WO1998044520A1 - Puce d'inductance et procede de fabrication - Google Patents
Puce d'inductance et procede de fabrication Download PDFInfo
- Publication number
- WO1998044520A1 WO1998044520A1 PCT/JP1998/001349 JP9801349W WO9844520A1 WO 1998044520 A1 WO1998044520 A1 WO 1998044520A1 JP 9801349 W JP9801349 W JP 9801349W WO 9844520 A1 WO9844520 A1 WO 9844520A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- insulating resin
- main body
- coil
- manufacturing
- concave portion
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims abstract description 95
- 239000011347 resin Substances 0.000 claims abstract description 95
- 239000004020 conductor Substances 0.000 claims abstract description 48
- 239000011810 insulating material Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 230000009974 thixotropic effect Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 6
- 239000011800 void material Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/122—Insulating between turns or between winding layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
Definitions
- the present invention relates to a chip inductor used for an electronic device, a communication device, and the like, and a method for manufacturing the same.
- a conventional chip inductor has a prismatic body 21 made of an insulating material, and a wire formed by spirally grooved a conductor layer 22 on the surface of the body 21.
- a coil portion 25 having a conductor portion 23 and a groove cut portion 24, an exterior portion 29 made of an insulating resin 28 applied to the surface of the coil portion 25, and an end portion of the main body 21.
- the electrode section 26 was provided.
- the manufacturing method includes a first step of forming a conductor layer 22 on a prismatic main body 21 made of an insulating material, and a step of forming a groove on the conductor layer 22 with a laser 27 to form a linear conductor section 2 3.
- the main body 21 having the coil portion 25 formed on the tape on which the insulating resin 28 is adhered is rotated in the direction of arrow A in FIG. 8 to coil part 25, and An insulating resin 28 is coated on the entire circumference of the coil part 25.
- the insulating resin 28 is dried to form the exterior part 29.
- the insulating resin 28 is applied to the surface of the coil portion 25, but the insulating resin 28 is not applied to the inside of the groove cut portion 24 of the coil portion 25.
- the distance between the adjacent linear conductors 23 in the coil 25 is several tens of microns. Because it is narrow, it is difficult to apply the insulating resin 28 due to the surface tension of the insulating resin 28, etc., and the inside of the grooved portion 24 is the part where the insulating resin 28 is applied and the part where it is not applied And were mixed.
- a gap 40 is formed inside the grooved section 24 as shown in FIG. 7, and the air and moisture in the gap 40 cause the linear conductor 2 adjacent to the coil section 25 to move. Among them, there was a problem that proper insulation was not provided and a short circuit occurred.
- the insulating resin 28 is attached to the coil portion 2.
- the insulating resin 28 coated on the coil part 25 has a circular shape while surrounding the prism-shaped main body 21 due to surface tension.
- the present invention provides an appropriate insulation between the linear conductor portions adjacent to the coil portion, prevents a short circuit from occurring, improves electrical characteristics, and improves the mounting surface by the exterior portion. It is an object of the present invention to provide a chip inductor having a flat shape and capable of being accurately mounted, and a method of manufacturing the same.
- the present invention provides a prismatic main body made of an insulating material, electrode portions disposed at both ends of the main body, and a connection between the electrode portions.
- a coil portion disposed on the outer periphery of the main body, and an exterior portion in which the coil portion is covered with an insulating resin, wherein the coil portion is a linear conductor formed by cutting a conductor layer covering the surface of the main body.
- a grooved portion, and the insulating resin is also provided on the entire inside of the grooved portion.
- the manufacturing method includes a first step of forming a conductor layer on a prismatic main body made of an insulating material; and a coil having a linear conductor portion and a groove cut portion by cutting the conductor layer.
- the coil portion formed on one side of the main body is coated with an insulating resin, and after drying, the coil portion formed on the other side is coated with an insulating resin and dried to form an exterior portion. It is a way to do it.
- the insulating resin is also provided on the entire inside of the groove cut portion, so that there is no void in the groove cut portion and air and moisture are eliminated. Therefore, proper insulation can be provided between the linear conductor portions, and short-circuit prevention can be achieved.
- the coil formed on the adjacent side of the main body is coated with an insulating resin on the coil formed on one side, and after drying, the coil formed on the other side is coated with the insulating resin. Is coated and dried to form an exterior part.
- the outer shape does not become circular due to the influence of the surface tension.
- the surface tension is also reduced, and the entire inside of the groove is easily coated with the insulating resin.
- the insulating resin is also covered in a prismatic shape with respect to the main body having a prismatic shape, and a prismatic exterior part is formed. This makes it possible to easily provide an insulating resin even in the entire grooved portion of the coil portion.
- FIG. 1 is a cross-sectional view of a chip inductor according to an embodiment of the present invention
- FIG. 2 is an enlarged cross-sectional view of the vicinity of a coil portion (a portion A in FIG. 1) of the chip inductor
- FIG. FIGS. 4 (a) to (e) are perspective views showing a series of forming steps of the chip inductor
- FIGS. 4 (a) to (c) are perspective views of the chip inductor.
- FIG. 4 is a cross-sectional view showing a state of formation of the exterior part.
- FIG. 6 is a perspective view of a conventional chip connector, and Fig. 7 is the same.
- FIG. 8 is a cross-sectional view of the chip inductor
- FIG. 8 is a cross-sectional view showing a state of forming an exterior part of the chip inductor
- FIGS. 9 (a) to (d) show a series of forming steps of the chip inductor. It is a perspective view.
- a chip connector comprises a prismatic main body 1 made of an insulating material, electrode portions 6 arranged at both ends of the main body 1, and an electrode
- the coil part 5 includes a coil part 5 disposed on the outer periphery of the main body 1 between the electrode parts 6, and an exterior part 9 in which the coil part 5 is covered with an insulating resin 8.
- the coil portion 5 has a linear conductor portion 3 formed by cutting a conductor layer 2 covering the surface of the main body 1 and a groove portion 4, and the entire inside of the groove portion 4 is also insulated. Resin 8 is provided.
- the concave portions 12 are provided on all side surfaces except the end surface of the main body 1, and the coil portions 5 are formed in the concave portions 12, and the insulating resin 8 is provided in the concave portions 12.
- the insulating resin 8 has a configuration in which an epoxy resin having a thixotropic property is used.
- the manufacturing method includes a first step of forming a conductor layer 2 on a prismatic body 1 made of an insulating material, and grooving the conductor layer 2 with a laser 7 to form a linear conductor portion 3 and a grooving portion.
- a fourth step of forming is a fourth step of forming.
- a step of removing conductive chips generated when the conductive layer 2 is grooved is provided, and a method such as a “cutting removing method”, a “sandblast removing method” or the like is used.
- the coil portion 5 formed on one side surface 10 in the direction A in FIG. 4 (c) is provided with the insulating resin 8 on the coil portion 5 formed on the adjacent side surface of the main body 1.
- the coil portion 5 formed on the other side 11 in the direction B in FIG. 4 (c) is coated with the insulating resin 8 and dried to form the exterior portion 9.
- the main body 1 has a rectangular pillar shape, and a concave portion 12 is provided on all side surfaces of the main body 1, and a coil portion 5 is provided in the concave portion 12.
- the coil portion 5 formed on the opposite side surface 10 is coated with the insulating resin 8 and dried, and then the coil portion 5 formed on the opposite side surface 11 is coated with the insulating resin 8 and dried.
- the insulating resin 8 is provided in the recess 12 so as not to protrude outside the recess 12.
- the entire inside of the grooved portion 4 is also coated, and a transfer coating method using a roller is used.
- the insulating resin 8 used for this is an epoxy resin having a thixotropic property.
- the insulating resin 8 is also provided on the entire inside of the grooved part 4, the grooved part Since no air gap exists in the portion 4 and air and moisture are eliminated, appropriate insulation can be provided between the adjacent linear conductor portions 3 to prevent short circuit.
- the insulating resin 8 is provided in the concave portion 12 provided with the coil portion 5, the insulating resin 8 surface does not become higher than the electrode portions 6 on both side surfaces of the concave portion 12. Since the prismatic flat surface of the main body 1 can be used as the mounting surface, the mountability on a mounting board or the like can be improved. In particular, since the concave portions 12 are provided on all side surfaces except the end surface of the main body 1 and are covered with the insulating resin 8, mounting on any side surface is possible, and productivity can be improved.
- the insulating resin 8 is an epoxy resin having a thixotropy, there is no change in shape when the insulating resin 8 is cured, and the shape of the outer surface 9 can be precisely defined on a flat surface, and the mountability is improved. Can be improved.
- the coil portion 5 formed on the adjacent side surface of the main body 1 is coated with the insulating resin 8 on the coil portion 5 formed on one side surface 10, dried, and then dried.
