WO2000003252A3 - Multi-point probe - Google Patents

Multi-point probe Download PDF

Info

Publication number
WO2000003252A3
WO2000003252A3 PCT/DK1999/000391 DK9900391W WO0003252A3 WO 2000003252 A3 WO2000003252 A3 WO 2000003252A3 DK 9900391 W DK9900391 W DK 9900391W WO 0003252 A3 WO0003252 A3 WO 0003252A3
Authority
WO
WIPO (PCT)
Prior art keywords
testing
technique
present
probe
allowing
Prior art date
Application number
PCT/DK1999/000391
Other languages
French (fr)
Other versions
WO2000003252A2 (en
Inventor
Christian Leth Petersen
Francois Grey
Peter Boeggild
Original Assignee
Capres Aps
Christian Leth Petersen
Francois Grey
Peter Boeggild
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26063886&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2000003252(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from EP98610023A external-priority patent/EP0974845A1/en
Application filed by Capres Aps, Christian Leth Petersen, Francois Grey, Peter Boeggild filed Critical Capres Aps
Priority to JP2000559436A priority Critical patent/JP4685240B2/en
Priority to DE69937147T priority patent/DE69937147T2/en
Priority to EP99932677A priority patent/EP1095282B1/en
Priority to AU48973/99A priority patent/AU4897399A/en
Priority to CA002336531A priority patent/CA2336531A1/en
Publication of WO2000003252A2 publication Critical patent/WO2000003252A2/en
Publication of WO2000003252A3 publication Critical patent/WO2000003252A3/en
Priority to US09/750,645 priority patent/US20010050565A1/en
Priority to US10/098,969 priority patent/US7304486B2/en
Priority to US10/675,886 priority patent/US7323890B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14—Measuring resistance by measuring current or voltage obtained from a reference source
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/04—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Mechanical Pencils And Projecting And Retracting Systems Therefor, And Multi-System Writing Instruments (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An object of the present invention is to provide a novel testing probe allowing the testing of electronic circuits of a smaller dimension as compared to the prior art testing technique. A particular advantage of the present invention is related to the fact that the novel testing technique involving a novel multi-point probe (12, 14, 16, 18) allows the probe to be utilised for establishing a reliable contact between any testing pin or testing tip and a specific location of a test sample, as the testing probe according to the present invention includes individually bendable or flexible testing pins (14, 18). A particular feature of the present invention relates to the fact that the testing probe according to the present invention may be produced in a process compatible with the production of electronic circuits, allowing measurement electronics to be integrated on the testing probe, and allowing for tests to be performed on any device fabricated by any appropriate circuit technology involving planar technique, CMOS technique, thick-film technique or thin-film technique and also LSI and VLSI production techniques.
PCT/DK1999/000391 1998-07-08 1999-07-08 Multi-point probe WO2000003252A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000559436A JP4685240B2 (en) 1998-07-08 1999-07-08 Multi-probe probe
DE69937147T DE69937147T2 (en) 1998-07-08 1999-07-08 MORE TIP PROBE
EP99932677A EP1095282B1 (en) 1998-07-08 1999-07-08 Multi-point probe
AU48973/99A AU4897399A (en) 1998-07-08 1999-07-08 Multi-point probe
CA002336531A CA2336531A1 (en) 1998-07-08 1999-07-08 Multi-point probe
US09/750,645 US20010050565A1 (en) 1998-07-08 2000-12-28 Multi-point probe
US10/098,969 US7304486B2 (en) 1998-07-08 2002-03-14 Nano-drive for high resolution positioning and for positioning of a multi-point probe
US10/675,886 US7323890B2 (en) 1998-07-08 2003-09-30 Multi-point probe

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP98610023A EP0974845A1 (en) 1998-07-08 1998-07-08 Apparatus for testing electric properties using a multi-point probe
EP98610023.8 1998-07-08
DKPA199900378 1999-03-17
DKPA199900378 1999-03-17

Related Child Applications (2)

Application Number Title Priority Date Filing Date
PCT/DK2000/000513 Continuation WO2001020347A1 (en) 1998-07-08 2000-09-15 Nano-drive for high resolution positioning and for positioning of a multi-point probe
US09/750,645 Continuation US20010050565A1 (en) 1998-07-08 2000-12-28 Multi-point probe

Publications (2)

Publication Number Publication Date
WO2000003252A2 WO2000003252A2 (en) 2000-01-20
WO2000003252A3 true WO2000003252A3 (en) 2000-04-13

Family

ID=26063886

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK1999/000391 WO2000003252A2 (en) 1998-07-08 1999-07-08 Multi-point probe

Country Status (8)

Country Link
US (2) US20010050565A1 (en)
EP (1) EP1095282B1 (en)
JP (1) JP4685240B2 (en)
AT (1) ATE373830T1 (en)
AU (1) AU4897399A (en)
CA (1) CA2336531A1 (en)
DE (1) DE69937147T2 (en)
WO (1) WO2000003252A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110383077B (en) * 2017-03-07 2022-03-29 卡普雷斯股份有限公司 Probe for testing electrical properties of a test sample

