WO2001009952A3 - Interconnect assemblies and methods - Google Patents

Interconnect assemblies and methods Download PDF

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Publication number
WO2001009952A3
WO2001009952A3 PCT/US2000/020530 US0020530W WO0109952A3 WO 2001009952 A3 WO2001009952 A3 WO 2001009952A3 US 0020530 W US0020530 W US 0020530W WO 0109952 A3 WO0109952 A3 WO 0109952A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
beam portion
base portion
assembly
resilient
Prior art date
Application number
PCT/US2000/020530
Other languages
French (fr)
Other versions
WO2001009952A2 (en
Inventor
Benjamin N Eldridge
Gaetan Mathieu
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/364,788 external-priority patent/US7435108B1/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Priority to AU63856/00A priority Critical patent/AU6385600A/en
Priority to EP00950811A priority patent/EP1208595A2/en
Priority to JP2001514483A priority patent/JP2003506873A/en
Publication of WO2001009952A2 publication Critical patent/WO2001009952A2/en
Publication of WO2001009952A3 publication Critical patent/WO2001009952A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Abstract

An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion conencted to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
PCT/US2000/020530 1999-07-30 2000-07-28 Interconnect assemblies and methods WO2001009952A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU63856/00A AU6385600A (en) 1999-07-30 2000-07-28 Interconnect assemblies and methods
EP00950811A EP1208595A2 (en) 1999-07-30 2000-07-28 Interconnect assemblies and methods
JP2001514483A JP2003506873A (en) 1999-07-30 2000-07-28 Interconnect assembly and method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US36485599A 1999-07-30 1999-07-30
US09/364,855 1999-07-30
US09/364,788 1999-07-30
US09/364,788 US7435108B1 (en) 1999-07-30 1999-07-30 Variable width resilient conductive contact structures

Publications (2)

Publication Number Publication Date
WO2001009952A2 WO2001009952A2 (en) 2001-02-08
WO2001009952A3 true WO2001009952A3 (en) 2001-11-15

Family

ID=27002648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/020530 WO2001009952A2 (en) 1999-07-30 2000-07-28 Interconnect assemblies and methods

Country Status (6)

Country Link
EP (1) EP1208595A2 (en)
JP (1) JP2003506873A (en)
KR (2) KR100733525B1 (en)
AU (1) AU6385600A (en)
TW (1) TW518916B (en)
WO (1) WO2001009952A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7137830B2 (en) 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6780001B2 (en) 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
DE10143790B4 (en) * 2001-09-06 2007-08-02 Infineon Technologies Ag Electronic component with at least one semiconductor chip
US7010854B2 (en) 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
DE102008001038B4 (en) 2008-04-08 2016-08-11 Robert Bosch Gmbh Micromechanical component with a slanted structure and corresponding manufacturing method
US10281648B2 (en) * 2013-07-30 2019-05-07 President And Fellows Of Harvard College Device support structures from bulk substrates
KR102655504B1 (en) 2022-06-10 2024-04-11 영진전자산업 주식회사 The pcb chamfering device with spindle fine adjustment device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
EP0552003A1 (en) * 1992-01-14 1993-07-21 International Business Machines Corporation Integrated light deflector
JPH06260383A (en) * 1993-03-03 1994-09-16 Nikon Corp Exposure method
JPH08306708A (en) * 1995-05-09 1996-11-22 Sanyo Electric Co Ltd Semiconductor device and its fabrication
WO1996037332A1 (en) * 1995-05-26 1996-11-28 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
EP0802419A2 (en) * 1996-04-15 1997-10-22 Nec Corporation Probe card and method of forming the same
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06213929A (en) * 1993-01-19 1994-08-05 Sharp Corp Manufacture of probe head of inspecting apparatus and the probe head
JP3611637B2 (en) * 1995-07-07 2005-01-19 ヒューレット・パッカード・カンパニー Electrical connection structure of circuit members
JP3294084B2 (en) * 1995-10-31 2002-06-17 沖電気工業株式会社 Device mounting structure and mounting method
EP0839322B1 (en) * 1996-05-17 2005-08-10 Formfactor, Inc. Microelectronic contact structure and method of making same
JPH10303345A (en) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd Packaging structure to substrate of semiconductor chip

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US5152695A (en) * 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
EP0552003A1 (en) * 1992-01-14 1993-07-21 International Business Machines Corporation Integrated light deflector
JPH06260383A (en) * 1993-03-03 1994-09-16 Nikon Corp Exposure method
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
JPH08306708A (en) * 1995-05-09 1996-11-22 Sanyo Electric Co Ltd Semiconductor device and its fabrication
WO1996037332A1 (en) * 1995-05-26 1996-11-28 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
EP0802419A2 (en) * 1996-04-15 1997-10-22 Nec Corporation Probe card and method of forming the same
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 658 (E - 1643) 13 December 1994 (1994-12-13) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31) *

Also Published As

Publication number Publication date
TW518916B (en) 2003-01-21
KR100733525B1 (en) 2007-06-28
AU6385600A (en) 2001-02-19
KR20070043856A (en) 2007-04-25
KR20020022139A (en) 2002-03-25
WO2001009952A2 (en) 2001-02-08
KR100807426B1 (en) 2008-02-25
EP1208595A2 (en) 2002-05-29
JP2003506873A (en) 2003-02-18

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