WO1998052220A1 - Procede de production d'un boitier pour semi-conducteur et systeme de carte de circuits - Google Patents

Procede de production d'un boitier pour semi-conducteur et systeme de carte de circuits Download PDF

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Publication number
WO1998052220A1
WO1998052220A1 PCT/JP1998/001905 JP9801905W WO9852220A1 WO 1998052220 A1 WO1998052220 A1 WO 1998052220A1 JP 9801905 W JP9801905 W JP 9801905W WO 9852220 A1 WO9852220 A1 WO 9852220A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor package
circuit board
board assembly
manufacturing semiconductor
assembly
Prior art date
Application number
PCT/JP1998/001905
Other languages
English (en)
French (fr)
Inventor
Yoshihiro Ishida
Kiyoshi Shimizu
Tetsuo Sato
Shinichi Nishikata
Shuichi Ishiwata
Atsushi Omura
Tsutomu Ohara
Original Assignee
Citizen Watch Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11922097A external-priority patent/JP4115553B2/ja
Priority claimed from JP15868897A external-priority patent/JP4115556B2/ja
Priority claimed from JP15868997A external-priority patent/JP4115557B2/ja
Priority claimed from JP25650397A external-priority patent/JP4115560B2/ja
Priority claimed from JP29531797A external-priority patent/JP3964515B2/ja
Application filed by Citizen Watch Co., Ltd. filed Critical Citizen Watch Co., Ltd.
Priority to EP98917679.7A priority Critical patent/EP0932198B1/en
Priority to US09/194,735 priority patent/US6365438B1/en
Publication of WO1998052220A1 publication Critical patent/WO1998052220A1/ja

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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PCT/JP1998/001905 1997-05-09 1998-04-24 Procede de production d'un boitier pour semi-conducteur et systeme de carte de circuits WO1998052220A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP98917679.7A EP0932198B1 (en) 1997-05-09 1998-04-24 Process for manufacturing semiconductor package and circuit board assembly
US09/194,735 US6365438B1 (en) 1997-05-09 1998-04-24 Process for manufacturing semiconductor package and circuit board assembly

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP9/119220 1997-05-09
JP11922097A JP4115553B2 (ja) 1997-05-09 1997-05-09 半導体パッケージの製造方法
JP9/158688 1997-06-16
JP15868897A JP4115556B2 (ja) 1997-06-16 1997-06-16 半導体パッケージの製造方法
JP9/158689 1997-06-16
JP15868997A JP4115557B2 (ja) 1997-06-16 1997-06-16 半導体パッケージの製造方法
JP25650397A JP4115560B2 (ja) 1997-09-22 1997-09-22 半導体パッケージの製造方法
JP9/256503 1997-09-22
JP9/295317 1997-10-28
JP29531797A JP3964515B2 (ja) 1997-10-28 1997-10-28 半導体装置の切断分離方法

Publications (1)

Publication Number Publication Date
WO1998052220A1 true WO1998052220A1 (fr) 1998-11-19

Family

ID=27526829

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KR100568571B1 (ko) 2006-04-07
TW395033B (en) 2000-06-21
KR20000023622A (ko) 2000-04-25
EP0932198B1 (en) 2015-12-09
MY123937A (en) 2006-06-30
CN1185702C (zh) 2005-01-19
CN1225750A (zh) 1999-08-11
EP2015359A2 (en) 2009-01-14
US6365438B1 (en) 2002-04-02
EP0932198A4 (en) 2005-01-12
EP0932198A1 (en) 1999-07-28
EP2015359A3 (en) 2010-10-06
EP2015359B1 (en) 2015-12-23

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