WO1998031204A1 - Printed wiring board and method of manufacturing the same - Google Patents
Printed wiring board and method of manufacturing the same Download PDFInfo
- Publication number
- WO1998031204A1 WO1998031204A1 PCT/JP1998/000007 JP9800007W WO9831204A1 WO 1998031204 A1 WO1998031204 A1 WO 1998031204A1 JP 9800007 W JP9800007 W JP 9800007W WO 9831204 A1 WO9831204 A1 WO 9831204A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- wiring board
- pattern
- printed wiring
- insulating substrate
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K2201/09209—Shape and layout details of conductors
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- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
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- H05K2201/09209—Shape and layout details of conductors
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- H05K2201/09—Shape and layout
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- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
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- H05K2203/05—Patterning and lithography; Masks; Details of resist
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Definitions
- the present invention relates to a printed wiring board and a method of manufacturing the same, and more particularly to a printed wiring board capable of forming minute openings and conductive holes and capable of high-density mounting, and a method of electrically connecting the upper and lower surfaces of an insulating substrate. Also, it relates to the electrical connection between the external connection pad and the conduction hole, and the plating lead used when performing electroplating. Background art
- a printed circuit board with a mounting section 970 for mounting electronic components on an insulating substrate 97 and a conductor circuit 96 provided around it is shown. is there.
- a bonding pad 969, which is the tip of the conductor circuit 96, is formed near the mounting section 970.
- the conductor circuit 966 has a pad portion 961 for joining a solder ball or the like.
- the mounting portion 970 includes a concave portion surrounded by a mounting hole 971 formed in the insulating substrate 977 and a heat radiating plate 98 covering one of the mounting holes 971.
- the surface of the insulating substrate 97 is covered with the insulating film 91 except for the pad portion 961 and the bonding pad portion 969.
- the insulating coating 91 is exposed by providing an opening 910 above the pad 961 and the bonding pad 969.
- an insulating substrate 97 to which copper foil is adhered is used, and a mounting hole 971 is formed in it.
- the copper foil is etched to form a conductor circuit 96 having a pad portion 951 and a bonding pad portion 969.
- solder resist made of thermosetting resin is printed on the surface of the insulating substrate 97. At this time, the surfaces of the pad portions 961 and the bonding pad portions 962 are not printed with solder resist and are left exposed. Next, the solder resist is thermally cured to form an insulating coating 91.
- a heat sink 988 is bonded to the surface of the insulating substrate 977 with an adhesive material 981, so as to cover one of the mounting holes 971.
- the conventional method for manufacturing the printed wiring board 9 has the following problems.
- a fine opening 910 is formed in the insulating film 91 as shown in FIG. Can not. For this reason, it is not possible to expose only a minute portion of the conductor circuit 96. As a result, high-density mounting cannot be improved.
- the entire surface of the insulating substrate 97 on which the conductor circuit 96 is formed is coated with a solder resist 912 made of photocurable resin, and the light blocking property is provided above the opening.
- a method has been proposed in which the solder resist 912 is exposed while the mask 94 is arranged.
- the solder resist 912 in the portion where the light 940 is blocked by the mask 94 is not cured and the solder resist in the exposed portion is cured to form an insulating film.
- the insulating substrate 97 is immersed in a developing solution to remove the unhardened portion of the solder resist. As a result, an opening 910 is formed in the cured insulating film 91, and a part of the conductor circuit 96 is exposed.
- this method is not suitable as an insulating film because the photocurable resin used as a solder resist has the property of absorbing moisture.
- various conductive members may be formed around the conduction hole.
- a conductive member includes a land surrounding the hole for conduction and a solder ball.
- plating leads for forming electrical plating.
- high density is desired.
- the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a printed wiring board capable of forming an insulating film having a minute opening and capable of high-density mounting, and a method of manufacturing the same. Disclosure of the invention
- a conductive circuit is formed on a surface of an insulating substrate
- solder resist made of thermosetting resin is printed on the surface of the insulating substrate.
- solder resist is thermally cured to 100 ppmZ. Forming an insulating film with a thermal expansion coefficient of C or less,
- a laser is applied to a portion of the insulating film where the opening is formed, and the insulating film in the portion where the opening is formed is burned to form an opening, thereby exposing the conductive circuit. Is the way.
- the entire surface of the insulating substrate is covered with an insulating film, and a portion where an opening is to be formed is irradiated with a laser beam.
- the laser-irradiated part is given higher energy by the laser and becomes very hot, and the irradiated part is burned off. Therefore, a fine opening can be formed in the insulating film.
- the laser is a parallel light, there is no light scattering. Therefore, a small opening having a size of about 0.05 to 0.6 mm can be formed at a desired position and at a desired size. Therefore, many openings can be formed in a small space, and high-density mounting can be realized.
- thermosetting resin used in the solder resist has a 1 0 0 pp mZ e C or lower expansion rate. Therefore, it has the property that the stress generation of solder-resist is reduced by temperature cycle test and the like. Therefore, the adhesion between the solder resist and the conductor circuit is improved.
- the lower limit of the coefficient of thermal expansion of the thermosetting resin includes OppmZ ° C, but is preferably 1 ppmZ ° C in order to more effectively exert the above effects of the present invention.
- thermosetting resin used for the solder resist has a coefficient of thermal expansion of 30 to 50 ppmZ ° C.
- the solder resist is preferably made of any one of epoxy resin, triazine resin, polyimide resin, or a modified product thereof. This improves the heat-resistant adhesion between the solder resist and the conductor circuit. In addition, due to the thermosetting of the solder resist, an insulating substrate with low water absorption can be obtained.
- a metal plating film on the exposed surface of the conductor circuit. This improves solder leakage on the surface of the conductor circuit. Also, corrosion of the conductor circuit can be prevented.
- Desmear treatment refers to dissolving and removing the solder-resist residue remaining on the exposed surface of the conductor circuit with chemicals. As a result, the exposed surface of the conductive circuit is cleaned, and the adhesive strength of the metal plating film is improved.
- Desmear treatment agents include, for example, concentrated sulfuric acid, chromic acid, or a mixture of these, or sodium permanganate / permanganate rim.
- the solder resist is preferably made of a thermosetting resin.
- Thermosetting resins are resistant to the strong acids used in desmearing. Therefore, by using a thermosetting resin as the solder resist, separation of the insulating coating on the periphery of the opening can be prevented.
- the thermosetting resin includes, for example, epoxy resin, polyimide resin, triazine resin, and the like.
- the second invention is an upper surface pattern formed on the upper surface of the insulating substrate and a lower surface formed on the lower surface of the insulating substrate. And a conductive hole penetrating the insulating substrate and reaching the upper surface of the lower pattern, and the upper surface is provided inside the conductive hole.
- a metal filler material is provided which is filled with a metal for electrically connecting the pattern and the lower pattern, and the upper pattern has a width of about 0.05 to 5 mm around the conductor hole.
- a printed wiring board characterized by being provided at 0.2 mm.
- the most remarkable point in the second invention is that a metal filler is provided inside the conduction hole to electrically connect the upper surface pattern and the lower surface pattern.
- the conduction hole is provided through the insulating substrate, and the lower end of the conduction hole is closed by a lower surface pattern.
- a top panel is provided around the upper end of the conduction hole. Therefore, by forming the metal filling material inside the conduction hole, the upper pattern and the lower pattern can be electrically connected via the metal filling material.
- the metal filling material inside the conduction hole is joined to the top pattern at least on the side surface at the upper end. Therefore, regardless of the width of the upper surface pattern, the upper surface pattern can be joined to the metal filling material, and reliable electrical conduction between the upper surface pattern and the conduction hole can be realized.
- the width of the plating adhesion area for forming the plating film in the conduction hole in the upper surface pattern can be reduced to 0.05 to 0.2 mm.
- an extra area is created on the surface of the insulating substrate by the reduced width of the top pattern. Therefore, other top surface patterns, electronic component mounting portions, and the like can be formed in this surplus area, and high-density mounting can be achieved.
- the second invention can be applied not only to a printed wiring board composed of one insulating substrate but also to a multilayer printed wiring board formed by laminating two or more insulating substrates.
- a conductive hole for electrically connecting the upper surface pattern and the lower surface pattern can be provided through each insulating substrate, and a plurality of insulating substrates can be provided. It can also be provided continuously through.
- the upper surface pattern or the lower surface pattern may be an inner layer pattern, and may be an outer layer pattern.
- the metal filler is preferably made of solder. As a result, since the solder melts at a low temperature, it is easy to fill the inside of the conduction hole. Also, since the solder material is inexpensive, bonding can be performed at low cost.
- the metal pitting material is a plating deposit formed by depositing a plating layer on the lower surface pattern inside the conduction hole.
- the metal deposit is formed in the conductive hole by depositing the metal sequentially from the upper surface of the lower surface pattern and the wall of the conductive hole in the conductive hole. This allows the metal filler to be easily formed inside the conduction hole.
- the plating deposit is formed using an electroplating method. This is because the electroplating method has a higher metal deposition rate than the chemical plating method, so that the metal filler can be formed quickly.
- the thickness of the insulating substrate is small and the depth of the conduction hole is small, it is preferable to use the electroplating method. The reason is that the metal filler can be formed quickly because the thickness deposited from the upper surface of the lower pattern can be small.
- the upper surface pattern is covered with a resist film except for the periphery of the conduction hole.
- metal can be filled in the conduction hole without the metal for forming the metal filling material adhering to the upper surface pattern near the periphery of the conduction hole.
- an upper surface pattern is formed on an upper surface of an insulating substrate so as to surround a portion where a conduction hole is formed, and a lower surface of the insulating substrate is formed on the lower surface of the insulating substrate.
- a lower surface pattern is formed so as to cover the conductive hole forming portion.
- a conductive hole penetrating the insulating substrate and reaching the upper surface of the lower pattern is formed in the conductive hole forming portion of the insulating substrate.
- metal is filled into the inside of the conduction hole to form a metal filler, so that the upper surface pattern and the lower surface are turned through the metal filler.
- the lower end of the conduction hole is covered with the lower surface pattern to form a non-through hole.
- Metal filling material is formed inside. Therefore, the upper surface pattern and the lower surface pattern can be electrically connected via the metal filler.
- the top surface pattern has a width corresponding to the plating adhesion area for forming a film that attaches to the conduction hole. No need to provide. Therefore, the width of the upper surface pattern provided around the conduction hole can be made narrower than before, and the upper surface pattern and electronic component mounting part can be formed correspondingly, achieving high-density mounting. Can be.
- the conductive hole it is preferable to irradiate a laser beam to a portion of the insulating substrate where the conductive hole is formed. This makes it possible to easily form a non-through hole in the conductive hole forming portion.
- a laser beam can be perforated locally, so that a small diameter conduction hole can be accurately provided.
- the top surface pattern is not contaminated by metal adhesion or the like.
- the metal filling the inside of the conduction hole is preferably solder. Further, it is preferable that the filling of the metal into the conductive hole is performed by depositing a plating layer on the upper surface of the lower surface pattern inside the conductive hole. As a result, as described above, the inside of the conduction hole can be easily filled with metal.
- the second invention can be used for multilayer printed wiring boards requiring high connection reliability, for example, memory modules, multichip modules, mother boards, daughter boards, plastic packages, and the like.
- an insulating substrate including one or more insulating layers, an external connection pad provided on an outermost layer of the insulating substrate, and a conductor pad provided on another layer different from the outermost layer.
- the external connection pad is formed on the outermost layer side of the conduction hole.
- the external connection pads are arranged so as to form the bottom of the conduction hole. This eliminates the need for a conductor pattern that connects the conduction hole and the external connection pad. Therefore, a surplus area is created on the surface of the insulating substrate, and other conductive patterns can be provided in that area, and high-density surface mounting can be realized. In addition, the gap between the conduction holes can be narrowed, and the conduction holes can be formed at a high density.
- the external connection pad closes the opening on the outermost layer side of the conduction hole, forming the bottom of the conduction hole. Therefore, the external connection pad has at least the area of the opening of the conduction hole. Therefore, the pad for external connection can secure a sufficient bonding area for bonding the external connection terminal, and has excellent bonding strength with the external connection terminal.
- a metal plating film is provided inside the conduction hole to continuously cover the inner wall and bottom. Therefore, the external connection pad at the bottom is strongly bonded to the metal plating film, and the bonding strength to the conduction hole is improved. Therefore, the external connection pad can be reduced to a size close to the opening of the conduction hole. Therefore, high-density mounting of external connection pads and high-density surface mounting of insulating substrates can be realized.
- the above conductor pattern refers to any conductive pattern that can be formed on the surface of an insulating substrate, such as a wiring circuit, a pad, a terminal, and a land.
- the conductor pattern is formed by, for example, etching of a metal foil or metal plating.
- the insulating layer examples include a synthetic resin alone, a resin substrate composed of a synthetic resin and an inorganic filler, a cloth substrate composed of a synthetic resin and an inorganic cloth, and a prepreg.
- the synthetic resin include epoxy resin, phenol resin, polyimide resin, polybutylene resin, and fluorinated resin.
- the third invention can be used for multilayer printed wiring boards requiring high connection reliability, for example, memory modules, multichip modules, motherboards, daughterboards, and plastic packages.
- An external connection terminal is connected to the surface of the external connection pad at the center of the conduction hole. Preferably, they are combined. This makes it possible to stably connect the external connection terminal to the surface of the external connection pad.
- the external connection terminal is one of a solder ball, a probe, a conductive paste, or a conductive wire. This is because these external connection terminals can accurately derive the electrical information transmitted to the external connection pads.
- a conductor pattern is provided on the upper surface of the insulating layer, and a pad for external connection is provided on the lower surface.
- an upper copper foil and a lower copper foil are attached to the upper and lower surfaces of the insulating layer, and then the upper copper foil is formed.
- the portion corresponding to the conductive hole forming portion in the above is removed by etching to form an opening, and then the conductive hole is formed in the insulating layer exposed from the opening in the upper surface copper foil.
- the bottom of the conduction hole is brought to the above-mentioned lower surface copper foil, then a chemical plating film is formed on the inner wall of the conduction hole, and then the inner wall and bottom of the conduction hole are continuously connected inside the conduction hole.
- Electric plating A film is formed, and then the upper copper foil and the lower copper foil are etched to form a conductor pattern electrically connected to the conduction hole from the upper copper foil, and the conductive pattern is formed from the lower copper foil.
- There is a method for manufacturing a printed wiring board characterized by forming an external connection pad for closing an opening of a passage hole.
- the most remarkable point in this manufacturing method is that the conductor hole is formed, the inner wall and the bottom of the hole are covered with a metal plating film, and then the copper foil on the bottom that constitutes the bottom of the conductor hole is etched. That is, a pad for external connection is formed.
- the conductor hole is formed so that its bottom reaches the lower surface copper foil, and then an electroplating film is formed to continuously cover the inner wall and bottom.
- the electroplated film adheres to the bottom copper foil, which is the bottom of the conductor hole. Therefore, even if the external connection pad is reduced to approximately the same size as the conductor hole by etching the lower copper foil, the external connection pad is strong against the electroplated film in the conductor hole. Can be in close contact. Therefore, an extra area is created on the lower surface of the insulating layer as the external connection pad becomes narrower. In the surplus area, other external connection pads, conductive layers, etc. can be mounted at high density.
- a method of forming the conduction hole in the insulating layer for example, there is a method of irradiating a laser beam to a portion of the insulating layer where the conductor hole is formed.
- the laser beam gives a high energy to the insulating layer, which in turn creates holes inside the insulating layer.
- the laser light is reflected by the lower copper foil when the tip reaches the lower copper foil. Therefore, when the laser beam irradiation is stopped here, a non-penetrating conduction hole with one opening covered with the lower surface copper foil is formed.
- non-through holes reaching the lower copper foil can be formed by laser light irradiation.
- non-through holes reaching the copper foil on the bottom surface can be formed by laser light irradiation, eliminating the need to cover the openings after drilling. As a result, the number of manufacturing steps is reduced, and manufacturing costs can be reduced.
- the conductor pattern provided on the upper surface of the insulating layer and the external connection pad provided on the lower surface can be simultaneously formed by etching the upper copper foil and the lower copper foil. Therefore, a printed wiring board can be efficiently and easily manufactured.
- the external connection pad is disposed on the outermost layer, and one layer or one layer is formed on the insulating layer provided with the external connection pad. It is preferable to stack two or more other insulating layers. As a result, high-density mounting of the printed wiring board can be realized. It is preferable to connect an external connection terminal to the surface of the external connection pad at the center of the conduction hole. This allows the external connection terminal to be bonded to the external connection pad in a stable state, similarly to the above-described invention of claim 2.
- a method of manufacturing a printed wiring board comprising a conductor pattern covered with an electroplating film provided on a surface of an insulating substrate, the method comprising forming a conductor pattern on the surface of the insulating substrate, A step of forming a plating lead electrically connected to the conductor pattern; and a step of passing a current through the conductor pattern through the plating lead to cover the surface of the conductor pattern with an electrodeposition film.
- the most remarkable point in the fourth invention is that the plating lead is blown off by laser light after forming an electroplating film on the surface of the conductive pattern using a plating lead.
- Laser light has good directivity because coherent light with the same phase is obtained. Therefore, high energy can be given to minute parts by laser light irradiation. Therefore, even when the plating lead is miniaturized, only the plating lead can be blown without damaging the conductor pattern provided around the plating lead. Therefore, the plating leads can be formed in a fine pattern, and the distance between the conductor patterns can be reduced to a minimum of 0.3 mm. Therefore, according to the present invention, high-density mounting of the conductor pattern can be realized.
- the laser beam has an energy intensity sufficient to blow the plating lead and not to damage the insulating substrate below the plating lead.
- energy intensities include, for example, a wavelength of 20 nm to 10 ⁇ , an output of 30 to 300 W, and an irradiation time of 0.1 to 1.0 seconds.
- the fusing state of the mounting lead by laser light is adjusted by the energy and intensity of the laser light and the irradiation time.
- the electroplating film can be formed by a general electroplating method.
- an electric plating film is formed by depositing metal on the surface of a conductor pattern by passing a current through a lead to the conductor pattern while the insulating substrate is immersed in the electric plating tank. Can be.
- the above conductor pattern is used for wiring circuits, pads, terminals, lands, etc.
- Any conductive pattern that can be formed on the surface of an insulating substrate is formed by, for example, etching metal foil or plating metal.
- the insulating substrate examples include a synthetic resin alone, a resin base made of a synthetic resin and an inorganic filler, and a cloth base made of a synthetic resin and an inorganic cloth.
- the synthetic resin examples include an epoxy resin, a phenol resin, a polyimide resin, a polybutadiene resin, and a fluorinated resin.
- a method of manufacturing a printed wiring board that utilizes the fourth invention to form an electroplating film not only on the surface of a conductive pattern but also on the inner wall of a through hole.
- This manufacturing method includes a conductor pattern provided on a surface of an insulating substrate, a through hole penetrating the insulating substrate, and a surface of the conductor, the inner surface of the through hole and an inner wall of the through hole.
- a step of forming a through hole in an insulating substrate and a step of forming a chemical plating film on an inner wall of the through hole are included.
- a chemical plating method is formed on the inner wall of the through-hole after drilling the hole. This imparts conductivity to the inner wall of the through hole. Then, while the insulating substrate is immersed in the electroplating bath, a current is passed through the plating lead to the chemical plating film covering the inner wall of the through hole. As a result, a metal is deposited on the surface of the chemical plating film to form an electroplating film.
- the connection with the through hole and the conductor pattern is made in the same manner as in the fourth invention.
- the lead is melted by irradiation with a laser beam after forming an electroplating film. Therefore, the plating leads can be miniaturized, and the distance between the through holes and between the conductor patterns can be reduced to a minimum of about 0,3 mm. Therefore, high-density mounting of through holes and conductor patterns can be realized.
- the above-mentioned through-hole is a through-hole that penetrates the insulating substrate or a non-through-hole that does not penetrate the insulating substrate.
- the chemical plating film can be formed by a general chemical plating method.
- an electroplating film can be formed on the surface of the conductor pattern by a general electroplating method as described above.
- an excimer laser, a carbon dioxide laser, or the like can be used as the laser light.
- the process of forming the conductor pattern and the plating lead is through-through. This step may be performed before or after the step of forming a hole, or before or after the step of forming the chemical plating film.
- the printed wiring board of the fourth invention can be used for a multilayer printed wiring board requiring high connection reliability, for example, a memory module, a multi-chip module, a mother board, a daughter board, and a plastic package.
- FIG. 3 is a cross-sectional view of an insulating substrate covered with an insulating film (FIG. 1A) and a cross-sectional view of the insulating substrate showing a method of forming an opening in the insulating film in Embodiment 1 (FIG. 1B).
- FIG. 3 is a cross-sectional view of an insulating substrate in which a plating film is formed on a surface of a conductor circuit in the first embodiment.
- the insulating substrate is shown to show the opening (FIG. 3 (a)) having substantially the same shape as the conductor circuit and the opening (FIG. 3 (b)) opening to the periphery of the conductor circuit. Sectional view.
- FIG. 9 is a cross-sectional view of a printed wiring board according to the second embodiment.
