WO2000075402A1 - Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell - Google Patents
Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell Download PDFInfo
- Publication number
- WO2000075402A1 WO2000075402A1 PCT/US2000/014976 US0014976W WO0075402A1 WO 2000075402 A1 WO2000075402 A1 WO 2000075402A1 US 0014976 W US0014976 W US 0014976W WO 0075402 A1 WO0075402 A1 WO 0075402A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- anode
- membrane
- cell
- hydrophobic
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
Definitions
- a plating tool uses a negatively charged anode (usually a copper anode) to plate a positively charged (cathode) silicon wafer.
- the anode provides a source of replenishing metal ions.
- the metal ions are reduced to metal and deposited on the 0 cathode surface.
- Sulfuric acid and a plating solution flows through a chamber around the anode and is used to dissolve a metal (copper) plate. As fluid flows past the anode, it becomes enriched with metal ions .
- the present invention provides a plating anode cup filter 0 design that vents unwanted gases from the plating solution before they exit the cell and reach the wafer. More specifically, in a first embodiment of the present invention, in the chamber where the fluid flows into the plating tool cell and contacts the anode, it encounters a hydrophobic membrane 5 and a hydrophilic membrane spaced from the hydrophobic membrane. A driving force such as a vacuum applied in the space between the membranes removes unwanted gases therein. In a second embodiment of the present invention, a single membrane is used that is both hydrophobic and hydrophilic. Preferably the hydrophobic portion of the membrane is located at or near the perimeter of the fluid chamber in the plating tool cell, and gas to be vented is directed toward the hydrophobic portion (s).
- Figure 1 is a cross-sectional view of the anode holder in accordance with the present invention.
- Figure 2 is a cross-sectional view of the anode holder in accordance with another embodiment of the present invention.
- Figure 3 is a top view of a membrane having hydrophilic and a hydrophobic portions in accordance with one embodiment of the present invention
- Figure 4 is a cross-sectional view of an anode holder using the membrane of Figure 3 ;
- Figure 5 is a cross-sectional view of still another embodiment of the present invention.
- a plating tool cell 10 is the housing for the anode 50, which is preferably a copper anode, and includes one or more fluid inlets 12.
- the plating tool cell 10 serves as an anode holder and as a means for fluid distribution to the substrate being plated, such as a wafer (not shown) which is typically rotating for uniform plating.
- the plating tool cell 10 is made of plastic, and includes an optional fluid inlet 12 and a fluid outlet 13.
- a fluid plating solution or ion source such as copper sulfate, is introduced into a chamber defined by the plating tool cell 10 through optional fluid inlet 12, and contacts the anode 50.
- the resulting reaction between the plating solution and the metal anode generates hydrogen gas.
- situated in the fluid path is a hydrophobic membrane 14.
- the hydrophobicity of the membrane 14 inhibits or prevents passage of the fluid.
- the porosity of the hydrophobic membrane 14 is such that gases, generally air and hydrogen, entrapped in the fluid are able to pass through the hydrophobic membrane 14 easily.
- a second membrane 15 is positioned downstream of the first membrane (in the direction away from the anode 50) .
- the second membrane 15 is spaced from the first membrane 14, and is hydrophilic. Once the hydrophilic membrane 15 is wetted, it does not allow the passage of gases through it. Accordingly, most or all of the gases remain in the gap 16 between the two membranes.
- the gap 16 can be filled with a open mesh type separation material, and may be 1/16 to 1/4 inch wide, on average.
- a driving force such as a vacuum source in communication with the gap 16 with suitable plumbing draws off the gases, thereby preventing them from contacting the wafer and causing defects.
- high velocity air can be used to create a vacuum by the venturi effect to draw off the gases.
- Figure 2 shows another embodiment where the gases are vented in gap 16 by creating a high spot 23 in the gap 16 mechanically.
- the high spot 23 is a portion of the gap 16 that is wider, from membrane 14 to membrane 15, than the total average width of the gap 16.
- the air tends to collect in the high spot 23 and vent naturally, or can be assisted with a vacuum or high velocity air pressure.
- the high spot 23 also can be created by bowing the membrane with external fluid pressure, leaving high spots during processing.
- FIG 3 illustrates another embodiment of the present invention.