- the coil part 5 formed in the above is coated with the insulating resin 8 and dried to form the exterior part 9.
- the outer shape does not become circular due to the influence of the surface tension.
- the area to be coated and dried with the insulating resin 8 at one time is reduced, the surface tension is also reduced, and the entire inside of the grooved portion 4 can be easily coated with the insulating resin 8.
- the insulating resin 8 also has a prismatic shape with respect to the prismatic body 1. Since it is covered and the prismatic exterior part 9 is formed, the mounting surface of the exterior part 9 has a planar shape, and the mountability on a mounting substrate or the like can be improved.
- the step of forming the exterior portion 9 on the main body 1 is performed. Can be performed in two steps, so that manufacturing can be simplified.
- the entire inside of the grooved portion 4 is also covered with the insulating resin 8, no void is formed inside the grooved portion 4, and adjacent lines are formed by air, moisture, etc. in the void. To prevent corrosion, short-circuit, etc. between the conductors 3 and short-circuits between adjacent linear conductors 3 due to conductor removal, dust, etc., generated when the conductor layer 2 is cut into grooves. Can be prevented.
- the insulating resin 8 is provided in the concave portion 12 provided on the side surface of the main body 1, the insulating resin surface does not become higher than the electrode portion 6, which is the both end surfaces of the concave portion 12, and the prismatic shape of the main body 1 Since a flat surface can be used as the mounting surface, it is possible to improve the mountability on a mounting board or the like.
- a conductive material such as a conductive material is used. The layer prevents short-circuiting between adjacent linear conductors 3 and prevents the inductance value from being changed by adhering to the linear conductors 3 and improving electrical characteristics. Can be done.
- the insulating resin 8 is a epoxy resin having a thixotropy
- the coated shape was maintained. As it is, it is cured by drying, and the exterior part 9 can be formed. Thereby, the shape change during curing of the insulating resin 8 is reduced, the shape of the outer surface 9 can be defined, and the mountability can be improved.
- the insulating resin 8 since the insulating resin 8 is coated by the transfer coating method, the insulating resin 8 can be applied very thinly and uniformly. For this reason, the cross-sectional area of the main body 1 can be maximized, and the miniaturization can be achieved while maximizing the inductance value caused by the cross-sectional area of the main body 1.
- the insulating resin 8 surface does not become higher than the electrode portions 6 on both sides of the concave portion 12, and the prismatic flat surface of the main body 1 can be used as a mounting surface, and mounting on a mounting board or the like is possible.
- the recesses 1 and 2 are provided on all sides except the end face of the main body 1 and covered with the insulating resin 8, so that mounting on any side is possible, and productivity is improved. It can also be improved.
- the insulating resin 8 is an epoxy resin having a thixotropy, there is no change in the shape when the insulating resin 8 is cured, and the shape of the exterior 9 can be accurately defined as a flat surface, thereby improving mountability. Can be made o
- the insulating resin 8 is also covered in a prismatic shape with respect to the prismatic body 1 and the prismatic exterior part 9 can be formed, so that the mounting surface of the exterior part 9 has a planar shape.
- the insulating resin 8 is provided in the concave portion 1 2 provided on the side surface of 1, the insulating resin surface does not become higher than the electrode portions 6 on both end surfaces of the concave portion 1 2, and the mountability on a mounting board or the like is improved. be able to.
- the insulating resin 8 is an epoxy resin having a thixotropy, the shape of the outer surface 9 can be defined, and the mountability can be further improved.
- the insulating resin 8 also covers the voids. Therefore, it is possible to prevent the occurrence of corrosion, short-circuit, etc. between the adjacent linear conductors 3, to suppress deterioration in use in the high-frequency current range, and to coat with the transfer coating method. 8 can be applied very thinly and uniformly, and the size can be reduced while maximizing the inductance value.
- the conductive material forming the conductive waste may cause a short circuit between the adjacent linear conductors 3 or a hindrance. It is possible to prevent the inductance value from being changed by adhering to the conductor portion 3, thereby improving the electrical characteristics.
- the coil portion 5 formed on one opposing side surface 10 of the main body 1 and the coil portion 5 formed on the opposing other side surface 11 are coated with the insulating resin 8 and dried.
- the step of forming the exterior part 9 can be performed in two steps, and the manufacturing can be simplified.