- FIG. 9 is an explanatory diagram showing a periphery of an upper end of a conduction hole according to a second embodiment.
- FIG. 9 is an explanatory view showing a method of forming a conduction hole in a second embodiment.
- FIG. 7 is an explanatory view of an insulating substrate having a conduction hole according to a second embodiment.
- FIG. 9 is a cross-sectional view of a printed wiring board according to Embodiment 4.
- FIG. 9 is a sectional view of a principal part of a printed wiring board according to Embodiment 4.
- FIG. 9 is an explanatory diagram of an insulating layer to which a copper foil is adhered, for illustrating a method for manufacturing a printed wiring board of Embodiment 4;
- FIG. 2 is an explanatory view of the insulating layer provided with conduction holes, following FIG. 11;
- FIG. 9 is an explanatory rear view of the insulating substrate, showing a position of an external connection pad according to the fourth embodiment.
- FIG. 10 is a cross-sectional view of a printed wiring board used as a chip size package in a fourth embodiment.
- FIG. 15 is a cross-sectional view of a printed wiring board according to Embodiment 5.
- FIG. 13 is a cross-sectional view of a printed wiring board according to the sixth embodiment.
- FIG. 13 is a plan view of a printed wiring board according to a sixth embodiment.
- FIG. 15 is a rear view of the printed wiring board according to the sixth embodiment.
- FIG. 1 An insulating substrate to which a copper foil is adhered in the method for manufacturing a printed wiring board according to Embodiment 6.
- FIG. 1 An insulating substrate to which a copper foil is adhered in the method for manufacturing a printed wiring board according to Embodiment 6.
- FIG. 2 is an explanatory sectional view of an insulating substrate on which a conductor pattern and a plated lead are formed, following FIG. 21;
- FIG. 3 is an explanatory sectional view of an insulating substrate on which a through-hole and a chemical plating film are formed, following FIG.
- FIG. 4 is an explanatory sectional view of an insulating substrate on which an electroplating film is formed, following FIG.
- FIG. 4 is an explanatory plan view of an insulating substrate on which an electroplating film is formed, following FIG.
- FIG. 25 is an explanatory sectional view showing a method of fusing the plating lead, following FIG. 25;
- FIG. 4 is a partial plan view of a printed wiring board in a conventional example.
- Sectional view of an insulating substrate with solder resist printed in a conventional example Sectional view of an insulating substrate with solder resist printed in a conventional example.
- FIG. 9 is a cross-sectional view of an insulating substrate showing a method of forming an opening in an insulating film in another conventional example.
- a solder resist made of a thermosetting resin is printed on the surface of the insulating substrate 107 having the conductor circuit 106, including the surface of the conductor circuit 106, and is thermally cured to have a low thermal expansion.
- An insulating film 101 having a coefficient is formed (FIG. 1 (a)).
- a portion of the insulating film 101 where the opening is formed is irradiated with a laser beam 102 to burn off the opening, and the opening 110 is formed. To expose the part (Fig. 1 (b)).
- an 18-zm-thick copper foil is attached to an insulating substrate made of glass epoxy resin.
- mounting holes for mounting electronic components are formed in the insulating substrate 107.
- the copper foil is etched to form a conductor circuit 106 on the surface of the insulating substrate 107.
- thermosetting resin made of thermosetting resin is printed on the entire surface of the insulating substrate 107.
- Epoxy resin impregnated with filler is used as the thermosetting resin.
- the print thickness is 40 ⁇ m.
- the insulating substrate 107 is placed in a heating furnace, and the folder resist is heat-hardened to form an insulating film 101 (Fig. 1 (a)).
- This insulating coating 101 has a low coefficient of thermal expansion at 50 ppmZ.
- a laser 102 is applied to the portion of the insulating film 101 where the opening is formed, and the portion where the opening is formed is burned off. As shown in FIG. 1 (b), the opening 110 is formed in the insulating film 101.
- the laser use a general C 0 2 laser.
- the conductor circuit 106 is exposed from the opening 110.
- a Ni—Au plating film 1331 is formed on the exposed surface of the conductor circuit 106 by the electroplating method, and then the surface is formed by the electroplating method.
- An Au plating film 1 32 is formed.
- a heat sink is bonded to the surface of the insulating substrate 107 using an adhesive to obtain a printed wiring board (see Fig. 28).
- the opening 110 formed by laser irradiation may expose only a part of the upper surface of the conductor circuit 106, as shown in Fig. 1 (b). As shown, a part of the top and side surfaces of the conductor circuit 106 (FIG. 3 (a)), or the conductor circuit 106 and its peripheral insulating substrate 107 may be exposed.
- the entire surface of the insulating substrate 107 is coated with the insulating film 101, and the portion where the opening is to be formed is irradiated with the laser 102. .
- the part irradiated with the laser 102 is given higher energy by the laser 102, becomes extremely hot, and is burned out. Therefore, a fine opening 110 can be formed in the insulating film 101.
- a small opening having a size of about 0.05 to 0.6 mm can be formed at a desired position and a desired size.
- the insulating coating 101 is made of a thermosetting epoxy resin. Therefore, as shown in Fig. 1 (b), the insulating coating 101 does not separate from the insulating substrate 107 at the periphery 108 of the opening 110 even by desmearing.
