WO1997017823A1 - Connector break-off locator tab - Google Patents
Connector break-off locator tab Download PDFInfo
- Publication number
- WO1997017823A1 WO1997017823A1 PCT/US1996/015481 US9615481W WO9717823A1 WO 1997017823 A1 WO1997017823 A1 WO 1997017823A1 US 9615481 W US9615481 W US 9615481W WO 9717823 A1 WO9717823 A1 WO 9717823A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- housing
- locator
- locator tab
- waste
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates generally to circuit-board mounted connectors, and particularly those used with a panelized circuit board manufacturing method.
- the present invention utilizes the waste areas of panelized circuit boards to provide self-fixturing of electronic devices to the circuit boards prior to soldering.
- the components, connectors in particular, include a main body or housing intended to remain with the circuit board after assembly and one or more locator tabs extending from the housing into the waste area or areas of the panelized circuit board.
- a weakened area located between the housing and the locator tab facilitates separation of the locator tab from the housing and permits the locator tab or tabs to be easily removed at the same time the waste area of the circuit board is removed from the useful area.
- the present invention is an electronic device for attachment to a printed circuit board having a waste area adapted to be removed after assembly of components thereto, the device comprising a housing intended to remain attached to the circuit board after completion of assembly, at least one locator tab connected to the housing and intended to be removed from the housing when the waste area is removed from the circuit board, and means projecting from the locator tab for orienting the housing with respect to the circuit board.
- a line of weakening between the housing and the locator tab coinciding with an edge of the circuit board waste area is provided, the line of weakening facilitating separation of the locator tab from the housing as the waste area is removed from the circuit board.
- the means for orienting the device is preferably a hole in the circuit board waste area and a pin extending from the locator tab of the device.
- one of the holes in the waste area can be an elongated slot allowing the locating pin to "float" and absorb any tolerances in the parts or accommodate expansion differences between the device and the board attributable to temperature changes during assembly.
- the pins may include retention features to ensure retention of the device and support its weight during assembly.
- This retention feature can be a split pin defining two legs and enlarged ends on the legs.
- Figure 1 is a perspective view of a portion of an electronic component according to the present invention and a portion of a panelized circuit board to which the component is assembled;
- Figure 2 is a side view of a portion of the component of Figure 1;
- Figure 3 is a side view of a portion of a first alternate embodiment of a component according to the invention;
- Figure 4 is an plan view of a second alternate embodiment of a component according to the invention
- Figure 5 is perspective view of a third alternate embodiment of a component according to the invention.
- Figure 6 is a partial perspective view of a fourth alternate embodiment of the invention.
- the component 10 is a connector to permit connection of the circuit board 12 to another electronic device, either by connection to a complimentary connector half on another circuit board or a connector half assembled to cabling.
- the component 10 could be any device which is commonly attached to circuit board, although the device should be one which is attached adjacent an edge of the board 12, as will become apparent later.
- the circuit board 12 is one of a series of circuit boards 12 connected to each other by waste areas 14. After assembly of components to each circuit board 12, the circuit boards 12 are separated from the waste areas 14 at lines of perforation 16 extending the length of the boards 12. This separation of the circuit boards 12 from the waste areas 14 can be accomplished by flexing the circuit board 12 relative to the waste area 14 or shearing the larger panelized circuit board at the perforation 16.
- the component 10 includes a housing 18 adapted to remain with the circuit board 12 after the board 12 has been separated from the waste 14, and a locating tab 20 extending laterally from the side of housing 18.
- a dual line of weakening 22 between the housing 18 and the locator tab 20 which coincide with the line of perforations 16 between the circuit board 12 and the waste area 14.
- a line of weakening 22 is shown in both the top and bottom surfaces of the material bridge between the housing 18 and the locator tab 20, only one could be provide in either the top or bottom surface.
- lines of weakening 22 can be molded into the component 10 or cut into the surface after molding, and are designed to concentrate stresses when the waste area 14 and the locator tab 20 are flexed relative to the housing 18 and the circuit board 12 and facilitate separation of the locator tab 20 from the housing 18.
- the line of weakening 22 would not be necessary.
- the line of weakening 22 would still be desirable to reduce the thickness of material which must be sheared and possibly to improve the appearance of the sheared edge.
- Figure 1 illustrates that the waste area 14 is provided with holes 24, and Figures 2 illustrates that the locator tab is provided with a pin 26 adapted for insertion in the hole 24.
- This pin 26 and hole 24 arrangement locates the component 10 relative to the circuit board 12. If the length of the component permits, it is desirable to provide a locator tab 20 on each side of the housing 18, as may be seen in Figure 4, to more positively locate the component 10 relative to the circuit board 12.
- Figure 4 also illustrates in phantom lines the various positions the locator tabs 20 may assume relative to the housing 10. If the length of the component 10 does not allow locator tabs 20 on each side to reach the waste areas 14 on each side of the circuit board 12, the component 18 can still be positively located by providing a locator tab 20 on one side of the housing 18 having more than one pin 26.
