WO2000019222A3 - Semiconductor switching circuit with an integrated self-testing circuit - Google Patents

Semiconductor switching circuit with an integrated self-testing circuit Download PDF

Info

Publication number
WO2000019222A3
WO2000019222A3 PCT/DE1999/003117 DE9903117W WO0019222A3 WO 2000019222 A3 WO2000019222 A3 WO 2000019222A3 DE 9903117 W DE9903117 W DE 9903117W WO 0019222 A3 WO0019222 A3 WO 0019222A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
semiconductor switching
testing circuit
integrated self
switching circuit
Prior art date
Application number
PCT/DE1999/003117
Other languages
German (de)
French (fr)
Other versions
WO2000019222A2 (en
Inventor
Helmut Schneider
Original Assignee
Siemens Ag
Helmut Schneider
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Helmut Schneider filed Critical Siemens Ag
Publication of WO2000019222A2 publication Critical patent/WO2000019222A2/en
Publication of WO2000019222A3 publication Critical patent/WO2000019222A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Abstract

The invention relates to a semiconductor switching circuit with a self-testing circuit. Said self-testing circuit (BIST) is located under a connection pad (P), which is provided for operating the self-testing circuit (BIST).
PCT/DE1999/003117 1998-09-30 1999-09-28 Semiconductor switching circuit with an integrated self-testing circuit WO2000019222A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1998145064 DE19845064A1 (en) 1998-09-30 1998-09-30 Semiconductor circuit with integrated self-test circuit
DE19845064.8 1998-09-30

Publications (2)

Publication Number Publication Date
WO2000019222A2 WO2000019222A2 (en) 2000-04-06
WO2000019222A3 true WO2000019222A3 (en) 2000-06-08

Family

ID=7882943

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/003117 WO2000019222A2 (en) 1998-09-30 1999-09-28 Semiconductor switching circuit with an integrated self-testing circuit

Country Status (3)

Country Link
DE (1) DE19845064A1 (en)
TW (1) TW432572B (en)
WO (1) WO2000019222A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10345470A1 (en) * 2003-09-30 2004-12-30 Infineon Technologies Ag Semiconductor chip wafer contact structure has cup shaped test contact surfaces and active connection multiplexer circuit in sawing grid areas

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60246668A (en) * 1984-05-22 1985-12-06 Mitsubishi Electric Corp Semiconductor integrated circuit
JPH04365347A (en) * 1991-06-13 1992-12-17 Mitsubishi Electric Corp Element structure for monitor apparatus in semiconductor chip
JPH09321104A (en) * 1996-05-30 1997-12-12 Nec Yamagata Ltd Semiconductor integrated circuit
US5751065A (en) * 1993-08-05 1998-05-12 Lucent Technologies Inc. Integrated circuit with active devices under bond pads
US5965903A (en) * 1995-10-30 1999-10-12 Lucent Technologies Inc. Device and method of manufacture for an integrated circuit having a BIST circuit and bond pads incorporated therein

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794683A (en) * 1993-09-27 1995-04-07 Nec Corp Semiconductor integrated circuit device having self-diagnostic function

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60246668A (en) * 1984-05-22 1985-12-06 Mitsubishi Electric Corp Semiconductor integrated circuit
JPH04365347A (en) * 1991-06-13 1992-12-17 Mitsubishi Electric Corp Element structure for monitor apparatus in semiconductor chip
US5751065A (en) * 1993-08-05 1998-05-12 Lucent Technologies Inc. Integrated circuit with active devices under bond pads
US5965903A (en) * 1995-10-30 1999-10-12 Lucent Technologies Inc. Device and method of manufacture for an integrated circuit having a BIST circuit and bond pads incorporated therein
JPH09321104A (en) * 1996-05-30 1997-12-12 Nec Yamagata Ltd Semiconductor integrated circuit
US5923048A (en) * 1996-05-30 1999-07-13 Nec Corporation Semiconductor integrated circuit device with test element

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 108 (E - 398) 23 April 1986 (1986-04-23) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 241 (E - 1364) 14 May 1993 (1993-05-14) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 04 31 March 1998 (1998-03-31) *

Also Published As

Publication number Publication date
TW432572B (en) 2001-05-01
DE19845064A1 (en) 2000-04-13
WO2000019222A2 (en) 2000-04-06

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