WO1999050889A3 - Printed insulators for active and passive electronic devices - Google Patents
Printed insulators for active and passive electronic devices Download PDFInfo
- Publication number
- WO1999050889A3 WO1999050889A3 PCT/US1999/006454 US9906454W WO9950889A3 WO 1999050889 A3 WO1999050889 A3 WO 1999050889A3 US 9906454 W US9906454 W US 9906454W WO 9950889 A3 WO9950889 A3 WO 9950889A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed
- insulators
- active
- printing
- electronic devices
- Prior art date
Links
- 239000012212 insulator Substances 0.000 title 1
- 238000000034 method Methods 0.000 abstract 4
- 238000007639 printing Methods 0.000 abstract 3
- 239000003989 dielectric material Substances 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 238000007641 inkjet printing Methods 0.000 abstract 1
- 229920000620 organic polymer Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
- H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66181—Conductor-insulator-semiconductor capacitors, e.g. trench capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU32031/99A AU3203199A (en) | 1998-03-27 | 1999-03-26 | Printed insulators for active and passive electronic devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7974698P | 1998-03-27 | 1998-03-27 | |
US60/079,746 | 1998-03-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999050889A2 WO1999050889A2 (en) | 1999-10-07 |
WO1999050889A3 true WO1999050889A3 (en) | 1999-12-23 |
Family
ID=22152544
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/006453 WO1999050890A1 (en) | 1998-03-27 | 1999-03-26 | Method for making multilayer thin-film electronics |
PCT/US1999/006454 WO1999050889A2 (en) | 1998-03-27 | 1999-03-26 | Printed insulators for active and passive electronic devices |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/006453 WO1999050890A1 (en) | 1998-03-27 | 1999-03-26 | Method for making multilayer thin-film electronics |
Country Status (2)
Country | Link |
---|---|
AU (2) | AU3203099A (en) |
WO (2) | WO1999050890A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0105145D0 (en) | 2001-03-02 | 2001-04-18 | Koninkl Philips Electronics Nv | Thin film transistors and method of manufacture |
DE10151131A1 (en) * | 2001-10-17 | 2003-05-08 | Infineon Technologies Ag | Production of a structured layer on a surface of a substrate comprises forming a mask made from fixed toner on the surface of the substrate using a laser printing process, and forming the structured layer with a structure defined by a mask |
GB2388709A (en) * | 2002-05-17 | 2003-11-19 | Seiko Epson Corp | Circuit fabrication method |
US8026565B2 (en) * | 2003-01-30 | 2011-09-27 | University Of Cape Town | Thin film semiconductor device comprising nanocrystalline silicon powder |
EP1684366A1 (en) * | 2005-01-25 | 2006-07-26 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Electronic device comprising an electronic component and encapsulation members |
US7906415B2 (en) | 2006-07-28 | 2011-03-15 | Xerox Corporation | Device having zinc oxide semiconductor and indium/zinc electrode |
EP2089897A2 (en) | 2006-12-07 | 2009-08-19 | Innovalight, Inc. | Methods for creating a densified group iv semiconductor nanoparticle thin film |
US7851336B2 (en) | 2008-03-13 | 2010-12-14 | Innovalight, Inc. | Method of forming a passivated densified nanoparticle thin film on a substrate |
US8247312B2 (en) | 2008-04-24 | 2012-08-21 | Innovalight, Inc. | Methods for printing an ink on a textured wafer surface |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5385848A (en) * | 1993-09-20 | 1995-01-31 | Iowa Thin Film Technologies, Inc | Method for fabricating an interconnected array of semiconductor devices |
US5820932A (en) * | 1995-11-30 | 1998-10-13 | Sun Chemical Corporation | Process for the production of lithographic printing plates |
US5919532A (en) * | 1996-03-25 | 1999-07-06 | Sharp Kabushiki Kaisha | Active matrix substrate, method for fabricating the same, and liquid crystal display device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2581781B1 (en) * | 1985-05-07 | 1987-06-12 | Thomson Csf | NON-LINEAR CONTROL ELEMENTS FOR FLAT ELECTROOPTIC DISPLAY SCREEN AND MANUFACTURING METHOD THEREOF |
US5049527A (en) * | 1985-06-25 | 1991-09-17 | Hewlett-Packard Company | Optical isolator |
US4796975A (en) * | 1987-05-14 | 1989-01-10 | Amphenol Corporation | Method of aligning and attaching optical fibers to substrate optical waveguides and substrate optical waveguide having fibers attached thereto |
US5309003A (en) * | 1992-02-28 | 1994-05-03 | At&T Bell Laboratories | Article comprising a real space transfer semiconductor device, and method of making the article |
US5249245A (en) * | 1992-08-31 | 1993-09-28 | Motorola, Inc. | Optoelectroinc mount including flexible substrate and method for making same |
EP0680163A3 (en) * | 1994-04-25 | 1996-07-03 | At & T Corp | Integrated detector/photoemitter with non-imaging director. |
US5471552A (en) * | 1995-02-22 | 1995-11-28 | Industrial Technology Research Institute | Fabrication of static-alignment fiber-guiding grooves for planar lightwave circuits |
US5699073A (en) * | 1996-03-04 | 1997-12-16 | Motorola | Integrated electro-optical package with carrier ring and method of fabrication |
-
1999
- 1999-03-26 WO PCT/US1999/006453 patent/WO1999050890A1/en active Application Filing
- 1999-03-26 AU AU32030/99A patent/AU3203099A/en not_active Abandoned
- 1999-03-26 WO PCT/US1999/006454 patent/WO1999050889A2/en active Application Filing
- 1999-03-26 AU AU32031/99A patent/AU3203199A/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5385848A (en) * | 1993-09-20 | 1995-01-31 | Iowa Thin Film Technologies, Inc | Method for fabricating an interconnected array of semiconductor devices |
US5820932A (en) * | 1995-11-30 | 1998-10-13 | Sun Chemical Corporation | Process for the production of lithographic printing plates |
US5919532A (en) * | 1996-03-25 | 1999-07-06 | Sharp Kabushiki Kaisha | Active matrix substrate, method for fabricating the same, and liquid crystal display device |
Also Published As
Publication number | Publication date |
---|---|
WO1999050890A1 (en) | 1999-10-07 |
AU3203199A (en) | 1999-10-18 |
WO1999050889A2 (en) | 1999-10-07 |
AU3203099A (en) | 1999-10-18 |
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