- the printed wiring board 208 of this example has an upper surface pattern 201 formed on the upper surface of the insulating substrate 207 and a lower surface pattern 202 formed on the lower surface of the insulating substrate 207. And a conduction hole 203 penetrating through the insulating substrate 207 and reaching the upper surface 228 of the lower surface pattern 202. Inside the conductive hole 203, a metal filler 205 is provided by filling with solder for electrically connecting the upper surface pattern 201 and the lower surface pattern 202. The upper surface pattern 201 is covered with the resist film 261, leaving the periphery of the conduction hole 203.
- the thickness of the insulating substrate is 0.1 mm. As shown in Fig. 5, the diameter A of the conduction hole 203 is 0.3 mm.
- the upper end portion 231 of the conduction hole 203 is surrounded by an upper surface pattern 201 having a width B of 0.025 mm.
- the lower end portion 232 of the conduction hole 203 is covered with a lower surface pattern 202 so as to cover the bottom portion.
- a mounting portion for mounting electronic components is formed in the center of the printed wiring board 208 (not shown).
- an insulating substrate made of glass epoxy resin is prepared. Adhere copper foil on the upper and lower surfaces of the insulating substrate. Next, unnecessary portions of the copper foil are removed by etching to form an upper pattern 201 and a lower pattern 202 as shown in FIG.
- the upper surface pattern 201 is formed around the conduction hole forming portion 230 on the upper surface of the insulating substrate 207.
- the lower surface pattern 202 is formed on the lower surface of the insulating substrate 207 so as to cover the conductive hole forming portion 230.
- a resist film 261 is coated on the upper surface of the insulating substrate 207.
- the resist film 261 formed on the upper surface forms an opening hole 263 for opening the insulating substrate 207 of the conduction hole forming portion 230.
- the lower surface of the insulating substrate 207 is coated with a resist film 262.
- the resist film 262 formed on the lower surface covers the lower surface of the insulating substrate 207, including the conductive hole forming portion 230.
- the laser beam 204 is applied to the conductive hole forming portion 30.
- a carbon dioxide laser is used as the laser beam 204.
- the conduction pattern penetrates the insulating substrate 207 of the conduction hole forming portion 230 and reaches the upper surface of the lower pattern 202 with the bottom pattern 202 remaining.
- a hole 203 is formed.
- an electric plating method is performed in which the insulating substrate 207 is immersed in a soldering bath and electricity is supplied to the bottom panel 202.
- solder is deposited from the upper surface of the lower surface pattern 202 inside the conduction hole 203, and is filled in the entire inside of the conduction hole 203. 205 is formed.
- the conduction hole 203 is provided through the insulating substrate 207, and a metal filler 205 is formed therein.
- the lower end portion 2 32 of the conduction hole 203 is covered with the lower surface pattern 202.
- an upper surface pattern 201 is provided around the upper end 31 of the conduction hole 203. Therefore, the upper pattern 201 and the lower pattern 202 can be electrically connected to each other through the metal filler 205 inside the conduction hole 203.
- the metal filler 205 formed inside the conduction hole 203 is joined to the upper surface pattern 201 on the side surface of the upper end 231. Therefore, the upper surface pattern 201 can be bonded to the metal filler 205 regardless of the size of the width, and reliable electrical continuity between the upper surface pattern 201 and the metal filler 205 is obtained. Can be realized. Therefore, it is not necessary to provide the upper surface pattern 201 with a width corresponding to the plating adhesion region for forming the plating film on the conduction hole 203 as in the conventional case.
- the width of the upper surface pattern 201 provided around the conduction hole 203 can be made smaller than before.
- the surplus area on the surface of the insulating substrate 207 corresponds to the reduced width of the upper surface pattern 201. to be born. Therefore, in the surplus area, other upper surface patterns and electronic component mounting parts can be formed, and high-density mounting can be achieved.
- This example is an embodiment of the second invention.
- This embodiment differs from the second embodiment in that the inside of the conduction hole is filled with metal by a printing method. That is, after forming the conduction holes in the same manner as in Embodiment 2 above, a printing mask having openings at the portions corresponding to the conduction holes is arranged on the upper surface side of the insulating substrate. Next, the solder paste is placed on the mask and pressed with a roller. Then, the solder paste moves from the opening of the mask to the inside of the conduction hole. As a result, the interior of the conduction hole is filled with solder, and a metal filler is formed.
- a printed wiring board according to an embodiment of the third invention will be described with reference to FIGS.
- the printed wiring board 341 of this example has an insulating substrate 305 consisting of two insulating layers 351 and 352, and an external board provided on the outermost layer of the insulating substrate 305.
- the connection pads 301, conductor pads 325, 326 provided on another layer different from the outermost layer, external connection pads 301, and conductor patterns 325, 326 Are provided with conduction holes 331 and 332.
- the external connection pad 301 closes the opening 339 on the outermost layer side of the conduction hole 331 to form the bottom of the conduction hole 331.
- the inner wall and the bottom of the conduction hole 3331 are covered with a metal plating film 3233.
- an external connection terminal 310 is bonded at the center of the conduction hole 331.
- External connection The terminal 310 is a solder ball for joining the printed wiring board 341 to a mating member 308 such as a mother board.
- the diameter A of the external connection pad 301 is 0.2 to 0.4 mm, and the opening diameter B of the conductor hole 331 is almost the same size as 0.1 to 0.3 mm.
- the substrate 305 is provided with a mounting portion 370 for mounting the electronic component 307 on the outermost layer on the side opposite to the side on which the external connection pads 301 are provided.
- the mounting part 370 is provided on almost the entire lower part of the electronic component 307.
