WO1999010916A3 - Copper electroless deposition on a titanium-containing surface - Google Patents
Copper electroless deposition on a titanium-containing surface Download PDFInfo
- Publication number
- WO1999010916A3 WO1999010916A3 PCT/US1998/017276 US9817276W WO9910916A3 WO 1999010916 A3 WO1999010916 A3 WO 1999010916A3 US 9817276 W US9817276 W US 9817276W WO 9910916 A3 WO9910916 A3 WO 9910916A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- titanium
- containing surface
- electroless deposition
- copper electroless
- copper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/903—Catalyst aided deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU91103/98A AU9110398A (en) | 1997-08-22 | 1998-08-20 | Copper electroless deposition on a titanium-containing surface |
KR1020007001830A KR100578676B1 (en) | 1997-08-22 | 1998-08-20 | Copper electroless deposition on a titanium-containing surface |
JP2000508134A JP3388230B2 (en) | 1997-08-22 | 1998-08-20 | Electroless copper plating on titanium-containing surface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/916,219 | 1997-08-22 | ||
US08/916,219 US6054173A (en) | 1997-08-22 | 1997-08-22 | Copper electroless deposition on a titanium-containing surface |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999010916A2 WO1999010916A2 (en) | 1999-03-04 |
WO1999010916A3 true WO1999010916A3 (en) | 1999-08-05 |
Family
ID=25436897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/017276 WO1999010916A2 (en) | 1997-08-22 | 1998-08-20 | Copper electroless deposition on a titanium-containing surface |
Country Status (5)
Country | Link |
---|---|
US (4) | US6054173A (en) |
JP (1) | JP3388230B2 (en) |
KR (1) | KR100578676B1 (en) |
AU (1) | AU9110398A (en) |
WO (1) | WO1999010916A2 (en) |
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US6054173A (en) | 1997-08-22 | 2000-04-25 | Micron Technology, Inc. | Copper electroless deposition on a titanium-containing surface |
US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
WO1999040615A1 (en) | 1998-02-04 | 1999-08-12 | Semitool, Inc. | Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device |
US6211073B1 (en) | 1998-02-27 | 2001-04-03 | Micron Technology, Inc. | Methods for making copper and other metal interconnections in integrated circuits |
US6268289B1 (en) * | 1998-05-18 | 2001-07-31 | Motorola Inc. | Method for protecting the edge exclusion of a semiconductor wafer from copper plating through use of an edge exclusion masking layer |
US6284656B1 (en) | 1998-08-04 | 2001-09-04 | Micron Technology, Inc. | Copper metallurgy in integrated circuits |
US6380083B1 (en) * | 1998-08-28 | 2002-04-30 | Agere Systems Guardian Corp. | Process for semiconductor device fabrication having copper interconnects |
US6288442B1 (en) | 1998-09-10 | 2001-09-11 | Micron Technology, Inc. | Integrated circuit with oxidation-resistant polymeric layer |
US20040065540A1 (en) * | 2002-06-28 | 2004-04-08 | Novellus Systems, Inc. | Liquid treatment using thin liquid layer |
JP3687722B2 (en) * | 1999-01-12 | 2005-08-24 | 上村工業株式会社 | Electroless composite plating solution and electroless composite plating method |
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US6323128B1 (en) * | 1999-05-26 | 2001-11-27 | International Business Machines Corporation | Method for forming Co-W-P-Au films |
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US6663915B2 (en) | 2000-11-28 | 2003-12-16 | Interuniversitair Microelektronica Centrum | Method for copper plating deposition |
US20020064592A1 (en) * | 2000-11-29 | 2002-05-30 | Madhav Datta | Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects |
KR100743770B1 (en) * | 2000-12-05 | 2007-07-30 | 주식회사 하이닉스반도체 | Method of forming a copper metal wiring in a semiconductor device |