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US6955078B2 (en) * 2001-03-30 2005-10-18 Xidex Corporation Caliper method, system, and apparatus
EP1466182B1 (en) 2002-01-07 2011-08-03 Capres A/S Electrical feedback detection system for multi-point probes
DE10201491C1 (en) * 2002-01-16 2003-08-28 Gfd Ges Fuer Diamantprodukte M Probe system and method for its production
EP2463668A2 (en) 2004-06-21 2012-06-13 Capres A/S A method and an apparatus for testing electrical properties
CN102305896B (en) 2004-06-21 2015-05-13 卡普雷斯股份有限公司 A method for providing alignment of a probe
US9423693B1 (en) 2005-05-10 2016-08-23 Victor B. Kley In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate
US7571638B1 (en) * 2005-05-10 2009-08-11 Kley Victor B Tool tips with scanning probe microscopy and/or atomic force microscopy applications
ES2265277B1 (en) * 2005-06-01 2008-01-01 Consejo Superior Investig. Cientificas SENSOR DEVICE AND EQUIPMENT FOR RESISTIVITY MEASUREMENT WITH THE FOUR POINT METHOD, AS WELL AS A METHOD FOR THE MANUFACTURE OF THE DEVICE.
US7511510B2 (en) * 2005-11-30 2009-03-31 International Business Machines Corporation Nanoscale fault isolation and measurement system
KR20090005217A (en) 2006-04-24 2009-01-12 카프레스 에이/에스 Method for sheet resistance and leakage current density measurements on shallow semiconductor implants
US8245318B2 (en) * 2006-07-27 2012-08-14 The Regents Of The University Of California Sidewall tracing nanoprobes, method for making the same, and method for use
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EP2101181A1 (en) 2008-03-12 2009-09-16 Capres A/S Device including a contact detector
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EP2498081A1 (en) 2011-03-08 2012-09-12 Capres A/S Single-position hall effect measurements
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US20150075264A1 (en) * 2012-03-27 2015-03-19 Hysitron, Inc. Microscope objective mechanical testing instrument
US8806284B2 (en) 2012-05-02 2014-08-12 Avalanche Technology Inc. Method for bit-error rate testing of resistance-based RAM cells using a reflected signal
EP2677324A1 (en) 2012-06-20 2013-12-25 Capres A/S Deep-etched multipoint probe
US9252187B2 (en) 2013-03-08 2016-02-02 Avalanche Technology, Inc. Devices and methods for measurement of magnetic characteristics of MRAM wafers using magnetoresistive test strips
US9778572B1 (en) 2013-03-15 2017-10-03 Victor B. Kley In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate
US9844139B2 (en) * 2013-03-16 2017-12-12 Indiana Integrated Circuits, LLC Method of interconnecting microchips
KR102080661B1 (en) * 2013-08-06 2020-02-24 삼성전기주식회사 Thickness measurement device and method for measuring the same
EP2871487A1 (en) 2013-11-11 2015-05-13 Capres A/S Small scale measurements of anisotropic sheet conductances
US9170273B2 (en) * 2013-12-09 2015-10-27 Globalfoundries U.S. 2 Llc High frequency capacitance-voltage nanoprobing characterization
US9201112B2 (en) 2013-12-09 2015-12-01 International Business Machines Corporation Atom probe tomography sample preparation for three-dimensional (3D) semiconductor devices
US10302677B2 (en) 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements
TWI567846B (en) * 2015-08-19 2017-01-21 創意電子股份有限公司 Testing unit and testing apparatus using the same
US10896803B2 (en) * 2016-08-19 2021-01-19 The Regents Of The University Of California Ion beam mill etch depth monitoring with nanometer-scale resolution
US10514391B2 (en) 2016-08-22 2019-12-24 Kla-Tencor Corporation Resistivity probe having movable needle bodies
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JP7219276B2 (en) * 2017-11-15 2023-02-07 カプレス・アクティーゼルスカブ Probes and associated proximity detectors for testing electrical properties of test specimens
US10411185B1 (en) 2018-05-30 2019-09-10 Spin Memory, Inc. Process for creating a high density magnetic tunnel junction array test platform
US11125779B2 (en) 2018-11-15 2021-09-21 Rohde & Schwarz Gmbh & Co. Kg Probe with radio frequency power detector, test system and test method
KR102137442B1 (en) * 2018-12-05 2020-07-27 전북대학교산학협력단 A probe for atomic force microscopy, and a method for manufacturing the same
CN110190106B (en) * 2019-06-13 2022-01-28 京东方科技集团股份有限公司 Display panel, preparation method and detection method thereof, and display device
JP2022179066A (en) * 2021-05-21 2022-12-02 富士フイルムビジネスイノベーション株式会社 Sheet electric resistance measuring unit
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110383077B (en) * 2017-03-07 2022-03-29 卡普雷斯股份有限公司 Probe for testing electrical properties of a test sample

Also Published As

Publication number Publication date
US7323890B2 (en) 2008-01-29
EP1095282B1 (en) 2007-09-19
DE69937147T2 (en) 2008-06-19
AU4897399A (en) 2000-02-01
DE69937147D1 (en) 2007-10-31
US20010050565A1 (en) 2001-12-13
US20040056674A1 (en) 2004-03-25
ATE373830T1 (en) 2007-10-15
JP4685240B2 (en) 2011-05-18
WO2000003252A2 (en) 2000-01-20
JP2002520596A (en) 2002-07-09
EP1095282A2 (en) 2001-05-02
CA2336531A1 (en) 2000-01-20

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