WO1998052218A1 - Connecteur et systeme d'echantillonnage - Google Patents

Connecteur et systeme d'echantillonnage Download PDF

Info

Publication number
WO1998052218A1
WO1998052218A1 PCT/JP1998/001722 JP9801722W WO9852218A1 WO 1998052218 A1 WO1998052218 A1 WO 1998052218A1 JP 9801722 W JP9801722 W JP 9801722W WO 9852218 A1 WO9852218 A1 WO 9852218A1
Authority
WO
WIPO (PCT)
Prior art keywords
probing
contact
multilayered film
tip
bringing
Prior art date
Application number
PCT/JP1998/001722
Other languages
English (en)
French (fr)
Inventor
Susumu Kasukabe
Terutaka Mori
Akihiko Ariga
Hidetaka Shigi
Takayoshi Watanabe
Ryuji Kohno
Original Assignee
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi, Ltd. filed Critical Hitachi, Ltd.
Priority to US09/423,385 priority Critical patent/US6305230B1/en
Publication of WO1998052218A1 publication Critical patent/WO1998052218A1/ja
Priority to US11/853,979 priority patent/US7541202B2/en
Priority to US12/408,000 priority patent/US20090209053A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
PCT/JP1998/001722 1997-05-09 1998-04-15 Connecteur et systeme d'echantillonnage WO1998052218A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US09/423,385 US6305230B1 (en) 1997-05-09 1998-05-14 Connector and probing system
US11/853,979 US7541202B2 (en) 1997-05-09 2007-09-12 Connection device and test system
US12/408,000 US20090209053A1 (en) 1997-05-09 2009-03-20 Connection device and test system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9/119107 1997-05-09
JP11910797 1997-05-09
JP10049912A JPH1123615A (ja) 1997-05-09 1998-03-03 接続装置および検査システム
JP10/49912 1998-03-03

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US09423385 A-371-Of-International 1998-04-14
US09/971,606 Continuation US6759258B2 (en) 1997-05-09 2001-10-09 Connection device and test system

Publications (1)

Publication Number Publication Date
WO1998052218A1 true WO1998052218A1 (fr) 1998-11-19

Family

ID=26390358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/001722 WO1998052218A1 (fr) 1997-05-09 1998-04-15 Connecteur et systeme d'echantillonnage

Country Status (4)

Country Link
US (5) US6305230B1 (ja)
JP (1) JPH1123615A (ja)
KR (2) KR100375116B1 (ja)
WO (1) WO1998052218A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2812400A1 (fr) * 2000-07-28 2002-02-01 Mesatronic Procede de fabrication d'une carte a pointes de contact multiple pour le test de circuits integres a microbilles, et dispositif de test utilisant la carte
US7688086B2 (en) 2005-11-11 2010-03-30 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device and probe card
TWI480974B (zh) * 2012-05-31 2015-04-11 Mitsubishi Electric Corp 半導體裝置之製造方法及半導體製造裝置
WO2019021749A1 (ja) * 2017-07-24 2019-01-31 株式会社ヨコオ 検査治具
CN115184650A (zh) * 2022-09-14 2022-10-14 江苏玄博智能标识科技有限公司 一种多功能智能标识控制检测装置

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JPH1123615A (ja) * 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
DE19952943C2 (de) * 1999-11-03 2003-07-03 Infineon Technologies Ag Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP2002110751A (ja) * 2000-10-03 2002-04-12 Hitachi Ltd 半導体集積回路装置の検査装置および製造方法
US6677771B2 (en) 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US6762612B2 (en) 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
JP2003066066A (ja) * 2001-08-30 2003-03-05 Yamaha Fine Technologies Co Ltd バンプ形プローブカード
JP2003078310A (ja) * 2001-09-04 2003-03-14 Murata Mfg Co Ltd 高周波用線路変換器、部品、モジュールおよび通信装置
US6653825B2 (en) * 2001-11-29 2003-11-25 Theodore G. Munniksma Meter lead holder device
JP2003287553A (ja) * 2002-03-28 2003-10-10 Fujitsu Ltd プローブカード及びそれを製造するための基板
US6767817B2 (en) * 2002-07-11 2004-07-27 Micron Technology, Inc. Asymmetric plating
US20040051541A1 (en) * 2002-09-04 2004-03-18 Yu Zhou Contact structure with flexible cable and probe contact assembly using same
JP3649239B2 (ja) 2002-10-28 2005-05-18 Ｊｓｒ株式会社 シート状コネクターの製造方法
JP4099412B2 (ja) 2003-03-19 2008-06-11 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP4465995B2 (ja) 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
WO2005013332A2 (en) * 2003-07-28 2005-02-10 Nextest Systems Corporation Apparatus for planarizing a probe card and method using same
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
US6900649B1 (en) * 2003-09-23 2005-05-31 Keithley Instruments, Inc. High frequency RF interconnect for semiconductor automatic test equipment
JP2005136246A (ja) * 2003-10-31 2005-05-26 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4723195B2 (ja) * 2004-03-05 2011-07-13 株式会社オクテック プローブの製造方法
CN100539061C (zh) * 2004-03-31 2009-09-09 Jsr株式会社 探针设备，配备有该探针设备的晶片检测设备，以及晶片检测方法
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6810752B1 (en) * 2004-04-23 2004-11-02 Jia-Yih Yen Block test stand
CN1957259A (zh) * 2004-04-27 2007-05-02 Jsr株式会社 片状探针及其制造方法以及其应用
CN100499056C (zh) 2004-06-09 2009-06-10 株式会社瑞萨科技 半导体集成电路器件的制造方法
JP4980903B2 (ja) * 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
JP2006071486A (ja) * 2004-09-02 2006-03-16 Renesas Technology Corp 接続装置、半導体チップ検査装置および半導体装置の製造方法
JP4535494B2 (ja) * 2004-10-20 2010-09-01 ルネサスエレクトロニクス株式会社 薄膜プローブシートの製造方法および半導体チップの検査方法
JP4438601B2 (ja) * 2004-10-28 2010-03-24 株式会社ヨコオ 検査ユニットの製法
CN100508154C (zh) 2004-11-18 2009-07-01 株式会社瑞萨科技 半导体集成电路器件的制造方法
CN100348983C (zh) * 2005-02-07 2007-11-14 董玟昌 一种微机电探针电路薄膜及其制法
WO2006097982A1 (ja) 2005-03-11 2006-09-21 Renesas Technology Corp. 半導体集積回路装置の製造方法
US7030636B1 (en) 2005-05-02 2006-04-18 Fargo Assembly Company Low pin testing system
JP2006343182A (ja) 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4825457B2 (ja) 2005-06-21 2011-11-30 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2007012810A (ja) * 2005-06-29 2007-01-18 Renesas Technology Corp 半導体集積回路装置の製造方法
US7498825B2 (en) * 2005-07-08 2009-03-03 Formfactor, Inc. Probe card assembly with an interchangeable probe insert
WO2007057944A1 (ja) * 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
JP5191646B2 (ja) 2006-10-24 2013-05-08 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP5065674B2 (ja) 2006-12-28 2012-11-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
DE202008010533U1 (de) * 2008-08-07 2008-10-30 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktlose Schleifensonde
US8030957B2 (en) * 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
JP5557547B2 (ja) * 2010-02-10 2014-07-23 株式会社アドバンテスト テストヘッド及びそれを備えた半導体ウェハ試験装置
TWI395366B (zh) * 2010-03-12 2013-05-01 Iner Aec Executive Yuan 固態氧化物燃料電池堆在封裝製程中元件間最佳接觸壓力量測方法及其量測裝置
JP2011196934A (ja) * 2010-03-23 2011-10-06 Hitachi Ltd 試験方法およびそれに用いられるインターポーザ
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Cited By (11)

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Publication number Priority date Publication date Assignee Title
FR2812400A1 (fr) * 2000-07-28 2002-02-01 Mesatronic Procede de fabrication d'une carte a pointes de contact multiple pour le test de circuits integres a microbilles, et dispositif de test utilisant la carte
WO2002010779A1 (fr) * 2000-07-28 2002-02-07 Mesatronic Procede de fabrication d'une carte a pointes de contact multiple pour le test de circuits integres a microbilles, et dispositif de test utilisant la carte
US6873145B2 (en) 2000-07-28 2005-03-29 Mesatronic Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
KR100798669B1 (ko) * 2000-07-28 2008-01-28 메사트로닉 마이크로스피어 집적 회로를 테스팅하기 위한 다수의 접촉팁들을 가진 카드를 제조하는 방법 및 이 카드를 사용하여장치를 테스트하는 방법
US7688086B2 (en) 2005-11-11 2010-03-30 Renesas Technology Corp. Fabrication method of semiconductor integrated circuit device and probe card
TWI480974B (zh) * 2012-05-31 2015-04-11 Mitsubishi Electric Corp 半導體裝置之製造方法及半導體製造裝置
WO2019021749A1 (ja) * 2017-07-24 2019-01-31 株式会社ヨコオ 検査治具
JPWO2019021749A1 (ja) * 2017-07-24 2020-05-28 株式会社ヨコオ 検査治具
JP7240317B2 (ja) 2017-07-24 2023-03-15 株式会社ヨコオ 検査治具
CN115184650A (zh) * 2022-09-14 2022-10-14 江苏玄博智能标识科技有限公司 一种多功能智能标识控制检测装置
CN115184650B (zh) * 2022-09-14 2022-12-02 江苏玄博智能标识科技有限公司 一种多功能智能标识控制检测装置

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JPH1123615A (ja) 1999-01-29
KR100375116B1 (ko) 2003-03-08
US20080009082A1 (en) 2008-01-10
US6305230B1 (en) 2001-10-23
US7541202B2 (en) 2009-06-02
US6759258B2 (en) 2004-07-06
US20090209053A1 (en) 2009-08-20
US7285430B2 (en) 2007-10-23
KR20010012353A (ko) 2001-02-15
KR100416675B1 (ko) 2004-01-31
US20040235207A1 (en) 2004-11-25
US20020129323A1 (en) 2002-09-12

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