horizontal position.
- the IC 51 is inserted, and the IC driving pieces 1 to 3 are moved in the direction of the arrow X to move the IC in the magazine 51 in the direction of the arrow X, thereby discharging the IC from the inside of the magazine 51.
- a buffer rail 53 is arranged at the tip end of the magazine 51, and an escape rail 54 is arranged at the exit side of the buffer rail 53.
- a movable stopper 53A is attached near the exit of the buffer rail 53 as usual, so that the IC received by the buffer rail 53 is suppressed near the exit.
- the escape rail 54 has a plurality of IC storage units arranged side by side (in a direction perpendicular to the direction in which the ICs are fed). Each time it is received, it moves horizontally by a space equivalent to one IC. By this movement, mechanical engagement due to burrs or the like between the IC received and the IC on the buffer rail 53 side can be released.
- the IC When the IC is fed from the no-rail rail 53 to the escape rail 54, the IC is pressed against the closed end of the escape rail 54, so that the position is aligned with the feeding direction. As a result, after, for example, eight ICs are stored in the escape rail 54, the escape rail 54 is moved to a predetermined position, and the IC stored in the escape rail 54 is transferred to the horizontal transport means. When the vacuum suction head 41 sucks the IC and carries it to the test tray, the ICs are aligned and the work can be performed smoothly and reliably.
- the IC driving piece 173 is supported by a belt 175 driven by a pulse motor 174, and by driving the pulse motor 174 intermittently, one IC is provided.
- Each can be sent out from magazine 51.
- two IC driving pieces 173 are supported on the belt 175 at substantially equal intervals.
- the magazine 51 is replaced.
- the other IC drive piece 173 attached to the belt 175 is replaced with the magazine 511. It enters the slit and picking up the IC resumes.
- an IC in an inclined attitude supplied from an inclined magazine is converted into a horizontal attitude and converted into a test tray. It can be transported. Therefore, the IC stored in the rod-shaped magazine can be transferred to the test section of the IC tester by the IC handler adopting the horizontal transfer method.
- the magazine is It is possible to construct a magazine / tray combined type IC tester that can perform tests on ICs that use both trays and trays as storage containers.
- the IC is directly carried into the test tray from the position fi in which the posture of the IC is converted into the horizontal posture by the posture conversion device, and is compared with the tray / magazine combined IC handler previously proposed.
- the IC transport time is reduced, and the test time of the IC stored in the magazine can be reduced.
- the transport mechanism between the attitude converting means and the test tray can be simplified, the cost can be reduced.
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960707305A KR100230070B1 (ko) | 1995-11-06 | 1995-11-24 | 반도체디바이스 반송장치, 반도체디바이스 자세변환장치 및 반도체디바이스 취출장치 |
DE19581894T DE19581894C2 (de) | 1995-11-06 | 1995-11-24 | Vorrichtung zum Ändern der Ausrichtung von ICs |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28765595 | 1995-11-06 | ||
JP7/287655 | 1995-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997017619A1 true WO1997017619A1 (fr) | 1997-05-15 |
Family
ID=17720023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1995/002393 WO1997017619A1 (fr) | 1995-11-06 | 1995-11-24 | Transporteur, changeur de position et dispositif de prelevement pour circuits integres |
Country Status (5)
Country | Link |
---|---|
US (2) | US6074158A (ja) |
KR (1) | KR100230070B1 (ja) |
DE (1) | DE19581894C2 (ja) |
TW (1) | TW350991B (ja) |
WO (1) | WO1997017619A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10328942A (ja) * | 1997-05-23 | 1998-12-15 | Molex Inc | コネクタ供給装置 |
JPH11183863A (ja) * | 1997-12-22 | 1999-07-09 | Micronics Japan Co Ltd | 被測定基板の検査装置 |
