WO1999013300A1 - Mass sensor and mass detection method - Google Patents
Mass sensor and mass detection method Download PDFInfo
- Publication number
- WO1999013300A1 WO1999013300A1 PCT/JP1998/003969 JP9803969W WO9913300A1 WO 1999013300 A1 WO1999013300 A1 WO 1999013300A1 JP 9803969 W JP9803969 W JP 9803969W WO 9913300 A1 WO9913300 A1 WO 9913300A1
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- WO
- WIPO (PCT)
- Prior art keywords
- plate
- detection
- diaphragm
- mass
- piezoelectric element
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
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- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
- G01P15/0922—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up of the bending or flexing mode type
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
- B06B1/0692—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF with a continuous electrode on one side and a plurality of electrodes on the other side
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
- G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
- G01G3/16—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of frequency of oscillations of the body
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N2035/00178—Special arrangements of analysers
- G01N2035/00207—Handling bulk quantities of analyte
- G01N2035/00217—Handling bulk quantities of analyte involving measurement of weight
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N2035/00178—Special arrangements of analysers
- G01N2035/00237—Handling microquantities of analyte, e.g. microvalves, capillary networks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Definitions
- the present invention nanograms (1 0- 9 g) mass sensor for measuring a minute mass of the order, for example, bacteria, viruses, mass sensor (immune sensor) for detecting a microorganism protozoa such and moisture and toxic substances Also, it relates to mass sensors (moisture meters, gas sensors, taste sensors) and mass detection methods used to detect specific chemical substances such as taste components. In particular, capture substances that react only with these target substances and capture the target substances TECHNICAL FIELD The present invention relates to a mass sensor and a mass detection method suitably used for measuring a mass of an object to be detected by measuring a change in a resonance frequency based on a change in mass of a diaphragm coated with the material.
- the mass sensor of the present invention measures the mass change of the trapped substance applied to the diaphragm, that is, is not limited to measuring the indirect mass change of the diaphragm. Since it is naturally possible to detect a change in the resonance frequency based on a change in its own mass, it is also used as a vapor deposition thickness meter or a dew point meter.
- the mass of the diaphragm is not directly or indirectly changed, it is placed in an environment that causes a change in the resonance frequency, that is, under a medium environment such as gas or liquid with different degrees of vacuum, viscosity, and temperature.
- a medium environment such as gas or liquid with different degrees of vacuum, viscosity, and temperature.
- the basic measurement principle of measuring the change in the resonance frequency of the force diaphragm having various applications and the resonance unit including the diaphragm is the same. Things. Background art
- diseases caused by microorganisms such as bacteria, viruses, and protozoa, find these pathogens, identify their types, and determine what drugs are susceptible. Microbial testing is essential for treating disease.
- a virus serum test method used to detect a virus is a method for proving specific immunological antibodies that appear in the serum of a patient.
- An example is a complement fixation reaction, which reacts with the antigen or antibody in the blood to adhere to the cell membrane of the antigen or antibody, or determines the presence of the antibody or antigen by disrupting the cell membrane.
- the disease condition is a new one that has not been seen before and the disease is caused by a new pathogen that has not been discovered so far, in the treatment of disease caused by microorganisms, the above-mentioned microbial test is used.
- early detection of the pathogen allows appropriate treatment to be taken, and leads to recovery of the sick without worsening the condition.
- the analyte reacts only with a specific microorganism, which is the analyte, and the analyte reacts with a capture substance that captures the analyte, Although very small, the mass of the capture substance increases by the mass of the object to be detected.
- Such an increase in mass is the same in the relationship between a chemical substance such as a specific gas substance or an odor component and its trapping substance.Furthermore, the substrate itself having no change in mass is regarded as a trapping substance, and the This also applies to the case where specific substances are deposited or added to Conversely, if a reaction occurs such that the detection target that has been captured by the capturing substance or the like is desorbed, the mass of the capturing substance or the like will be slightly reduced.
- US Pat. No. 4,878,984 discloses a method in which an opposing surface of a quartz oscillator 81 is applied as shown in FIG.
- the electrode 82.83 is formed, and the change in the resonance frequency of the thickness shear vibration of the crystal resonator 81 in the direction of the electrode surface when any substance adheres to the electrodes 82.383 from the outside.
- a mass sensor 80 for detecting a change in mass by utilizing the mass sensor 80 is disclosed. Since such a mass sensor 80 basically measures a change in resonance frequency based on a change in the mass load of the crystal unit 81, for example, It is considered that it can also be used as a vapor thickness meter or moisture meter for measuring the length.
- the portion where the substance from the outside adheres and the portion for detecting the resonance frequency are the same portion. If the piezoelectric characteristics of the sample itself change, the resonance frequency will not be constant, and if the sample is a conductive solution, immersing the mass sensor 80 in the sample will cause a short circuit between the electrodes. Problems always occur when insulation treatment such as resin coating must be applied. Disclosure of the invention
- the present invention has been made in view of the problem of the above-described minute mass sensor, and according to the present invention, the following first to sixth mass sensors are provided.
- a piezoelectric element is disposed on at least a part of at least one flat plate surface of the detection plate, and one side surface of at least one thin plate-shaped vibration plate is a flat plate of the vibration plate.
- the other side of the detection plate is joined to the sensor substrate so that the surface and the flat surface of the detection plate are orthogonal to each other.
- the connecting plate and the diaphragm are joined to each other on their side surfaces, and the detection plate is connected to the connecting plate and the diaphragm in a direction orthogonal to the joining direction of the diaphragm and the joining plate.
- a piezoelectric element is disposed on at least a part of at least one flat surface of the detection plate, and at least a part of the side surface of the connection plate and the detection plate is bonded to a side surface of the sensor substrate.
- a mass sensor is provided, wherein a resonance section is formed from the vibration plate, the connection plate, the detection plate, and the piezoelectric element.
- connection plate and the vibration plate are joined to each other on their side surfaces, and the two detection plates are connected to each other in a direction orthogonal to the joining direction of the vibration plate and the connection plate.
- a piezoelectric element is disposed on at least a portion of at least one of the detection plates on at least one flat surface of the connection plate so as to sandwich the plate; At least a part of the side surface of each detection plate is joined to the side surface of the sensor substrate, and a resonance part is formed from the vibration plate, the connection plate, the detection plates, and the piezoelectric elements. Sensors are provided.
- a piezoelectric element is disposed on at least one flat plate surface of one of the detection plates, and the other detection plate is provided with a piezoelectric element. It is preferable that one or more, preferably a plurality of slits are formed in a direction perpendicular to the joining direction between the other detection plate and the connection plate.
- a piezoelectric element is disposed on at least the same plane of the detection plate facing each other via the connecting plate, and the polarization direction of the piezoelectric film in the piezoelectric element disposed on one detection plate and the other. It is preferable that the polarization directions of the piezoelectric films of the piezoelectric elements provided on the detection plate are opposite to each other with respect to the connection plate.
- a connection plate and a detection plate which are not directly joined, are joined to the diaphragm with side surfaces so that the joining directions with the diaphragm are parallel to each other.
- the connection plate and the detection plate are joined to one side surface of the sensor substrate, and a piezoelectric element is provided on at least a part of at least one flat surface of the detection plate. Accordingly, there is provided a mass sensor, wherein a resonance portion is formed by the vibration plate, the connection plate, the detection plate, and the piezoelectric element.
- a fifth mass sensor two connecting plates sandwich the diaphragm by sandwiching it on the side surfaces of each other. The force is applied between the side surfaces of the concave portion provided on the sensor substrate.
- a plurality of detection plates are laid on the respective connection plates and the bottom side surface of the concave portion in a direction orthogonal to the direction in which the connection plates sandwich the diaphragm, and at least one of the detection plates is provided.
- a mass sensor wherein a piezoelectric element is provided on at least a part of the flat plate surface, and a resonance section is formed by the vibration plate, the connection plates, the detection plates, and the piezoelectric elements. Is provided.
- the term “concave portion” refers to a surface consisting of opposing side surfaces and a bottom side surface connecting the side surfaces.
- the bottom side surface does not necessarily have to be a single plane, and a recess may be provided on the bottom side surface.
- a vibration plate is joined and sandwiched between two connecting plates at two sides thereof is provided so as to straddle a through hole provided in the sensor substrate, and at least a plurality of mass sensors are provided.
- the detection plate is disposed between the connection plate and the side surface of the through hole or between the vibration plate and the side surface of the through hole in a direction orthogonal to the direction in which the connection plate sandwiches the vibration plate.
- a piezoelectric element is disposed on at least a part of at least one of the at least one flat plate surface of the at least one detection plate, and the vibration plate, the respective connection plates, the respective detection plates, and the piezoelectric plates are provided.
- a mass sensor characterized in that a resonance part is formed from an element.
- the piezoelectric element in each pair of detection plates facing each other via the connecting plate or the vibration plate, when the piezoelectric element is disposed on at least one flat surface of one of the detection plates, it is preferable that one or more, preferably a plurality of slits are formed on the other detection plate in a direction perpendicular to the joining direction of the other detection plate and the connecting plate.
- the piezoelectric film of the piezoelectric element provided on one of the detection plates is provided.
- the piezoelectric film of the piezoelectric element disposed on the other detection plate it is preferable that the polarization directions are opposite to each other with respect to the connecting plate or the diaphragm.
- the connecting plate, the diaphragm and the detection plate form the same plane when they are joined to each other, that is, it is preferable that these members have substantially the same thickness.
- the detection plate is fitted and joined to a concave portion formed by the connection plate and the sensor substrate. For this reason, it is preferable that the vibration plate, the connection plate, and the detection plate are formed integrally from one vibration plate, and the sensor substrate is formed integrally by laminating the vibration plate and the base plate.
- a spring plate is bonded to one or both flat surfaces of the connecting plate, and the panel plate is joined to the sensor substrate or the spring plate reinforcing portion.
- the panel plate is not integrally bonded to the vibration plate and the base plate, but is formed integrally with an intermediate plate that is inserted and integrated between the vibration plate and the base plate, or Preferably, it is formed integrally with the panel plate reinforcing portion formed integrally with the vibration plate, and further formed integrally with the connecting plate.
- the connecting plate and the panel plate have the same shape.
- the diaphragm is coated with a trapping substance that traps the detection target only in response to the detection target, and the detection target is not trapped by the trapping substance.
- At least two or more resonating portions are provided on the sensor substrate, and it is preferable that the vibrating plate in one resonating portion is not used as a trapping substance but is used as a reference resonating portion.
- two or more resonance parts are provided The dynamic range can be increased by integrating the signals from the resonance unit.
- Such a resonating portion may be formed with a through hole of an arbitrary shape inside the sensor substrate and formed on the inner peripheral surface of the through hole.
- one piezoelectric element is divided into two parts, one of which is used for driving, and the other is used for detection, because the detection sensitivity can be increased. Further, it is also preferable to increase the detection sensitivity by arranging two piezoelectric elements for one resonating part, using one piezoelectric element for driving and the other piezoelectric element for detection. Therefore, each of the piezoelectric elements disposed at two locations with respect to one resonance part may be further divided into two, and in this case, the piezoelectric element combining the driving and the detecting is composed of 2 It will be arranged in the place.
- the vibration plate when the sample is a conductive solution, when the mass sensor is immersed, the vibration plate is immersed in the solution but the piezoelectric element is not immersed in the solution.
- a position sensor including a pair of electrodes at an intermediate position between the plate and the piezoelectric element because the mass sensor can be installed at a suitable position.
- the electrodes of the piezoelectric element and the piezoelectric element and the electrode leads connected to the electrodes are made of resin, and the sample is a conductive solution by being covered with an insulating coating layer made of glass or the like. Even in this case, it is possible to prevent short-circuiting of the electrodes and the like. Further, it is preferable to form a shield layer made of a conductive member on the surface of the insulating coating layer, since it is possible to reduce noise such as external electromagnetic waves.
- the sensor substrate, the vibration plate, the connection plate, the detection plate, and the spring plate constituting the above-described mass sensor of the present invention are integrally formed using stabilized zirconia or partially stabilized zirconia.
- a material mainly containing a component composed of lead zirconate, lead titanate, and lead magnesium niobate is preferably used.
- trimming the shape of the diaphragm, coupling plate, detection plate or spring plate by laser machining or mechanical machining to adjust the shape allows adjustment of the resonance frequency of the resonance section, adjustment of the sensitivity of the resonance section, and vibration. The other vibration modes that are not necessary for the detection of vibrations are suppressed.
- piezoelectric in the present application includes piezoelectric action and electrostriction action.
- a piezoelectric element includes an electrostrictive element
- a piezoelectric ceramic also includes an electrostrictive ceramic.
- At least one side surface of at least one thin plate-shaped diaphragm is formed by a flat surface of the diaphragm. Is connected to one side of the detection plate so as to be orthogonal to the flat surface on which the piezoelectric elements of the detection plate are arranged, and the other side of the detection plate is connected to the sensor substrate.
- the diaphragm is perpendicular to a side surface of the diaphragm and perpendicular to the vertical axis, with a joint surface between the diaphragm and the detection plate as a fixed surface, with a vertical axis passing vertically through the center of the fixed surface as a center.
- a mass sensor characterized in that a resonance frequency based on at least one of vibration in the ⁇ mode, which vibrates like a pendulum, and vibration in the direction of the vertical axis of the diaphragm is measured by the piezoelectric element.
- a mass detection method is provided. Such a mass detection method of the mass sensor is suitably adopted as a mass detection method in the above-described first mass sensor according to the present invention because of its configuration.
- the connecting plate and the vibration plate are joined to each other on the side surfaces, and at least one detection plate is attached in a direction orthogonal to the joining direction of the vibration plate and the connecting plate.
- a mass sensor having at least one or more piezoelectric elements, which is joined to the connection plate on each side surface, and at least a part of the connection plate and the detection plate is joined to a part of the sensor substrate side surface.
- the diaphragm is perpendicular to a side surface of the diaphragm, with a joint surface between the coupling plate and the sensor substrate as a fixed surface, and about a vertical axis vertically penetrating the center of the fixed surface as a center.
- a zero-mode oscillating vibration that vibrates like a pendulum in a direction perpendicular to the axis, or a vibration about the vertical axis in a direction perpendicular to the side surface of the diaphragm and perpendicular to the vertical axis is the vibration of the diaphragm.
- ⁇ Mode shaking vibration a mass detection method of a mass sensor characterized by measuring a resonance frequency based on at least one of the vibrations by the piezoelectric element.
- the mass detection method of such a mass sensor is based on the configuration of the present invention described above. It is suitably adopted as a mass detection method in the second and third mass sensors. Further, according to the present invention, the vibration plate joined and sandwiched by the two connection plates at the side surfaces thereof is provided so as to straddle the side surface or the through hole of the concave portion provided in the sensor substrate, and A plurality of detection plates are between each of the connection plates and the bottom side surface of the recess or the side surface of the through hole in a direction orthogonal to the direction in which the connection plates sandwich the vibration plate.