- the electronic component 307 is bonded to the mounting portion 370 with an adhesive 372 such as a silver paste.
- a number of bonding pads 327 are provided for bonding the bonding wires 371.
- the surface of each insulating layer 351 and 352 is covered with a solder resist 306.
- the inner wall and the bottom of the conduction holes 331 and 332 are covered with a metal plating film 3233. A part of the solder resist 303 enters into the conductor holes 331 and 332.
- an insulating layer made of a glass epoxy substrate is prepared.
- the upper and lower copper foils 32 1 and 32 2 are attached to the upper and lower surfaces of the insulating layer 35 1.
- the portion corresponding to the conductive hole forming portion 338 in the upper surface copper foil 321 is removed by etching to form an opening hole 328.
- the laser beam 3388 is irradiated to the conduction hole forming portion 3388.
- the conduction hole 3 3 1 is formed in the insulating layer 3 51 exposed from the opening 3 3 8 of the upper surface copper foil 3 21, and the conduction hole 3 3 1 To the bottom copper foil 3 2 2.
- the metal plating film 3 2 3 is formed by performing the learning plating method and the electric plating method.
- the metal plating film 3 23 is also formed on the surface of the lower copper foil 3 22.
- the upper copper foil 3 2 1 and the lower copper foil 3 2 2 are etched, and as shown in Fig. 14, the upper copper foil 3 2 1 leads to the conductive pattern 3 3 electrically connected to the conduction hole 3 3 1.
- Form 2 5 An external connection pad 301 for closing the opening of the conduction hole 331 is formed from the lower surface copper foil 322.
- the surface of the insulating layer 351 is covered with the solder resist 306, and a part of the solder resist 306 is made to enter the inside of the conduction hole 331, and the inside is made. Fill the hole.
- another insulating layer 352 is laminated on the upper surface of the insulating layer 351 to obtain an insulating substrate 305. That is, a prepreg and copper foil are laminated and pressed on the upper surface of the insulating layer 351. Next, the copper foil is etched to form the conductor pattern 326, the bonding pad 327, and the mounting portion 370. Next, the insulating layer 352 is irradiated with a laser beam to form a conduction hole 335. At this time, the bottom of the conduction hole 332 reaches the internal conductor pattern 3255. Next, a metal plating film 3233 is formed on the inner wall and bottom of the conduction hole 3332 by performing the chemical plating method and the electric plating method.
- the surface of the insulating layer 352 is covered with the solder resist 306, and a part of the solder resist 306 is penetrated into the conduction hole 332 to fill the hole. At this time, the bonding pads 327 are left exposed.
- the external connection pad 301 is arranged so as to form the bottom of the conduction hole 331. Therefore, there is no need for a conductor pattern to connect the conduction hole 331 and the external connection pad 301. Therefore, A surplus area is created on the surface of the insulating substrate 305, and another conductor pattern or the like can be provided in that area, realizing high-density surface mounting. Also, as shown in Fig. 15, the gap between the conduction holes 331 can be made narrower, and the holes can be provided at a higher density than the conventional conduction holes.
- the external connection pad 301 closes the opening on the outermost layer side of the conduction hole 331 to form the bottom of the conduction hole 331. Therefore, the external connection pad 301 has at least the area of the opening of the conduction hole 331. Therefore, the external connection pad 301 can secure a sufficient bonding area for bonding the external connection terminal 310, and has excellent bonding strength with the external connection terminal 310. ⁇
- a metal plating film 3233 that continuously covers the inner wall and bottom of the conduction hole 3331 is provided. Therefore, the external connection pad 301, which is the bottom, is strongly bonded to the metal plating film 323, and the bonding strength to the conduction hole 331 is improved. Therefore, the external connection pad 301 can be reduced to a size close to the opening of the conduction hole 331. Accordingly, it is possible to realize a high-density mounting of the external connection pads 301 and a high-density surface mounting of the insulating substrate 305.
- the lower copper foil 3222 strongly adheres to the metal plating film 3233 at the bottom of the conductor hole 3331. Therefore, the external connection pad 301 can be reduced to almost the same size as the conductor hole 331, and high-density mounting can be realized.
- a portion of the insulating layer 351, on which the conduction hole is formed, is irradiated with a laser beam.
- the laser beam 388 applies high energy to the insulating layer 351, thereby sequentially opening holes inside the insulating layer 351.
- the laser beam 3 8 8 When it reaches the foil 322, it is reflected by the lower copper foil 322. Therefore, when the irradiation of the laser beam 3888 is stopped here, as shown in FIG. 12, one of the openings 339 is covered with the lower copper foil 322 and the non-penetrating conduction hole 3 1 is formed.
- non-through holes can be formed by irradiation with laser light 388.
- it has conventionally been necessary to cover the opening with a copper foil after drilling a hole in the insulating layer with a drill.
- non-through holes reaching the lower copper foil 3222 can be formed by laser light irradiation, so that the opening work after drilling is not required. As a result, the number of manufacturing steps is reduced, and manufacturing costs can be reduced.
- Laser light is also used to form the conduction hole 335 in the other insulating layer 352. Therefore, it is possible to easily form the conduction hole 332 in which the bottom of the conduction hole 332 reaches the internal conductor pattern 325 o
- the conductive pattern 3 25 on the upper surface of the insulating layer 3 51 and the external connection pad 3 0 1 on the lower surface should be formed simultaneously by etching the upper copper foil 3 2 1 and the lower copper foil 3 2 2. Can be. Therefore, the printed wiring board 341 can be manufactured efficiently and easily.