TWI583973B (zh) * | 2016-03-29 | 2017-05-21 | Bothhand Entpr Inc | Electronic component detection device |
CN110026346A (zh) * | 2019-05-17 | 2019-07-19 | 福州派利德电子科技有限公司 | 集成电路芯片测试分选机送料装置及方法 |
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JP3430918B2 (ja) * | 1998-05-15 | 2003-07-28 | 株式会社村田製作所 | 部品搬送装置 |
TW490564B (en) * | 1999-02-01 | 2002-06-11 | Mirae Corp | A carrier handling apparatus for module IC handler, and method thereof |
US6264415B1 (en) * | 1999-09-30 | 2001-07-24 | Advanced Micro Devices, Inc. | Mechanism for accurately transferring a predetermined number of integrated circuit packages from tube to tube |
AU5117000A (en) * | 2000-03-06 | 2001-10-08 | Vladimir Nikolaevich Davidov | Apparatus for processing and sorting semiconductor devices received in trays |
US6371715B1 (en) * | 2000-07-03 | 2002-04-16 | Advanced Micro Devices, Inc. | Automated tube to tube transfer of a predetermined number of IC packages for various types of IC packages |
US20030205030A1 (en) * | 2001-02-22 | 2003-11-06 | Martin Weiss | Taper machine using inertial control of parts |
US6734694B2 (en) * | 2001-03-19 | 2004-05-11 | Juki Corporation | Method and apparatus for automatically testing semiconductor device |
US6719518B2 (en) * | 2001-10-15 | 2004-04-13 | Anadigics, Inc. | Portable tube holder apparatus |
US6861859B1 (en) * | 2001-10-22 | 2005-03-01 | Electroglas, Inc. | Testing circuits on substrates |
US6781394B1 (en) * | 2001-10-22 | 2004-08-24 | Electroglas, Inc. | Testing circuits on substrate |
US6771060B1 (en) * | 2001-10-22 | 2004-08-03 | Electroglas, Inc. | Testing circuits on substrates |
DE10208757B4 (de) * | 2002-02-28 | 2006-06-29 | Infineon Technologies Ag | Verfahren und Magazinvorrichtung zur Prüfung von Halbleitereinrichtungen |
TWI339737B (en) | 2005-04-27 | 2011-04-01 | Aehr Test Systems | Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device |
TWI275814B (en) * | 2005-07-22 | 2007-03-11 | King Yuan Electronics Co Ltd | Electronic component testing apparatus |
US7501809B2 (en) * | 2005-09-22 | 2009-03-10 | King Yuan Electronics Co., Ltd. | Electronic component handling and testing apparatus and method for electronic component handling and testing |
US7528617B2 (en) * | 2006-03-07 | 2009-05-05 | Testmetrix, Inc. | Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing |
KR100866156B1 (ko) | 2007-03-16 | 2008-10-30 | 미래산업 주식회사 | 반도체 소자 테스트용 핸들러 및 테스트방법 |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
KR100990886B1 (ko) | 2008-11-13 | 2010-11-01 | (주) 에스에스피 | 자동화 장비의 자재공급장치 |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
JP2015184165A (ja) * | 2014-03-25 | 2015-10-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
JP2015184162A (ja) * | 2014-03-25 | 2015-10-22 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
CN105366364A (zh) * | 2015-12-02 | 2016-03-02 | 苏州索力旺新能源科技有限公司 | 一种接线盒贴片上料装置 |
US9975708B2 (en) | 2016-03-16 | 2018-05-22 | Texas Instruments Incorporated | Transfer track stopper for packaged integrated circuits |
KR20230021177A (ko) | 2017-03-03 | 2023-02-13 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 |
EP4226165A1 (en) | 2020-10-07 | 2023-08-16 | AEHR Test Systems | Electronics tester |
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- 1995-11-28 TW TW084112677A patent/TW350991B/zh active
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10328942A (ja) * | 1997-05-23 | 1998-12-15 | Molex Inc | コネクタ供給装置 |
JPH11183863A (ja) * | 1997-12-22 | 1999-07-09 | Micronics Japan Co Ltd | 被測定基板の検査装置 |
TWI583973B (zh) * | 2016-03-29 | 2017-05-21 | Bothhand Entpr Inc | Electronic component detection device |
CN110026346A (zh) * | 2019-05-17 | 2019-07-19 | 福州派利德电子科技有限公司 | 集成电路芯片测试分选机送料装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
KR970704156A (ko) | 1997-08-09 |
KR100230070B1 (ko) | 1999-11-15 |
TW350991B (en) | 1999-01-21 |
DE19581894T1 (de) | 1998-01-08 |
DE19581894C2 (de) | 1999-12-23 |
US6074158A (en) | 2000-06-13 |
US6135699A (en) | 2000-10-24 |
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