- the vibration plate includes the connection plate and the sensor substrate.
- Oscillating vibration, or oscillating vibration that oscillates in a direction perpendicular to the side surface of the diaphragm with respect to the vertical axis and parallel to a direction perpendicular to the vertical axis, or the diaphragm A mass detection method for a mass sensor, characterized in that a resonance frequency based on at least one of the vibrations in the plane of the plate is measured by the piezoelectric element.
- Such a mass detection method of the mass sensor is suitably adopted as the mass detection method in the fifth and sixth mass sensors according to the present invention described above from the configuration, but the detection plate also has a function as a connection plate.
- the fourth mass sensor having a structure can be suitably used.
- the specific numerical value of the change in the resonance frequency of the resonance unit provided in the mass sensor can reliably and quickly reduce the minute mass generated on the diaphragm. It has the advantage that changes can be known and that the measurement operation is easy. Therefore, various physical quantities and chemical quantities can be measured by setting the environment where the resonance frequency of the resonance part is changed. For example, there are a vapor deposition film thickness meter and a dew point meter that use the direct mass change of the diaphragm, a vacuum gauge and a viscometer that use the environment where the diaphragm is placed, such as vacuum and viscosity, and temperature.
- a corresponding trapping substance can be applied to a diaphragm, and it can be suitably used for the presence or absence of an object to be detected and the measurement of the mass using the change in mass.
- FIG. 1 shows an embodiment of the mass sensor of the present invention
- (a) to (d) are perspective views of the embodiment in which the positions and the number of arranged diaphragms are respectively changed.
- FIG. 2 is a perspective view showing one embodiment of a piezoelectric element provided in the mass sensor of the present invention.
- FIG. 3 is a perspective view showing another embodiment of the piezoelectric element provided in the mass sensor of the present invention.
- FIG. 4 is a perspective view showing still another embodiment of the piezoelectric element provided in the mass sensor of the present invention.
- FIG. 5A and 5B show another embodiment of the mass sensor of the present invention, in which FIG. 5A is a plan view, FIG. 5B is an explanatory diagram of a 0-mode oscillating vibration, and FIG. It is a figure.
- FIG. 6 is a plan view showing still another embodiment of the mass sensor of the present invention.
- 7A and 7B show still another embodiment of the mass sensor of the present invention, wherein FIG. 7A is a plan view, and FIGS. 7B to 7E are sectional views.
- FIG. 8 is an explanatory diagram relating to driving of the mass sensor of the present invention.
- FIG. 9 shows still another embodiment of the mass sensor of the present invention, wherein (a) and (b) are plan views and (c) is a cross-sectional view.
- FIG. 10 is a plan view showing still another embodiment of the mass sensor of the present invention.
- FIG. 11 is a plan view showing the appearance of still another embodiment of the mass sensor of the present invention.
- FIG. 12 is a plan view showing the structure of the sensor unit in the mass sensor shown in FIG.
- FIG. 13 is a perspective view showing the structure of the sensor unit in the mass sensor shown in FIG.
- FIG. 14 is another perspective view showing the structure of the sensor unit in the mass sensor shown in FIG. It is.
- FIG. 15 is a plan view showing still another embodiment of the mass sensor of the present invention.
- FIG. 16 is a plan view showing still another embodiment of the mass sensor of the present invention.
- FIG. 17 shows still another embodiment of the mass sensor of the present invention, wherein (a) is a plan view and (b) is a cross-sectional view.
- FIG. 18 is a plan view showing still another embodiment of the mass sensor of the present invention.
- FIG. 19 shows still another embodiment of the mass sensor of the present invention, wherein (a) is a plan view and (b) to (d) are cross-sectional views.
- FIG. 20 is a plan view showing still another embodiment of the mass sensor of the present invention.
- FIG. 21 is a plan view showing still another embodiment of the mass sensor of the present invention.
- FIG. 22 shows still another embodiment of the mass sensor of the present invention, and (a) to (d) and (f) are plan views showing various structures in which a detection plate is joined to a connection plate; (e) is a plan view showing a structure in which the detection plate is connected to the diaphragm.
- FIG. 23 shows a green substrate for a sensor substrate used for manufacturing the mass sensor of the present invention.
- FIG. 7 is a plan view showing an example of processing a unit.
- FIG. 24 is an explanatory diagram showing dimensions and shapes that are preferably adjusted when manufacturing the mass sensor of the present invention.
- FIG. 25 is an explanatory diagram illustrating an example of a method of processing the piezoelectric element of the mass sensor according to the present invention.
- FIG. 26 is an explanatory diagram showing operation characteristics of the mass sensor of the present invention.
- FIG. 27 is a cross-sectional view showing a basic structure of a conventional minute mass sensor.
- FIG. 28 is a perspective view showing a structure of a quartz oscillator of a conventional quartz friction vacuum gauge.
- FIG. 1A is a perspective view illustrating an embodiment of the mass sensor 5 OA of the present invention, in which a first electrode 52, a piezoelectric film 53, A piezoelectric element 55 composed of a second electrode 54 is provided. Note that the piezoelectric element 55 may be provided on both planes of the detection plate 51, and the first and second electrodes 52, 54 are provided with electrode leads (not shown) used for connecting to a frequency measuring device or the like. (Not shown).
- the thin plate-shaped diaphragm 56 is joined to one side surface of the detection plate 51 such that the flat surface of the vibration plate 56 and the flat surface of the detection plate 51 are orthogonal to each other.
- the side surface of the detection plate 51 is a plane perpendicular to the flat surface of the detection plate 51 on which the piezoelectric element 55 is disposed, that is, a plane in the thickness direction, and one side surface is the side surface.
- the other side of the detection plate 51 here the opposite side to which the vibration plate 56 is bonded, is bonded to the sensor substrate 49, and the vibration from the vibration plate 56, the detection plate 51, and the piezoelectric element 55 causes resonance.
- a portion is formed, and a mass sensor 50A is formed.
- the diaphragm is a place where a mass change is mainly caused or received, and refers to an element that vibrates in various modes described later.
- the connecting plate is a combination of the diaphragm, the sensor substrate, and the detection plate.
- the detection plate is a sensor that generates distortion due to the movement of the diaphragm and transmits the distortion to a detection element such as a piezoelectric element disposed on the surface, or conversely, a driving element such as a piezoelectric element.
- the sensor board is an element that holds the resonance section and has various electrode terminals to be attached to the measuring device, and is used for handling in actual use.
- a capture substance that reacts only with a target and captures the target is applied to the diaphragm 56, and the diaphragm 56 is applied to a liquid as a sample.
- a method of measuring the change in the resonance frequency of the mass sensor 5OA using the piezoelectric element 55 or immersing the diaphragm 56 in a liquid as a sample A method of measuring the resonance frequency by drying the vibration plate 56 by using the method described above.
- an example of such a detection target is an antigen causing a disease
- an example of the capture substance is an antibody against the antigen.
- the resonance frequency of the mass sensor 5 OA depends on the mass of the resonance part, It changes depending on the mass.
- the resonance frequency of the resonating unit when the object is not captured by the diaphragm 56 and the resonance frequency of the resonating unit after the object is captured are determined by the captured object Shows different values depending on the amount of mass. Therefore, by measuring the change in the resonance frequency using the piezoelectric element 55, it is possible to measure the mass of the detection target captured by the capture substance applied to the diaphragm 56. .
- the mass sensor 5OA can be used to measure the amount of decrease in the case where the mass of the diaphragm 56 decreases from the initial state.
- the applied trapped substance when the applied trapped substance is peeled off for some reason, or when micro-corrosion of the material of the diaphragm 56 itself or micro-dissolution amount in a specific solution is to be investigated, or when the diaphragm 56 has a specific It can also be suitably used for the purpose of applying a chemical substance and measuring the change due to evaporation, dissolution, etc. of the chemical substance.
- the structure of such a mass sensor 5OA is simply that at least one side surface of the thin plate-shaped vibration plate 56 is provided with the piezoelectric element 55 of the detection plate 51 on one side surface of the vibration plate 56. It can be expressed that the detection plate 51 is joined to one side surface of the detection plate 51 so as to be orthogonal to the flat plate surface, and the other side surface of the detection plate 51 is joined to the sensor substrate 49.
- the vibration mode of the diaphragm used for measuring the resonance frequency in the mass sensor 50 A the joint surface between the diaphragm 56 and the detection plate 51 in FIG.
- 0 mode 0 mode oscillating vibration
- a pendulum-shaped vibration in a direction perpendicular to the side surface of the diaphragm 56 and perpendicular to the Y axis, that is, in the X-axis direction, and parallel to the side surface of the diaphragm 56 as the distance from the Y axis increases.
- the resonance frequency of the resonance part based on at least one of the 0-mode swing vibration (hereinafter referred to as “ ⁇ mode”) with the swing increasing in the direction (Z-axis direction) and the vibration in the Y-axis direction. Is preferably measured.
- the S mode and the 0 mode are equivalent to the mass sensor 30 described later, and will be described in detail in the description of the mass sensor 30.
- the rigid mode using the side surface of the diaphragm is preferably used especially when the diaphragm 56 or the whole mass sensor 5OA is immersed in a liquid.
- a bending mode in which bending in the Z-axis direction is dominant in FIG. 1 (a) can be effectively used.
- the effects of viscosity and density from the liquid are larger than those in the 0 mode and ⁇ mode, but it is not possible to know the change in mass by measuring the resonance frequency. it can.
- a change in the resonance frequency of the diaphragm 56 that is, a change in mass can be known.
- FIGS. 1B to 1D As an embodiment of a mass sensor that functions in the same manner as that of FIG. 1A using the above-described operation principle of the mass sensor 5OA, those illustrated in FIGS. 1B to 1D can be exemplified.
- the mass sensor 50 B shown in FIG. 1 (b) is obtained by attaching one diaphragm 56 in FIG. 1 (a) in parallel to one side of the detection plate 51. By arranging a plurality of diaphragms 56, the dynamic range can be improved.
- the joining position between the plurality of diaphragms 56 and the detecting plate 51 is not particularly limited as long as it is a side surface other than the joining side surface between the sensor substrate 49 and the detecting plate 51 in the detecting plate 51. Further, since it is sufficient that at least one diaphragm 56 is provided, for example, as shown in a mass sensor 50 C shown in FIG. 1 (c), the diaphragm 56 is connected to the side of the detection plate 51. Of these, the detection plate 51 and the sensor substrate 49 may be joined on a side surface perpendicular to the joining side surface. Further, as shown in a mass sensor 50D shown in FIG. By providing a total of two diaphragms 56, it is possible to improve the dynamic range similarly to the mass sensor 50B.
- the connection position of the vibration plate 56 and the detection plate 51 is set to the sensor board of the detection plate 51.
- the Q value (sharp value, hereafter referred to as “Q value”) of the 0 mode and the ⁇ mode can be increased, that is, the vibration of the diaphragm 56 can be increased. This is preferable because the width can be increased and the detection sensitivity is improved.
- a first electrode 52 As a form of the piezoelectric element 55 provided in the above-described mass sensors 50A to 50D, a first electrode 52, a piezoelectric film 53, and a second electrode 54 shown in FIG. Although a stacked type is typical, a piezoelectric film 58 is arranged on a detection plate 57 as shown in FIG.
- a piezoelectric element 62 A having a comb-shaped structure in which a first electrode 59, a second electrode 60, and a gap portion 61 having a constant width are formed on the upper portion 58 can be used.
- the first electrode 59 and the second electrode 60 in FIG. 3 may be formed between the connection surfaces between the detection plate 57 and the piezoelectric film 58.
- a piezoelectric element 62 B in which a piezoelectric film 58 is embedded between a comb-shaped first electrode 59 and a second electrode 60 is also preferably used.
- the comb-shaped electrodes shown in FIGS. 3 and 4 it is possible to increase the measurement sensitivity by reducing the pitch 63.
- the piezoelectric elements shown in FIGS. 2 to 4 can be applied to all mass sensors of the present invention described later. Now, it is possible to perform mass measurement and the like as described above using the mass sensors 50A to 50D, but with such a structure, the area of the diaphragm 56 must be reduced. Therefore, there is a limit in improving the detection sensitivity, for example, the area for applying the trapping substance is reduced, and the change in mass is small when measuring the thickness of the deposited film. Further, the diaphragm 56 may be warped or curved, and in addition, a mode in which only the diaphragm 56 vibrates may appear strongly. Therefore, it is preferable to use the structure shown in FIG.
- FIG. 5 (a) is a plan view showing another embodiment of the mass sensor of the present invention.
- the vibration plate 31 and the connection plate 33 are joined to each other on the side surfaces.
- the detection plate 32 is joined to the connection plate 33 on the side surfaces of the connection plate 33 in a direction orthogonal to the Y-axis direction which is the joining direction of the vibration plate 31 and the connection plate 33, that is, in the X-axis direction.
- a piezoelectric element 35 is disposed on at least a part of at least one flat surface of the detection plate 32 to form a detection unit 36, and a vibration plate 31 case is provided.
- connection plate 33 and the detection plate 32 are joined to the side surfaces of the sensor substrate 34 without being directly joined to the sensor substrate 34.
- the resonance part is formed by the vibration plate 31, the connection plate 33, the detection plate 32, and the piezoelectric element 35, thereby forming the mass sensor 30.
- the vibration plate 31, the connection plate 33, and the detection plate 32 do not necessarily need to have the same thickness, but preferably have the same thickness so as to form the same plate surface, More preferably, they are formed integrally.
- the conditions regarding the thickness and joining of the vibration plate 31, the connection plate 33, and the detection plate 32 are similarly applied to all mass sensors according to the present invention described later.
- the side surfaces of the connection plate 33 and the detection plate 32 are preferably formed integrally with the sensor substrate 34.
- the structure of such a mass sensor 30 is simply such that the connection plate 33 and the vibration plate 31 are joined to each other on their side surfaces, and at least one detection plate 32 is connected to the vibration plate 31.
- the connecting plate 33 is joined on both sides, and at least a part of the side of the connecting plate 33 and the detecting plate 32 is connected to the side of the sensor board 34. It can be expressed as a mass sensor having at least one or more piezoelectric elements joined to a part thereof.
- the diaphragm 31 has a Z perpendicular to both the X axis and the Y axis.
- FIG. (b) is an explanatory diagram of the 0 mode, in which the mass sensor 30 of FIG. 5 (a) is viewed from the arrow AA in FIG. 5 (a), that is, This shows the change in position.
- the upper end surface 3 1 F of the diaphragm 31 is located at the position P 1 in a non-vibrating state.
- the diaphragm 31 is in the plane of the diaphragm 31. , That is, constant with the Y axis around the Y axis in the X—Y plane Vibrates like an pendulum in the X-axis direction at an angle of 0.
- the movement of the upper end face 31F of the diaphragm 31 can be expressed as a vibration that reciprocates between the position P2 and the position P3 on the X axis.
- Oscillating motion is defined as 0 mode.
