WO1998013695A1 - Grid array package test contactor - Google Patents
Grid array package test contactor Download PDFInfo
- Publication number
- WO1998013695A1 WO1998013695A1 PCT/US1997/008901 US9708901W WO9813695A1 WO 1998013695 A1 WO1998013695 A1 WO 1998013695A1 US 9708901 W US9708901 W US 9708901W WO 9813695 A1 WO9813695 A1 WO 9813695A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- input
- elements
- contact
- electrical device
- output elements
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51560198A JP3511031B2 (en) | 1996-09-26 | 1997-05-23 | Contact machine device |
EP97927758A EP0928422A1 (en) | 1996-09-26 | 1997-05-23 | Grid array package test contactor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/715,838 US6181149B1 (en) | 1996-09-26 | 1996-09-26 | Grid array package test contactor |
US08/715,838 | 1996-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998013695A1 true WO1998013695A1 (en) | 1998-04-02 |
Family
ID=24875685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/008901 WO1998013695A1 (en) | 1996-09-26 | 1997-05-23 | Grid array package test contactor |
Country Status (4)
Country | Link |
---|---|
US (1) | US6181149B1 (en) |
EP (1) | EP0928422A1 (en) |
JP (1) | JP3511031B2 (en) |
WO (1) | WO1998013695A1 (en) |
Cited By (7)
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EP1031840A2 (en) * | 1999-02-24 | 2000-08-30 | JSR Corporation | Electric resistance measuring apparatus and method for circuit board |
WO2001009980A2 (en) * | 1999-08-02 | 2001-02-08 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
US6572396B1 (en) | 1999-02-02 | 2003-06-03 | Gryphics, Inc. | Low or zero insertion force connector for printed circuit boards and electrical devices |
US6830460B1 (en) | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
US7214069B2 (en) | 2003-07-07 | 2007-05-08 | Gryphics, Inc. | Normally closed zero insertion force connector |
EP1936387A1 (en) * | 2005-10-11 | 2008-06-25 | JSR Corporation | Anisotropic conductive connector and inspection equipment of circuit device |
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US5345170A (en) * | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
US6380751B2 (en) * | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
US5561377A (en) * | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
US6232789B1 (en) * | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6002263A (en) * | 1997-06-06 | 1999-12-14 | Cascade Microtech, Inc. | Probe station having inner and outer shielding |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6489788B2 (en) * | 2000-01-20 | 2002-12-03 | Earl Sausen | Contactor assembly for common grid array devices |
US6407568B1 (en) * | 2000-02-10 | 2002-06-18 | International Business Machines Corporation | Apparatus for probing ends of pins |
US6331836B1 (en) * | 2000-08-24 | 2001-12-18 | Fast Location.Net, Llc | Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path |
US6462568B1 (en) * | 2000-08-31 | 2002-10-08 | Micron Technology, Inc. | Conductive polymer contact system and test method for semiconductor components |
US6965226B2 (en) * | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US6914423B2 (en) * | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
DE20114544U1 (en) * | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
US6677770B2 (en) | 2001-07-17 | 2004-01-13 | Infineon Technologies | Programmable test socket |
US7123034B2 (en) * | 2001-08-14 | 2006-10-17 | Earl William Sausen | Contactor assembly for common grid array devices |
AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
US6777964B2 (en) * | 2002-01-25 | 2004-08-17 | Cascade Microtech, Inc. | Probe station |
US6876213B2 (en) | 2002-02-22 | 2005-04-05 | Johnstech International Corporation | Compliant actuator for IC test fixtures |
WO2003076957A1 (en) * | 2002-03-05 | 2003-09-18 | Rika Denshi America, Inc. | Apparatus for interfacing electronic packages and test equipment |
US7352258B2 (en) * | 2002-03-28 | 2008-04-01 | Cascade Microtech, Inc. | Waveguide adapter for probe assembly having a detachable bias tee |
