WO1999060829A3 - Method and apparatus for making electrical traces, circuits and devices - Google Patents

Method and apparatus for making electrical traces, circuits and devices Download PDF

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Publication number
WO1999060829A3
WO1999060829A3 PCT/US1999/010502 US9910502W WO9960829A3 WO 1999060829 A3 WO1999060829 A3 WO 1999060829A3 US 9910502 W US9910502 W US 9910502W WO 9960829 A3 WO9960829 A3 WO 9960829A3
Authority
WO
WIPO (PCT)
Prior art keywords
printer
print
conductive
inks
prints
Prior art date
Application number
PCT/US1999/010502
Other languages
French (fr)
Other versions
WO1999060829A2 (en
Inventor
Christopher A Wiklof
Pixie A Austin
Robert M Paratore
Original Assignee
Intermec Ip Corp
Christopher A Wiklof
Pixie A Austin
Robert M Paratore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intermec Ip Corp, Christopher A Wiklof, Pixie A Austin, Robert M Paratore filed Critical Intermec Ip Corp
Priority to AU41866/99A priority Critical patent/AU4186699A/en
Publication of WO1999060829A2 publication Critical patent/WO1999060829A2/en
Publication of WO1999060829A3 publication Critical patent/WO1999060829A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Abstract

A printer (108) forms conductive traces (116) on the print media (114) for circuit connection, such as for connecting to integrated circuit chips. The printer (108) prints the conductive traces (116) according to a digital representation of a desired conductor pattern (112) produced with a computer system (102), thus eliminating typical masking and photolithographic steps. In one embodiment, the printer (108) includes three print heads in series and a transport mechanism that transport the print media past the print heads to print conductive, dielectric, and/or ferromagnetic inks. In another embodiment, the printer includes a single print head that sequentially prints each of the inks. By printing not only conductive material, the printer (108) can print various impedance elements, including resistors, capacitors, and inductors. The printer can also print N- and P-type material to produce active circuit elements. The printer can print various other electrical devices, all in a very inexpensive manner.
PCT/US1999/010502 1998-05-20 1999-05-12 Method and apparatus for making electrical traces, circuits and devices WO1999060829A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU41866/99A AU4186699A (en) 1998-05-20 1999-05-12 Method and apparatus for making electrical traces, circuits and devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8242798A 1998-05-20 1998-05-20
US09/082,427 1998-05-20

Publications (2)

Publication Number Publication Date
WO1999060829A2 WO1999060829A2 (en) 1999-11-25
WO1999060829A3 true WO1999060829A3 (en) 2003-04-17

Family

ID=22171147

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/010502 WO1999060829A2 (en) 1998-05-20 1999-05-12 Method and apparatus for making electrical traces, circuits and devices

Country Status (2)

Country Link
AU (1) AU4186699A (en)
WO (1) WO1999060829A2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8860318B2 (en) 2010-01-04 2014-10-14 Cooledge Lighting Inc. Failure mitigation in arrays of light-emitting devices
US8877561B2 (en) 2012-06-07 2014-11-04 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
US8907370B2 (en) 2010-06-29 2014-12-09 Cooledge Lighting Inc. Electronic devices with yielding substrates
US9179510B2 (en) 2009-06-27 2015-11-03 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU9451098A (en) 1997-10-14 1999-05-03 Patterning Technologies Limited Method of forming an electronic device
US7323634B2 (en) 1998-10-14 2008-01-29 Patterning Technologies Limited Method of forming an electronic device
GB2350321A (en) * 1999-05-27 2000-11-29 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
US6849308B1 (en) 1999-05-27 2005-02-01 Stuart Speakman Method of forming a masking pattern on a surface
US6414543B1 (en) * 2000-11-28 2002-07-02 Precision Dynamics Corporation Rectifying charge storage element
DE50203384D1 (en) * 2002-01-14 2005-07-14 Fraunhofer Ges Forschung SYSTEM FOR THE MANUFACTURE OF ELECTRICAL AND INTEGRATED CIRCUITS
US20070234918A1 (en) * 2006-03-31 2007-10-11 Edward Hirahara System and method for making printed electronic circuits using electrophotography
US7724142B2 (en) 2007-09-27 2010-05-25 Intermec Ip Corp. Systems and methods for wirelessly marking media
DE202014103821U1 (en) 2014-07-09 2014-09-09 Carmen Diegel Flexible electrical conductor structure
DE102018102734A1 (en) 2018-01-18 2019-07-18 Schreiner Group Gmbh & Co. Kg Flexible electrical circuit with connection between electrically conductive structural elements
AT521913B1 (en) * 2018-11-20 2020-10-15 Adaptive Regelsysteme Ges M B H Electrical connection on a textile carrier material
US11764491B2 (en) 2018-11-20 2023-09-19 Adaptive Regelsysteme Gesellschaft M.B.H. Electrical connection on a textile carrier material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS642392A (en) * 1987-06-24 1989-01-06 Murata Mfg Co Ltd Formation of conductor pattern
JPS6464290A (en) * 1987-09-03 1989-03-10 Murata Manufacturing Co Conductor pattern forming method
WO1992020489A1 (en) * 1991-05-21 1992-11-26 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
JPH06252532A (en) * 1993-02-25 1994-09-09 Sega Enterp Ltd Manufacture of wiring board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS642392A (en) * 1987-06-24 1989-01-06 Murata Mfg Co Ltd Formation of conductor pattern
JPS6464290A (en) * 1987-09-03 1989-03-10 Murata Manufacturing Co Conductor pattern forming method
WO1992020489A1 (en) * 1991-05-21 1992-11-26 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
JPH06252532A (en) * 1993-02-25 1994-09-09 Sega Enterp Ltd Manufacture of wiring board

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
M CUMMINGS: "Shareware layout tool gives individual performance", ELECTRONICS WORLD AND WIRELESS WORLD., vol. 98, May 1992 (1992-05-01), REED BUSINESS PUBLISHING, SUTTON, SURREY., GB, pages 375 - 380, XP000290542, ISSN: 0959-8332 *
M. SHANKIN: "Hybrid circuits by computerized writing", ELECTRONIC PACKAGING AND PRODUCTION., vol. 21, no. 1, January 1981 (1981-01-01), CAHNERS PUBLISHING CO, NEWTON, MASSACHUSETTS., US, pages 98 - 109, XP002116001, ISSN: 0013-4945 *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 173 (E - 748) 24 April 1989 (1989-04-24) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 277 (E - 778) 26 June 1989 (1989-06-26) *
PATENT ABSTRACTS OF JAPAN vol. 18, no. 643 (E - 1640) 7 December 1994 (1994-12-07) *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9179510B2 (en) 2009-06-27 2015-11-03 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US9431462B2 (en) 2009-06-27 2016-08-30 Cooledge Lighting, Inc. High efficiency LEDs and LED lamps
US9559150B2 (en) 2009-06-27 2017-01-31 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8860318B2 (en) 2010-01-04 2014-10-14 Cooledge Lighting Inc. Failure mitigation in arrays of light-emitting devices
US9107272B2 (en) 2010-01-04 2015-08-11 Cooledge Lighting Inc. Failure mitigation in arrays of light-emitting devices
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
US8907370B2 (en) 2010-06-29 2014-12-09 Cooledge Lighting Inc. Electronic devices with yielding substrates
US8877561B2 (en) 2012-06-07 2014-11-04 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
US9214615B2 (en) 2012-06-07 2015-12-15 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods

Also Published As

Publication number Publication date
AU4186699A (en) 1999-12-06
WO1999060829A2 (en) 1999-11-25

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