- FIG. 5 (c) is an explanatory diagram of the 0 mode, and like FIG. 5 (b), shows how the position of the diaphragm 31 changes as viewed from the arrow AA in FIG. 5 (a). ing. Also in this case, the upper end surface 31F of the vibration plate 31 is at the position P1 when not vibrating.
- the diaphragm 31 vibrates like a pendulum in the X-axis direction around the Y-axis, and in the Z-axis direction parallel to the side surface of the diaphragm 31 as the distance from the Y-axis increases. Vibrates so as to increase the swing component.
- the movement of the upper end surface 31F of the diaphragm 31 in the view AA is defined as a movement between the position P4 and the position P5 on the circular orbit S passing through the position P1 with the center 0 at one point on the Z axis.
- the angle between the Z axis and the straight line connecting the diaphragm 31 and the center 0 is ⁇
- the above vibration mode is defined as the ⁇ mode.
- the resonance frequency of the resonance unit including the vibration plate 31, the connection plate 33, and the detection unit 36 is measured by the piezoelectric element 35.
- the resonance frequency of the resonance portion changes mainly with the change in the mass of the diaphragm 31, any substance adheres to or separates from the diaphragm 31, and the resonance frequency of the diaphragm 31 changes.
- the change in mass can be determined from the change in the resonance frequency of the resonance unit in the same manner as in the case of the mass sensors 50A to 50D described above.
- the dynamic range can be increased by arranging the piezoelectric elements 35 on both flat surfaces of the detection plate 32 and comparing and processing the signals to be detected. Furthermore, in this case, the detection sensitivity can be improved by using one piezoelectric element 35 for driving (excitation) the diaphragm 31 and using the other piezoelectric element 35 for detection (for receiving vibration). Can be.
- one piezoelectric element 35 is arranged so that two piezoelectric elements 35 A and 35 B are formed in the Y-axis direction, and the piezoelectric element 35 A is If it is used for driving and the piezoelectric element 35B is used for detection, the detection sensitivity can be improved. Good.
- a piezoelectric element 35 is divided and formed by arranging one piezoelectric element 35 and then dividing it by laser processing, or dividing the piezoelectric element 35 from the beginning when disposing the piezoelectric element 35. Any of the methods of disposing them may be used.
- the arrangement of the plurality of piezoelectric elements and the method of dividing and using each of the piezoelectric elements 35 can be applied to all the mass sensors according to the present invention.
- the diaphragm 31 When the resonance frequency is measured by immersing the diaphragm 31 in a liquid using the above-described bending mode, the diaphragm 31 has a resistance from the liquid according to the size of the area of the diaphragm 31. As a result, there is a disadvantage that it is difficult to detect a minute change in the mass of the diaphragm 31.
- the bending mode can be used because the resistance is small. In this case, the length of the diaphragm 31 in the Y-axis direction and the length in the X-axis direction are reduced. This is preferred.
- the diaphragm 31 near the Y axis of the diaphragm 31 where the width (width in the X-axis direction) of the connecting plate 33 is extended to the diaphragm 31 is used.
- the change in mass of 1 has almost no effect on the rotational vibration of diaphragm 31 and does not contribute to the rotational vibration more than the same change in mass at the left and right ends of diaphragm 31.
- a problem arises in the measurement sensitivity depending on the position where the mass change occurs in. In this case, as in the mass sensor 3OA shown in FIG.
- the shape of the diaphragm 31 is concave and the measurement error can be reduced by reducing the area near the Y axis.
- the mass and change is the same, in order to reduce the measurement error in the attachment position, the short dimension, in order to increase the dust Inamikkurenji is preferably longer dimension H 2.
- the 0 mode or the ⁇ mode when used, regardless of whether the sample is liquid or gas, the dimensions H 3 and H 4 shown in Fig.
- the effect of the position of attachment to the diaphragm 31 can be reduced, and the effect of density and viscosity is small because the thickness of the diaphragm 31 is thin.
- the diaphragm 31 operates in a rigid body mode Therefore, it is resistant to temperature changes and has the best detection sensitivity and environmental friendliness. Therefore, it is preferable to use the 0 mode or the 0 mode in the mass sensor of the present invention.
- FIG. 7 (a) is a plan view of a mass sensor 4OA according to an embodiment in which a panel 38 and a spring plate reinforcement 39 are provided on the mass sensor 30 described above.
- FIGS. 7B to 7E show various cross-sectional views of the arrangement example of the spring plate 38 and the spring plate reinforcing portion 39 as viewed from the X-axis direction in the Y-axis.
- the spring plate 38 is joined to at least one flat surface of the connecting plate 33, and its width may be narrower than the connecting plate 33 as shown in FIG. 7 (a). It is preferable that the width is equal to.
- the spring plates 38 made of the same material are provided on both flat surfaces of the connecting plate 33, it is preferable that the spring plates 38 have the same shape.
- the material of the spring plate 38 is changed to the flat plate of the connecting plate 33. When the surfaces are different from each other, it is not necessary to make the respective spring plates 38 have the same shape, and it is possible to appropriately set the respective shapes in consideration of the Young's modulus of each spring plate 38 and the like.
- Such a spring plate 38 is, in principle, also joined to the sensor board 34. At this time, depending on the joining position of the connecting plate 33 and the sensor board 34, it is necessary to dispose the panel board reinforcing portion 39. Is determined. That is, as shown in FIGS. 7 (b) and (c), when the connecting plate 33 is joined at a position where the solder plate 38 can be directly joined to the sensor substrate 34, Since the sensor substrate 34 also functions as the spring plate reinforcing portion 39, it is not necessary to separately provide the spring plate reinforcing portion 39. At this time, the spring plate 38 may be provided only on one flat surface of the connection plate 33.
- the spring plate reinforcing portion 39 also functions as the spring plate 38B, but it is preferable to provide the panel plate reinforcing portion 39 as a portion for supporting the spring plate 38B. As shown in FIG. 7 (e), even when the connecting plate 33 is joined to the end of the sensor board 12, only the spring plate 38 A that can be joined to the sensor board 12 is used. When the spring plate 38B is not provided, the spring plate reinforcing portion 39 is not required.
- the mechanical strength of the resonance part can be increased.
- This also has the advantage that the thickness of the connecting plate 33 and the diaphragm 31 can be reduced, and the attenuation of the resonance peak in measurement in a liquid is reduced.
- the vibration plate 31 is formed by the piezoelectric element 35.
- FIGS. 8 (a) and (b) cross-sectional views of the embodiment shown in FIGS. 7 (c) and (d) as viewed from the X-axis and Y-axis directions are shown in FIGS. 8 (a) and (b), respectively. Since the piezoelectric element 35 can excite the spring plate 38 A, the spring plate 38 B, and the center 0 of the coupling plate 33 in the X-axis direction, the vibration plate 31 and the entire resonance part are in the X-axis direction. It becomes easy to shake to S mode. On the other hand, in the case of FIG. 8 (b), since the center 0 of the spring plate 38A, the spring plate 38B, and the connecting plate 33 is not on the connecting plate 33, the spring plate 38A itself is not provided.
- the spring plate 38 is further attached to the spring plate 38 and joined to the side surface of the sensor substrate 34. It is also preferable to provide such a reinforcing plate 41.
- 9 (a) and 9 (b) show front views of the mass sensor 40B from the front and back, respectively.
- FIG. 9 (c) shows the Y-axis of the X-axis in FIG. 9 (b).
- FIG. 2 is a cross-sectional view as viewed from a direction.
- the reinforcing plate 41 is attached to a spring plate 38 A attached to the connecting plate 33, and is joined to a side surface of the sensor substrate 34 cut at a right angle. Further, the reinforcing plate 41 is preferably formed integrally with the spring plate 38 and the sensor substrate 34.
- the diaphragm 31 easily resonates in the 0 mode and the ⁇ mode, so that there is an advantage that the attenuation of the Q value is reduced and the detection sensitivity is improved. Therefore, it can be particularly suitably used for measurement in a liquid.
- the above-mentioned panel plate is applied to all mass sensors according to the present invention in which the connecting plate is used as a constituent member. As described in the manufacturing method of the mass sensor, it is formed integrally with the intermediate plate which is inserted and integrated between the vibration plate and the base plate, or is formed integrally with the vibration plate It is preferable that the connecting plate is formed integrally with the spring plate reinforcing portion, and that the connecting plate is also formed integrally.
- the shape of the flat surface of the diaphragm 31 in the above-described mass sensor 30 or the like is not limited to the rectangular shape as shown in FIGS. 5 (a), 7 (a), and 9; 0
- various arbitrary shapes such as circular, triangular, inverted concave, polygonal, elliptical, oval, etc. It is possible to use something.
- the diaphragm 31 may not be joined to the connecting plate 33 so as to be symmetric about the Y axis. The fact that the shape of the diaphragm 31 can be arbitrarily selected in this way is also applied to all the mass sensors of the present invention.
- FIG. 11 shows an embodiment of a mass sensor in which only one spring plate is bonded to the above-described mass sensor 30 and is incorporated in the sensor substrate.
- the spring plate, the spring plate reinforcing portion, and the reinforcing plate described above can be formed, and the shape of the diaphragm can be arbitrarily changed.
- Fig. 11 is a plan view of the mass sensor 1 as viewed from the vibration plate 3 side.
- the mass sensor 1 is designed to have a symmetrical shape.
- the vibration plate 3 forms a sensor substrate 2 together with a base plate 15 and an intermediate plate 17 described later.
- the hole 8 provided in the sensor substrate 2 is provided as an alignment mark used in the packaging and manufacturing processes of the mass sensor 1, and includes a diaphragm 19, a connecting plate 20, and a detection plate (described later).
- a resonating part 26 comprising a plate 21 and a piezoelectric element 25 and a spring plate 18 is provided at two places for the purpose of using one for reference or the like.
- the position sensor electrodes 4 and 5 conduct with the sample to detect the immersion position of the mass sensor 1. If the sample has conductivity, the upper part is immersed in the sample from the pattern formed in the horizontal direction of the position sensor electrodes 4 and 5, and the mass sensor 1 is deeper than the position where the position sensor electrodes 4 and 5 responded.
- the second electrode 24 and the first electrode 22 of the piezoelectric element 25 (not shown in FIG. 11), which will be described later, and the electrode leads 9 pulled out from these electrodes, respectively.
- Prevents 10 short circuits Can be stopped. Terminal portions 6 and 7 are provided at one end of the position sensor electrodes 4 and 5, and terminal portions 11 and 12 are provided at one end of the electrode leads 9 and 10, respectively. Connected to the terminals of the detection device.
- the piezoelectric element 25 and the electrode leads 9 and 10 are coated with an insulating resin or the like, even if the mass sensor 1 is immersed in a conductive sample, the piezoelectric element 25 and the electrode leads 9 Since 9 ⁇ 10 is not short-circuited, the position sensor electrodes 4 ⁇ 5 and the terminals 6 ⁇ 7 need not be provided.
- FIG. 12 is an enlarged plan view from the base plate 15 side of the sensor unit 13 in FIG. 11, that is, from the back side of the vibration plate 3 in FIG. 11, and FIG. FIG. 6 is a perspective view of the vicinity of a notch 16 shown in FIG.
- the sensor section 13 refers to a mass sensor section including the resonance section 26 provided in the mass sensor 1 and the sensor board 2 around the resonance section 26.
- the base plate 15 is provided with a through hole 14 having a concave cutout 16.
- a similar notch 16 is also formed in the intermediate plate 17 overlapping the base plate 15.
- the through hole 1 extends from the center of the bottom of the notch 16.
- a substantially prismatic spring plate 18 toward the center of 4 is formed.
- the intermediate plate 17 and the spring plate 18 are not always necessary, and may be used as members constituting the mass sensor 1 according to the necessity of adjusting the strength of the resonance part 26 and the detection sensitivity of the mass sensor 1. It is something that can be done.
- the notch 16 of the vibrating plate 3 has a connecting plate 20 joined to the spring plate 18 and a vibrating plate joined to the upper end side of the connecting plate 20 and not joined to the flat plate 18 19 are formed. Further, in the notch 16 of the vibration plate 3, the detection plate 21 is provided between one side surface of the connecting plate 20 and the opposing side surface of the notch 16.
- FIG. 14 is a perspective view of the vicinity of the notch 16 shown in FIG.
- a piezoelectric element 25 formed by laminating a first electrode 22, a piezoelectric film 23, and a second electrode 24 in this order is arranged.
- the second electrode 24 is connected to the electrode lead 9, and the first electrode 22 is connected to the electrode lead 10.
- the detection section 29 is composed of the detection plate 21 and the piezoelectric element 25, and the panel A resonance unit 26 is constituted by 18, a vibration plate 19, a coupling plate 20, and a detection unit 29.
- the piezoelectric element 25 is disposed on one flat surface of the detection plate 21.
- the piezoelectric element 25 is disposed on both flat surfaces of the detection plate 21. In this case, since the structure of the detection unit 29 becomes symmetrical, the rigidity of the detection plate 21 can be matched.
- the detection plate 21 has a structure in which the detection plate 21 is joined to the lower side of the notch 16 in the vibration plate 16 so as not to form the gap 27. That is, assuming a structure in which the detection plate 21 is fitted into and joined to the recess formed by the force of the connection plate 20 and the sensor board 2, the connection plate 20 and the Z or spring plate 18 This is preferable because the bending of the panel portion can be suppressed, and the stress applied to the piezoelectric element 25 can be increased.
- the sensor section 13 is provided by using the periphery of the through hole 14 provided in the sensor board 2, but the sensor section 13 is, of course, provided with the sensor board 2. It may be provided on the outer periphery, for example, on the upper side in FIG.
- the thin diaphragm 19 is often provided at a position protruding from the notch 16 as shown in FIGS.
- the resonance part 26 is protected from external shocks, such as by preventing the diaphragm 19 from being damaged when handling the mass sensor 1
- FIG. 16 (a) is a plan view showing a mass sensor 43A according to another embodiment of the present invention.
- the connection plate 20 and the vibration plate 19 are joined at the side surfaces of each other, and the two detection plates 21A and 21B, and the vibration plate 19 and the connection plate 20 are connected to each other.
- the connecting plate 20 is sandwiched between the connecting plates 20 so as to sandwich the connecting plate 20, and the detecting plates 21A and 21B are pressed together.
- the sensor substrate 2 is also joined and supported and fixed on three sides, and the sensitivity is improved by supporting the three sides.
- the detection plates 21A and 21B do not necessarily need to be joined to the lower side of the recess formed by the connection plate 20 and the sensor substrate 2.
- a piezoelectric element including a first electrode, a piezoelectric film, and a second electrode is disposed on at least a part of at least one flat plate surface of at least one of the detection plates.
- a piezoelectric element 25 A to 25 D force is provided on both flat surfaces of 1 A and 21 B, and a vibration plate 19, a coupling plate 20, a detection plate 21 A and 21 B, and a piezoelectric element A resonance part is formed from the elements 25A to 25D.