US6759842B2 (en) * | 2002-04-17 | 2004-07-06 | Eagle Test Systems, Inc. | Interface adapter for automatic test systems |
WO2003100445A2 (en) * | 2002-05-23 | 2003-12-04 | Cascade Microtech, Inc. | Probe for testing a device under test |
US20040066207A1 (en) * | 2002-10-05 | 2004-04-08 | Bottoms Wilmer R. | Flexible DUT interface assembly |
US20040086869A1 (en) * | 2002-10-31 | 2004-05-06 | Schembri Carol T. | Device having multiple molecular arrays |
US6847219B1 (en) * | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
US6724205B1 (en) * | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US6861856B2 (en) * | 2002-12-13 | 2005-03-01 | Cascade Microtech, Inc. | Guarded tub enclosure |
US6998862B2 (en) * | 2003-04-28 | 2006-02-14 | Micron Technology, Inc. | Test socket for semiconductor components having serviceable nest |
US7221172B2 (en) * | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
US7057404B2 (en) * | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US7492172B2 (en) * | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7250626B2 (en) * | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
DE202004021093U1 (en) * | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Differential probe for e.g. integrated circuit, has elongate probing units interconnected to respective active circuits that are interconnected to substrate by respective pair of flexible interconnects |
US7187188B2 (en) * | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US20050174136A1 (en) * | 2004-02-09 | 2005-08-11 | Jiachun Zhou | Test pin back surface in probe apparatus for low wear multiple contacting with conductive elastomer |
WO2005121824A2 (en) * | 2004-06-07 | 2005-12-22 | Cascade Microtech, Inc. | Thermal optical chuck |
JP4980903B2 (en) * | 2004-07-07 | 2012-07-18 | カスケード マイクロテック インコーポレイテッド | Probe head with membrane suspension probe |
US20060022692A1 (en) * | 2004-07-28 | 2006-02-02 | Lameres Brock J | Backside attach probe, components thereof, and methods for making and using same |
US20060024986A1 (en) * | 2004-07-28 | 2006-02-02 | International Business Machines Corporation | Electrostatic discharge dissipative sockets |
KR20070058522A (en) * | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | Double sided probing structures |
DE202005021436U1 (en) * | 2004-11-02 | 2008-02-14 | Cascade Microtech, Inc., Beaverton | Optically enhanced digital imaging system |
KR20060062824A (en) * | 2004-12-06 | 2006-06-12 | 주식회사 아이에스시테크놀러지 | Silicone connector for testing semiconductor package |
US7656172B2 (en) * | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) * | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7449899B2 (en) * | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
JP5080459B2 (en) * | 2005-06-13 | 2012-11-21 | カスケード マイクロテック インコーポレイテッド | Wideband active / passive differential signal probe |
US20070176618A1 (en) * | 2005-08-12 | 2007-08-02 | Amkor Technology, Inc. | Universal contactor for use with multiple handlers and method therefor |
US7583097B2 (en) * | 2005-12-23 | 2009-09-01 | Essai, Inc. | Contactor nest for an IC device and method |
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7443186B2 (en) * | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) * | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
EP2071680A4 (en) * | 2006-09-19 | 2012-11-07 | Panasonic Corp | Socket, module board, and inspection system using the module board |
US7876114B2 (en) * | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7837481B1 (en) | 2008-01-14 | 2010-11-23 | Xilinx, Inc. | Socket for an integrated circuit and a method of providing a connection in a socket |
US7888954B1 (en) * | 2008-09-18 | 2011-02-15 | Xilinx, Inc. | Method of utilizing an interposer in an automated test system and an automated test system having an interposer |
US7888957B2 (en) * | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
CN102422726B (en) | 2009-03-10 | 2015-07-01 | 约翰国际有限公司 | Electrically conductive pins for microcircuit tester |