WO2002063760A1 (en) * | 2001-02-08 | 2002-08-15 | Stridsberg Innovation Ab | High reliability motor system |
JP2002348680A (en) * | 2001-05-22 | 2002-12-04 | Sharp Corp | Pattern of metal film and manufacturing method therefor |
US6900119B2 (en) * | 2001-06-28 | 2005-05-31 | Micron Technology, Inc. | Agglomeration control using early transition metal alloys |
US20030008243A1 (en) * | 2001-07-09 | 2003-01-09 | Micron Technology, Inc. | Copper electroless deposition technology for ULSI metalization |
JP2003147541A (en) * | 2001-11-15 | 2003-05-21 | Hitachi Ltd | Electroless copper plating solution, replenishing solution for electroless copper plating, and method of producing wiring board |
US6815342B1 (en) * | 2001-11-27 | 2004-11-09 | Lsi Logic Corporation | Low resistance metal interconnect lines and a process for fabricating them |
KR100422597B1 (en) | 2001-11-27 | 2004-03-16 | 주식회사 하이닉스반도체 | Method of forming semiconductor device with capacitor and metal-interconnection in damascene process |
US6787450B2 (en) | 2002-05-29 | 2004-09-07 | Micron Technology, Inc. | High aspect ratio fill method and resulting structure |
US20040038526A1 (en) * | 2002-08-08 | 2004-02-26 | United Microelectronics Corp. | Thermal process for reducing copper via distortion and crack |
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DE10243814B4 (en) * | 2002-09-20 | 2018-05-30 | Robert Bosch Gmbh | Method for producing a conductive coating on an insulating substrate |
US7632537B2 (en) * | 2002-10-30 | 2009-12-15 | Hybird Electronics Australia Pty Ltd. | Circuits including a titanium substrate |
US6900126B2 (en) | 2002-11-20 | 2005-05-31 | International Business Machines Corporation | Method of forming metallized pattern |
US7902062B2 (en) * | 2002-11-23 | 2011-03-08 | Infineon Technologies Ag | Electrodepositing a metal in integrated circuit applications |
KR100482180B1 (en) * | 2002-12-16 | 2005-04-14 | 동부아남반도체 주식회사 | Fabricating method of semiconductor device |
US6887776B2 (en) * | 2003-04-11 | 2005-05-03 | Applied Materials, Inc. | Methods to form metal lines using selective electrochemical deposition |
US7220665B2 (en) * | 2003-08-05 | 2007-05-22 | Micron Technology, Inc. | H2 plasma treatment |
TWI250614B (en) * | 2005-04-08 | 2006-03-01 | Chung Cheng Inst Of Technology | Method for preparing copper interconnections of ULSI |
KR20080112790A (en) * | 2007-06-22 | 2008-12-26 | 삼성전자주식회사 | Method for forming film of semicondoctor device |
TW201119742A (en) * | 2009-12-14 | 2011-06-16 | Yi-Chun Liu | Composition having catalyst particles |
FR2968016B1 (en) * | 2010-11-29 | 2013-05-03 | Seb Sa | HEATING APPARATUS COVERED WITH SELF-CLEANING COATING |
JP5996244B2 (en) * | 2011-04-19 | 2016-09-21 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | Copper plating on semiconductors |
US9758367B2 (en) | 2015-12-09 | 2017-09-12 | Analog Devices, Inc. | Metallizing MEMS devices |
DE102017114085B4 (en) | 2016-06-28 | 2023-05-04 | Analog Devices, Inc. | Selective conductive coating for MEMS sensors |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2034261A1 (en) * | 1970-07-10 | 1972-01-13 | Boehler & Co Ag Geb | Process for dip copper plating of parts, in particular wires |
US4340620A (en) * | 1980-03-04 | 1982-07-20 | Mtu Motoren-Und Turbinen-Union | Method for activating titanium surfaces for subsequent plating with metallic coatings |
JPS6187893A (en) * | 1984-10-04 | 1986-05-06 | Mitsubishi Electric Corp | Surface treatment of titanium or titanium alloy |
US4699811A (en) * | 1986-09-16 | 1987-10-13 | Macdermid, Incorporated | Chromium mask for electroless nickel or copper plating |