- not all of the piezoelectric elements 25A to 25D need to be provided, and any number of the piezoelectric elements 25A to 25D may be provided at any position of the detection plate 21A or 21B.
- each piezoelectric element 25A to 25D When a plurality of piezoelectric elements 25A to 25D are provided as in the mass sensor 43A, not only can the rigidity of each detection plate 21A and 21B be matched, but also each piezoelectric element By integrating and calculating the signals from 25 A to 25 D, the Q value of the 0 mode and ⁇ mode can be increased and the Q value of the rotation mode can be reduced, so the measurement of the resonance frequency can be performed with higher accuracy Will be able to do it. Further, when at least two of the piezoelectric elements 25A to 25D are provided, if one is used for driving and the other is used for detection, the detection sensitivity can be improved. Here, as in the case where the piezoelectric element 35 is divided into the piezoelectric elements 35 A and 35 B in the mass sensor 30, these piezoelectric elements 25 A to 25 D are similarly divided and used. The detection sensitivity is improved, which is preferable.
- piezoelectric elements 25 A and 25 C are respectively disposed on the flat surfaces of the detection plates 21 A and 21 B in the same direction, and the piezoelectric films of these piezoelectric elements 25 A and 25 C are provided. It is also preferable to adopt a configuration in which the polarization directions are opposite to each other, as this contributes to an improvement in output charge. Of course, it is also preferable to adopt such a configuration on both flat surfaces of the detection plates 21A and 21B. Further, as shown in a mass sensor 43B shown in FIG.
- At least one of the piezoelectric elements 25A to 25D for example, at least one direction of the piezoelectric elements 25C It is preferable to have a structure in which one side or two sides of the side support are overlapped, because high sensitivity can be obtained. However, even in this case, the piezoelectric elements 25A to 25D When the tie plate 20 and the spring plate are provided, it is necessary that the spring plate does not overlap with the spring plate.
- a spring plate when a spring plate is bonded to the mass sensors 43A and 43B, it is possible to provide a spring plate reinforcing portion like the mass sensor 40B or to provide a reinforcing plate.
- the reinforcing plate is bonded to the panel plate, and the force, the force, and the side of the reinforcing plate are attached to the side of the sensor board 2 (the notch 1 6 and a side surface of the sensor board 2 (a bottom side surface of the cutout 16), which is a joint surface between the connecting plate 20 and the sensor board 2.
- the Q value of the 0 mode can be improved, and the bending mode of the piezoelectric element can be improved.
- a mass sensor 43C shown in FIG. 16 (c) shows an embodiment in which a slit 48 is provided at the center in the longitudinal direction of the connecting plate 20 in the mass sensor 43A.
- the slit 48 is hollow, and has a function of easily causing the vibration of the diaphragm 19 in the 0 mode and the ⁇ mode, and facilitating the recognition of the resonance frequency.
- it has a function of reducing the mass of the connecting plate 20 and improving the detection sensitivity.
- the spring plate may be formed into a shape having such a cavity and integrated with the connecting plate.
- FIG. 1 7 (b) is a sectional view seen from the Y-axis direction in the X-axis in FIG.
- one of the detection plates for example, the detection plate 21 B Is provided with at least one of the piezoelectric elements 25C and 25D, and a slit 28 is formed in the other detection plate 21A in a direction perpendicular to the joining direction of the detection plate 21A and the connection plate 20. It is also preferred. With such a structure, the vibration in the rotation mode can be suppressed, the Q value in the 0 mode and the ⁇ mode can be increased, and the shift of the resonance point can be increased to change the resonance frequency. It is possible to increase the absolute value of the degree of change. Although only one slit 28 may be provided, it is preferable to provide a plurality of slits, since the above-described effects are remarkably obtained.
- FIG. 19 (a) shows a plan view of a mass sensor 43D which is an embodiment in which the form of the mass sensor 43A shown in FIG. 16 (a) is formed in the through hole 14 of the sensor substrate 2.
- FIG. 19 (b) is a cross-sectional view taken along a broken line AA in FIG. 19 (a).
- the mass sensor 43D two piezoelectric elements 25 ⁇ and 25C are provided, and the piezoelectric elements 25A and 25C are provided with electrode leads 9 and 10, respectively.
- An insulating coating layer 65 is formed so as to cover the piezoelectric elements 25A and 25C and the electrode leads 9 and 10. The insulating coating layer 65 prevents short-circuiting of the piezoelectric elements 25A and 25C and the electrode leads 9 and 10 even when the resonance part of the mass sensor 43D is immersed in a conductive sample. .
- the mass sensor 43D has a shield layer 66 made of a conductive material so as to cover the insulating coating layer 65.
- the shield layer 66 is formed on both surfaces of the sensor substrate 2 through the through holes 67. I have. 0.When detecting very small masses on the order of lng, in order to cut off electromagnetic waves from the outside and reduce the error in determining the resonance frequency, not only the wiring from the sensor board 2 to the measuring instrument, but also the sensor board It is also preferable to shield the upper wiring (piezoelectric elements 25A and 25C, electrode leads 9 and 10).
- the arrangement of the shield layer 66 is such that it is formed so as to sandwich the sensor substrate 2 as shown in FIG. 19 (b), and is also shown in the sectional view of FIG. 19 (c).
- the form that only surrounds the wiring part on the sensor board 2 and the form that shields the wiring part only on one side as shown in Fig. 19 (d) It is preferable to shield the entire wiring portion as shown in FIGS.
- the shield layers 66 formed on the respective surfaces of the sensor substrate 2 are electrically connected using the through holes 67, but using the side surfaces of the sensor substrate 2, This conduction may be achieved. Details of the materials suitably used for forming the insulating coating layer 65 and the shield layer 66 will be described together with the materials used for the mass sensor when described later.
- FIG. 20 is a plan view showing still another embodiment of the mass sensor of the present invention.
- the connection plate 20 and the detection plate 21 are different from each other. Without being directly joined, the connecting plate 20 and the detecting plate 21 are joined to the diaphragm 19 so that their joining directions to the diaphragm 19 are parallel to each other.
- the diaphragm 19 is joined to the side surface of the sensor board 2 without connecting the diaphragm 19 to the sensor board 2 without being joined to the sensor board 2. That is, the detection plate 21 also has a function as the connection plate 20.
- a piezoelectric element 25 is disposed on at least a part of at least one of the flat surfaces of the detection plate 21, and resonance is generated from the vibration plate 19, the connection plate 20, the detection plate 21, and the piezoelectric element 25. A part is formed.
- the mass sensor 44B shown in FIG. 20 (b) two detection plates 21A and 21B are arranged on both sides of the connection plate 20, and each detection plate 21A Piezoelectric elements 25 A and 25 B are provided for each of 21 B.
- the vibration of the diaphragm 19 is likely to occur in the plane of the diaphragm 19, so that it is suitable for the measurement in the 0 mode.
- the vibration in the rotation mode is suppressed.
- the vibration of the vibration plate 19 is directly transmitted to the piezoelectric element 25 via the detection plate, there is an advantage that the detection sensitivity is increased.
- FIGS. 21 (a) to 21 (c) are plan views showing still another embodiment of the mass sensor of the present invention.
- the vibration plate 72 is joined to each other so as to be sandwiched by the two connection plates 74 A and 74 B,
- the side surfaces of the connection plates 74 A and 74 B are provided so as to straddle the side surfaces of the concave portion 76 of the sensor substrate 70.
- the recesses 76 are, for example, in the mass sensor 1
- the notch 16 is formed in the same manner as the outer periphery of the sensor board 2 and the through hole 14 provided in the sensor board 2 shown in FIG. It may be formed on the 70 side face or the like.
- the connecting plates 74A and 74B sandwich the diaphragm 72, that is, in the direction orthogonal to the Y-axis direction.
- the piezoelectric elements 75 A and 75 B are disposed on at least one of the flat surfaces of each of the detection plates 73 A and 73 B.
- the vibrating plate 72, the connecting plates 74A and 74B, the detecting plates 73A and 73B, and the piezoelectric elements 75A and 75B form a resonance section.
- the structure of the mass sensor 45 A is such that the diaphragm 72 is joined to each other so that the diaphragm 72 is sandwiched between two connecting plates, and the side of each connecting plate 74 A And at least a plurality of detecting plates 73 A 73 B are connected to the side surfaces of the through holes or gaps provided in the sensor substrate 70 and each connecting plate 74 A
- a mass sensor having at least one piezoelectric element laid across the side surface of each of the connecting plates 74A and 74B and the through hole or the gap in the direction orthogonal to the holding direction.
- the connecting surface between the connecting plates 74A and 74B and the sensor substrate 70 is used as a fixed surface, and the diaphragm 72 penetrates vertically through the center of the fixed surface.
- the vibrating plate 72 vibrates like a pendulum in the direction perpendicular to the side surface of the diaphragm 72 and perpendicular to the Y axis, that is, in the direction of the X axis, around the vertical axis, that is, the Y axis.
- Oscillation in the X-axis direction around the Y-axis oscillates in a direction parallel to the side surface of diaphragm 72, that is, in a pendulum shape with oscillation in the Z-axis direction (not shown).
- the resonance frequency of the resonating part based on at least one of the oscillation vibration oscillating in the X-axis direction about the axis or the rotational vibration in the plane of the diaphragm 72, and the detection plate 73A Measured by the piezoelectric element 75 A • 75 B provided on 73 B It is.
- mass sensors 46 A to 46 F which will be described later, is simply expressed in the same way as the mass sensors 45 A to 45 C, and the mass detection method in the mass sensors 46 A to 46 F Are the same as those of the mass sensors 45A to 45C.
- mass sensor 46 A to 46 In F the number of detection plates is increased to four, and as an embodiment, at least a plurality of detection plates 73A to 73D In the direction orthogonal to the direction of pinching, a structure or the like that extends between the diaphragm 72 and the side surface of the through hole or gap is added.
- the diaphragm 72 and the detection plates 73 A and 73 B are in the directions indicated by arrows in FIG. 21, that is, in the direction parallel to the flat surface of the diaphragm 72 about the Y axis, and In order to vibrate in the direction perpendicular to the Y-axis, that is, in the X-axis direction, the diaphragm 72 can stably swing in the direction of arrow K as a rigid body mode like the zero mode of the diaphragm 72. . There is also an advantage that the bending mode of the diaphragm 72 is suppressed.
- the shape of the diaphragm 72 is not limited to the rectangular shape shown in FIGS.
- each detection plate 73A and 73B is connected to the detection plate 21 of the mass sensor 42 shown in FIG.
- the connecting plates 74 A and 75 B and the sensor substrate 70 may be supported and fixed on three sides.
- the mass sensor 45B is provided with a position sensor 77 similar to the position sensor electrodes 4 and 5 of the mass sensor 1.
- the diaphragm 72 has two connected plates.
- the side surfaces of each connecting plate 74A • 74B are sandwiched by the plates 74A • 74B, and the side surfaces of the respective connecting plates 74A • 74B are connected to the through holes 71 of the sensor substrate 70 having through holes.
- At least a plurality of detection plates, here, detection plates 73 A to 73 D force, are laid on the side surface, and each connecting plate 74 A, 74 B is orthogonal to the direction in which the diaphragm 72 is sandwiched. In the direction, they are laid on the side surfaces of the connecting plates 74A and 74B and the through holes 71 or the side surfaces of the diaphragm 72 and the through holes 71.
- the piezoelectric elements 75A to 75D are disposed on at least one flat surface of at least one of the detection plates 73A to 73D, and the vibration plate 72 and each connecting plate 74A A resonance section is formed from 74B, each detection plate 73A to 73D, and piezoelectric elements 75A to 75D.
- the mass sensor 46A shown in FIG. 22 (a) shows the mass sensor 46A shown in FIG. In comparison with the structure of the mass sensors 45 A to 45 C, the rotation of the diaphragm 72 around the Y axis is suppressed by the detection plates 73 A and 73 B.
- the mass sensor 46 B in FIG. 22 (b) has the piezoelectric elements 75 A to 7 D on all the faces of the detection plates 73 A to 73 D in FIG. 5D is provided.
- the amplitude of the diaphragm 72 in the K direction is increased, the viscosity is reduced, and the viscous plate 72 can be suitably used not only for measuring substances but also for measuring viscosity.
- the polarization directions of the piezoelectric films of the piezoelectric elements 75 A and 75 C, and 75 B and 75 D are opposite to each other. Further, the piezoelectric elements 75A to 75D may be provided on both sides of each detection plate 73A to 73D.
- the mass sensor 46 C in FIG. 22 (c) has a side facing the sensor board 70 of the detection plates 73 A to 73 D in FIGS. 22 (a) and (b) joined to the sensor board 70.
- 1 shows an embodiment that is configured to be configured as follows. With such a structure, the effects obtained by the structure of the mass sensor 42 shown in FIG. 15 can be added to the effects of FIGS. 22 (a) and (b).
- the mass sensor 46 D shown in Fig. 22 (d) is connected to the detection plates 73B and 73C that are point-symmetric with respect to the intersection of the X-axis and the Y-axis, Element 75B ⁇ 75C is provided.
- the detection of the resonance frequency here uses a rigid body mode in which vibration in the direction centered on the intersection of the X-axis and the Y-axis (the direction of the arrow in Fig. 22 (d)) is dominant.
- 73 A ⁇ 73 D need not necessarily be formed.
- slits or piezoelectric elements 73A and 73D may be provided on the detection plates 73A and 73D. In this case, it is preferable that the polarization direction of each piezoelectric film is the same in each set of the piezoelectric elements 75A and 75D and 75B and 75C.
- the mass sensor 46 E shown in Fig. 22 (e) is obtained by connecting detection plates 73A to 73D to the vibration plate 72, and the arrangement of the piezoelectric elements 75A to 75D is as follows. This is the same as the case in Fig. 22 (b). Even with such a structure, the vibration of the diaphragm 72 in the direction of arrow K It is possible to detect. Further, the mass sensor 46F shown in FIG. 22 (f) has a mode of 0 by increasing the width of one of the connecting plates 74A and 74B and reducing the width of the other. It has a structure that makes it easy to swing in 0 mode.
- the force for selecting various shapes, and the materials used for manufacturing the mass sensor do not change in these individual mass sensors.
- each member and shape which constitute the mass sensor of the present invention will be described next by taking the above-described mass sensor 1 as an example.
- the sensor substrate 2, the vibration plate 19, the connection plate 20, the detection plate 21, and the spring plate 18 are preferably made of ceramic.
- a stabilized or partially stabilized device is preferably used. Luconia, alumina, magnesia, silicon nitride and the like can be used. Among these, stabilized or partially stabilized zirconia is most preferably employed because of its high mechanical strength, high toughness, and low reactivity between the piezoelectric film and the electrode material even in a thin plate.
- the detection plate contains at least an additive such as alumina or titania.
