WO2000051012A3 - Integrated circuit interconnect system - Google Patents

Integrated circuit interconnect system Download PDF

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Publication number
WO2000051012A3
WO2000051012A3 PCT/US2000/004715 US0004715W WO0051012A3 WO 2000051012 A3 WO2000051012 A3 WO 2000051012A3 US 0004715 W US0004715 W US 0004715W WO 0051012 A3 WO0051012 A3 WO 0051012A3
Authority
WO
WIPO (PCT)
Prior art keywords
interconnect system
terminal
esd
frequency response
devices
Prior art date
Application number
PCT/US2000/004715
Other languages
French (fr)
Other versions
WO2000051012A2 (en
WO2000051012A8 (en
Inventor
Charles A Miller
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/258,185 external-priority patent/US6448865B1/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Priority to AU33758/00A priority Critical patent/AU3375800A/en
Priority to JP2000601543A priority patent/JP2003526901A/en
Priority to EP00911945A priority patent/EP1200990A2/en
Publication of WO2000051012A2 publication Critical patent/WO2000051012A2/en
Publication of WO2000051012A3 publication Critical patent/WO2000051012A3/en
Publication of WO2000051012A8 publication Critical patent/WO2000051012A8/en

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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
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Abstract

In an interconnect system for providing access to a common I/O terminal for multiple circuit devices such as drivers (40), receivers (44) and electrostatic discharge (48, 50) (ESD) protection devices implemented on an IC (42, 46), each such device is provided with a separate contact pad (52, 54) within the IC (42, 46). The contact pads (52A, 52B or 54A, 54B) are linked to one another and to the IC I/O terminal though inductive conductors such as bond wires (58, 62), metalization layer traces (64) in the IC (42, 46), or legs (56, 60) of a forked, lithographically-defined spring contact formed on the IC (42, 46). The conductor inductance isolates the capacitane of the circuit devices from one another, thereby improving characteristics of the frequency response of the interconnect system. Also the ESD protection function is distributed among multiple ESD devices interconnected by series inductors to provide a multiple-pole filter at each IC terminal. The inductances of the conductors and various capacitances of the interconnect system are also appropriately adjusted to optimize desired interconnect system frequency response characteristics.
PCT/US2000/004715 1999-02-25 2000-02-23 Integrated circuit interconnect system WO2000051012A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU33758/00A AU3375800A (en) 1999-02-25 2000-02-23 Integrated circuit interconnect system
JP2000601543A JP2003526901A (en) 1999-02-25 2000-02-23 Integrated circuit interconnect system
EP00911945A EP1200990A2 (en) 1999-02-25 2000-02-23 Integrated circuit interconnect system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/258,185 1999-02-25
US09/258,185 US6448865B1 (en) 1999-02-25 1999-02-25 Integrated circuit interconnect system
US09/510,657 2000-02-22
US09/510,657 US6459343B1 (en) 1999-02-25 2000-02-22 Integrated circuit interconnect system forming a multi-pole filter

Publications (3)

Publication Number Publication Date
WO2000051012A2 WO2000051012A2 (en) 2000-08-31
WO2000051012A3 true WO2000051012A3 (en) 2001-02-01
WO2000051012A8 WO2000051012A8 (en) 2001-12-06

Family

ID=26946481

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/004715 WO2000051012A2 (en) 1999-02-25 2000-02-23 Integrated circuit interconnect system

Country Status (5)

Country Link
US (2) US6459343B1 (en)
EP (1) EP1200990A2 (en)
JP (2) JP2003526901A (en)
KR (1) KR100640130B1 (en)
WO (1) WO2000051012A2 (en)

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US20030006856A1 (en) 2003-01-09
US6646520B2 (en) 2003-11-11
KR20020013504A (en) 2002-02-20
US6459343B1 (en) 2002-10-01
WO2000051012A2 (en) 2000-08-31
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KR100640130B1 (en) 2006-10-31
JP2003526901A (en) 2003-09-09

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