WO2000051012A8 - Integrated circuit interconnect system - Google Patents
Integrated circuit interconnect systemInfo
- Publication number
- WO2000051012A8 WO2000051012A8 PCT/US2000/004715 US0004715W WO0051012A8 WO 2000051012 A8 WO2000051012 A8 WO 2000051012A8 US 0004715 W US0004715 W US 0004715W WO 0051012 A8 WO0051012 A8 WO 0051012A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- interconnect system
- terminal
- esd
- frequency response
- devices
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
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- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
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- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Filters And Equalizers (AREA)
- Wire Bonding (AREA)
- Waveguide Connection Structure (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU33758/00A AU3375800A (en) | 1999-02-25 | 2000-02-23 | Integrated circuit interconnect system |
JP2000601543A JP2003526901A (en) | 1999-02-25 | 2000-02-23 | Integrated circuit interconnect system |
EP00911945A EP1200990A2 (en) | 1999-02-25 | 2000-02-23 | Integrated circuit interconnect system |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/258,185 US6448865B1 (en) | 1999-02-25 | 1999-02-25 | Integrated circuit interconnect system |
US09/258,185 | 1999-02-25 | ||
US09/510,657 | 2000-02-21 | ||
US09/510,657 US6459343B1 (en) | 1999-02-25 | 2000-02-22 | Integrated circuit interconnect system forming a multi-pole filter |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2000051012A2 WO2000051012A2 (en) | 2000-08-31 |
WO2000051012A3 WO2000051012A3 (en) | 2001-02-01 |
WO2000051012A8 true WO2000051012A8 (en) | 2001-12-06 |
Family
ID=26946481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/004715 WO2000051012A2 (en) | 1999-02-25 | 2000-02-23 | Integrated circuit interconnect system |
Country Status (5)
Country | Link |
---|---|
US (2) | US6459343B1 (en) |
EP (1) | EP1200990A2 (en) |
JP (2) | JP2003526901A (en) |
KR (1) | KR100640130B1 (en) |
WO (1) | WO2000051012A2 (en) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6459343B1 (en) * | 1999-02-25 | 2002-10-01 | Formfactor, Inc. | Integrated circuit interconnect system forming a multi-pole filter |
US6538538B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | High frequency printed circuit board via |
US6597227B1 (en) * | 2000-01-21 | 2003-07-22 | Atheros Communications, Inc. | System for providing electrostatic discharge protection for high-speed integrated circuits |
AU2001243200A1 (en) * | 2000-02-22 | 2001-09-03 | Don Mccord | Method and system for wafer and device-level testing of an integrated circuit |
WO2002025296A2 (en) * | 2000-09-22 | 2002-03-28 | Don Mccord | Method and system for wafer and device-level testing of an integrated circuit |
DE20114544U1 (en) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
WO2002058155A1 (en) * | 2001-01-19 | 2002-07-25 | Koninklijke Philips Electronics N.V. | Semiconductor chip with internal esd matching |
KR100902296B1 (en) * | 2001-08-10 | 2009-06-10 | 히타치 긴조쿠 가부시키가이샤 | Multi-band antenna switch circuit, and layered module composite part and communcation device using them |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US7289302B1 (en) * | 2001-10-04 | 2007-10-30 | Maxtor Corporation | On slider inductors and capacitors to reduce electrostatic discharge damage |
US6624999B1 (en) * | 2001-11-20 | 2003-09-23 | Intel Corporation | Electrostatic discharge protection using inductors |