- the vibration plate 3, intermediate plate 17, base plate 15, and vibration plate 19, connecting plate 20, spring plate 18, and detection plate 21 in the sensor board 2 are not necessarily the same. It is not necessary to be composed of materials, and it is possible to use a combination of the various ceramic materials described above according to the design.However, it is possible to integrally form the same material based on This is preferable from the viewpoints of ensuring the reliability of the parts and simplifying the manufacturing process.
- the spring plate 18 when the spring plate 18 is formed on both flat surfaces of the connecting plate 20, the spring plate formed on the surface on which the piezoelectric element 25 is provided has the same structure as the piezoelectric element 25. Those having one can also be formed and used as a spring plate. In this case, the spring plate can be formed simultaneously with the piezoelectric element 25, which is preferable in the manufacturing process. However, electrodes are not used as electrodes for piezoelectric elements formed as spring plates.
- the mass sensor 1 has a force whose main purpose is to detect mass in the order of 0.1 nanogram (ng).
- the thickness of the diaphragm 19 is about 3 to 20.
- the thickness is preferably set to about 5 to 15, and the thickness of the base plate 15 at this time is appropriately determined in consideration of operability.
- the thickness is 10 to 22 m and the width is 100 to 50, regardless of whether it is attached to one side or both sides of the connecting plate 20. 0 zm is preferable, and the aspect ratio (width Z thickness) of the spring plate 18 is preferably in the range of 0.4 to 50. Further, considering the attenuation of the vibration amplitude due to the use of the mass sensor 1 in a liquid, the thickness is 100 to 70 m, the width is 100 to 500 m, and the specific force of the air is 1.0. It is preferably 4 to 50. More preferable setting ranges are a thickness of 100 to 70 ⁇ m, a width of 100 to 300 ⁇ m, and an aspect ratio of 1.4 to 30. When the spring plate reinforcing portion is required, the thickness of the spring plate reinforcing portion is preferably the same as the thickness of the spring plate joined to the spring plate reinforcing portion.
- the connecting plate 20 can be used as a spring plate without providing the spring plate 18.
- the intermediate plate 17 need not be provided, but the base plate 15 should be thicker by the thickness of the intermediate plate 17 in order to maintain the mechanical strength of the sensor substrate 2.
- a piezoelectric ceramic formed in a film shape is preferably used, but may be an electrostrictive ceramic or a ferroelectric ceramic. Further, a material that requires polarization treatment or a material that does not require polarization treatment may be used. Examples of ceramics used as the piezoelectric film 23 include, for example, lead zirconate, lead titanate, lead magnesium niobate, nickel nickel niobate, lead zinc niobate, lead manganniobate, lead antimony stannate, and lead manganese tungstate. And lead cobalt diborate and barium titanate.
- a material mainly composed of a component consisting of lead zirconate, lead titanate and lead magnesium niobate is preferably used. This is because such a material has a high heat resistance and an electromechanical coupling coefficient. In addition to having a piezoelectric constant, it has low reactivity with a sensor substrate member during sintering of a piezoelectric film, which will be described later, and can stably form a film having a predetermined composition.
- lanthanum, calcium, strontium, Molybdenum, tungsten, barium, niobium, zinc, nickel, manganese, cerium, force dome, chromium, cono-cort, antimony, iron, yttrium, tantalum, lithium, bismuth, tin and other oxides alone or Ceramics to which any of these are combined or to which other compounds of these elements are appropriately added may be used.
- ceramics containing lead zirconate, lead titanate, and lead magnesium niobate as main components, and lanthanum and strontium, and further adding manganese to the mechanical quality of the piezoelectric material.
- the coefficient is large, and the Q value can be increased not only from the structural aspect of the sensor but also from the material aspect, which is preferable.
- the first electrode 22 and the second electrode 24 in the piezoelectric element 25 are preferably solid at room temperature and made of a conductive metal, for example, aluminum, titanium, chromium, iron, and cobalt. Metal, nickel, copper, zinc, niobium, molybdenum, ruthenium, palladium, rhodium, silver, tin, tantalum, tungsten, iridium, platinum, gold, lead, etc., or an alloy combining any of these. It is also possible to use a sacrificial material in which the same material as that of the piezoelectric film 23 or the detection plate 21 is dispersed.
- a conductive metal for example, aluminum, titanium, chromium, iron, and cobalt.
- Metal nickel, copper, zinc, niobium, molybdenum, ruthenium, palladium, rhodium, silver, tin, tantalum, tungsten, iridium, platinum, gold, lead, etc., or
- the actual material selection of the first electrode 22 and the second electrode 24 is determined depending on the method of forming the piezoelectric film 23. For example, when the piezoelectric film 23 is formed on the first electrode 22 by firing after forming the first electrode 22 on the detection plate 21, the first electrode 22 is formed of the piezoelectric film 23. Although it is necessary to use a high melting point metal such as platinum which does not change even at the firing temperature, the second electrode formed on the piezoelectric film 23 after forming the piezoelectric film 23 can be formed at a low temperature. Therefore, a low melting point metal such as aluminum can be used.
- the piezoelectric element 25 can be formed by firing integrally.
- both the first electrode 22 and the second electrode 24 are made of a high melting point metal that can withstand the firing temperature of the piezoelectric film 23. There must be.
- the first and second electrodes 59, 60 are formed after the piezoelectric film 58 is formed on the piezoelectric film 58, as in the case of the piezoelectric element 62A shown in FIG. Although it can be formed using a low melting point metal, when simultaneously firing the piezoelectric element 62A, both the first electrode 22 and the second electrode 24 are also made of high melting point. Must be point metal.
- the first electrode 22 and the second electrode 24 are appropriately suitable depending on the formation temperature of the piezoelectric film 23 typified by the firing temperature of the piezoelectric film 23 and the structure of the piezoelectric element 25. What is necessary is just to choose.
- the material and the method of forming the electrode leads 9 ⁇ 10 are the same as those of the first electrode 22 and the second electrode 24 of the piezoelectric element 25.
- the thickness of the piezoelectric film 23 is reduced, the sensitivity is improved.
- the rigidity is reduced, a problem may occur. Therefore, it is preferable that the thickness of the detection plate 21 and the piezoelectric film 23 be reduced. The sum is set to be 15 to 50 m.
- an insulating coating layer 65 such as the mass sensor 43 shown in FIG. 19 is formed on the piezoelectric element 25 and the electrode leads 9 Glass or resin is used, but in order to improve the performance of the mass sensor 1, it is preferable to use resin as the insulating coating material rather than glass, and a fluororesin with excellent chemical stability, for example, Polytetrafluoroethylene resin-based Teflon (Teflon PTFE manufactured by DuPont), ethylene tetrafluoride / hexafluoropropylene copolymer resin-based Teflon (Teflon FEP), Teflon tetrafluoroethylene Alkyl vinyl ether copolymer resin Teflon (Teflon PFA), PTFEZPFA composite Teflon and the like are preferably used.
- resin for example, Polytetrafluoroethylene resin-based Teflon (Teflon PTFE manufactured by DuPont), ethylene tetrafluoride
- silicone resins in particular, thermosetting silicone resins
- epoxy resins, acrylic resins, and the like are also used according to purposes. be able to.
- the insulating coating layer 65 When the insulating coating layer 65 is formed, various metals such as gold, silver, copper, nickel, and aluminum are suitable as the material of the shield layer 66 formed on the insulating coating layer 65.
- the first in the piezoelectric element 25 described above All metal materials used for the electrodes 22 and the like can be used. Further, a conductive paste obtained by mixing a metal powder with a resin can also be used.
- the mass sensor 1 is used as an immunosensor as an example.
- One of the sensor sections 13 provided at the two locations is detected as the sensor section 13D, and the diaphragm of the detection sensor section 13D reacts only with the target such as the pathogen virus to be detected.
- Apply a capture substance that captures the body For example, a combination of an antigen as an object to be detected and an antibody as a capture substance can be mentioned, and examples thereof include human serum albumin / anti-human serum albumin antibody, and human immunoglobulin / anti-human immunoglobulin antibody.
- the other sensor unit 13 is a reference sensor unit 13R, and the diaphragm is not coated with a trapped substance. Then, each of the sensor sections 13D and 13R is immersed or placed in the same sample. Therefore, since the sample is often a fluid such as a liquid or gas, comparing the signals from the sensor sections 13D and 13R, the physical properties of the sample, such as the type, flow, and temperature of the fluid, are determined. It is possible to carry out inspection without being affected by the inspection environment.
- the mass sensor 1 When the mass sensor 1 is immersed in a liquid sample having conductivity, for example, when the mass sensor 1 is immersed in the sample to a position where the position sensor electrodes 4 and 5 are short-circuited, The diaphragm 19 in the section 13D ⁇ 13R is a force immersed in the specimen ⁇ The detection section 29 is not short-circuited by the specimen. However, if the piezoelectric element 25 and the electrode leads 9 • 10 are insulated and coated with insulating resin or glass, the parts other than the terminals 1 1 and 1 2 of the mass sensor 1 should be sampled. Can be immersed.
- the mass of the diaphragm 19 of the detection sensor unit 13D increases, and resonance occurs with the increase in the mass of the diaphragm 19.
- the resonance frequency of part 26 changes. Therefore, conversely, by examining the change in the resonance frequency of the resonance unit 26, the force of the detection of the object by the diaphragm 19, that is, the presence of the object in the sample And the magnitude of the increased mass can be measured.
- the reference is sometimes made. If the Teflon coating is applied to the resonance part of the sensor 13R, that is, the diaphragm and the connecting plate, the detection plate, the piezoelectric element, and the spring plate, the detection target can be prevented from attaching to the reference sensor 13R. And more accurate measurement is possible.
- the object to be detected can be reliably captured only on the vibration plate 19 by applying Teflon coating to a part other than the vibration plate 19, and high sensitivity can be achieved. , Is preferred. Further, in order to apply an expensive capturing substance such as an antibody only to a necessary portion, it is preferable in terms of cost to apply Teflon coating to the entire sensor substrate 2 except for the vibration plate 19.
- the two sensor sections 13 are arranged in the horizontal direction (horizontal direction) of the sensor board 2 in Fig. 11 so that both sensor sections 13 are easily immersed in the sample at the same time. .
- the two sensor sections 13 are arranged in the vertical direction (up and down direction) of the sensor board 2, that is, the detection sensor section 13D is immersed in liquid or the like first, and the reference sensor section 13R is If it is placed in a position where it will not be immersed in the body, etc., only the detection sensor section 13D will be immersed in the trapping substance and applied, while the reference sensor section 13R will be heated without Teflon coating.
- a sensor such as a correction sensor, it can be easily processed so as not to be immersed in the trapped substance, that is, not to apply the trapped substance.
- each diaphragm of each sensor section 13D13R The same capture substance is applied to each diaphragm of each sensor section 13D13R, and the signal of each sensor section 13D13R is integrated to increase the dynamic range.
- Various usages are also possible. Further, it is also possible to apply a capture substance different from that of the detection sensor unit 13D without using the reference sensor unit 13R as a reference.
- the diaphragm 19 In measuring the change in the resonance frequency of the mass sensor 1 in each of these usage methods, That is, as described above, it is preferable to detect the resonance frequency of the 0 mode or the ⁇ mode. That is, for example, as shown in FIG. 14, the diaphragm 19 causes a 0-mode swing vibration around the spring plate 18 and the connecting plate 20 in the plane of the diaphragm 19.
- the movement is transmitted to the detection plate 21, and a bending vibration is generated on the detection plate 21, and a stretching vibration is generated on the flat piezoelectric film 23 of the piezoelectric element 25 on the surface of the detection plate 21.
- a constant voltage is generated based on the electromechanical coupling coefficient k 3 of the piezoelectric film 23, (piezoelectric constant d 31 ).
- the piezoelectric element 2 in the case of those having a comb electrode structure, a constant voltage is generated based on k 3 3 (d 3 3) . The same applies when the ⁇ mode is used.
- a method of controlling the mass ratio to the spring plate 18 can be used.
- the spring plate 18 is made thinner to reduce the mass, and the mass ratio to the diaphragm 19 (mass of the diaphragm 19 / mass of the panel plate 18) increases as the force increases.
- the mass ratio (mass of diaphragm 19 (mass of spring plate 18 + mass of connecting plate 20)) is preferably 0.1 or more as long as rigidity of 0 is secured. In consideration of the area of 9, it is preferable to set a suitable ratio as appropriate. However, these mass ratios depend on the conditions of the thickness and width and the aspect ratio of the panel board 18 described above. It is preferable to set within the range that satisfies. Note that the mass sensor 43C described in FIG. 16 (c) is an example of this.
- the diaphragm 19 is made thinner to increase the mass ratio to the object to be detected (the mass of the object to be detected and the mass of the diaphragm 19).
- a method of increasing the mass change ratio of 19 is mentioned.
- the diaphragm 19 is made thinner, if the surface area is increased without changing the mass, the area to which the trapping substance is applied becomes larger, so that more detection targets can be trapped. Detection sensitivity can be improved.
- the mass sensor 1 when a moisture adsorbent is used as a trapping substance applied to the diaphragm 19, the mass sensor 1 can be used as a moisture meter. Further, by applying an adsorbent for adsorbing a specific gas component, an organic substance, or an inorganic substance as a trapping substance to the diaphragm 19, it can be used as a gas sensor, an odor sensor, a taste sensor, or the like. Further, when the temperature of the diaphragm 19 is controlled to cause dew condensation, the diaphragm 19 can be used as a dew point meter that measures the dew point from the temperature when the mass of the diaphragm 19 increases.
- the present mass sensor 1 can be used as a film thickness gauge.
- the target films include a sputtered film CVD film formed in a vacuum or the like, an LB film formed in a gas, an electrodeposition film formed in a liquid, and the like.
- a film is formed on the vibration plate 19 or the resonance unit 26. Since the mass changes and the resonance frequency changes, it is possible to measure the formed film thickness and the growth rate of the film.
- a crystal deposition film thickness meter that detects a change in the slip direction resonance frequency when the film thickness of the crystal unit 80 is changed, which is the same as that shown in FIG. 27, is known.
- the vibrator itself is used in a vapor deposition atmosphere, there is a problem in that it is greatly affected by noise and vacuum pressure change due to temperature changes and collision of impurities.
- the mass sensor 1 when used in the S mode as a vapor deposition film thickness meter, the detection section 29 is in a rigid body mode, so it is resistant to temperature changes, and the diaphragm 19 is as thin as 3 to 20.
- This has the advantage of reducing the probability of collision.
- the spring plate 18 and the connecting plate 20 can be easily maintained in a constant atmosphere, so that the measurement accuracy can be improved as compared with the case where the crystal unit 80 is used. .
- the mass sensor 1 can also be used as a viscometer that, when the diaphragm 19 is immersed in a liquid, causes a shear wave of a shear wave in the fluid and receives a mass load corresponding to the penetration length of the viscous wave. it can.
- such a viscometer also employs a viscometer that detects a change in the resonance frequency of the crystal unit 80 in the sliding direction. Since it is immersed, it has a disadvantage that it is easily affected by noise such as temperature change and collision of impurities in liquid.
