WO2001001451A3 - Microwave circuit packages having a reduced number of vias in the substrate - Google Patents

Microwave circuit packages having a reduced number of vias in the substrate Download PDF

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Publication number
WO2001001451A3
WO2001001451A3 PCT/US2000/016102 US0016102W WO0101451A3 WO 2001001451 A3 WO2001001451 A3 WO 2001001451A3 US 0016102 W US0016102 W US 0016102W WO 0101451 A3 WO0101451 A3 WO 0101451A3
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WO
WIPO (PCT)
Prior art keywords
substrate
mmic
vias
reduced number
waveguide
Prior art date
Application number
PCT/US2000/016102
Other languages
French (fr)
Other versions
WO2001001451A2 (en
Inventor
Daniel F Douriet
Jorge M Hernandez
M P Ramachandra Panicker
Original Assignee
Microsubstrates Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsubstrates Corp filed Critical Microsubstrates Corp
Publication of WO2001001451A2 publication Critical patent/WO2001001451A2/en
Publication of WO2001001451A3 publication Critical patent/WO2001001451A3/en

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A circuit package for a microwave signal comprises a substrate (56) defining a MMIC surface (62) of the substrate (56) and an opposing non-MMIC surface (64) of the substrate (56). The substrate (56) is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface (62). A MMIC (60) is disposed on the MMIC surface (62), and the MMIC (60) is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board (52). The MMIC surface (62) faces the PC board (52) when the I/O port is electrically connected to the PC board (52).
PCT/US2000/016102 1999-06-16 2000-06-13 Microwave circuit packages having a reduced number of vias in the substrate WO2001001451A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/334,195 1999-06-16
US09/334,195 US6426686B1 (en) 1999-06-16 1999-06-16 Microwave circuit packages having a reduced number of vias in the substrate

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WO2001001451A2 WO2001001451A2 (en) 2001-01-04
WO2001001451A3 true WO2001001451A3 (en) 2008-02-28

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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6759743B2 (en) * 2000-09-11 2004-07-06 Xytrans, Inc. Thick film millimeter wave transceiver module
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US8143108B2 (en) 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US6812805B2 (en) * 2001-08-16 2004-11-02 Multiplex, Inc. Differential transmission line for high bandwidth signals
US6737931B2 (en) * 2002-07-19 2004-05-18 Agilent Technologies, Inc. Device interconnects and methods of making the same
TWI236763B (en) * 2003-05-27 2005-07-21 Megic Corp High performance system-on-chip inductor using post passivation process
WO2005048314A2 (en) * 2003-11-12 2005-05-26 Silicon Pipe, Inc. Tapered dielectric and conductor structures and applications thereof
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US20080100394A1 (en) * 2004-06-30 2008-05-01 Emag Technologies, Inc. Microstrip to Coplanar Waveguide Transition
US7361994B2 (en) * 2005-09-30 2008-04-22 Intel Corporation System to control signal line capacitance
WO2008089418A1 (en) * 2007-01-18 2008-07-24 Miteq, Inc. Microwave surface mount hermetically sealed package and method of forming the same
US8028406B2 (en) * 2008-04-03 2011-10-04 International Business Machines Corporation Methods of fabricating coplanar waveguide structures
AU2011218651B2 (en) * 2010-08-31 2014-10-09 Viasat, Inc. Leadframe package with integrated partial waveguide interface
US9502382B2 (en) * 2011-09-26 2016-11-22 Regents Of The University Of Minnesota Coplaner waveguide transition
US8731345B2 (en) * 2011-12-15 2014-05-20 Kotura, Inc. System for managing thermal conduction on optical devices
US9839118B2 (en) * 2013-11-01 2017-12-05 Telefonaktiebolaget Lm Ericsson (Publ) Method and arrangement for board-to-board interconnection
GB2554847A (en) 2016-06-06 2018-04-18 Oclaro Tech Ltd Optimised RF Input section
US11527696B2 (en) * 2017-10-05 2022-12-13 Google Llc Low footprint resonator in flip chip geometry

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5087896A (en) * 1991-01-16 1992-02-11 Hughes Aircraft Company Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor
US5545924A (en) * 1993-08-05 1996-08-13 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits
US5877560A (en) * 1997-02-21 1999-03-02 Raytheon Company Flip chip microwave module and fabrication method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575313A (en) * 1991-09-11 1993-03-26 Oki Electric Ind Co Ltd Hybrid integrated circuit device
US5307237A (en) * 1992-08-31 1994-04-26 Hewlett-Packard Company Integrated circuit packaging with improved heat transfer and reduced signal degradation
US5424693A (en) * 1993-01-13 1995-06-13 Industrial Technology Research Institute Surface mountable microwave IC package
KR19990028818A (en) * 1995-07-14 1999-04-15 와인스타인 폴 Metal ball grid electronic package
US6163458A (en) * 1999-12-03 2000-12-19 Caesar Technology, Inc. Heat spreader for ball grid array package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5087896A (en) * 1991-01-16 1992-02-11 Hughes Aircraft Company Flip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductor
US5545924A (en) * 1993-08-05 1996-08-13 Honeywell Inc. Three dimensional package for monolithic microwave/millimeterwave integrated circuits
US5877560A (en) * 1997-02-21 1999-03-02 Raytheon Company Flip chip microwave module and fabrication method

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WO2001001451A2 (en) 2001-01-04
US6426686B1 (en) 2002-07-30

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