US6816031B1 (en) | 2001-12-04 | 2004-11-09 | Formfactor, Inc. | Adjustable delay transmission line |
US20030120777A1 (en) * | 2001-12-26 | 2003-06-26 | First Data Corporation | Forms auditing systems and methods |
DE10214068B4 (en) * | 2002-03-28 | 2009-02-19 | Advanced Micro Devices, Inc., Sunnyvale | ESD protection circuit for radio frequency output connections in an integrated circuit |
KR100894803B1 (en) | 2002-06-11 | 2009-04-30 | 세미컨덕터 콤포넨츠 인더스트리즈 엘엘씨 | Semiconductor filter circuit and method |
US20030235019A1 (en) * | 2002-06-19 | 2003-12-25 | Ming-Dou Ker | Electrostatic discharge protection scheme for flip-chip packaged integrated circuits |
DE10231638B4 (en) * | 2002-07-12 | 2011-07-28 | Infineon Technologies AG, 81669 | Integrated circuit arrangement |
TW573350B (en) * | 2002-10-25 | 2004-01-21 | Via Tech Inc | Integrated circuit with electrostatic discharge protection |
JP4744786B2 (en) * | 2003-04-23 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | High frequency power amplification module |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
US7388424B2 (en) | 2004-04-07 | 2008-06-17 | Formfactor, Inc. | Apparatus for providing a high frequency loop back with a DC path for a parametric test |
US7466113B2 (en) * | 2004-07-07 | 2008-12-16 | 02Micro International Limited | Break-before-make sensing for drivers |
US7327035B2 (en) * | 2004-09-08 | 2008-02-05 | Texas Instruments Incorporated | System and method for providing a low frequency filter pole |
JP2008512680A (en) | 2004-09-13 | 2008-04-24 | カスケード マイクロテック インコーポレイテッド | Double-sided probing structure |
US7737553B2 (en) | 2004-10-06 | 2010-06-15 | Panasonic Corporation | Semiconductor device |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
JP4506722B2 (en) * | 2006-05-19 | 2010-07-21 | ソニー株式会社 | Semiconductor element coupling device, semiconductor element, high-frequency module, and semiconductor element coupling method |
JP4702178B2 (en) * | 2006-05-19 | 2011-06-15 | ソニー株式会社 | Semiconductor coupling device, semiconductor element, and high-frequency module |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
ES2334399T3 (en) | 2007-11-26 | 2010-03-09 | Siae Microelettronica S.P.A. | MICROWAVE MODULE. |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8107254B2 (en) * | 2008-11-20 | 2012-01-31 | International Business Machines Corporation | Integrating capacitors into vias of printed circuit boards |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
WO2010087184A1 (en) * | 2009-01-29 | 2010-08-05 | パナソニック株式会社 | Differential transmission circuit and electronic device provided with the same |
JP5578797B2 (en) | 2009-03-13 | 2014-08-27 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
US8242384B2 (en) | 2009-09-30 | 2012-08-14 | International Business Machines Corporation | Through hole-vias in multi-layer printed circuit boards |
US8432027B2 (en) * | 2009-11-11 | 2013-04-30 | International Business Machines Corporation | Integrated circuit die stacks with rotationally symmetric vias |
US8310841B2 (en) * | 2009-11-12 | 2012-11-13 | International Business Machines Corporation | Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same |
US8315068B2 (en) | 2009-11-12 | 2012-11-20 | International Business Machines Corporation | Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same |
US8258619B2 (en) | 2009-11-12 | 2012-09-04 | International Business Machines Corporation | Integrated circuit die stacks with translationally compatible vias |
US9646947B2 (en) * | 2009-12-22 | 2017-05-09 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Integrated circuit with inductive bond wires |