- the mass sensor 1 when used as the viscometer in the 0 mode, the detecting unit 29, the spring plate 18 and the connecting plate 20 do not need to be immersed in the liquid, and the detecting unit 29 has the rigid body mode. Therefore, since the vibration plate 19 is thin and the diaphragm 19 is as thin as 3 to 20 / m, the probability of collision with impurities is reduced, thereby improving the measurement accuracy.
- a quartz oscillator is used as a friction vacuum gauge because the electrical resistance changes due to the friction of gas molecules and the viscous friction of a gas in a vacuum, and this vacuum gauge is used as a result of the mass of the quartz oscillator. Since the frequency change due to the load effect is measured, the mass sensor 1 of the present invention having the same basic measurement principle can also be used as a vacuum gauge.
- the mass sensor 1 can be used as a temperature sensor by using the bending mode of the diaphragm 19, that is, detecting a change in the Young's modulus in the bending mode as a change in the resonance frequency. .
- the mass sensor 1 can be used as a wide variety of sensors, but its basic measurement principle is to measure the change in the resonance frequency of the resonance section 26 based on the mass load on the diaphragm 19. It is doing. For this reason, it is easy to provide a plurality of sensor sections 13 having different functions in one mass sensor 1.For example, the functions of a temperature sensor, a vacuum gauge, and a viscosity sensor can be used together with the mass sensor 1.
- Ceramics such as zirconia are preferably used as the sensor substrate material, and a binder, a solvent, a dispersant, etc. are added to and mixed with the ceramic powder to prepare a slurry, which is then subjected to a defoaming treatment.
- a green sheet or green tape for a vibrating plate, an intermediate plate, and a base plate having a predetermined thickness is prepared by a method such as a doctor blade method.
- a through hole 14 and a spring plate 18 are formed in the intermediate plate 17 by using a mold or a laser for each green sheet.
- the plate 15 is punched into a predetermined shape having a through hole 14 formed therein, and the manufactured vibrating plate 3, intermediate plate 17 and green sheet for the base plate 15 are formed at least in this order.
- One by one is laminated and fired to create a sensor substrate.
- holes 8 are formed in each green sheet for stacking positioning.
- the shape of the green sheet shown in FIG. 23 is obtained by simplifying the formation of the sensor portion 13 of the mass sensor 1 shown in FIG. 11 so as to be easily understood.
- the vibrating plate 3 is also capable of forming the through holes 14 and the vibrating plate 19 in a green state.
- the vibrating plate 3 is as thin as 20 m or less.
- the piezoelectric film 23 is formed by a press forming method or a tape forming method using a slurry material, and the unbaked piezoelectric film 23 is thermocompression-bonded to a portion of the vibrating plate 3 where the detecting plate 21 is to be formed.
- the sensor substrate 2 and the piezoelectric film 23 are simultaneously formed by stacking and sintering simultaneously.
- the electrodes 22 and 24 need to be formed in advance on the sensor substrate 2 or the piezoelectric film 23 by a film forming method described later.
- the firing temperature of the piezoelectric film 23 is appropriately determined depending on the material constituting the piezoelectric film 23, but is generally 800 ° C. to 140 ° C., preferably 100 ° C. C-1400. C.
- sintering is preferably performed in the presence of an evaporation source of the material of the piezoelectric film 23.
- a thick film forming method such as a screen printing method, a dive method, a coating method, an ion beam method, or a sputtering method is applied to a position where the detecting plate 21 is formed on the sintered sensor substrate 2.
- the piezoelectric element 25 can be provided by various thin film forming methods such as vacuum deposition, ion plating, chemical vapor deposition (CVD), and plating.
- CVD chemical vapor deposition
- a thick film forming method by a screen printing method, a diving method, a coating method or the like is suitably adopted. This is because, in these methods, the piezoelectric film 23 is formed using a paste slurry mainly containing piezoelectric ceramic particles having an average particle diameter of 0.01 to 5, preferably 0.05 to 3. And good piezoelectric operation characteristics can be obtained.
- the first electrode 22 is printed and fired at a predetermined position on the surface of the vibration plate 3, and then the piezoelectric film 23 is printed and fired.
- the two electrodes 24 are printed and fired, and the piezoelectric elements 25 are provided.
- the electrode leads 9 ⁇ 10 for connecting the formed electrodes 22 ⁇ 24 to the measuring device are printed and fired.
- platinum (Pt) is used as the first electrode 22 and the piezoelectric film
- lead zirconate titanate (PZT) is used as 23
- gold (Au) is used as the second electrode 24
- silver (Ag) or the like is used as the electrode lead 9 ⁇ 10, sintering is performed. Since the firing temperature force in the process is set to decrease gradually, in a certain firing step, the re-sintering of the material fired earlier does not occur, causing problems such as peeling and aggregation of electrode materials etc. It is possible to avoid occurrence.
- each member of the piezoelectric element 25 and the electrode leads 9 and 10 can be sequentially printed and baked together at one time, and the piezoelectric film 23 is formed.
- Each electrode or the like may be provided later at a low temperature.
- each component of the piezoelectric element 25 and the electrode leads 9 and 10 may be formed by a thin film method such as a sputtering method or a vapor deposition method, and in this case, heat treatment is not necessarily required.
- the piezoelectric element 25 and the detection plate 21 can be integrally joined and disposed without using an adhesive, so that reliability and reproduction can be improved. It is particularly preferable because of its excellent property and easy integration.
- an appropriate pattern may be further formed on the piezoelectric film 23. Examples of the formation method include a screen printing method, a photolithography method, a laser processing method, slicing, and ultrasonic processing. Etc. can be used. Next, a diaphragm 19 and the like are formed at predetermined positions on the manufactured sensor substrate. Here, it is preferable that the vibrating plate 3 is cut out and processed by processing using the fourth harmonic of the YAG laser to remove unnecessary portions.
- the through hole 14 can be formed while leaving a portion integrally joined to the sensor substrate 2 such as the vibration plate 19 and the detection plate 21 as shown in FIG. 11 or FIG.
- the resonance frequency can be adjusted to a predetermined value, and the mass range of the object to be detected can be determined.
- the length of the diaphragm 19 is L. If a part of the diaphragm 19 is cut or removed so as to shorten from to, the resonance point can be increased, while the width of the spring plate 18 and the connecting plate 20 is set to t. Reducing the resonance point from t to t, makes it possible to lower the resonance point. Therefore, the resonance point can be adjusted by these combinations. Further, the width of the diaphragm 19 is set to W. By reducing the rotation mode from to, the rotation mode is suppressed, and the Q value of the 0 mode is increased. However, it is possible to reduce the variation in the resonance frequency depending on the attachment position.
- the detection sensitivity can be adjusted by adjusting the effective electrode area of the piezoelectric element by removing the upper electrode by YAG fourth harmonic laser, machining or the like.
- the structure of the piezoelectric element 25 is a comb-shaped structure as shown in FIG. 3 or FIG. 4, one of the electrodes and a part of both electrodes have to be removed.
- the sensor substrate 2 can also be manufactured by a pressure molding method using a molding die, a molding method, an injection molding method, or the like, in addition to the manufacturing method using the green sheet described above. Also in these cases, before and after firing, machining is performed by machining such as cutting, grinding, laser processing, punching by pressing, or ultrasonic processing, and the mass sensor 1 having a predetermined shape is obtained.
- an insulating coating layer 65 is formed on the piezoelectric element 25 and the electrode leads 9 • 10 in the mass sensor 1 thus manufactured, as in the mass sensor 43D shown in FIG. It can be formed by a screen printing method, a coating method, a spray method, or the like using a resin.
- a resin when glass is used as the material, it is necessary to raise the temperature of the mass sensor 1 itself to about the softening temperature of the glass, and the hardness is high, which may hinder the vibration, but the resin is soft and It is preferable to use a resin since only a drying process is required.
- a fluororesin or a silicone resin is preferably used as the resin used as the insulating coating layer 65, when these resins are used, the adhesion to the underlying ceramic is reduced.
- the formation of the shield layer 66 on the insulating coating layer 65 is difficult if the insulating coating layer 65 is made of a resin, since it is difficult to perform a baking treatment.
- the metal paste can be screen-printed or fired at a temperature at which the glass does not flow.
- the mass sensor 1 is completed by applying a trapping substance or the like to the vibration plate 19 or the whole of the resonance part 26.
- the resonance frequency is measured by using an impedance analyzer and a network analyzer, or by using a SINSWEP method, or by measuring a transfer function by applying an external ultrasonic wave or the like. Further, by observing the change in the resonance frequency value, it is possible to measure the mass change in the diaphragm 19 and the like.
- the present invention will be described with reference to examples. However, it is needless to say that the examples do not limit the present invention.
- a piezoelectric element including a first electrode, a piezoelectric film, and a second electrode and electrode leads connected to these electrodes were formed at predetermined positions on the vibration plate on which the detection plate was formed by a screen printing method.
- the first electrode was made of platinum
- the piezoelectric film was made of a material mainly composed of lead zirconate, lead titanate, and magnesium magnesium niobate
- the second electrode was made of gold
- the electrode lead was made of silver.
- the mass sensor 1 was manufactured.
- the thickness of the vibrating plate is 7 m
- the thickness of the intermediate plate is 65 m
- the thickness of the base plate is 150 zm
- the size of the vibrating plate is 0.5 mm x 0 3 mm.
- the change in mass on the diaphragm is achieved by forming gold with a thickness of 0.3 m on one entire surface of the diaphragm and then forming a plurality of 10 ⁇ m0 spot patterns with the YAG laser. Was changed in the direction of decreasing.
- the mass sensor according to the present invention exhibited a change in resonance frequency according to a change in mass on the order of nanometers.
- the mass sensor of the present invention has been described centering on a piezoelectric conversion device using a piezoelectric film utilizing a piezoelectric action as a device for detecting vibration of a resonance portion and converting the vibration into an electric signal.
- signal converters for such vibrations are not limited to those using a piezoelectric action, those using an electromagnetic induction action, those using a change in capacitance, and those using a change in incident light. It may be configured by a device using a change in electric resistance, a device using a pyroelectric effect, or the like.
- a coil provided on a detection plate, an electric circuit for detecting an electric signal flowing through the coil, and a magnet (may be an electromagnet) for forming a magnetic field in the coil. And the like.
- a current flows through the coil by electromagnetic induction, and the electric circuit detects the current.
- a device utilizing the change in capacitance has a pair of electrodes provided on the surface of a detection plate, a dielectric material sandwiched between the electrodes, and an electronic circuit connected to the electrodes. In this case, the detected capacitance is detected by an electronic circuit.
- Some of the devices that use the change in the incidence of light include a device that projects light to a resonating unit such as an optical diode and a device (light receiving unit) that measures the amount of light reflected by the resonating unit.
- a resonating unit such as an optical diode
- a device (light receiving unit) that measures the amount of light reflected by the resonating unit.
- An optical sensor or the like can be used for the light receiving unit, and the amount of light reflected by the resonance unit changes as the resonance unit vibrates, and the change in the amount of incident light is measured by the light receiving unit.
- those that use electrical resistance change can be roughly divided into those that use conductors and those that use semiconductors.
- those that use conductors have a conductor provided on the surface of the resonance part and an electric circuit connected to this conductor.When the conductor vibrates together with the resonance part, the conductor is distorted by vibration and the resistance changes. Therefore, this resistance change is detected by an electric circuit.
- those using semiconductors are Instead, a semiconductor is used.
- the device that uses the pyroelectric action consists of a pair of electrodes provided on the surface of the detection plate, a pyroelectric body formed between them, an electronic circuit connected to the electrodes, and a heat source, and detects the pyroelectric current due to vibration with the electronic circuit. Things.
- Signal converters for these vibrations are installed in place of the above-described piezoelectric elements, and signal converters for differently exciting and receiving the resonance part, for example, a piezoelectric converter for excitation, and a capacitance type converter for receiving. It is also possible to configure with a device.
- the arrangement of the excitation / vibration receiving device can be appropriately selected according to the number of detection plates provided. For example, when one detection plate is provided, two detection plates are provided in the plane. In the case where a plurality of the detecting plates are provided, the excitation and receiving devices may be arranged on both planes of each detecting plate or separately for each detecting plate.
- the mass sensor of the present invention in detecting the resonance frequency, the influence of a change in the material temperature of the mass sensor itself due to the temperature of the specimen or the specimen temperature is small, so that the composition is 0.1 nanogram (ng). It can measure even minute amounts, and is effective for detecting trace substances.
- the mass sensor of the present invention can be used for the various applications described above, but it is a basic measurement that measures the change in the resonance frequency of the resonance section including the diaphragm subjected to the mass load.
- Different functions because measurement is performed based on the principle It is characterized in that it is easy to provide a plurality of resonating parts having the same in one mass sensor. Therefore, since it is not necessary to use sensors for each of a plurality of different types, it is necessary to incorporate sensors into the measurement position, to reduce equipment costs for measuring equipment for handling and measurement, and to reduce costs by consolidating and sharing manufacturing equipment. It is extremely effective in reducing costs.