- the step of forming the exterior part 9 on the main body 1 was performed twice, but the side surfaces of the main body 1 were sequentially covered with the insulating resin 8 one by one and dried. Then, the exterior part may be formed in several steps. Also, the method of removing the conductive dust may be other methods such as an etching removing method and a sand blast removing method. Industrial applicability
- the present invention provides a prism-shaped main body made of an insulating material, electrode portions disposed at both ends of the main body, and connection to the electrode portions.
- a coil portion disposed therein; and an exterior portion in which the coil portion is covered with an insulating resin.
- the coil portion includes a linear conductor portion formed by cutting a conductor layer coated on the surface of the main body and a groove cut portion. And the insulating resin is also provided on the entire inside of the groove cut portion.
- the insulating resin is also provided on the entire inside of the grooved portion, there is no void in the grooved portion, and air and moisture are eliminated, so that between the linear conductor portions, Proper insulation can be provided, a short circuit can be prevented, and a chip injector with improved electrical characteristics can be provided.
- the production method of the present invention includes a first step of forming a conductor layer on a prismatic body made of an insulating material, and a groove having a linear conductor portion and a groove cut portion by grooving the conductor layer.
- a second step of forming an coil part a third step of forming electrode parts at both ends of the coil part, and a fourth step of covering the coil part with an insulating resin and drying to form an exterior part.
- the coil portion formed on one side of the main body is coated with an insulating resin, and after drying, the coil portion formed on the other side is coated with an insulating resin, and dried to be packaged.
- the coil portion formed on the adjacent side surface of the main body is coated with the insulating resin on the coil portion formed on one side surface, dried, and then dried on the other side surface. Cover the part with insulating resin and dry to form the exterior part. For this reason, the insulating resin that covers the coil portion on the adjacent side surface is already hardened, so that the outer shape does not become circular due to the influence of the surface tension.
- the insulating resin is also covered on the prismatic body in the shape of a prismatic pillar, and the prismatic exterior part is formed.
- the packaging part has a planar shape due to the exterior part, which improves the mountability on a mounting board or the like.
- a chip inductor can be provided.
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69832249T DE69832249T2 (de) | 1997-03-28 | 1998-03-26 | Chip-induktivität und sein herstellungsverfahren |
KR1019980709568A KR100283371B1 (ko) | 1997-03-28 | 1998-03-26 | 칩인덕터 및 그 제조방법 |
EP98911019A EP0921542B1 (en) | 1997-03-28 | 1998-03-26 | Chip inductor and method for manufacturing the same |
US09/147,314 US6084500A (en) | 1997-03-28 | 1998-03-26 | Chip inductor and method for manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9/76989 | 1997-03-28 | ||
JP09076990A JP3123459B2 (ja) | 1997-03-28 | 1997-03-28 | チップインダクタ |
JP9/76990 | 1997-03-28 | ||
JP09076989A JP3087679B2 (ja) | 1997-03-28 | 1997-03-28 | チップインダクタの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/570,927 Division US6388550B1 (en) | 1997-03-28 | 2000-05-15 | Chip inductor and its manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998044520A1 true WO1998044520A1 (fr) | 1998-10-08 |
Family
ID=26418097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1998/001349 WO1998044520A1 (fr) | 1997-03-28 | 1998-03-26 | Puce d'inductance et procede de fabrication |
Country Status (5)
Country | Link |
---|---|
US (2) | US6084500A (ja) |
EP (1) | EP0921542B1 (ja) |
KR (1) | KR100283371B1 (ja) |
DE (1) | DE69832249T2 (ja) |