JP2013183072A (en) * | 2012-03-02 | 2013-09-12 | Toshiba Corp | Semiconductor device |
CN103531580B (en) * | 2012-07-06 | 2016-08-03 | 联咏科技股份有限公司 | Chip-packaging structure |
JP5752657B2 (en) * | 2012-09-10 | 2015-07-22 | 株式会社東芝 | Semiconductor device |
JP6211772B2 (en) * | 2013-02-14 | 2017-10-11 | ローム株式会社 | LSI ESD protection circuit and semiconductor device |
CN104253134B (en) * | 2013-06-28 | 2017-11-10 | 上海天马微电子有限公司 | A kind of pixel cell electrostatic protection structure and imaging sensor |
JP2015012571A (en) * | 2013-07-02 | 2015-01-19 | ラピスセミコンダクタ株式会社 | Oscillator and phase-locked loop |
WO2015076008A1 (en) * | 2013-11-20 | 2015-05-28 | 株式会社村田製作所 | Impedance conversion circuit and communication terminal apparatus |
US9595217B2 (en) | 2013-12-05 | 2017-03-14 | Samsung Display Co., Ltd. | Trace structure for improved electrical signaling |
US10153238B2 (en) | 2014-08-20 | 2018-12-11 | Samsung Display Co., Ltd. | Electrical channel including pattern voids |
US9461810B2 (en) | 2014-09-18 | 2016-10-04 | Samsung Display Co., Ltd. | Multi-drop channels including reflection enhancement |
JP6579111B2 (en) | 2014-10-24 | 2019-09-25 | 株式会社ソシオネクスト | Semiconductor integrated circuit device |
WO2016063458A1 (en) | 2014-10-24 | 2016-04-28 | 株式会社ソシオネクスト | Semiconductor integrated circuit device |
US9935063B2 (en) * | 2016-07-01 | 2018-04-03 | Intel Corporation | Rlink-on-die inductor structures to improve signaling |
DE102017103803A1 (en) * | 2017-02-23 | 2018-08-23 | Infineon Technologies Ag | An integrated circuit device and a device for protecting a circuit |
TW201843945A (en) | 2017-03-03 | 2018-12-16 | 日商索尼半導體解決方案公司 | Transmission device and communication system |
US10128229B1 (en) | 2017-11-13 | 2018-11-13 | Micron Technology, Inc. | Semiconductor devices with package-level configurability |
US10867991B2 (en) * | 2018-12-27 | 2020-12-15 | Micron Technology, Inc. | Semiconductor devices with package-level configurability |
US10971458B2 (en) * | 2019-01-07 | 2021-04-06 | Credo Technology Group Limited | Compensation network for high speed integrated circuits |
KR102213561B1 (en) * | 2019-05-09 | 2021-02-08 | 베렉스주식회사 | Semiconductor device |
JP7426702B2 (en) | 2020-02-13 | 2024-02-02 | ザインエレクトロニクス株式会社 | semiconductor equipment |
CN114093334B (en) * | 2021-11-30 | 2022-09-06 | 长沙惠科光电有限公司 | Display module, display device and electrostatic isolation method |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4354268A (en) | 1980-04-03 | 1982-10-12 | Santek, Inc. | Intelligent test head for automatic test system |
US4342013A (en) | 1980-08-25 | 1982-07-27 | Pilgrim Electric Co. | Bidirectional power line filter |
JPS5873881A (en) | 1981-10-29 | 1983-05-04 | Advantest Corp | Ic tester |
US4472725A (en) | 1982-02-01 | 1984-09-18 | Century Iii Electronics Inc. | LC Delay line for feedforward amplifier |
US4616178A (en) | 1982-05-27 | 1986-10-07 | Harris Corporation | Pulsed linear integrated circuit tester |
US4837622A (en) | 1985-05-10 | 1989-06-06 | Micro-Probe, Inc. | High density probe card |
JPH02198158A (en) * | 1989-01-27 | 1990-08-06 | Hitachi Ltd | Semiconductor device |
US5012213A (en) | 1989-12-19 | 1991-04-30 | Motorola, Inc. | Providing a PGA package with a low reflection line |
US5090118A (en) | 1990-07-31 | 1992-02-25 | Texas Instruments Incorporated | High performance test head and method of making |
JPH04107940A (en) * | 1990-08-29 | 1992-04-09 | Hitachi Ltd | Semiconductor device and its component parts |