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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EP98941714A EP0943903B1 (en) | 1997-09-08 | 1998-09-04 | Mass sensor and mass detection method |
DE69827767T DE69827767T2 (de) | 1997-09-08 | 1998-09-04 | Gewichtssensor und verfahren zur bestimmung der masse |
US09/297,655 US6386053B1 (en) | 1997-09-08 | 1998-09-04 | Mass sensor and mass detection method |
JP51533399A JP3298897B2 (ja) | 1997-09-08 | 1998-09-04 | 質量センサおよび質量検出方法 |
US10/925,514 US6895829B2 (en) | 1997-09-08 | 2004-08-25 | Mass sensor and mass sensing method |
US11/060,988 US7089813B2 (en) | 1997-09-08 | 2005-02-18 | Mass sensor and mass sensing method |
Applications Claiming Priority (6)
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JP9/243073 | 1997-09-08 | ||
JP24307397 | 1997-09-08 | ||
JP36136897 | 1997-12-26 | ||
JP9/361368 | 1997-12-26 | ||
PCT/JP1998/003971 WO1999013518A1 (en) | 1997-09-08 | 1998-09-04 | Piezoelectric/electrostriction device |
US09/242,642 US6239534B1 (en) | 1997-09-08 | 1998-12-28 | Piezoelectric/electrostrictive device |
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US09297655 A-371-Of-International | 1998-09-04 | ||
US09/297,655 A-371-Of-International US6386053B1 (en) | 1997-09-08 | 1998-09-04 | Mass sensor and mass detection method |
US10/071,019 Division US6612190B2 (en) | 1997-09-08 | 2002-02-08 | Mass sensor and mass sensing method |
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WO1999013300A1 true WO1999013300A1 (en) | 1999-03-18 |
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PCT/JP1998/003971 WO1999013518A1 (en) | 1997-09-08 | 1998-09-04 | Piezoelectric/electrostriction device |
PCT/JP1998/003969 WO1999013300A1 (en) | 1997-09-08 | 1998-09-04 | Mass sensor and mass detection method |
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PCT/JP1998/003971 WO1999013518A1 (en) | 1997-09-08 | 1998-09-04 | Piezoelectric/electrostriction device |
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US (8) | US6386053B1 (ja) |
EP (3) | EP0938143A4 (ja) |
JP (4) | JP3844784B2 (ja) |
CN (2) | CN1119628C (ja) |
DE (1) | DE69827767T2 (ja) |
WO (2) | WO1999013518A1 (ja) |
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JP2009528543A (ja) * | 2006-02-28 | 2009-08-06 | エクソンモービル リサーチ アンド エンジニアリング カンパニー | 機械的振動子を用いる金属損失率センサおよび測定 |
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Families Citing this family (90)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0938143A4 (en) | 1997-09-08 | 2000-03-15 | Ngk Insulators Ltd | PIEZOELECTRIC / ELECTROSTRICTIVE DEVICE |
EP1065735B1 (de) * | 1999-06-29 | 2007-03-07 | Siemens Aktiengesellschaft | Piezoaktor mit einer elektrisch leitenden Mehrschichtfolie |
KR20030016244A (ko) * | 2000-04-05 | 2003-02-26 | 더 차레스 스타크 드레이퍼 래보레이토리, 인코포레이티드 | 물질의 질량을 측정하는 방법 및 장치 |
US6760195B2 (en) * | 2000-04-17 | 2004-07-06 | Seagate Technology Llc | Intrinsically excitable actuator assembly |
JP4868270B2 (ja) * | 2000-05-26 | 2012-02-01 | 日立金属株式会社 | 圧電アクチュエータ素子 |
US6787975B2 (en) * | 2000-05-31 | 2004-09-07 | Denso Corporation | Piezoelectric device for injector |
DE10029444B4 (de) * | 2000-06-21 | 2004-07-22 | Leica Microsystems Heidelberg Gmbh | Optische Anordnung |
US6851120B2 (en) * | 2000-07-13 | 2005-02-01 | Seagate Technology Llc | Micro-actuator structure for improved stability |
WO2002010217A2 (en) * | 2000-08-02 | 2002-02-07 | The Johns Hopkins University | Endothelial cell expression patterns |
JP2002141569A (ja) * | 2000-08-03 | 2002-05-17 | Tokin Ceramics Corp | マイクロアクチュエータ素子 |
EP1331726A4 (en) * | 2000-10-20 | 2008-02-13 | Fujitsu Ltd | PIEZOELECTRIC OPERATING DEVICE, DRIVE PROCESS AND INFORMATION STORAGE DEVICE |
US6689288B2 (en) | 2000-11-28 | 2004-02-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polymeric blends for sensor and actuation dual functionality |
JP4587232B2 (ja) * | 2001-01-18 | 2010-11-24 | 日本碍子株式会社 | 圧電/電歪デバイスおよびその製造方法 |
JP3485904B2 (ja) | 2001-04-24 | 2004-01-13 | 松下電器産業株式会社 | 音響変換器 |
US7162918B2 (en) * | 2001-05-15 | 2007-01-16 | Baker Hughes Incorporated | Method and apparatus for downhole fluid characterization using flexural mechanical resonators |
US7317989B2 (en) * | 2001-05-15 | 2008-01-08 | Baker Hughes Incorporated | Method and apparatus for chemometric estimations of fluid density, viscosity, dielectric constant, and resistivity from mechanical resonator data |
US6938470B2 (en) * | 2001-05-15 | 2005-09-06 | Baker Hughes Incorporated | Method and apparatus for downhole fluid characterization using flexural mechanical resonators |
US6876129B2 (en) * | 2001-09-26 | 2005-04-05 | Mitsuba Corporation | Rotary actuator and method of controlling an actuator |
US7011758B2 (en) * | 2002-02-11 | 2006-03-14 | The Board Of Trustees Of The University Of Illinois | Methods and systems for membrane testing |
JP4305623B2 (ja) * | 2002-03-13 | 2009-07-29 | セイコーエプソン株式会社 | 振動子および振動型ジャイロスコープ |
JP4321034B2 (ja) * | 2002-10-16 | 2009-08-26 | パナソニック株式会社 | 圧電アクチュエータおよびディスク装置 |
US7043969B2 (en) * | 2002-10-18 | 2006-05-16 | Symyx Technologies, Inc. | Machine fluid sensor and method |
DE10260088A1 (de) * | 2002-12-19 | 2004-08-05 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zur Bestimmung und/oder Überwachung mindestens einer physikalischen Größe mit einem Piezoantrieb zur Schwingungserregung und -detektion |
US7521257B2 (en) * | 2003-02-11 | 2009-04-21 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Reno | Chemical sensor with oscillating cantilevered probe and mechanical stop |
US7260980B2 (en) * | 2003-03-11 | 2007-08-28 | Adams Jesse D | Liquid cell and passivated probe for atomic force microscopy and chemical sensing |
WO2005026678A1 (de) * | 2003-09-17 | 2005-03-24 | Kistler Holding Ag | Mehrschichtiges piezoelektrisches messelement und ein druck- oder kraftsensor umfassend ein solches messelement |
US20060257286A1 (en) | 2003-10-17 | 2006-11-16 | Adams Jesse D | Self-sensing array of microcantilevers for chemical detection |
US7458265B2 (en) * | 2003-10-27 | 2008-12-02 | Drexel University | Piezoelectric cantilever sensors |
KR100613398B1 (ko) * | 2003-11-25 | 2006-08-17 | 한국과학기술연구원 | 캔틸레버 센서형 분석 시스템, 제조 방법 및 이를 이용한극미세 물질 감지 방법 |
US20050148065A1 (en) * | 2003-12-30 | 2005-07-07 | Intel Corporation | Biosensor utilizing a resonator having a functionalized surface |
AU2005224247B2 (en) * | 2004-03-23 | 2010-04-01 | Sintokogio, Ltd. | Casting mold forming apparatus and metal mold unit for use therein |
US7279131B2 (en) * | 2004-07-01 | 2007-10-09 | Uop Llc | Method and apparatus for mass analysis of samples |
KR20060006269A (ko) * | 2004-07-15 | 2006-01-19 | 한국항공우주연구원 | 진동자의 주파수 변화 측정에 의한 질량 측정 시스템 및방법 |
GB2437753B8 (en) | 2004-10-01 | 2009-05-20 | Nevada System Of Higher Education | Cantilevered probe detector with piezoelectric element |
US20060217893A1 (en) * | 2005-01-07 | 2006-09-28 | Yanbin Li | Method for detecting an unknown contaminant concentration in a substance |
JP4529889B2 (ja) | 2005-02-10 | 2010-08-25 | セイコーエプソン株式会社 | 圧電振動体、圧電振動体の調整方法、圧電アクチュエータ、時計、電子機器 |
US7221076B2 (en) * | 2005-07-15 | 2007-05-22 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Multiple movements harmonic frequency actuator system |
US7819011B2 (en) * | 2005-08-23 | 2010-10-26 | Georgia Tech Research Corporation | High-Q longitudinal block resonators with annexed platforms for mass sensing applications |
DE102005050159A1 (de) * | 2005-10-19 | 2007-04-26 | Siemens Ag | Schwingungssensor |
DE102006039858A1 (de) * | 2006-01-02 | 2007-07-12 | Ceramtec Ag Innovative Ceramic Engineering | Monolithisches Biegeelement |
US7927288B2 (en) * | 2006-01-20 | 2011-04-19 | The Regents Of The University Of Michigan | In situ tissue analysis device and method |
CN101371132B (zh) * | 2006-01-23 | 2013-05-01 | 德雷塞尔大学 | 自励、自感知压电悬臂梁传感器 |
US8171795B1 (en) * | 2006-01-23 | 2012-05-08 | Drexel University | Self-exciting, self-sensing piezoelectric cantilever sensor for detection of airborne analytes directly in air |
JP2007265570A (ja) * | 2006-03-29 | 2007-10-11 | Fujitsu Ltd | 微小変位機構及び磁気ディスク装置 |
US8179257B2 (en) * | 2006-03-30 | 2012-05-15 | International Business Machines Corporation | Warning of hazardous conditions in monitored spaces using RFID technology |
US7569977B2 (en) * | 2006-08-02 | 2009-08-04 | Cts Corporation | Laser capacitance trimmed piezoelectric element and method of making the same |
JP5205725B2 (ja) * | 2006-08-21 | 2013-06-05 | パナソニック株式会社 | 角速度センサ |
US20100120016A1 (en) * | 2006-09-01 | 2010-05-13 | Yanbin Li | Methods and systems for detection of contaminants |
WO2008114603A1 (ja) * | 2007-03-16 | 2008-09-25 | National Institute Of Advanced Industrial Science And Technology | 検出センサ、振動子 |
WO2008136249A1 (ja) * | 2007-04-27 | 2008-11-13 | Murata Manufacturing Co., Ltd. | 共振素子および、その製造方法 |
FR2916271B1 (fr) * | 2007-05-14 | 2009-08-28 | St Microelectronics Sa | Circuit electronique permettant la mesure de masse de materiau biologique et procede de fabrication |
FR2924422B1 (fr) * | 2007-11-30 | 2009-12-25 | Commissariat Energie Atomique | Dispositif a detection par jauge de contrainte piezoresistive suspendue comportant une cellule d'amplification de contrainte. |
US20090238955A1 (en) * | 2008-03-20 | 2009-09-24 | E. I. Du Pont De Nemours And Company | Processes for the manufacture of barium titanate capacitors on nickel foils |
CN101576404B (zh) * | 2008-05-08 | 2011-04-20 | 瑞鼎科技股份有限公司 | 振荡器、质量测量系统以及质量测量方法 |
JP5292954B2 (ja) * | 2008-07-04 | 2013-09-18 | 株式会社ニコン | 振動アクチュエータ及びレンズ鏡筒 |
DE102008046336A1 (de) * | 2008-09-09 | 2010-03-11 | Osram Gesellschaft mit beschränkter Haftung | LTCC-Schichtstapel |
JP2010078334A (ja) * | 2008-09-24 | 2010-04-08 | National Institute Of Advanced Industrial Science & Technology | 検出センサ、振動子 |
US7960201B2 (en) * | 2009-01-29 | 2011-06-14 | Emcore Solar Power, Inc. | String interconnection and fabrication of inverted metamorphic multijunction solar cells |
FR2951826B1 (fr) * | 2009-10-23 | 2012-06-15 | Commissariat Energie Atomique | Capteur a detection piezoresistive dans le plan |
US20110133755A1 (en) * | 2009-12-08 | 2011-06-09 | Delphi Technologies, Inc. | System and Method of Occupant Detection with a Resonant Frequency |
US20110184313A1 (en) * | 2010-01-22 | 2011-07-28 | The Regents Of The University Of Michigan | Cauterization Device and Method of Cauterizing |
JP5231495B2 (ja) | 2010-03-10 | 2013-07-10 | 日本電波工業株式会社 | 微生物の検出方法及び微生物検出装置 |
JP5565856B2 (ja) * | 2010-03-24 | 2014-08-06 | セイコーインスツル株式会社 | ダイアフラム、ダイアフラムバルブ、及びダイアフラムの製造方法 |
IT1403287B1 (it) * | 2010-12-23 | 2013-10-17 | Associazione La Nostra Famiglia Irccs Eugenio Medea | Dispositivo per il rilevamento di sollecitazioni meccaniche in ambiente nmr |
US9222867B2 (en) | 2011-01-05 | 2015-12-29 | Brian L. Norling | Resonant micromachined biochemical sensor |
AT511330B1 (de) * | 2011-06-03 | 2012-11-15 | Piezocryst Advanced Sensorics | Sensor für die messung von druck und/oder kraft |
US20210320597A1 (en) * | 2012-05-11 | 2021-10-14 | The Regents Of The University Of California | Virus-Based Piezoelectric Energy Generation |
JP2014000491A (ja) * | 2012-06-15 | 2014-01-09 | Canon Inc | 振動型駆動装置、医療装置、及び医療システム |
GB201219029D0 (en) * | 2012-10-23 | 2012-12-05 | Liverpool John Moores University | Electromagnetic wave sensing |
JP6086347B2 (ja) | 2013-02-16 | 2017-03-01 | 国立大学法人信州大学 | 共振型質量センサ |
WO2016052116A1 (ja) * | 2014-10-03 | 2016-04-07 | 住友精密工業株式会社 | シャッタ装置及び駆動装置 |
CN106092387B (zh) * | 2015-04-30 | 2019-11-22 | 意法半导体股份有限公司 | 用于检测诸如冲击、加速度、旋转力等平面内的力的集成压电传感器 |
DE102016104803B4 (de) * | 2016-03-15 | 2018-01-18 | Physik Instrumente (Pi) Gmbh & Co. Kg | Piezoelektrischer Schreitantrieb |
WO2018088340A1 (ja) * | 2016-11-11 | 2018-05-17 | 株式会社村田製作所 | 振動装置 |
CN109923685B (zh) * | 2016-11-18 | 2023-11-10 | Vega格里沙贝两合公司 | 压电发射和接收装置及其制造方法,以及振动传感器 |
CN106784297B (zh) * | 2016-12-09 | 2020-09-25 | 苏州攀特电陶科技股份有限公司 | 压电陶瓷致动片及其制备方法 |