- the membrane 14' is patterned such that only a portion 28 thereof is hydrophobic.
- Conventional techniques to render portions of the membrane hydrophobic well known to those skilled in the art can be used.
- the hydrophobic portion (s) are located at or near the perimeter of the cell 10, and the fluid flow is directed towards the perimeter, as shown in Figure 4.
- FIG 5 illustrates another embodiment of the present invention, where a high spot 23 is created and a small hydrophobic membrane patch 15' is used in a vertical orientation.
- the hydrophobic membrane 15 is optional, and a bowed hydrophilic membrane 14 is positioned to create a high spot 23 as in the embodiment of Figure 2.
- the air trapped in gap 16 vents naturally through hydrophobic patch 15' without the use of an external driving force such as a vacuum.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU53088/00A AU5308800A (en) | 1999-06-04 | 2000-05-31 | Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell |
US10/009,744 US6846392B1 (en) | 1999-06-04 | 2000-05-31 | Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13755899P | 1999-06-04 | 1999-06-04 | |
US60/137,558 | 1999-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000075402A1 true WO2000075402A1 (en) | 2000-12-14 |
Family
ID=22477980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/014976 WO2000075402A1 (en) | 1999-06-04 | 2000-05-31 | Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU5308800A (en) |
WO (1) | WO2000075402A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004097929A2 (en) * | 2003-04-29 | 2004-11-11 | Asm Nutool, Inc. | Method and apparatus for reduction of defects in wet processed layers |
DE10340012A1 (en) * | 2003-08-30 | 2005-04-07 | Roche Diagnostics Gmbh | Device for gas or liquid separation from microfluidic flow systems |
US7138014B2 (en) * | 2002-01-28 | 2006-11-21 | Applied Materials, Inc. | Electroless deposition apparatus |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4075069A (en) * | 1975-04-10 | 1978-02-21 | Mitsui Mining & Smelting Co., Ltd. | Processes for preventing the generation of a mist of electrolyte and for recovering generated gases in electrowinning metal recovery, and electrodes for use in said processes |
US4201653A (en) * | 1977-10-11 | 1980-05-06 | Inco Limited | Electrowinning cell with bagged anode |
US4522695A (en) * | 1982-12-23 | 1985-06-11 | Neefe Charles W | Vapor phase hydrogen generator |
US5112465A (en) * | 1990-12-04 | 1992-05-12 | George Danielson | Electrodeposition apparatus |
-
2000
- 2000-05-31 WO PCT/US2000/014976 patent/WO2000075402A1/en active Application Filing
- 2000-05-31 AU AU53088/00A patent/AU5308800A/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4075069A (en) * | 1975-04-10 | 1978-02-21 | Mitsui Mining & Smelting Co., Ltd. | Processes for preventing the generation of a mist of electrolyte and for recovering generated gases in electrowinning metal recovery, and electrodes for use in said processes |
US4201653A (en) * | 1977-10-11 | 1980-05-06 | Inco Limited | Electrowinning cell with bagged anode |
US4522695A (en) * | 1982-12-23 | 1985-06-11 | Neefe Charles W | Vapor phase hydrogen generator |
US5112465A (en) * | 1990-12-04 | 1992-05-12 | George Danielson | Electrodeposition apparatus |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7138014B2 (en) * | 2002-01-28 | 2006-11-21 | Applied Materials, Inc. | Electroless deposition apparatus |
US7189146B2 (en) | 2003-03-27 | 2007-03-13 | Asm Nutool, Inc. | Method for reduction of defects in wet processed layers |
US7503830B2 (en) | 2003-03-27 | 2009-03-17 | Novellus Systems, Inc. | Apparatus for reduction of defects in wet processed layers |
WO2004097929A2 (en) * | 2003-04-29 | 2004-11-11 | Asm Nutool, Inc. | Method and apparatus for reduction of defects in wet processed layers |
WO2004097929A3 (en) * | 2003-04-29 | 2004-12-29 | Asm Nutool Inc | Method and apparatus for reduction of defects in wet processed layers |
DE10340012A1 (en) * | 2003-08-30 | 2005-04-07 | Roche Diagnostics Gmbh | Device for gas or liquid separation from microfluidic flow systems |
Also Published As
Publication number | Publication date |
---|---|
AU5308800A (en) | 2000-12-28 |
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