US5172051A (en) | 1991-04-24 | 1992-12-15 | Hewlett-Packard Company | Wide bandwidth passive probe |
JPH0555287A (en) * | 1991-08-26 | 1993-03-05 | Seiko Epson Corp | Semiconductor integrated circuit device |
GB2263980B (en) | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
US5182220A (en) | 1992-04-02 | 1993-01-26 | United Microelectronics Corporation | CMOS on-chip ESD protection circuit and semiconductor structure |
US5270673A (en) | 1992-07-24 | 1993-12-14 | Hewlett-Packard Company | Surface mount microcircuit hybrid |
US5424693A (en) | 1993-01-13 | 1995-06-13 | Industrial Technology Research Institute | Surface mountable microwave IC package |
US5309019A (en) | 1993-02-26 | 1994-05-03 | Motorola, Inc. | Low inductance lead frame for a semiconductor package |
US5536906A (en) | 1993-07-23 | 1996-07-16 | Texas Instruments Incorporated | Package for integrated circuits |
US5521406A (en) | 1994-08-31 | 1996-05-28 | Texas Instruments Incorporated | Integrated circuit with improved thermal impedance |
EP1408337A3 (en) | 1994-11-15 | 2007-09-19 | FormFactor, Inc. | Probe card assembly |
US5546405A (en) | 1995-07-17 | 1996-08-13 | Advanced Micro Devices, Inc. | Debug apparatus for an automated semiconductor testing system |
US5642054A (en) | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
JPH09121127A (en) * | 1995-10-26 | 1997-05-06 | Murata Mfg Co Ltd | High frequency amplifier and integrated circuit device |
US5744869A (en) | 1995-12-05 | 1998-04-28 | Motorola, Inc. | Apparatus for mounting a flip-chip semiconductor device |
US5917220A (en) | 1996-12-31 | 1999-06-29 | Stmicroelectronics, Inc. | Integrated circuit with improved overvoltage protection |
US5901022A (en) | 1997-02-24 | 1999-05-04 | Industrial Technology Research Inst. | Charged device mode ESD protection circuit |
EP0976190A1 (en) * | 1997-04-16 | 2000-02-02 | The Board Of Trustees Of The Leland Stanford Junior University | Distributed esd protection device for high speed integrated circuits |
US5869898A (en) | 1997-04-25 | 1999-02-09 | Nec Corporation | Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof |
WO1998052224A1 (en) | 1997-05-15 | 1998-11-19 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
US6008533A (en) | 1997-12-08 | 1999-12-28 | Micron Technology, Inc. | Controlling impedances of an integrated circuit |
US6459343B1 (en) * | 1999-02-25 | 2002-10-01 | Formfactor, Inc. | Integrated circuit interconnect system forming a multi-pole filter |
-
2000
- 2000-02-22 US US09/510,657 patent/US6459343B1/en not_active Expired - Fee Related
- 2000-02-23 WO PCT/US2000/004715 patent/WO2000051012A2/en active IP Right Grant
- 2000-02-23 EP EP00911945A patent/EP1200990A2/en not_active Withdrawn
- 2000-02-23 KR KR1020017010806A patent/KR100640130B1/en not_active IP Right Cessation
- 2000-02-23 JP JP2000601543A patent/JP2003526901A/en active Pending
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2002
- 2002-08-02 US US10/211,003 patent/US6646520B2/en not_active Expired - Fee Related
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2007
- 2007-02-22 JP JP2007043028A patent/JP2007189241A/en not_active Ceased
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KR100640130B1 (en) | 2006-10-31 |
US6459343B1 (en) | 2002-10-01 |
WO2000051012A3 (en) | 2001-02-01 |
JP2007189241A (en) | 2007-07-26 |
JP2003526901A (en) | 2003-09-09 |
US6646520B2 (en) | 2003-11-11 |
KR20020013504A (en) | 2002-02-20 |
WO2000051012A2 (en) | 2000-08-31 |
EP1200990A2 (en) | 2002-05-02 |
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