US10952654B2 (en) | 2017-03-14 | 2021-03-23 | International Business Machines Corporation | PH sensitive surgical tool |
JP2018155576A (ja) * | 2017-03-17 | 2018-10-04 | 太陽誘電株式会社 | 検出素子及び検出装置 |
DE102017214786A1 (de) * | 2017-08-23 | 2019-02-28 | Infineon Technologies Ag | MEMS-Sensoren, Verfahren zum Bereitstellen derselben und Verfahren zum Messen eines Fluidbestandteils |
CN111386447B (zh) * | 2017-12-24 | 2022-11-01 | 磅秤 (2008)有限公司 | 平面负载传感器组件 |
RU180725U1 (ru) * | 2018-01-22 | 2018-06-21 | Открытое акционерное общество "ФОМОС-МАТЕРИАЛС" | Высокотемпературный масс-чувствительный элемент для пьезорезонансных датчиков |
JP2021526651A (ja) | 2018-05-16 | 2021-10-07 | シェケル スケールズ(2008)リミテッド | 計量ロードセルおよびそれらを棚において利用する構成 |
CN108827431B (zh) * | 2018-06-06 | 2020-08-14 | 南京邮电大学 | 一种基于opcl耦合的光机械腔质量传感器 |
WO2020003221A1 (en) | 2018-06-28 | 2020-01-02 | Shekel Scales (2008) Ltd | Systems and methods for weighing products on a shelf |
WO2020163595A1 (en) * | 2019-02-07 | 2020-08-13 | Butterfly Network, Inc | Bi-layer metal electrode for micromachined ultrasonic transducer devices |
EP3715826B1 (en) * | 2019-03-26 | 2024-03-06 | Infineon Technologies AG | Sensor device, particle sensor device and method for detecting a particulate matter density |
US11684951B2 (en) | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
CN112282478B (zh) * | 2020-10-16 | 2022-05-13 | 广东电网有限责任公司 | 一种承力调整装置及输电铁塔 |
TWI807333B (zh) * | 2021-03-19 | 2023-07-01 | 美律實業股份有限公司 | 電子裝置 |
US11818955B2 (en) * | 2021-08-26 | 2023-11-14 | City University Of Hong Kong | Method for forming piezoelectric films on surfaces of arbitrary morphologies |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61231419A (ja) * | 1985-04-08 | 1986-10-15 | Nok Corp | 有機物質の微量測定法 |
JPS6264934A (ja) * | 1985-09-17 | 1987-03-24 | Seiko Instr & Electronics Ltd | 水晶振動子バイオセンサ− |
JPS63200028A (ja) * | 1987-02-17 | 1988-08-18 | Japan Atom Energy Res Inst | 圧電振動子を用いた重量測定法及び装置 |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL278407A (ja) | 1961-05-15 | |||
US3581579A (en) * | 1968-07-17 | 1971-06-01 | Singer General Precision | Fluidic accelerometer |
US3739202A (en) * | 1970-08-28 | 1973-06-12 | W Cady | Instrument for responding to mechanical vibration of acceleration andfor converting the same into electric energy |
US4215570A (en) * | 1979-04-20 | 1980-08-05 | The United States Of America As Represented By The United States Department Of Energy | Miniature quartz resonator force transducer |
US4383763A (en) * | 1979-09-12 | 1983-05-17 | Litton Systems, Inc. | Controllable mirrors |
SE434438B (sv) | 1980-02-21 | 1984-07-23 | Gambro Engstrom Ab | Anordning for detektering av forekomsten av en given gaskomponent i en gasblandning |
JPS58137317A (ja) * | 1982-02-09 | 1983-08-15 | Nec Corp | 圧電薄膜複合振動子 |
DE3246201A1 (de) * | 1982-12-14 | 1984-06-14 | Wabco Westinghouse Fahrzeugbremsen GmbH, 3000 Hannover | Verfahren und einrichtung zur ermittlung des gewichtes eines fahrzeuges |
US4517841A (en) | 1983-01-06 | 1985-05-21 | Sundstrand Data Control, Inc. | Accelerometer with beam resonator force transducer |
JPS60133320A (ja) * | 1983-12-22 | 1985-07-16 | Ishida Scales Mfg Co Ltd | 荷重検出器 |
US4685767A (en) * | 1984-02-27 | 1987-08-11 | Matsushita Electric Industrial Co., Ltd. | Fine adjustment apparatus for optical system lens |
US4613782A (en) * | 1984-03-23 | 1986-09-23 | Hitachi, Ltd. | Actuator |
JPS6146082A (ja) * | 1984-08-10 | 1986-03-06 | Nippon Telegr & Teleph Corp <Ntt> | 圧電アクチユエ−タ |
JPS61185982A (ja) * | 1985-02-14 | 1986-08-19 | Mitsubishi Electric Corp | セラミツク圧電材料 |
EP0215669A3 (en) | 1985-09-17 | 1989-08-30 | Seiko Instruments Inc. | Analytical device and method for analysis of biochemicals, microbes and cells |
JPS62201956A (ja) | 1986-02-28 | 1987-09-05 | Toyobo Co Ltd | ポリアミド組成物 |
JPS62201956U (ja) * | 1986-06-12 | 1987-12-23 | ||
JPS6364640A (ja) | 1986-09-06 | 1988-03-23 | Olympus Optical Co Ltd | アクチユエ−タ |
JPS63224275A (ja) * | 1987-03-13 | 1988-09-19 | Ube Ind Ltd | 圧電たわみ素子 |
JPS64351U (ja) * | 1987-06-19 | 1989-01-05 | ||
JPH07118146B2 (ja) | 1987-07-31 | 1995-12-18 | 株式会社富士通ゼネラル | 磁気記録再生装置 |
JPS6435767U (ja) * | 1987-08-26 | 1989-03-03 | ||
US5079958A (en) * | 1989-03-17 | 1992-01-14 | Olympus Optical Co., Ltd. | Sensor having a cantilever |
JP2936331B2 (ja) | 1989-06-29 | 1999-08-23 | 京セラ株式会社 | 固体電解質燃料電池用支持管 |
JPH0334259U (ja) * | 1989-08-10 | 1991-04-04 | ||
GB8922601D0 (en) * | 1989-10-06 | 1989-11-22 | Rolls Royce Plc | Thermal piezoelectric microbalance and method of using the same |
JP2971916B2 (ja) * | 1990-07-02 | 1999-11-08 | 東洋化工株式会社 | 樹脂系圧電素子の製造方法 |
US5209119A (en) * | 1990-12-12 | 1993-05-11 | Regents Of The University Of Minnesota | Microdevice for sensing a force |
US5323228A (en) * | 1991-04-22 | 1994-06-21 | Alliedsignal Inc. | Cavity length controller for ring laser gyroscope applications |
US5351412A (en) * | 1991-06-11 | 1994-10-04 | International Business Machines Corporation | Micro positioning device |
US5121180A (en) * | 1991-06-21 | 1992-06-09 | Texas Instruments Incorporated | Accelerometer with central mass in support |
KR0122128B1 (ko) * | 1991-07-23 | 1997-11-20 | 세끼사와 요시 | 헤드의 미소이동기구 |
US5668303A (en) | 1992-04-30 | 1997-09-16 | Forschung E.V Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten | Sensor having a membrane as part of an electromechanical resonance circuit forming receiver and transmitter converter with interdigital structures spaced apart from one another |
JPH0670565A (ja) * | 1992-08-18 | 1994-03-11 | Olympus Optical Co Ltd | 超音波振動子及び超音波アクチュエータ |
US5349844A (en) * | 1992-09-11 | 1994-09-27 | Trc Companies, Inc. | System and method for resonant filter mass monitoring |
JPH06104503A (ja) | 1992-09-18 | 1994-04-15 | Sharp Corp | バイモルフ型圧電アクチュエータ |
JP2542154B2 (ja) * | 1992-11-26 | 1996-10-09 | 山一電機株式会社 | 圧電アクチェ―タ― |
EP0614087B1 (en) * | 1993-03-01 | 2000-03-29 | Murata Manufacturing Co., Ltd. | Piezoelectric vibrator and acceleration sensor using the same |
US5708320A (en) * | 1994-10-28 | 1998-01-13 | Alps Electric Co., Ltd | Vibratory gyroscope |
KR100215989B1 (ko) * | 1994-11-07 | 1999-08-16 | 모리시타 요이찌 | 압전작동기 및 그것을 사용한 초전형적외선센서 |
DE4445642A1 (de) * | 1994-12-21 | 1996-06-27 | Marco Systemanalyse Entw | Piezoaktuatorisches Antriebs- bzw. Verstellelement |
ATE273628T1 (de) * | 1995-06-07 | 2004-09-15 | Nike International Ltd | Aufgeblasene, verschlossene behälter aus polyesterurethanmembranen und herstellungsverfahren |
JP2709045B2 (ja) * | 1995-07-31 | 1998-02-04 | 有限会社ユーエスエム | 圧電駆動装置 |
JPH09196682A (ja) | 1996-01-19 | 1997-07-31 | Matsushita Electric Ind Co Ltd | 角速度センサと加速度センサ |
DE19613158A1 (de) * | 1996-04-02 | 1997-10-09 | Daetwyler Ag | Hochdynamischer piezoelektrischer Antrieb |
JPH10136665A (ja) | 1996-10-31 | 1998-05-22 | Tdk Corp | 圧電アクチュエータ |
US5827947A (en) | 1997-01-17 | 1998-10-27 | Advanced Technology Materials, Inc. | Piezoelectric sensor for hydride gases, and fluid monitoring apparatus comprising same |
JP3434672B2 (ja) * | 1997-05-29 | 2003-08-11 | セイコーインスツルメンツ株式会社 | 小型回転式アクチュエータ及び小型回転式アクチュエータの共振周波数補正方法 |
US5867302A (en) * | 1997-08-07 | 1999-02-02 | Sandia Corporation | Bistable microelectromechanical actuator |
EP0938143A4 (en) * | 1997-09-08 | 2000-03-15 | Ngk Insulators Ltd | PIEZOELECTRIC / ELECTROSTRICTIVE DEVICE |
ATE260512T1 (de) * | 1997-11-12 | 2004-03-15 | Deka Products Lp | Piezoelektrischer antrieb betriebsfähig in elektrolytischer flüssigkeit |
JP3545269B2 (ja) | 1998-09-04 | 2004-07-21 | 日本碍子株式会社 | 質量センサ及び質量検出方法 |
JP2000180250A (ja) * | 1998-10-09 | 2000-06-30 | Ngk Insulators Ltd | 質量センサ及び質量検出方法 |
-
1998
- 1998-09-04 EP EP98941716A patent/EP0938143A4/en not_active Withdrawn
- 1998-09-04 CN CN98801739.3A patent/CN1119628C/zh not_active Expired - Fee Related
- 1998-09-04 JP JP51533499A patent/JP3844784B2/ja not_active Expired - Fee Related
- 1998-09-04 US US09/297,655 patent/US6386053B1/en not_active Expired - Fee Related
- 1998-09-04 WO PCT/JP1998/003971 patent/WO1999013518A1/ja not_active Application Discontinuation
- 1998-09-04 DE DE69827767T patent/DE69827767T2/de not_active Expired - Fee Related
- 1998-09-04 CN CN98801731.8A patent/CN1243604A/zh active Pending
- 1998-09-04 JP JP51533399A patent/JP3298897B2/ja not_active Expired - Fee Related
- 1998-09-04 US US09/214,110 patent/US6465934B1/en not_active Expired - Fee Related
- 1998-09-04 EP EP98941714A patent/EP0943903B1/en not_active Expired - Lifetime
- 1998-09-04 WO PCT/JP1998/003969 patent/WO1999013300A1/ja active IP Right Grant
- 1998-12-28 US US09/242,642 patent/US6239534B1/en not_active Expired - Fee Related
-
1999
- 1999-03-05 JP JP11059501A patent/JP2000162518A/ja active Pending
- 1999-08-31 JP JP24557199A patent/JP3778736B2/ja not_active Expired - Fee Related
- 1999-09-03 EP EP99307027A patent/EP0996175A3/en not_active Withdrawn
-
2002
- 2002-02-08 US US10/071,019 patent/US6612190B2/en not_active Expired - Fee Related
- 2002-08-30 US US10/231,737 patent/US6724127B2/en not_active Expired - Fee Related
-
2003
- 2003-06-19 US US10/465,470 patent/US6840123B2/en not_active Expired - Fee Related
-
2004
- 2004-08-25 US US10/925,514 patent/US6895829B2/en not_active Expired - Fee Related
-
2005
- 2005-02-18 US US11/060,988 patent/US7089813B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61231419A (ja) * | 1985-04-08 | 1986-10-15 | Nok Corp | 有機物質の微量測定法 |
JPS6264934A (ja) * | 1985-09-17 | 1987-03-24 | Seiko Instr & Electronics Ltd | 水晶振動子バイオセンサ− |
JPS63200028A (ja) * | 1987-02-17 | 1988-08-18 | Japan Atom Energy Res Inst | 圧電振動子を用いた重量測定法及び装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP0943903A4 * |
Cited By (11)
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JP2009528543A (ja) * | 2006-02-28 | 2009-08-06 | エクソンモービル リサーチ アンド エンジニアリング カンパニー | 機械的振動子を用いる金属損失率センサおよび測定 |
WO2007148522A1 (ja) * | 2006-06-22 | 2007-12-27 | National Institute Of Advanced Industrial Science And Technology | 検出センサ |
JP2008026304A (ja) * | 2006-06-22 | 2008-02-07 | National Institute Of Advanced Industrial & Technology | 検出センサ |
US8006561B2 (en) | 2006-06-22 | 2011-08-30 | National Institute Of Advanced Industrial Science And Technology | Detection sensor |
US8336367B2 (en) | 2007-03-16 | 2012-12-25 | National Institute Of Advanced Industrial Science And Technology | Detection sensor, vibrator |
JP2013522583A (ja) * | 2010-03-12 | 2013-06-13 | テールズ | 真空チャンバー内に配置された機器の脱ガスを数量化する装置 |
CN109248825A (zh) * | 2018-11-05 | 2019-01-22 | 大连理工大学 | 基于力反馈控制的微量高粘度胶液转移方法 |
KR20230113233A (ko) * | 2020-10-16 | 2023-07-28 | 경희대학교 산학협력단 | 정전 발전기 |
KR102635270B1 (ko) | 2020-10-16 | 2024-02-08 | 경희대학교 산학협력단 | 정전 발전기 |
CN115037185A (zh) * | 2022-07-18 | 2022-09-09 | 西安交通大学 | 基于压电充放电原理的结构形状调节机构与断电保形方法 |
CN115037185B (zh) * | 2022-07-18 | 2024-03-12 | 西安交通大学 | 基于压电充放电原理的结构形状调节机构与断电保形方法 |
Also Published As
Publication number | Publication date |
---|---|
WO1999013518A1 (en) | 1999-03-18 |
EP0943903B1 (en) | 2004-11-24 |
US6840123B2 (en) | 2005-01-11 |
US6239534B1 (en) | 2001-05-29 |
CN1243604A (zh) | 2000-02-02 |
JP3844784B2 (ja) | 2006-11-15 |
US20020088284A1 (en) | 2002-07-11 |
US6895829B2 (en) | 2005-05-24 |
JP2000102268A (ja) | 2000-04-07 |
JP2000162518A (ja) | 2000-06-16 |
US20030209094A1 (en) | 2003-11-13 |
EP0943903A1 (en) | 1999-09-22 |
US20030011283A1 (en) | 2003-01-16 |
DE69827767D1 (de) | 2004-12-30 |
US7089813B2 (en) | 2006-08-15 |
CN1243573A (zh) | 2000-02-02 |
US6612190B2 (en) | 2003-09-02 |
CN1119628C (zh) | 2003-08-27 |
EP0938143A1 (en) | 1999-08-25 |
EP0938143A4 (en) | 2000-03-15 |
EP0996175A3 (en) | 2002-09-25 |
US20050016277A1 (en) | 2005-01-27 |
EP0996175A2 (en) | 2000-04-26 |
US6465934B1 (en) | 2002-10-15 |
US6386053B1 (en) | 2002-05-14 |
JP3778736B2 (ja) | 2006-05-24 |
US20050145032A1 (en) | 2005-07-07 |
JP3298897B2 (ja) | 2002-07-08 |
DE69827767T2 (de) | 2006-03-02 |
US6724127B2 (en) | 2004-04-20 |
EP0943903A4 (en) | 2000-03-15 |
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