- such a single locator tab 20 would include the solid pin 26 shown and one of the pins shown in phantom.
- the second pin 26 could also be formed on an elongated portion of the locator tab 20 extending downwardly, from the perspective of Figure 4, from the solid-line tab 20 shown.
- Figure 3 illustrates that a pin 28 can also be used to retain the component 10 relative to the circuit board 12 in addition to orienting the component 10.
- the pin 28 is split to produce two resilient legs 30 and 32, and the ends of the legs 30, 32 are formed with enlarged grasping members 34.
- the resiliency of the legs 30, 32 allow the legs 30, 32 to compress when passing through a hole 24 and force the grasping members 34 outwardly once they have passed the lower edge of the hole 24.
- Such a grasping arrangement may be necessary if the component 10 is unsteady on the circuit board 12 or projects well beyond the edge of the circuit board 12.
- Figure 5 illustrates two types of pins 36 and 38 which may be used to "key" the component 40 to the circuit board 12 and thus prevent incorrect placement of the component 10 on the circuit board 12.
- the pins 36 and 38 are designed to fit into holes 24 of a similar shape and so will prevent the component 40 from being incorrectly assembled to the circuit board 12.
- Figure 6 illustrates that components 42 other than connectors will benefit from the invention.
- Figure 6 illustrates a header 42 which utilizes a locator tab 44 for orientation and retention relative to the circuit board.
- Any device which has a molded exterior and which will be mounted close to an edge of a circuit board can utilize the invention described above.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9808957A GB2321557B (en) | 1995-11-08 | 1996-09-19 | Connector break-off locator tab |
KR10-1998-0703291A KR100470512B1 (en) | 1995-11-08 | 1996-09-19 | Connector break-off locator tab |
JP9518166A JP2000500615A (en) | 1995-11-08 | 1996-09-19 | Connector locator tab |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/554,313 US5632650A (en) | 1995-11-08 | 1995-11-08 | Connector break-off locator tab |
US08/554,313 | 1995-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997017823A1 true WO1997017823A1 (en) | 1997-05-15 |
Family
ID=24212888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/015481 WO1997017823A1 (en) | 1995-11-08 | 1996-09-19 | Connector break-off locator tab |
Country Status (6)
Country | Link |
---|---|
US (1) | US5632650A (en) |
JP (1) | JP2000500615A (en) |
KR (1) | KR100470512B1 (en) |
GB (1) | GB2321557B (en) |
MY (1) | MY114316A (en) |
WO (1) | WO1997017823A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623902B1 (en) | 1991-03-28 | 2003-09-23 | Hewlett-Packard Indigo B.V. | Liquid toner and method of printing using same |
WO2018059625A1 (en) * | 2016-09-29 | 2018-04-05 | Phoenix Contact Gmbh & Co. Kg | Component, positioning device and method for fastening the component by soldering |
WO2019038169A1 (en) * | 2017-08-21 | 2019-02-28 | Phoenix Contact Gmbh & Co. Kg | Method for producing a printed circuit board having a surface mounted device arranged thereon, and electrical connection element |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW427571U (en) * | 1999-04-06 | 2001-03-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US7690107B2 (en) | 2007-06-15 | 2010-04-06 | The Boeing Company | Method for aligning and installing flexible circuit interconnects |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2503048A1 (en) * | 1975-01-25 | 1976-07-29 | Stocko Metallwarenfab Henkels | Electric plug contact pin protection during soldering - using additional housing coverplate protruding sideways beyond contact pins |
JPH02249299A (en) * | 1989-03-22 | 1990-10-05 | Mitsumi Electric Co Ltd | Fitting method for exothermic part in electronic apparatus |
JPH05110240A (en) * | 1991-10-17 | 1993-04-30 | Mitsubishi Electric Corp | Printed wiring board |
JPH05160539A (en) * | 1991-12-05 | 1993-06-25 | Sony Corp | Printed board and its manufacture |
JPH05275153A (en) * | 1992-10-22 | 1993-10-22 | Shintomu Kk | Method of mounting multi-pin display electronic parts and board used therein |
WO1993026063A1 (en) * | 1992-06-15 | 1993-12-23 | Berg Technology, Inc. | Face-mount connector |
DE4231427A1 (en) * | 1992-09-19 | 1994-03-24 | Bosch Gmbh Robert | Continuous chromatographic sepn of material mixt - using stack of oppositely rotating alternate discs of two different sorbents |