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US3994727A (en) * | 1971-07-29 | 1976-11-30 | Photocircuits Divison Of Kollmorgen Corporation | Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents |
US3708329A (en) * | 1971-09-10 | 1973-01-02 | Bell Telephone Labor Inc | Electroless copper plating |
US4273804A (en) * | 1975-10-23 | 1981-06-16 | Nathan Feldstein | Process using activated electroless plating catalysts |
US4143186A (en) * | 1976-09-20 | 1979-03-06 | Amp Incorporated | Process for electroless copper deposition from an acidic bath |
US4211564A (en) * | 1978-05-09 | 1980-07-08 | Hitachi, Ltd. | Chemical copper plating solution |
US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
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GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
US4511597A (en) * | 1983-10-12 | 1985-04-16 | Kollmorgen Technologies Corporation | Method for depositing a metal on a surface |
DE3404270A1 (en) * | 1984-02-04 | 1985-08-08 | Schering AG, 1000 Berlin und 4709 Bergkamen | AQUEOUS ALKALINE BATH FOR CHEMICAL DEPOSITION OF COPPER, NICKEL, COBALT AND THEIR ALLOYS |
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US4962058A (en) * | 1989-04-14 | 1990-10-09 | International Business Machines Corporation | Process for fabricating multi-level integrated circuit wiring structure from a single metal deposit |
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JP3493703B2 (en) * | 1994-01-25 | 2004-02-03 | 松下電工株式会社 | Circuit board forming method |
JP3332668B2 (en) * | 1994-07-14 | 2002-10-07 | 松下電器産業株式会社 | Electroless plating bath used for forming wiring of semiconductor device and method for forming wiring of semiconductor device |
JPH08153690A (en) * | 1994-09-29 | 1996-06-11 | Sony Corp | Semiconductor device, manufacture of semiconductor device and wiring formation |
US6054173A (en) | 1997-08-22 | 2000-04-25 | Micron Technology, Inc. | Copper electroless deposition on a titanium-containing surface |
-
1997
- 1997-08-22 US US08/916,219 patent/US6054173A/en not_active Expired - Lifetime
-
1998
- 1998-08-20 WO PCT/US1998/017276 patent/WO1999010916A2/en active IP Right Grant
- 1998-08-20 KR KR1020007001830A patent/KR100578676B1/en not_active IP Right Cessation
- 1998-08-20 JP JP2000508134A patent/JP3388230B2/en not_active Expired - Fee Related
- 1998-08-20 AU AU91103/98A patent/AU9110398A/en not_active Abandoned
- 1998-08-26 US US09/140,701 patent/US6126989A/en not_active Expired - Lifetime
-
1999
- 1999-02-25 US US09/257,854 patent/US6054172A/en not_active Expired - Lifetime
-
2000
- 2000-02-11 US US09/503,593 patent/US6326303B1/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2034261A1 (en) * | 1970-07-10 | 1972-01-13 | Boehler & Co Ag Geb | Process for dip copper plating of parts, in particular wires |
US4340620A (en) * | 1980-03-04 | 1982-07-20 | Mtu Motoren-Und Turbinen-Union | Method for activating titanium surfaces for subsequent plating with metallic coatings |
JPS6187893A (en) * | 1984-10-04 | 1986-05-06 | Mitsubishi Electric Corp | Surface treatment of titanium or titanium alloy |
US4699811A (en) * | 1986-09-16 | 1987-10-13 | Macdermid, Incorporated | Chromium mask for electroless nickel or copper plating |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 262 (C - 371) 6 September 1986 (1986-09-06) * |
Also Published As
Publication number | Publication date |
---|---|
AU9110398A (en) | 1999-03-16 |
JP2001514334A (en) | 2001-09-11 |
US6054172A (en) | 2000-04-25 |
KR20010023201A (en) | 2001-03-26 |
JP3388230B2 (en) | 2003-03-17 |
US6054173A (en) | 2000-04-25 |
WO1999010916A2 (en) | 1999-03-04 |
US6126989A (en) | 2000-10-03 |
US6326303B1 (en) | 2001-12-04 |
KR100578676B1 (en) | 2006-05-12 |
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