US20130002285A1 (en) | 2010-03-10 | 2013-01-03 | Johnstech International Corporation | Electrically Conductive Pins For Microcircuit Tester |
US10078101B2 (en) | 2009-04-21 | 2018-09-18 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
US7955091B2 (en) * | 2009-06-23 | 2011-06-07 | Tyco Electronics Corporation | Connector assembly having alignment members for holding a module |
US8251755B2 (en) * | 2010-06-14 | 2012-08-28 | Tyco Electronics Corporation | Connector with a laterally moving contact |
US9007082B2 (en) | 2010-09-07 | 2015-04-14 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
TWI534432B (en) | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | Electrically conductive pins for microcircuit tester |
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CN102636667A (en) * | 2012-04-28 | 2012-08-15 | 无锡卡利克斯科技有限公司 | Resistance test auxiliary clamp |
CN104395763B (en) * | 2012-06-20 | 2017-09-01 | 约翰国际有限公司 | Wafer-level integrated circuit contactor and construction method |
US9354267B1 (en) * | 2012-07-18 | 2016-05-31 | Neurotopia, Inc. | Sensor probe assembly |
KR102010916B1 (en) * | 2013-05-14 | 2019-08-14 | 삼성전자주식회사 | Semiconductor package testing structure |
TWI651539B (en) | 2014-03-10 | 2019-02-21 | 美商瓊斯科技國際公司 | Wafer-level integrated circuit probe array and construction method |
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US10444260B2 (en) | 2016-07-12 | 2019-10-15 | International Business Machines Corporation | Low force wafer test probe |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0420690A2 (en) * | 1989-09-29 | 1991-04-03 | Japan Synthetic Rubber Co., Ltd. | Electric inspection unit using anisotropically electroconductive sheet and process for producing the anisotropically electroconductive sheet |
US5057904A (en) * | 1988-03-18 | 1991-10-15 | Fujitsu Limited | Socket unit for package having pins and pads |
GB2274212A (en) * | 1992-12-25 | 1994-07-13 | Yamaichi Electronics Co Ltd | Sockets for testing I.C. packages |
US5500605A (en) * | 1993-09-17 | 1996-03-19 | At&T Corp. | Electrical test apparatus and method |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3702439A (en) | 1970-08-12 | 1972-11-07 | Bell Telephone Labor Inc | Low impedance fixed point test probe |
US4068170A (en) | 1975-12-15 | 1978-01-10 | Western Electric Company, Inc. | Method and apparatus for contacting the lead of an article |
US4267506A (en) * | 1979-01-02 | 1981-05-12 | Shiell Thomas J | Collinear four-point probe head and mount for resistivity measurements |
US4443756A (en) * | 1980-11-25 | 1984-04-17 | Lightbody James D | Apparatus and method for testing circuit boards |
US4574235A (en) | 1981-06-05 | 1986-03-04 | Micro Component Technology, Inc. | Transmission line connector and contact set assembly for test site |
US4419626A (en) | 1981-08-25 | 1983-12-06 | Daymarc Corporation | Broad band contactor assembly for testing integrated circuit devices |
IT1194298B (en) * | 1983-07-04 | 1988-09-14 | Honeywell Inf Systems Italia | PROBE-HOLDER ELEMENT FOR PRINTING CIRCUIT PLATE TESTING EQUIPMENT |
US4747784A (en) | 1986-05-16 | 1988-05-31 | Daymarc Corporation | Contactor for integrated circuits |
US4686468A (en) | 1984-12-10 | 1987-08-11 | Aseco Corporation | Contact set for test apparatus for testing integrated circuit package |
US4793814A (en) * | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
US4835464A (en) | 1987-04-23 | 1989-05-30 | Micro Component Technology, Inc. | Decoupling apparatus for use with integrated circuit tester |
US4904935A (en) * | 1988-11-14 | 1990-02-27 | Eaton Corporation | Electrical circuit board text fixture having movable platens |
US5127837A (en) | 1989-06-09 | 1992-07-07 | Labinal Components And Systems, Inc. | Electrical connectors and IC chip tester embodying same |
US5136586A (en) | 1989-12-04 | 1992-08-04 | Academy Of Applied Science | Method and apparatus for telephone line multiplex channeling of toll-quality voice and digital information |
US5134364A (en) * | 1990-06-19 | 1992-07-28 | Prime Computer, Inc. | Elastomeric test probe |
US5171290A (en) | 1991-09-03 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Testing socket for tab tape |