- This example is an embodiment of the third invention.
- Printed wiring board of this example 3 4 2 As shown in Fig. 17, the insulating substrate 305 consists of a single insulating layer 351.
- the surface of the insulating layer 351 is the outermost layer of the insulating substrate 305, on one of which an electronic component 307 is mounted, and on the other, a solder ball 310 is bonded.
- the printed wiring board 403 manufactured in this example has a mounting portion 406 for mounting electronic components and a conductive pattern 410 on the surface of the insulating substrate 407. And a through hole 405 for electrical conduction between the upper and lower sides.
- the conductor pattern 401 is composed of a land 411 of a through hole 405, a bonding wire 461 connected to an electronic component 601, a terminal 413 for bonding, a land 411 and a terminal 411. It is composed of a wiring circuit 4 1 2 that electrically connects between them, and a pad 4 1 4 for joining the solder balls 4.
- a large number of through holes 405 are provided on the periphery of the insulating substrate 407.
- an insulating substrate 407 made of a glass epoxy substrate is prepared, and copper foils 415 are attached to both surfaces thereof.
- unnecessary portions of the copper foil 415 are removed by etching to form the conductor pattern 401, and the conductor patterns 401 are electrically connected.
- a lead 402 is formed.
- the minimum gap between the conductor pattern 401 and the plating lead 402 is 0.3 mm.
- the through-hole forming portion 450 of the insulating substrate 407 was drilled using a drill, router, or the like. Drill 0 5.
- a chemical plating film 416 is formed on the surface of the conductor pattern 401 and the inner wall of the through hole 405.
- the chemical plating film 416 is made of copper and has a thickness of 2 m.
- the conductive pattern 401 and the chemical plating film 404 are passed through the plating leads 402.
- a current of 4 4 is passed through 16 and the surface of the conductive pattern 4 1 and the chemically plated film 4
- the electroplating film 4 17 is made of copper, and its thickness is
- the plating lead 402 is irradiated with a laser beam 408 to blow the plating lead 402.
- a laser beam 408 As the laser beam 408, an excimer laser with a wavelength of 248 nm and an output of 50 W is used.
- insulation between the conductor patterns 401 is achieved.
- the printed wiring board 400 shown in FIGS. 18 to 20 is obtained.
- the laser light is coherent light with the same phase, it has high directivity. Therefore, as shown in Fig. 26, high energy can be given to minute parts by irradiation with laser light 408. Therefore, even when the plating lead 402 is miniaturized, only the plating lead 402 can be blown without damaging the conductive pattern 401. Therefore, the plating lead 402 can be formed in a minute pattern, and thereby the space between the conductor patterns 401 and the space between the through holes 405 can be reduced. Therefore, according to this example, high-density mounting of the conductor pattern 401 can be realized.
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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KR1020067017008A KR100873835B1 (ko) | 1997-02-28 | 1998-01-05 | 프린트배선판 및 그 제조방법 |
KR1019997006199A KR100691297B1 (ko) | 1997-02-28 | 1998-01-05 | 프린트배선판및 그 제조방법 |
DE69837840T DE69837840T2 (de) | 1997-02-28 | 1998-01-05 | Verfahren zur herstellung einer gedruckten leiterplatte |
EP98900044A EP0966185B1 (en) | 1997-02-28 | 1998-01-05 | Method of manufacturing a printed wiring board |
US11/260,077 US7594320B2 (en) | 1997-01-10 | 2005-10-27 | Method of manufacturing printed wiring board |
US12/237,955 US7765692B2 (en) | 1997-01-10 | 2008-09-25 | Method of manufacturing printed wiring board |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
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JP1463597 | 1997-01-10 | ||
JP9/14635 | 1997-01-10 | ||
JP5248197 | 1997-02-19 | ||
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JP9/65509 | 1997-03-03 | ||
JP6550997 | 1997-03-03 | ||
JP36196197A JP3633252B2 (ja) | 1997-01-10 | 1997-12-09 | プリント配線板及びその製造方法 |
JP9/361961 | 1997-12-09 |
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US09348935 A-371-Of-International | 1998-01-05 | ||
US09/891,819 Division US6555208B2 (en) | 1997-01-10 | 2001-06-26 | Printed wiring board and method of manufacturing the same |
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WO1998031204A1 true WO1998031204A1 (en) | 1998-07-16 |
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PCT/JP1998/000007 WO1998031204A1 (en) | 1997-01-10 | 1998-01-05 | Printed wiring board and method of manufacturing the same |
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US (5) | US6284353B1 (ja) |
JP (1) | JP3633252B2 (ja) |
WO (1) | WO1998031204A1 (ja) |
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EP1121008A1 (en) * | 1998-09-03 | 2001-08-01 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
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Also Published As
Publication number | Publication date |
---|---|
US20060042824A1 (en) | 2006-03-02 |
US6555208B2 (en) | 2003-04-29 |
US20030203170A1 (en) | 2003-10-30 |
US7765692B2 (en) | 2010-08-03 |
JP3633252B2 (ja) | 2005-03-30 |
JPH10308576A (ja) | 1998-11-17 |
US7594320B2 (en) | 2009-09-29 |
US6284353B1 (en) | 2001-09-04 |
US6986917B2 (en) | 2006-01-17 |
US20010038905A1 (en) | 2001-11-08 |
US20090019693A1 (en) | 2009-01-22 |
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