JPH06164117A (en) * | 1992-11-19 | 1994-06-10 | Sony Corp | Manufacture of wiring board with connector attached |
JPH07153507A (en) * | 1993-11-25 | 1995-06-16 | Yazaki Corp | Connector surface mounting mechanism |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4553801A (en) * | 1982-09-23 | 1985-11-19 | Panduit Corp. | Locking and polarizing header |
JPH0316664U (en) * | 1989-06-30 | 1991-02-19 | ||
US5312264A (en) * | 1991-11-04 | 1994-05-17 | Gte Products Corp. | Article locating and centering means |
US5330360A (en) * | 1992-08-21 | 1994-07-19 | The Whitaker Corporation | Memory card and connector therefor |
US5317480A (en) * | 1992-08-21 | 1994-05-31 | At&T Bell Laboratories | Circuit pack interconnection |
AU670945B2 (en) * | 1992-08-21 | 1996-08-08 | Whitaker Corporation, The | Grounded memory cards |
US5257947A (en) * | 1992-12-14 | 1993-11-02 | Molex Incorporated | Electrical connector with improved hold-down mechanism |
-
1995
- 1995-11-08 US US08/554,313 patent/US5632650A/en not_active Expired - Fee Related
-
1996
- 1996-09-19 JP JP9518166A patent/JP2000500615A/en not_active Withdrawn
- 1996-09-19 GB GB9808957A patent/GB2321557B/en not_active Expired - Fee Related
- 1996-09-19 KR KR10-1998-0703291A patent/KR100470512B1/en not_active IP Right Cessation
- 1996-09-19 WO PCT/US1996/015481 patent/WO1997017823A1/en active IP Right Grant
- 1996-10-10 MY MYPI96004214A patent/MY114316A/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2503048A1 (en) * | 1975-01-25 | 1976-07-29 | Stocko Metallwarenfab Henkels | Electric plug contact pin protection during soldering - using additional housing coverplate protruding sideways beyond contact pins |
JPH02249299A (en) * | 1989-03-22 | 1990-10-05 | Mitsumi Electric Co Ltd | Fitting method for exothermic part in electronic apparatus |
JPH05110240A (en) * | 1991-10-17 | 1993-04-30 | Mitsubishi Electric Corp | Printed wiring board |
JPH05160539A (en) * | 1991-12-05 | 1993-06-25 | Sony Corp | Printed board and its manufacture |
WO1993026063A1 (en) * | 1992-06-15 | 1993-12-23 | Berg Technology, Inc. | Face-mount connector |
DE4231427A1 (en) * | 1992-09-19 | 1994-03-24 | Bosch Gmbh Robert | Continuous chromatographic sepn of material mixt - using stack of oppositely rotating alternate discs of two different sorbents |
JPH05275153A (en) * | 1992-10-22 | 1993-10-22 | Shintomu Kk | Method of mounting multi-pin display electronic parts and board used therein |
JPH06164117A (en) * | 1992-11-19 | 1994-06-10 | Sony Corp | Manufacture of wiring board with connector attached |
JPH07153507A (en) * | 1993-11-25 | 1995-06-16 | Yazaki Corp | Connector surface mounting mechanism |
Non-Patent Citations (6)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 14, no. 573 (E - 1015) 19 December 1990 (1990-12-19) * |
PATENT ABSTRACTS OF JAPAN vol. 17, no. 466 (E - 1421) 25 August 1993 (1993-08-25) * |
PATENT ABSTRACTS OF JAPAN vol. 17, no. 559 (E - 1445) 7 October 1993 (1993-10-07) * |
PATENT ABSTRACTS OF JAPAN vol. 18, no. 480 (E - 1603) 8 September 1994 (1994-09-08) * |
PATENT ABSTRACTS OF JAPAN vol. 18, no. 49 (E - 1497) 26 January 1994 (1994-01-26) * |
PATENT ABSTRACTS OF JAPAN vol. 95, no. 9 31 October 1995 (1995-10-31) * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623902B1 (en) | 1991-03-28 | 2003-09-23 | Hewlett-Packard Indigo B.V. | Liquid toner and method of printing using same |
US7078141B2 (en) | 1991-03-28 | 2006-07-18 | Hewlett-Packard Development Company, Lp | Liquid toner and method of printing using same |
WO2018059625A1 (en) * | 2016-09-29 | 2018-04-05 | Phoenix Contact Gmbh & Co. Kg | Component, positioning device and method for fastening the component by soldering |
US11688989B2 (en) | 2016-09-29 | 2023-06-27 | Phoenix Contact Gmbh & Co. | Component, positioning device and method for fastening the component by soldering |
WO2019038169A1 (en) * | 2017-08-21 | 2019-02-28 | Phoenix Contact Gmbh & Co. Kg | Method for producing a printed circuit board having a surface mounted device arranged thereon, and electrical connection element |
Also Published As
Publication number | Publication date |
---|---|
US5632650A (en) | 1997-05-27 |
JP2000500615A (en) | 2000-01-18 |
GB2321557A (en) | 1998-07-29 |
GB2321557B (en) | 1999-12-01 |
GB9808957D0 (en) | 1998-06-24 |
KR100470512B1 (en) | 2005-05-18 |
MY114316A (en) | 2002-09-30 |
KR19990067307A (en) | 1999-08-16 |
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