US5156649A (en) | 1991-11-27 | 1992-10-20 | Tektronix, Inc. | Test clip adapter for integrated circuit device |
US5307012A (en) | 1991-12-03 | 1994-04-26 | Intel Corporation | Test substation for testing semi-conductor packages |
JPH06101357B2 (en) | 1992-03-10 | 1994-12-12 | 山一電機株式会社 | Connector |
US5343473A (en) | 1992-08-07 | 1994-08-30 | International Business Machines Corporation | Method of determining whether to use preempt/resume or alternate protocol for data transmission |
US5452289A (en) | 1993-01-08 | 1995-09-19 | Multi-Tech Systems, Inc. | Computer-based multifunction personal communications system |
US5479110A (en) | 1994-01-13 | 1995-12-26 | Advanpro Corporation | Printed flexible circuit terminations and method of manufacture |
JP2929948B2 (en) | 1994-09-20 | 1999-08-03 | 三菱電機株式会社 | Probe type test handler and IC testing method using the same |
US5557212A (en) | 1994-11-18 | 1996-09-17 | Isaac; George L. | Semiconductor test socket and contacts |
JP2922139B2 (en) | 1995-09-19 | 1999-07-19 | ユニテクノ株式会社 | IC socket |
-
1996
- 1996-09-26 US US08/715,838 patent/US6181149B1/en not_active Expired - Fee Related
-
1997
- 1997-05-23 WO PCT/US1997/008901 patent/WO1998013695A1/en not_active Application Discontinuation
- 1997-05-23 EP EP97927758A patent/EP0928422A1/en not_active Withdrawn
- 1997-05-23 JP JP51560198A patent/JP3511031B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057904A (en) * | 1988-03-18 | 1991-10-15 | Fujitsu Limited | Socket unit for package having pins and pads |
EP0420690A2 (en) * | 1989-09-29 | 1991-04-03 | Japan Synthetic Rubber Co., Ltd. | Electric inspection unit using anisotropically electroconductive sheet and process for producing the anisotropically electroconductive sheet |
GB2274212A (en) * | 1992-12-25 | 1994-07-13 | Yamaichi Electronics Co Ltd | Sockets for testing I.C. packages |
US5500605A (en) * | 1993-09-17 | 1996-03-19 | At&T Corp. | Electrical test apparatus and method |
Non-Patent Citations (3)
Title |
---|
"MANUAL TEST PROBING OF VERY SMALL TARGETS ON THE TOP AND BOTTOM OF A MODULE SIMULTANEOUSLY", RESEARCH DISCLOSURE, no. 329, pages 656, XP000226203 * |
BOVE: "HIGH-PERFORMANCE CONTACTOR", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 18, no. 9, February 1976 (1976-02-01), NEW YORK US, pages 2883, XP002043142 * |
BYRNES ET AL.: "PAD DEFORMATION CONTACTOR", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 21, no. 11, April 1979 (1979-04-01), NEW YORK US, pages 4511 - 4512, XP002043143 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
US6572396B1 (en) | 1999-02-02 | 2003-06-03 | Gryphics, Inc. | Low or zero insertion force connector for printed circuit boards and electrical devices |
EP1031840A2 (en) * | 1999-02-24 | 2000-08-30 | JSR Corporation | Electric resistance measuring apparatus and method for circuit board |
EP1031840A3 (en) * | 1999-02-24 | 2000-12-20 | JSR Corporation | Electric resistance measuring apparatus and method for circuit board |
US6297652B1 (en) | 1999-02-24 | 2001-10-02 | Jsr Corporation | Electric resistance measuring apparatus and method for circuit board |
WO2001009980A2 (en) * | 1999-08-02 | 2001-02-08 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
WO2001009980A3 (en) * | 1999-08-02 | 2001-08-30 | Gryphics Inc | Controlled compliance fine pitch interconnect |
US6830460B1 (en) | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
US7214069B2 (en) | 2003-07-07 | 2007-05-08 | Gryphics, Inc. | Normally closed zero insertion force connector |
EP1936387A1 (en) * | 2005-10-11 | 2008-06-25 | JSR Corporation | Anisotropic conductive connector and inspection equipment of circuit device |
EP1936387A4 (en) * | 2005-10-11 | 2011-10-05 | Jsr Corp | Anisotropic conductive connector and inspection equipment of circuit device |
Also Published As
Publication number | Publication date |
---|---|
EP0928422A1 (en) | 1999-07-14 |
US6181149B1 (en) | 2001-01-30 |
JP3511031B2 (en) | 2004-03-29 |
JP2001503512A (en) | 2001-03-13 |
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