WO (1) | WO1998044520A1 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000243629A (ja) * | 1998-12-21 | 2000-09-08 | Murata Mfg Co Ltd | インダクタおよびその製造方法 |
JP4039779B2 (ja) * | 1999-01-28 | 2008-01-30 | 太陽誘電株式会社 | チップ状電子部品の製造方法 |
FR2793330B1 (fr) * | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue |
US6437676B1 (en) * | 1999-06-29 | 2002-08-20 | Matsushita Electric Industrial Co., Ltd. | Inductance element |
JP3583965B2 (ja) | 1999-11-26 | 2004-11-04 | 太陽誘電株式会社 | 面実装型コイル及びその製造方法 |
EP1195781A4 (en) * | 2000-04-12 | 2004-03-31 | Matsushita Electric Ind Co Ltd | MANUFACTURING METHOD OF A CHIP INDUCTOR |
JP2002008931A (ja) * | 2000-04-18 | 2002-01-11 | Taiyo Yuden Co Ltd | 巻線型コモンモードチョークコイル |
JP3395764B2 (ja) * | 2000-07-17 | 2003-04-14 | 株式会社村田製作所 | チップ型コモンモードチョークコイル |
KR100381361B1 (ko) * | 2000-11-08 | 2003-04-26 | 주식회사 쎄라텍 | 표면 실장형 칩 인덕터 제조방법 |
US6417755B1 (en) | 2000-08-25 | 2002-07-09 | Conexant Systems, Inc. | Method for fabrication of high inductance inductors and related structure |
US6864774B2 (en) * | 2000-10-19 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Inductance component and method of manufacturing the same |
KR100372737B1 (ko) * | 2001-05-28 | 2003-02-15 | 주식회사 쎄라텍 | 표면 실장형 칩 인덕터 및 제조 방법 |
JP2003115403A (ja) * | 2001-10-03 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法 |
US7884698B2 (en) * | 2003-05-08 | 2011-02-08 | Panasonic Corporation | Electronic component, and method for manufacturing the same |
JP5287154B2 (ja) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | 回路保護素子およびその製造方法 |
KR101219003B1 (ko) | 2011-04-29 | 2013-01-04 | 삼성전기주식회사 | 칩형 코일 부품 |
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CN103903838B (zh) * | 2014-03-27 | 2016-02-10 | 西北核技术研究所 | 一种紧凑型电感一体化电极及其加工方法 |
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KR102052767B1 (ko) * | 2014-12-12 | 2019-12-09 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
CN109003779B (zh) * | 2016-03-03 | 2021-04-09 | 台达电子企业管理(上海)有限公司 | 功率模块及其制造方法 |
US11277067B2 (en) | 2016-03-03 | 2022-03-15 | Delta Electronics, Inc. | Power module and manufacturing method thereof |
JP7221583B2 (ja) * | 2017-03-29 | 2023-02-14 | 太陽誘電株式会社 | コイル部品 |
KR102064068B1 (ko) * | 2018-04-25 | 2020-01-08 | 삼성전기주식회사 | 코일 전자부품 |
CN114758881A (zh) * | 2022-04-18 | 2022-07-15 | 宁波中科毕普拉斯新材料科技有限公司 | 一种片式电感的制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06215950A (ja) * | 1993-01-13 | 1994-08-05 | Matsushita Electric Ind Co Ltd | コイルおよびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3812442A (en) * | 1972-02-29 | 1974-05-21 | W Muckelroy | Ceramic inductor |
NZ200399A (en) * | 1981-05-15 | 1985-12-13 | Westinghouse Electric Corp | Forming paperless electric coils:winding conductor on gelled insulation coating |
US5441783A (en) * | 1992-11-17 | 1995-08-15 | Alliedsignal Inc. | Edge coating for amorphous ribbon transformer cores |
CN1075661C (zh) * | 1995-06-08 | 2001-11-28 | 松下电器产业株式会社 | 片状线圈 |
JP3241996B2 (ja) * | 1995-06-08 | 2001-12-25 | 松下電器産業株式会社 | チップコイル |
-
1998
- 1998-03-26 DE DE69832249T patent/DE69832249T2/de not_active Expired - Fee Related
- 1998-03-26 WO PCT/JP1998/001349 patent/WO1998044520A1/ja active IP Right Grant
- 1998-03-26 EP EP98911019A patent/EP0921542B1/en not_active Expired - Lifetime
- 1998-03-26 US US09/147,314 patent/US6084500A/en not_active Expired - Lifetime
- 1998-03-26 KR KR1019980709568A patent/KR100283371B1/ko not_active IP Right Cessation
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2000
- 2000-05-15 US US09/570,927 patent/US6388550B1/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06215950A (ja) * | 1993-01-13 | 1994-08-05 | Matsushita Electric Ind Co Ltd | コイルおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
DE69832249D1 (de) | 2005-12-15 |
EP0921542A4 (en) | 2000-06-07 |
EP0921542A1 (en) | 1999-06-09 |
US6388550B1 (en) | 2002-05-14 |
US6084500A (en) | 2000-07-04 |
DE69832249T2 (de) | 2006-05-24 |
KR20000016006A (ko) | 2000-03-25 |
KR100283371B1 (ko) | 2001-04-02 |
EP0921542B1 (en) | 2005-11-09 |
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