WO1999053528A3 - Surface treatment process and system - Google Patents

Surface treatment process and system Download PDF

Info

Publication number
WO1999053528A3
WO1999053528A3 PCT/US1999/007875 US9907875W WO9953528A3 WO 1999053528 A3 WO1999053528 A3 WO 1999053528A3 US 9907875 W US9907875 W US 9907875W WO 9953528 A3 WO9953528 A3 WO 9953528A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
polishing pad
surface treatment
treatment process
rotated
Prior art date
Application number
PCT/US1999/007875
Other languages
French (fr)
Other versions
WO1999053528A2 (en
WO1999053528A8 (en
Inventor
Igor J Malik
Original Assignee
Silicon Genesis Corp
Igor J Malik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/286,259 external-priority patent/US6221774B1/en
Application filed by Silicon Genesis Corp, Igor J Malik filed Critical Silicon Genesis Corp
Priority to AU34886/99A priority Critical patent/AU3488699A/en
Publication of WO1999053528A2 publication Critical patent/WO1999053528A2/en
Publication of WO1999053528A8 publication Critical patent/WO1999053528A8/en
Publication of WO1999053528A3 publication Critical patent/WO1999053528A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/006—Machines or devices using grinding or polishing belts; Accessories therefor for special purposes, e.g. for television tubes, car bumpers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Abstract

A wafer finishing system and method. A polishing pad (24) is rotated about an axis parallel to a surface (10) of a semiconductor wafer (12). The polishing pad (24) is supported by a roller (22) that receives fluid (38) and distributes the fluid through the polishing pad (24) across the surface of the wafer. The surface (10) of the wafer is moved in relation to the polishing pad so that the wafer surface is smoothed, or touch-polished, with or without the use of abrasive slurry. In one embodiment the wafer is rotated between an upper roller assembly (20) and a lower roller assembly (14).
PCT/US1999/007875 1998-04-10 1999-04-09 Surface treatment process and system WO1999053528A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU34886/99A AU3488699A (en) 1998-04-10 1999-04-09 Surface treatment process and system

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US8140898P 1998-04-10 1998-04-10
US60/081,408 1998-04-10
US28653299A 1999-04-05 1999-04-05
US28626999A 1999-04-05 1999-04-05
US09/286,532 1999-04-05
US09/286,259 1999-04-05
US09/286,269 1999-04-05
US09/286,259 US6221774B1 (en) 1998-04-10 1999-04-05 Method for surface treatment of substrates

Publications (3)

Publication Number Publication Date
WO1999053528A2 WO1999053528A2 (en) 1999-10-21
WO1999053528A8 WO1999053528A8 (en) 2000-01-13
WO1999053528A3 true WO1999053528A3 (en) 2002-01-10

Family

ID=27491619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/007875 WO1999053528A2 (en) 1998-04-10 1999-04-09 Surface treatment process and system

Country Status (1)

Country Link
WO (1) WO1999053528A2 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62162467A (en) * 1986-01-10 1987-07-18 Rohm Co Ltd Polishing device for wafer
JPS62162466A (en) * 1986-01-09 1987-07-18 Rohm Co Ltd Lapping device for wafer
JPH0596468A (en) * 1991-03-12 1993-04-20 Yuzo Mori Superprecision mirror surface work method
US5374564A (en) * 1991-09-18 1994-12-20 Commissariat A L'energie Atomique Process for the production of thin semiconductor material films
US5486134A (en) * 1992-02-27 1996-01-23 Oliver Design, Inc. System and method for texturing magnetic data storage disks
US5643056A (en) * 1994-10-31 1997-07-01 Ebara Corporation Revolving drum polishing apparatus
US5707274A (en) * 1996-07-09 1998-01-13 Lg Semicon Co., Ltd. Chemical mechanical polishing apparatus for semiconductor wafer
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US6013563A (en) * 1997-05-12 2000-01-11 Silicon Genesis Corporation Controlled cleaning process

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62162466A (en) * 1986-01-09 1987-07-18 Rohm Co Ltd Lapping device for wafer
JPS62162467A (en) * 1986-01-10 1987-07-18 Rohm Co Ltd Polishing device for wafer
JPH0596468A (en) * 1991-03-12 1993-04-20 Yuzo Mori Superprecision mirror surface work method
US5374564A (en) * 1991-09-18 1994-12-20 Commissariat A L'energie Atomique Process for the production of thin semiconductor material films
US5486134A (en) * 1992-02-27 1996-01-23 Oliver Design, Inc. System and method for texturing magnetic data storage disks
US5643056A (en) * 1994-10-31 1997-07-01 Ebara Corporation Revolving drum polishing apparatus
US5707274A (en) * 1996-07-09 1998-01-13 Lg Semicon Co., Ltd. Chemical mechanical polishing apparatus for semiconductor wafer
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
US6013563A (en) * 1997-05-12 2000-01-11 Silicon Genesis Corporation Controlled cleaning process
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller

Also Published As

Publication number Publication date
WO1999053528A2 (en) 1999-10-21
WO1999053528A8 (en) 2000-01-13

Similar Documents

Publication Publication Date Title
WO2002053322A3 (en) System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
TW376350B (en) Process for polishing a semiconductor device substrate
MY120338A (en) Wafer polishing apparatus
TW428225B (en) A method of polishing a surface of a substrate, a method of manufacturing semiconductor device, and an apparatus of manufacturing the same
DE69503408T2 (en) Device for chemical mechanical polishing with improved distribution of the polishing composition
ATE296185T1 (en) METHOD AND DEVICE FOR PLANARIZING MICROELECTRONIC SUBSTRATE STRUCTURE
EP0904895A3 (en) Substrate polishing method and apparatus
MY120573A (en) Slurry comprising a ligand or chelating agent for polishing a surface.
EP0820092A4 (en) Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates
CA2245498A1 (en) Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
EP1334802A4 (en) Polisher
GB2329601A (en) Methods and apparatus for the chemical mechanical planarization of electronic devices
EP1055486A3 (en) Dressing apparatus and polishing apparatus
AU5148198A (en) Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
EP1043379A4 (en) Abrasive, method of polishing wafer, and method of producing semiconductor device
EP0865875A3 (en) Precise polishing apparatus and method
KR960700864A (en) Apparatus and method for polishing
TW372209B (en) Polishing apparatus and polishing method
MY132505A (en) Apparatus and method for chamfering wafer with loose abrasive grains
TW429462B (en) Manufacturing method and processing device for semiconductor device
SG143964A1 (en) Polishing apparatus and dressing method
TW377467B (en) Polishing system, polishing method, polishing pad, and method of forming polishing pad
MY130537A (en) Polishing method and apparatus for automatic reduction of wafer taper in single wafer polishing
EP0860238A3 (en) Polishing apparatus
TW368696B (en) Manufacturing method for semiconductor device and the manufacturing device for semiconductor

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: C1

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: C1

Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i

Free format text: PAT. BUL. 42/99 UNDER (30) REPLACE "NOT FURNISHED" BY "09/286532 09/286259 09/286269"

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
NENP Non-entry into the national phase

Ref country code: KR

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG