WO2001020962A1 - Spray cooling system - Google Patents
Spray cooling system Download PDFInfo
- Publication number
- WO2001020962A1 WO2001020962A1 PCT/US2000/025360 US0025360W WO0120962A1 WO 2001020962 A1 WO2001020962 A1 WO 2001020962A1 US 0025360 W US0025360 W US 0025360W WO 0120962 A1 WO0120962 A1 WO 0120962A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling fluid
- cooling
- chamber
- incremental
- heat source
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/02—Details of evaporators
- F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates generally to cooling systems for heat-generating devices and, more particularly, to a spray cooling system and a method of using the spray cooling system to cool a heat source.
- processor boards can, in some instances, include multiple CPU modules, application-specific integrated circuits (ICs), and static random access memory (SRAM), as well as a dc-dc converter.
- Heat sinks can be used to increase the heat-dissipating surface area of such devices.
- heat sinks, and their interfaces to the cooled devices can provide interference in the heat flow, and can lead to uneven cooling.
- cooling methods for semiconductors include free-flowing and forced-air convection, free-flowing and forced-liquid convection, pool boiling (i.e., boiling a liquid cooling fluid off of a submerged device), and spray cooling (i.e., boiling a liquid cooling fluid off of a device being sprayed with the liquid). Because liquids typically have a high latent heat of vaporization, these latter two methods provide for a high heat-transfer efficiency, absorbing a large quantity of heat at a constant temperature. Typically, the cooling fluid used has a relatively low boiling point (the temperature to maintain) and is inert to the heat source. For semiconductor devices, FED.
- CLR.-72 i.e., Fluorinert ® , sold by 3M Corporation, is one of a number of known suitable cooling liquids.
- CHF critical heat flux
- the vaporized cooling fluid forms a vapor barrier insulating the device from the liquid cooling fluid, thus allowing the wall temperature of the device to increase greatly. This phenomenon is referred to as pooling.
- a coolant When properly sprayed, it can disperse such a vapor layer, and its CHF can be well over an order of magnitude higher than the CHF of a pool boiling system. This high CHF is reliant on having a uniform spray.
- spray cooling presently provides the most efficient cooling for a heat-generating device, such as a semiconductor device.
- Critical to consistent, controlled cooling is the controlled application of the liquid cooling fluid in a desired distribution, flow rate, and velocity. For example, at a low mass flow rate, CHF and h increase with the mass flow rate. However, at a critical mass flow rate, the advantages of increased mass flow are (liminished due to pooling and/or due to a transition to single phase heat transfer. Thus, a spray cooling system is preferably operated uniformly at a mass flow rate defined at a point before the critical mass flow rate is reached. All of these factors make critical the design of the sprayer, i.e., the design of the nozzle and its related spray devices. Also important to the cooling system design is its operating temperature.
- the system it is desirable to configure the system to operate at a high h, which will occur with a design temperature above the boiling temperature and below a temperature that will dry out the sprayed coolant.
- the amount of heat to be dissipated must be less than the CHF.
- the present invention provides a spray cooling system for cooling a heat source, embodiments of which can exhibit improved accuracy, reliability and/or cost efficiency.
- Embodiments of the invention typically feature an incremental sprayer configured to eject an incremental amount of the cooling fluid on the heat source.
- the cooling fluid is sprayed in response to a control signal, which is sent to the sprayer by a controller.
- these features provide for accurate delivery of cooling fluid at precise and controllable rates.
- the technology for this type of incremental sprayer is well developed in the ink-jet printer arts, and it is relatively inexpensive to manufacture.
- the design can be modular, offering quickly and easily replaceable units.
- the invention further features the use of thermal ink-jet technology in designing the sprayer.
- the embodiment of the invention may have a body defining a chamber configured to hold a volume of the cooling fluid, and defining an orifice in communication with the chamber.
- a heating element is in thermal communication with the chamber, and is configured to vaporize a portion of the cooling fluid held within the chamber.
- the orifice is configured to direct cooling fluid from the chamber to the heat source upon the heating element vaporizing a portion of the cooling fluid held within the chamber.
- This technology generally provides for efficient delivery of the cooling fluid to the heat source.
- Some known inert cooling fluids have viscosities and boiling points similar to that of ink-jet ink, and the ink-jet sprayers are typically adaptable to use with the cooling fluids.
- cooling fluid does not contain particulate matter that can clog the system. Thus, the system is both reliable and cost efficient to design.
- the invention further features the ejection of incremental amounts of a cooling fluid on the heat source, using an incremental sprayer, spaced over a number of time increments. Either the incremental time or the amount ejected can be varied to adjust the flow rate to an optimal level.
- the system can be controlled by monitoring, either directly or indirectly, the temperature of the heat source and the amount of pooling or dry-out that is occurring, if any. This can provide for optimized cooling of a heat source.
- FIG. 1 is a schematic representation of a cooling system embodying features of the present invention.
- FIG. 2 is a cross-sectional view of a sprayer for the cooling system represented in FIG. 1.
- FIG. 3 is a cut-away perspective view of a first embodiment of the cooling system represented in FIG. 1.
- FIG. 4 is a cross-sectional view of the embodiment depicted in FIG. 3.
- FIG. 5 is a cut-away perspective view of a second embodiment of the cooling system represented in FIG. 1.
- FIG. 6 is a cross-sectional view of a third embodiment of the cooling system represented in FIG. 1.
- FIG. 7 is a control system block diagram for controlling the operation of the embodiment depicted in FIG. 6.
- FIG. 8 is a control system block diagram for controlling the operation of the embodiment depicted in FIG. 5.
- FIG. 1 An embodiment of a cooling assembly 10 for cooling a heat-generating semiconductor device 12, according to the present invention, is schematically shown in FIG. 1.
- the assembly includes a one or more incremental sprayers 14 for spraying an incremental amount of a liquid cooling fluid 16, preferably from a reservoir 18, onto the semiconductor device to evaporatively cool the semiconductor device.
- the assembly also includes a heat exchanger 20 to extract the heat from the vaporized cooling fluid, and thereby liquify or condense it.
- the assembly further includes a pump 22 to pump the liquified cooling fluid back into the reservoir that feeds the sprayers.
- incremental sprayers 14 that can be used as part of the present invention can be based on other types of ink-jet droplet expelling technology, such as piezoelectric technology (i.e., piezoelectric nozzles), they are preferably based on thermal ink-jet technology. Examples of this technology are discussed in numerous U.S. Patents, including Nos. 5,924,198, 4,500,895, and 4,683,481, which are incorporated herein by reference. Other thermal ink-jet technologies can likewise be appropriate for use with this invention.
- a highly preferable cooling fluid for use with a thermal incremental sprayer is 3M Fluorinert ® , which is easily adaptable to existing thermal ink-jet technology because it has a viscosity and boiling point similar to that of the inks typically used in ink-jet printers.
- each sprayer includes structure defining a chamber 30 for receiving a predetermined portion of the cooling fluid and a heater 32 for vaporizing a portion of the cooling fluid, to create the pressure to eject an incremental amount of the cooling fluid through an orifice 34 that directs the ejected cooling fluid toward the semiconductor device 12 (FIG. 1).
- the orifices are formed in a flexible polymer tape 36, e.g., tape commercially available as Kapton TM tape, from 3M Corporation.
- a silicon substrate 40 containing the heaters 32, in the form of individually energizable thin-film resistors.
- Each heater is preferably located on a side of the chamber 30 across from the chamber's orifice 34.
- Cooling fluid is preferably drawn and loaded into the chamber by capillary action, as is typical for an ink-jet type device.
- a computerized controller (not shown) energizes the heater, vaporizing the portion of the cooling fluid adjacent to the heater. The vaporized cooling fluid expands, expelling most of the non-vaporized cooling fluid out of the orifice, typically in the form of a single droplet.
- the incremental amount of the fluid sprayed from the sprayer could be in the form of a single droplet, or in the form of multiple droplets.
- Multiple droplets could be produced by multiple orifices related to a single heater, or by sprayers having larger chamber volumes and appropriately shaped orifice nozzles to cause the incremental amount of fluid to break into droplets.
- the liquid spray from the incremental sprayers 14 can be highly controllable. For example, by increasing or decreasing the frequency that the sprayers are energized, the flow rate can be accurately adjusted. Furthermore, because the sprayers can be configured to deliver very small quantities of cooling fluid, and because a large number of sprayers can be fit into a small area, the heat distribution over that area can be accurately controlled by energizing some of the sprayers at a rate greater than that of other sprayers.
- the reservoir can be configured with a spring assist mechanism 42.
- the reservoir can be positioned such that the cooling fluid receives a gravity assist in flowing to the sprayers 14.
- the reservoir also serves to separate any gas leaving the condenser.
- a filter (not shown) can be used, either in the reservoir or in some other portion of the system, to remove board level contaminants that are present in the system.
- the pump 22 serves to replenish the reservoir 18, and can be a low-cost apparatus that does not provide either high pressure or consistent and controlled flow.
- the pump should be self priming to remove trapped gas.
- the precise order of the components can be varied.
- the pump 22 could be placed prior to the heat exchanger 20, so long as it can pump both vapors and fluids.
- the reservoir could be eliminated, and the pump could be used to directly feed the sprayers 14.
- the entire assembly 10, including the circuit board, is preferably a field-replaceable unit.
- multiple cooling systems within one computer can be configured to share components.
- the computer can contain a plurality of circuit boards 50 carrying heat-generating components 52 such as CPUs, each circuit board typically being mounted on a backplane 54.
- Incremental sprayers 56 are located adjacent to the components, and are configured to spray the components with a cooling fluid.
- a roll bond panel 60 serves as a first heat exchanger, condensing some or all of the vapor.
- the roll bond panel is formed as a wall of the sealed compartment.
- Suitable roll bond panels can be obtained from Showa Aluminum Corporation, of Tokyo, Japan, or from Algoods, of Toronto, Canada.
- a suitable low-boiling point working fluid e.g., 3M Fluorinert ® , is carried within fluid channels in the roll bond panel.
- working fluids such as hydrofluoroether or alcohol could be used.
- a second heat exchanger 62 which can also be a roll bond panel, is located externally from the circuit board compartments 58, and provides for the additional condensing of vaporized cooling fluid.
- the second heat exchanger receives the cooling fluid, which can be both liquid and vaporized, from the compartments of each circuit board 50.
- a commonly shared pump 64 delivers the cooling fluid to a commonly shared reservoir 66, which in turn returns the cooling fluid to the sprayers 56 of each circuit board.
- the entire cooling system can be incorporated into a single circuit board assembly 70.
- the circuit board assembly will typically include heat-generating components 72 such as CPUs, mounted on a circuit board 74.
- Incremental sprayers 76 are located adjacent to the components, and are configured to spray the components with a cooling fluid.
- the components and sprayers are enclosed in a sealed compartment 78 that prevents vaporized cooling fluid from escaping.
- One or more roll bond panels 80 preferably are incorporated into one or more compartment walls, and are configured to condense vapor and release it into a collection reservoir 82 in the bottom of the circuit board assembly.
- the pool also receives non-vaporized coolant that drips from the components.
- a pump 84 pumps the cooling fluid up into a main feed reservoir 86, preferably being above the sprayers, which provides the cooling fluid to the sprayers.
- a main feed reservoir 86 preferably being above the sprayers, which provides the cooling fluid to the sprayers.
- the reservoir could incorporate some type of pressure mechanism, such as a spring.
- the sprayers' mass flow rate should be adjusted to avoid having the semiconductor device become either dry or immersed. This rate is controlled by having a controller adjust the rate that the thermal jets are fired.
- the optimum mass flow rate can change as the heat flux of the semiconductor device changes.
- sensors can be used to track one or more of the system parameters.
- the types of parameters that are available vary with the type of system employed. For example, if the heat exchanger is external to the chamber where the spraying occurs, then the liquid and the vapor can be removed from the chamber through separate passages (with the assistance of a resistive mesh to inhibit entry of vapor into the liquid passage), and the mass flow of the vapor (rrt,) and/or mass flow of the liquid (m,) are available to be measured. However, these are not available if the heat exchanger is within the spray chamber, such as in the embodiment of FIG. 5. Instead, the vapor pressure within the spray chamber (P v ) and the semiconductor device's junction temperature can be sensed.
- P v the vapor pressure within the spray chamber
- FIG. 6 depicts a cooling system 90 having a heat exchanger 92 external to a spray chamber 94.
- the spray chamber contains incremental sprayers 96 that spray a cooling fluid onto semiconductor devices 98 on a circuit board 100.
- some of the cooling fluid may vaporize, and some may run off to form a pool 102.
- Vapor exits the spray chamber through a vapor passage 104, while liquid exits via a liquid passage 106.
- a mesh 108 is used to prevent vapor from entering the liquid passage, while gravity prevents the liquid from entering the vapor passage.
- the vapor and liquid are combined and inserted into the heat exchanger 92, which removes heat and liquefies the vapor.
- a pump 110 draws the cooled cooling fluid up into a reservoir 112, where it is again provided to the sprayers.
- a number of potentially useful system parameters can be sensed in this system, including: The temperature of the semiconductor devices (T j ) (i.e., the junction temperature), which can often be sensed from within the device; The ambient temperature (TJ and pressure (PJ, as well as the vapor pressure (P v ), in the spray chamber 94, which can be sensed using temperature and pressure sensors 114 within the spray compartment; The mass flow of the vapor (m and the mass flow of the liquid (m,), which can be sensed using appropriate sensors 116, 118 in respective vapor and liquid passages 120, 122; The temperature (T,,. of the sub-cooled liquid coming out of the heat pump 92, which can be sensed by a temperature sensor; And the temperature (T.) of the liquid being received by the sprayer.
- a method of adjusting the sprayers' mass flow rate begins with the steps of by starting the cooling system 120 and setting 122 the sprayers' initial mass flow rate at an initial value This value typically would be based on prior experience with this system, or with systems of its type, but could also be based on calculated heat generations rates and cooling rates.
- a limited amount of time (t) is preferably allowed to pass 124 so that the system can begin functioning, and then the sensing logic begins to take action, i.e., the cooling system begins sensing and monitoring parameters and adjusting the sensors' mass flow rate.
- the temperature of the semiconductor devices (T j ) is sensed 126, and the resulting sensor value is compared 128 to a selected maximum value T max . If the resulting sensor value is below the selected maximum value then no action is taken, and the monitoring of parameters is repeated. If, however, the semiconductor device has reached the selected maximum value, then sensors are used to determine if pooling is occurring.
- the mass flow of the vapor (rhj is sensed 130 and compared 132 to a selected minimum value to verify that it is above that value V ⁇ B ⁇ a .
- the selected-ininimum value typically would be based on prior experience with this system, or with systems of its type, but could also be based on calculated heat generations rates and cooling rates.
- the sprayers' mass flow rate should be increased 134 to reduce the temperature (T j ). However, if the mass flow rate of the vapor is not above the minimum value, then pooling is occurring and the sprayers' mass flow rate is decreased 136 to increase the cooling system's effectiveness. After the_ sprayers' mass flow rate is incrementally adjusted, either up or down, the monitoring is continued by again sensing the temperature of the semiconductor devices (T j ). It should be noted that the orientation of the sprayed surface (with respect to gravity) might have an effect on the accurate sensing of pooling, and that experimentation can be used to verify and/or adjust the selected minimum value accordingly.
- FIG. 8 is a flowchart depicting a method of adjusting the sprayers' mass flow rate (r ⁇ for a cooling device having an internal heat exchanger, such as the device depicted in FIG. 5. The method begins with the steps of starting the cooling system 140 and setting the sprayers' initial mass flow rate 142 at an initial value (m, ⁇ - This value typically would be based on experimentation, and/or prior experience with this system or systems of its type, but it could be based on an analysis of temperature generation rates and cooling rates.
- a limited amount of time (t) is preferably allowed to pass 144 prior to starting the actions of the sensing logic, so that the system can begin functioning, and the cooling system can begin sensing and monitoring parameters and adjusting the sensors' mass flow rate.
- the time (t) is related to the time constant of the system, i.e., the time needed for the system to reach operating temperatures.
- the temperature of the semiconductor devices (T j ) is sensed 146, and the resulting sensor value is compared 148 to a selected maximum value T ⁇ . If the resulting sensor value is below the selected maximum value then no action is taken, and the monitoring of parameters is repeated. If, however, the semiconductor device has reached the selected maximum value, then sensors are used to determine if pooling is occurring.
- the vapor pressure (P v ) in the spray chamber is sensed 150 and compared 152 to a selected minimum value (P Vjmin ) to verify that it is above the selected minimum value.
- the system is preferably configured with an internal pressure below atmospheric pressure.
- the selected mii ⁇ mum value (P v> ⁇ l ) is not easy to calculate, and is preferably determined empirically.
- the sprayers' mass flow rate should be increased 154 to reduce the temperature (T j ). However, if the vapor pressure (P v ) is not above the minimum value, then pooling is occurring and the sprayers' mass flow rate is decreased 156 to increase the cooling system's effectiveness. After the sprayers' mass flow rate is incrementally adjusted, either up or down, the monitoring is continued by again sensing the temperature of the semiconductor devices (T j ).
- any sensor reading indicative of the semiconductor's temperature can be used to judge whether the cooling is adequate.
- any sensor reading indicative of pooling such as vapor flow rate, liquid flow rate, vapor pressure, or others, can be used to judge whether the cooling would be improved by increasing or decreasing the spray flow rate.
- both temperature and pooling can be sensed prior to any comparisons.
- pooling can be sensed and compared to a reference value prior to sensing the semiconductor (or other heat-generating device) temperature.
- the present invention provides an accurate, reliable and cost efficient spray cooling system.
- the system includes a sprayer configured to deliver cooling fluid to a heat-generating device in limited increments.
- the sprayer is thermally driven in a fashion similar to that of an ink-jet print head.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001524405A JP4294899B2 (en) | 1999-09-13 | 2000-09-13 | Spray cooling system |
EP00966729A EP1212929A1 (en) | 1999-09-13 | 2000-09-13 | Spray cooling system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/395,092 | 1999-09-13 | ||
US09/395,092 US6205799B1 (en) | 1999-09-13 | 1999-09-13 | Spray cooling system |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001020962A1 true WO2001020962A1 (en) | 2001-03-22 |
Family
ID=23561655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/025360 WO2001020962A1 (en) | 1999-09-13 | 2000-09-13 | Spray cooling system |
Country Status (5)
Country | Link |
---|---|
US (3) | US6205799B1 (en) |
EP (2) | EP1212929A1 (en) |
JP (1) | JP4294899B2 (en) |
KR (1) | KR100770487B1 (en) |
WO (1) | WO2001020962A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002093994A2 (en) * | 2001-05-16 | 2002-11-21 | Cray Inc. | Method and apparatus for cooling electronic components |
US6580609B2 (en) | 2001-05-16 | 2003-06-17 | Cray Inc. | Method and apparatus for cooling electronic components |
SG120104A1 (en) * | 2003-06-30 | 2006-03-28 | Singapore Tech Aerospace Ltd | Spray cooling method and apparatus |
WO2010050873A1 (en) * | 2008-11-03 | 2010-05-06 | Telefonaktiebolaget L M Ericsson (Publ) | A system in a network node for regulating temperature of electronic equipment |
CN103518106A (en) * | 2011-04-20 | 2014-01-15 | 东京电力株式会社 | Condensing device |
CN105828575A (en) * | 2016-03-28 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Jet flow two-phase heat transfer cold plate and cooling system for track traffic |
Families Citing this family (133)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6205799B1 (en) * | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
US6354370B1 (en) * | 1999-12-16 | 2002-03-12 | The United States Of America As Represented By The Secretary Of The Air Force | Liquid spray phase-change cooling of laser devices |
US6459581B1 (en) * | 2000-12-19 | 2002-10-01 | Harris Corporation | Electronic device using evaporative micro-cooling and associated methods |
US7082778B2 (en) * | 2001-02-22 | 2006-08-01 | Hewlett-Packard Development Company, L.P. | Self-contained spray cooling module |
US6708515B2 (en) | 2001-02-22 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Passive spray coolant pump |
US6595014B2 (en) | 2001-02-22 | 2003-07-22 | Hewlett-Packard Development Company, L.P. | Spray cooling system with cooling regime detection |
US6550263B2 (en) | 2001-02-22 | 2003-04-22 | Hp Development Company L.L.P. | Spray cooling system for a device |
US6644058B2 (en) | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
US6484521B2 (en) | 2001-02-22 | 2002-11-26 | Hewlett-Packard Company | Spray cooling with local control of nozzles |
US6571569B1 (en) * | 2001-04-26 | 2003-06-03 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
US6993926B2 (en) | 2001-04-26 | 2006-02-07 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
US7654100B2 (en) * | 2001-04-26 | 2010-02-02 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
JP2003051689A (en) * | 2001-08-06 | 2003-02-21 | Toshiba Corp | Heating element cooling unit |
US6904968B2 (en) * | 2001-09-14 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Method and apparatus for individually cooling components of electronic systems |
US7064953B2 (en) * | 2001-12-27 | 2006-06-20 | Formfactor, Inc. | Electronic package with direct cooling of active electronic components |
US6891385B2 (en) * | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US6955062B2 (en) * | 2002-03-11 | 2005-10-18 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
US6625999B1 (en) | 2002-03-29 | 2003-09-30 | General Electric Company | Cooling system temperature control method and apparatus |
US7174774B2 (en) * | 2002-08-30 | 2007-02-13 | Kimberly-Clark Worldwide, Inc. | Method and apparatus of detecting pooling of fluid in disposable or non-disposable absorbent articles |
US6631756B1 (en) | 2002-09-10 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | High performance passive cooling device with ducting |
US6857283B2 (en) | 2002-09-13 | 2005-02-22 | Isothermal Systems Research, Inc. | Semiconductor burn-in thermal management system |
US7308801B1 (en) * | 2002-09-13 | 2007-12-18 | Isothermal Systems Research, Inc. | Method of operating a spray unit |
US6880350B2 (en) * | 2002-09-13 | 2005-04-19 | Isothermal Systems Research, Inc. | Dynamic spray system |
US7836706B2 (en) | 2002-09-27 | 2010-11-23 | Parker Intangibles Llc | Thermal management system for evaporative spray cooling |
US7159414B2 (en) * | 2002-09-27 | 2007-01-09 | Isothermal Systems Research Inc. | Hotspot coldplate spray cooling system |
US7370817B2 (en) * | 2002-10-24 | 2008-05-13 | Isothermal Systems Research Inc. | Actuated atomizer |
US20040083742A1 (en) * | 2002-10-31 | 2004-05-06 | Ruiz Orlando E. | Cooling system |
US6889515B2 (en) * | 2002-11-12 | 2005-05-10 | Isothermal Systems Research, Inc. | Spray cooling system |
TW551029B (en) * | 2002-12-31 | 2003-09-01 | Mitac Technology Corp | Controlling device and method to proceed cooling onto the object requiring heat dissipation by coolant |
US6650542B1 (en) * | 2003-01-06 | 2003-11-18 | Intel Corporation | Piezoelectric actuated jet impingement cooling |
US6925364B1 (en) | 2003-02-13 | 2005-08-02 | Hewlett-Packard Development Company, L.P. | Power market approach for device cooling |
US6976528B1 (en) | 2003-02-18 | 2005-12-20 | Isothermal Systems Research, Inc. | Spray cooling system for extreme environments |
WO2004075292A1 (en) * | 2003-02-20 | 2004-09-02 | Koninklijke Philips Electronics N.V. | Cooling assembly comprising micro-jets |
KR100542126B1 (en) * | 2003-04-29 | 2006-01-11 | 미래산업 주식회사 | Handler for testing semiconductor device |
TWM251443U (en) * | 2003-05-12 | 2004-11-21 | Hon Hai Prec Ind Co Ltd | A cycle system for dissipating heat |
US6955063B2 (en) * | 2003-06-14 | 2005-10-18 | Nanomist Systems, Llc | Cooling of electronics and high density power dissipation systems by fine-mist flooding |
US7310230B2 (en) * | 2003-08-21 | 2007-12-18 | Delta Design, Inc. | Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure |
US7150109B2 (en) * | 2003-08-25 | 2006-12-19 | Isothermal Systems Research, Inc. | Dry-wet thermal management system |
US7180741B1 (en) | 2003-08-26 | 2007-02-20 | Isothermal Systems Research, Inc. | Spray cool system with a dry access chamber |
US7043933B1 (en) | 2003-08-26 | 2006-05-16 | Isothermal Systems Research, Inc. | Spray coolant reservoir system |
US7240500B2 (en) | 2003-09-17 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Dynamic fluid sprayjet delivery system |
CN1324427C (en) * | 2003-12-05 | 2007-07-04 | 俊驰材料科技股份有限公司 | Heat sink mould set for forming spray water |
US6953082B2 (en) * | 2003-12-16 | 2005-10-11 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
US7128133B2 (en) * | 2003-12-16 | 2006-10-31 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
US7055579B2 (en) * | 2003-12-16 | 2006-06-06 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
US20050183844A1 (en) * | 2004-02-24 | 2005-08-25 | Isothermal Systems Research | Hotspot spray cooling |
WO2005089477A2 (en) * | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Direct cooling of leds |
JP4426396B2 (en) * | 2004-07-30 | 2010-03-03 | エスペック株式会社 | Cooling system |
JP4512815B2 (en) * | 2004-07-30 | 2010-07-28 | エスペック株式会社 | Burn-in equipment |
US7104078B2 (en) * | 2004-08-05 | 2006-09-12 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
US7392660B2 (en) * | 2004-08-05 | 2008-07-01 | Isothermal Systems Research, Inc. | Spray cooling system for narrow gap transverse evaporative spray cooling |
US7134289B2 (en) * | 2004-12-04 | 2006-11-14 | Hewlett-Packard Development Company, L.P. | Multi-state spray cooling system |
US7549298B2 (en) * | 2004-12-04 | 2009-06-23 | Hewlett-Packard Development Company, L.P. | Spray cooling with spray deflection |
US7469551B2 (en) * | 2005-01-18 | 2008-12-30 | Isothermal Systems Research, Inc. | Globally cooled computer system |
US7284389B2 (en) * | 2005-01-21 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Two-fluid spray cooling system |
US7349453B2 (en) * | 2005-02-02 | 2008-03-25 | Quintessence Photonics Corporation | Direct impingement cooling of a laser diode array |
DE102005005588B4 (en) * | 2005-02-07 | 2008-03-13 | Knürr AG | switch cabinet |
US8550372B2 (en) * | 2005-03-02 | 2013-10-08 | Wisconsin Alumni Research Foundation | Full coverage spray and drainage system and method for orientation-independent removal of high heat flux |
US7901191B1 (en) | 2005-04-07 | 2011-03-08 | Parker Hannifan Corporation | Enclosure with fluid inducement chamber |
US7849890B2 (en) * | 2005-07-01 | 2010-12-14 | Lockheed Martin Corporation | Apparatus for and methods of draining an enclosure |
TWI279256B (en) * | 2005-12-13 | 2007-04-21 | Ind Tech Res Inst | A compact spray cooling module |
US7717162B2 (en) * | 2005-12-22 | 2010-05-18 | Isothermal Systems Research, Inc. | Passive fluid recovery system |
TWI276396B (en) * | 2006-01-13 | 2007-03-11 | Ind Tech Res Inst | Closed-loop latent heat cooling method, and capillary force or non-nozzle module thereof |
US7495914B2 (en) * | 2006-02-06 | 2009-02-24 | Isothermal Systems Research, Inc. | Narrow gap spray cooling in a globally cooled enclosure |
US8174828B2 (en) * | 2006-02-06 | 2012-05-08 | Parker-Hannifin Corporation | Narrow gap spray cooling in a globally cooled enclosure |
US7602608B2 (en) * | 2006-02-06 | 2009-10-13 | Isothermal Systems Research, Inc. | Narrow gap spray cooling in a globally cooled enclosure |
JP4554557B2 (en) * | 2006-06-13 | 2010-09-29 | トヨタ自動車株式会社 | Cooler |
TWI304466B (en) * | 2006-10-24 | 2008-12-21 | Ind Tech Res Inst | Micro spray cooling system |
JP2008160013A (en) * | 2006-12-26 | 2008-07-10 | Toyota Central R&D Labs Inc | Semiconductor module |
WO2008117436A1 (en) * | 2007-03-27 | 2008-10-02 | Fujitsu Limited | Cooling system |
WO2008127644A1 (en) * | 2007-04-13 | 2008-10-23 | Xcelaero Corporation | Evaporative cooling system for electronic components |
JP2008304093A (en) * | 2007-06-06 | 2008-12-18 | Hitachi Ltd | Evaporative cooling system |
US7911161B2 (en) * | 2007-06-28 | 2011-03-22 | GM Global Technology Operations LLC | Automotive power inverter with reduced capacitive coupling |
WO2009113881A1 (en) * | 2008-03-10 | 2009-09-17 | Matrix Engineering Limited | Heat pump water heater |
US7944694B2 (en) | 2008-10-23 | 2011-05-17 | International Business Machines Corporation | Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
US7983040B2 (en) * | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
US7961475B2 (en) | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
US7885070B2 (en) * | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US7916483B2 (en) * | 2008-10-23 | 2011-03-29 | International Business Machines Corporation | Open flow cold plate for liquid cooled electronic packages |
US20100147492A1 (en) * | 2008-12-10 | 2010-06-17 | Ronald David Conry | IGBT cooling method |
DE102009011041A1 (en) * | 2009-02-28 | 2010-09-02 | Voith Patent Gmbh | Transmission with a transmission housing |
NL2004706A (en) * | 2009-07-22 | 2011-01-25 | Asml Netherlands Bv | RADIATION SOURCE. |
TW201128154A (en) * | 2010-02-12 | 2011-08-16 | Micro Base Technology Corp | Cooling and heat-dissipation system, and cooling device thereof |
US8974274B2 (en) | 2010-04-16 | 2015-03-10 | Google Inc. | Evaporative induction cooling |
US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
TW201204994A (en) * | 2010-07-30 | 2012-02-01 | Microbase Technology Corp | Lighting device, cooling/heat dissipating system and its cooling module |
TW201215299A (en) * | 2010-09-17 | 2012-04-01 | Hon Hai Prec Ind Co Ltd | Data center |
CN101949566B (en) * | 2010-10-09 | 2014-12-17 | 黄捷 | Air temperature regulating system |
TWI419641B (en) | 2010-10-29 | 2013-12-11 | Ind Tech Res Inst | Cooling structure of electronic device |
US8671697B2 (en) | 2010-12-07 | 2014-03-18 | Parker-Hannifin Corporation | Pumping system resistant to cavitation |
KR101559421B1 (en) * | 2011-02-21 | 2015-10-13 | (주)테크윙 | Test handler |
US9848509B2 (en) | 2011-06-27 | 2017-12-19 | Ebullient, Inc. | Heat sink module |
US9901013B2 (en) | 2011-06-27 | 2018-02-20 | Ebullient, Inc. | Method of cooling series-connected heat sink modules |
US9854715B2 (en) | 2011-06-27 | 2017-12-26 | Ebullient, Inc. | Flexible two-phase cooling system |
US9901008B2 (en) | 2014-10-27 | 2018-02-20 | Ebullient, Inc. | Redundant heat sink module |
US20120324911A1 (en) * | 2011-06-27 | 2012-12-27 | Shedd Timothy A | Dual-loop cooling system |
US9854714B2 (en) | 2011-06-27 | 2017-12-26 | Ebullient, Inc. | Method of absorbing sensible and latent heat with series-connected heat sinks |
US20120325436A1 (en) * | 2011-06-27 | 2012-12-27 | Shedd Timothy A | High efficiency thermal management system |
US9832913B2 (en) | 2011-06-27 | 2017-11-28 | Ebullient, Inc. | Method of operating a cooling apparatus to provide stable two-phase flow |
US8643173B1 (en) * | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
WO2014158196A1 (en) * | 2013-03-29 | 2014-10-02 | Hewlett-Packard Development Company, L.P. | Electronic apparatus having a cooling apparatus |
TW201442608A (en) * | 2013-04-19 | 2014-11-01 | Microthermal Technology Corp | Phase change heat dissipating device and system thereof |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US10622329B2 (en) * | 2014-10-27 | 2020-04-14 | Asm Technology Singapore Pte Ltd | Bond head cooling apparatus |
US10184699B2 (en) | 2014-10-27 | 2019-01-22 | Ebullient, Inc. | Fluid distribution unit for two-phase cooling system |
US20160120059A1 (en) | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Two-phase cooling system |
US9852963B2 (en) | 2014-10-27 | 2017-12-26 | Ebullient, Inc. | Microprocessor assembly adapted for fluid cooling |
EP3104009B1 (en) * | 2015-05-12 | 2018-09-19 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
US9992910B2 (en) | 2015-06-11 | 2018-06-05 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
US10390460B2 (en) * | 2016-01-29 | 2019-08-20 | Systemex-Energies International Inc. | Apparatus and methods for cooling of an integrated circuit |
CN105658037B (en) * | 2016-03-18 | 2018-04-20 | 苏州大景能源科技有限公司 | A kind of cold cooling cabinet of integrated liquid |
CA3021959C (en) | 2016-05-11 | 2019-05-21 | Hypertechnologie Ciara Inc | Cpu cooling system with direct spray cooling |
KR101678073B1 (en) * | 2016-06-13 | 2016-12-06 | 강성진 | Panel for electric furnace |
EP3457829B1 (en) * | 2016-06-16 | 2022-01-19 | Guangdong Hi-1 New Materials Technology Research Institute Co., Ltd. | Cooling system of working medium contact type for heat dissipation of computer and data centre |
US10139168B2 (en) * | 2016-09-26 | 2018-11-27 | International Business Machines Corporation | Cold plate with radial expanding channels for two-phase cooling |
WO2018075471A1 (en) * | 2016-10-18 | 2018-04-26 | Ecolab Usa Inc. | Device to separate water and solids of spray water in a continuous caster, and method to monitor and control corrosion background |
CN106455439B (en) * | 2016-10-31 | 2018-12-04 | 广东合一新材料研究院有限公司 | A kind of data center machine room concentration cooling system |
CN106886267B (en) * | 2017-01-20 | 2023-10-31 | 广东西江数据科技有限公司 | Low pressure oil way oil feed structure |
CN106604619B (en) * | 2017-01-20 | 2023-05-30 | 广东西江数据科技有限公司 | Gravity-based oil leaching and separating method and oil separating device thereof |
WO2018179158A1 (en) * | 2017-03-29 | 2018-10-04 | 日本電気株式会社 | Management device, management method, and program recording medium |
IL273104B2 (en) * | 2017-09-06 | 2024-04-01 | Iceotope Group Ltd | Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling |
JP7180130B2 (en) * | 2018-06-07 | 2022-11-30 | 富士通株式会社 | Immersion bath |
CN109526188B (en) * | 2018-11-27 | 2020-06-02 | 南京理工大学 | Array type spray cooling surface based on three-dimensional curved surface |
FR3105597A1 (en) * | 2019-12-20 | 2021-06-25 | Valeo Systemes Thermiques | Device for thermal regulation of an electrical or electronic component and method of operation of such a device |
CN111735260A (en) * | 2020-06-30 | 2020-10-02 | 中国神华能源股份有限公司国华电力分公司 | Hydrogen production equipment and cooling device thereof |
US11903166B2 (en) * | 2021-02-01 | 2024-02-13 | Microsoft Technology Licensing, Llc | Systems and methods for immersion cooling with subcooled spray |
US11903171B2 (en) * | 2021-08-05 | 2024-02-13 | Nan Chen | System for modular liquid spray cooling of electronic devices |
US20230112805A1 (en) * | 2021-10-08 | 2023-04-13 | Simmonds Precision Products, Inc. | Systems and methods for cooling electronics |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4350838A (en) * | 1980-06-27 | 1982-09-21 | Electric Power Research Institute, Inc. | Ultrasonic fluid-atomizing cooled power transformer |
US4500895A (en) | 1983-05-02 | 1985-02-19 | Hewlett-Packard Company | Disposable ink jet head |
US4683481A (en) | 1985-12-06 | 1987-07-28 | Hewlett-Packard Company | Thermal ink jet common-slotted ink feed printhead |
JPS63120449A (en) * | 1986-11-10 | 1988-05-24 | Fujitsu Ltd | Evaporation and cooling apparatus for integrated circuit element |
JPH08159635A (en) * | 1994-12-06 | 1996-06-21 | Nec Corp | Cooling device for electronic component parts |
US5924198A (en) | 1994-10-04 | 1999-07-20 | Hewlett-Packard Company | Method of forming an ink-resistant seal between a printhead assembly and the headland region of an ink-jet pen cartridge. |
US5943211A (en) * | 1997-04-18 | 1999-08-24 | Raytheon Company | Heat spreader system for cooling heat generating components |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2643282A (en) * | 1949-04-13 | 1953-06-23 | Albert D Greene | Electronic equipment cooling means |
US2849523A (en) * | 1952-08-16 | 1958-08-26 | Westinghouse Electric Corp | Electrical apparatus with vaporizable liquid coolant |
US2858355A (en) * | 1952-08-16 | 1958-10-28 | Westinghouse Electric Corp | Electrical apparatus |
US2875263A (en) * | 1953-08-28 | 1959-02-24 | Westinghouse Electric Corp | Transformer control apparatus |
US3714793A (en) * | 1971-01-18 | 1973-02-06 | Union Carbide Corp | Intransit liquefied gas refrigeration system |
US4068495A (en) * | 1976-03-31 | 1978-01-17 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Closed loop spray cooling apparatus |
US4290274A (en) * | 1979-07-16 | 1981-09-22 | Essex Donald D | Liquid spray device with adaptive duty cycle |
US4352392A (en) * | 1980-12-24 | 1982-10-05 | Thermacore, Inc. | Mechanically assisted evaporator surface |
US4490728A (en) | 1981-08-14 | 1984-12-25 | Hewlett-Packard Company | Thermal ink jet printer |
US4559789A (en) * | 1984-03-15 | 1985-12-24 | Research Products Corporation | Variable cycle moisturizing control circuit for a gas-liquid contact pad |
US4576012A (en) * | 1984-03-26 | 1986-03-18 | Computer Air Corp. | Evaporative cooler |
US4685308A (en) * | 1984-07-02 | 1987-08-11 | Welker Mark L | Temperature responsive cooling apparatus |
US4794410A (en) | 1987-06-02 | 1988-12-27 | Hewlett-Packard Company | Barrier structure for thermal ink-jet printheads |
JPH065700B2 (en) * | 1987-07-22 | 1994-01-19 | 株式会社日立製作所 | Cooling device for electronic circuit devices |
GB8905432D0 (en) * | 1989-03-09 | 1989-04-19 | Gen Electric Co Plc | A heat exchanger |
US5434606A (en) | 1991-07-02 | 1995-07-18 | Hewlett-Packard Corporation | Orifice plate for an ink-jet pen |
US5220804A (en) | 1991-12-09 | 1993-06-22 | Isothermal Systems Research, Inc | High heat flux evaporative spray cooling |
US5278584A (en) | 1992-04-02 | 1994-01-11 | Hewlett-Packard Company | Ink delivery system for an inkjet printhead |
JPH0994968A (en) * | 1995-09-29 | 1997-04-08 | Hewlett Packard Co <Hp> | Ink jet print head |
US5718117A (en) * | 1996-04-10 | 1998-02-17 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
CN1118224C (en) * | 1996-05-16 | 2003-08-13 | 雷泰昂公司 | Heat spreader system and method for cooling heat generating components |
JP3329663B2 (en) * | 1996-06-21 | 2002-09-30 | 株式会社日立製作所 | Cooling device for electronic devices |
US5768103A (en) * | 1996-08-30 | 1998-06-16 | Motorola, Inc. | Circuit board apparatus and apparatus and method for spray-cooling an electronic component |
US5724824A (en) * | 1996-12-12 | 1998-03-10 | Parsons; David A. | Evaporative cooling delivery control system |
US5907473A (en) * | 1997-04-04 | 1999-05-25 | Raytheon Company | Environmentally isolated enclosure for electronic components |
US5813237A (en) * | 1997-06-27 | 1998-09-29 | The Boc Group, Inc. | Cryogenic apparatus and method for spraying a cryogen incorporating generation of two phase flow |
US6108201A (en) * | 1999-02-22 | 2000-08-22 | Tilton; Charles L | Fluid control apparatus and method for spray cooling |
JP2000252671A (en) * | 1999-02-26 | 2000-09-14 | Sony Corp | Cooler and electronic apparatus |
US6205799B1 (en) * | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
-
1999
- 1999-09-13 US US09/395,092 patent/US6205799B1/en not_active Expired - Lifetime
-
2000
- 2000-09-13 JP JP2001524405A patent/JP4294899B2/en not_active Expired - Fee Related
- 2000-09-13 EP EP00966729A patent/EP1212929A1/en not_active Withdrawn
- 2000-09-13 EP EP08015219A patent/EP1991041A3/en not_active Withdrawn
- 2000-09-13 KR KR1020027003243A patent/KR100770487B1/en not_active IP Right Cessation
- 2000-09-13 WO PCT/US2000/025360 patent/WO2001020962A1/en active Application Filing
- 2000-12-11 US US09/735,415 patent/US6349554B2/en not_active Expired - Fee Related
-
2001
- 2001-12-19 US US10/025,650 patent/US6457321B1/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4350838A (en) * | 1980-06-27 | 1982-09-21 | Electric Power Research Institute, Inc. | Ultrasonic fluid-atomizing cooled power transformer |
US4500895A (en) | 1983-05-02 | 1985-02-19 | Hewlett-Packard Company | Disposable ink jet head |
US4683481A (en) | 1985-12-06 | 1987-07-28 | Hewlett-Packard Company | Thermal ink jet common-slotted ink feed printhead |
JPS63120449A (en) * | 1986-11-10 | 1988-05-24 | Fujitsu Ltd | Evaporation and cooling apparatus for integrated circuit element |
US5924198A (en) | 1994-10-04 | 1999-07-20 | Hewlett-Packard Company | Method of forming an ink-resistant seal between a printhead assembly and the headland region of an ink-jet pen cartridge. |
JPH08159635A (en) * | 1994-12-06 | 1996-06-21 | Nec Corp | Cooling device for electronic component parts |
US5943211A (en) * | 1997-04-18 | 1999-08-24 | Raytheon Company | Heat spreader system for cooling heat generating components |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 012, no. 369 (E - 665) 4 October 1988 (1988-10-04) * |
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 10 31 October 1996 (1996-10-31) * |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2242345A3 (en) * | 2001-05-16 | 2011-11-02 | Cray Inc. | Method and apparatus for cooling electronic components |
EP2267771A3 (en) * | 2001-05-16 | 2011-11-02 | Cray Inc. | Method and apparatus for cooling electronic components |
WO2002093994A3 (en) * | 2001-05-16 | 2003-06-19 | Cray Inc | Method and apparatus for cooling electronic components |
US6646879B2 (en) | 2001-05-16 | 2003-11-11 | Cray Inc. | Spray evaporative cooling system and method |
EP2242345A2 (en) * | 2001-05-16 | 2010-10-20 | Cray Inc. | Method and apparatus for cooling electronic components |
WO2002093994A2 (en) * | 2001-05-16 | 2002-11-21 | Cray Inc. | Method and apparatus for cooling electronic components |
US6580609B2 (en) | 2001-05-16 | 2003-06-17 | Cray Inc. | Method and apparatus for cooling electronic components |
SG120104A1 (en) * | 2003-06-30 | 2006-03-28 | Singapore Tech Aerospace Ltd | Spray cooling method and apparatus |
WO2010050868A1 (en) * | 2008-11-03 | 2010-05-06 | Telefonaktiebolaget L M Ericsson (Publ) | A system in a network node for regulating temperature of electronic equipment |
WO2010050873A1 (en) * | 2008-11-03 | 2010-05-06 | Telefonaktiebolaget L M Ericsson (Publ) | A system in a network node for regulating temperature of electronic equipment |
CN103518106A (en) * | 2011-04-20 | 2014-01-15 | 东京电力株式会社 | Condensing device |
CN103518106B (en) * | 2011-04-20 | 2016-10-05 | 东京电力株式会社 | Condensing unit |
US9625191B2 (en) | 2011-04-20 | 2017-04-18 | Tokyo Electric Power Company, Incorporated | Condensing apparatus |
CN105828575A (en) * | 2016-03-28 | 2016-08-03 | 中车株洲电力机车研究所有限公司 | Jet flow two-phase heat transfer cold plate and cooling system for track traffic |
CN105828575B (en) * | 2016-03-28 | 2020-03-17 | 中车株洲电力机车研究所有限公司 | Jet flow two-phase heat exchange cold plate and cooling system for rail transit |
Also Published As
Publication number | Publication date |
---|---|
US6349554B2 (en) | 2002-02-26 |
JP2003509874A (en) | 2003-03-11 |
US20010002541A1 (en) | 2001-06-07 |
JP4294899B2 (en) | 2009-07-15 |
US20020050144A1 (en) | 2002-05-02 |
EP1991041A2 (en) | 2008-11-12 |
KR20020071847A (en) | 2002-09-13 |
EP1212929A1 (en) | 2002-06-12 |
EP1991041A3 (en) | 2009-12-23 |
US6205799B1 (en) | 2001-03-27 |
US6457321B1 (en) | 2002-10-01 |
KR100770487B1 (en) | 2007-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6205799B1 (en) | Spray cooling system | |
US6550263B2 (en) | Spray cooling system for a device | |
US6484521B2 (en) | Spray cooling with local control of nozzles | |
US7082778B2 (en) | Self-contained spray cooling module | |
US6708515B2 (en) | Passive spray coolant pump | |
US6817196B2 (en) | Spray cooling system with cooling regime detection | |
US6817204B2 (en) | Modular sprayjet cooling system | |
US5512924A (en) | Jet apparatus having an ink jet head and temperature controller for that head | |
US9713285B2 (en) | Electronic apparatus having a cooling apparatus | |
US6604370B2 (en) | Variably configured sprayjet cooling system | |
WO2006062624A1 (en) | Spray cooling with spray deflection | |
JP2005231367A (en) | System for regulating temperature in fluid ejection device and inkjet printing device with system | |
Bash et al. | Inkjet assisted spray cooling of electronics | |
US20020118260A1 (en) | Inkjet printing system | |
US20070163756A1 (en) | Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof | |
JP4128986B2 (en) | Free-standing spray cooling module | |
JPH03133654A (en) | Image recorder | |
TWI380911B (en) | Inkjet printhead with adjustable bubble impulse | |
JP2005205721A (en) | Liquid discharge head and liquid discharge device | |
Sharma et al. | Experimental investigation of heat transfer characteristics of inkjet assisted spray cooling |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP KR SG |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
ENP | Entry into the national phase |
Ref document number: 2001 524405 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2000966729 Country of ref document: EP Ref document number: 1020027003243 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2000966729 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020027003243 Country of ref document: KR |