WO2001041054A2 - Chipkartenmodul mit anisotrop leitfähiger trägerfolie - Google Patents
Chipkartenmodul mit anisotrop leitfähiger trägerfolie Download PDFInfo
- Publication number
- WO2001041054A2 WO2001041054A2 PCT/DE2000/004282 DE0004282W WO0141054A2 WO 2001041054 A2 WO2001041054 A2 WO 2001041054A2 DE 0004282 W DE0004282 W DE 0004282W WO 0141054 A2 WO0141054 A2 WO 0141054A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- card module
- carrier
- film
- semiconductor chip
- chip card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
Definitions
- the invention relates to a chip card module with an anisotropically conductive carrier film.
- chip card modules are produced in the production of chip cards as intermediate products which are independent of production technology, as is known from DE 196 32 113.
- a conventional chip card module as used in the known telephone cards, consists of a carrier and at least one semiconductor circuit, a so-called semiconductor chip, which is arranged on the carrier. Furthermore, the carrier has contact surfaces. The size of the contact surfaces is standardized according to the ISO standard.
- conductor tracks are often provided on one side of the carrier and serve as feeds to the contact areas. Since the semiconductor chip and the contact areas are located on different sides of the carrier, through-contacts are also necessary which enable an electrical connection from one side of the carrier to the other.
- connection points so-called pads, which are located on the surface of the semiconductor chip.
- a chip card module customary today has a carrier made of film material, which is provided on one side with a metal film, from which the contact areas are formed by structuring.
- a carrier made of film material, which is provided on one side with a metal film, from which the contact areas are formed by structuring.
- connection points face away from the carrier surface. These connection points are then connected to the contact surfaces in an electrically conductive manner by means of thin wires.
- the semiconductor chip is soldered directly to the conductor system provided on the carrier. This requires a suitable metallization of the connection points beforehand. The soldering also mechanically fixes the semiconductor chip so that it has its own Fixing the chip is not necessary.
- JP 09148378 A it is known from JP 09148378 A to realize a connection between the semiconductor chip and the conductor track system by means of an anisotropically conductive film, a so-called AC film.
- the film is arranged between the carrier and the semiconductor chip.
- this AC film is an adhesive film with which the semiconductor chip is mechanically attached to the carrier.
- chip cards In particular when the semiconductor chip is connected to the carrier by means of an AC film, there are both costs for a carrier with a conductor track system and for the AC film. In many applications, chip cards must not cause high costs because, like the telephone card, they are a disposable product with a very manageable service life.
- the object of the present invention is to implement an inexpensive chip card module with as little effort as possible.
- an AC film is used as the carrier film, on one side of which the contact areas are applied directly and on the other side of which the semiconductor chip is attached.
- This AC film serves both as a mechanical support for the chip card module and as an electrical connecting element between the semiconductor chip and the contact surfaces.
- the contact areas are evaporated directly onto the AC film.
- This method for producing the contact areas is particularly cost-effective compared to a carrier provided with a continuous metal laminate, on which contact areas and conductor tracks are formed by structuring the metal laminate.
- the AC film is a hot-melt film. This has the advantage that this film at the same time ensures mechanical attachment of the semiconductor chip, so that additional attachment steps are omitted.
- connection points it is advantageous to dimension the areas of the connection points so that they cover almost the entire area of the side of the semiconductor chip facing the AC film. This results in a particularly reliable contact between the semiconductor chip and the AC film, so that the requirements on the AC film with regard to its conductivity and thus the manufacturing costs for the AC film are reduced and the manufacturing yield of the chip modules is increased.
- Another advantage of the invention is the possibility of producing a very thin module that is very flexible with regard to bending stress.
- Fig. 1 is a schematic side view of the chip card module according to the invention in partial section and
- Fig. 2 is a schematic plan view of the chip card module on the side of the contact surfaces in partial section.
- FIG. 1 shows a side view of a chip card module 5.
- This contains a carrier 3, which consists of a film-like material. An anisotropically conductive hot-melt film is selected for this material, whose direction of maximum conductivity is perpendicular to the film plane.
- a semiconductor chip 1 is applied to one side of this carrier 3 and has connection points 2 on one side surface.
- This semiconductor chip 1 is arranged so that its connection points 2 are in direct contact with the carrier 3.
- the semiconductor chip 1 is glued to the carrier 3, the hot-melt film itself acting as an adhesive due to its adhesive property.
- Metallic ISO contact surfaces 4 are evaporated on the other side of the carrier 3.
- the electrical connection between the ISO contact surfaces 4 and the connection points 2 of the semiconductor chip 1 is established by the carrier 3 itself.
- the direction of this connection is always perpendicular to the film plane, while the carrier 3 is an insulator parallel to the film plane.
- connection points 2 are designed with an enlarged cross-sectional area so that they cover a substantial part of the chip surface. Because of the large cross-sectional area, particularly good contact between the connection points 2 and the carrier 3 is ensured. Furthermore, the enlarged contact surfaces advantageously reduce the requirements for the positioning accuracy when the semiconductor chip 1 is applied to the carrier 3.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00989819A EP1234275B1 (de) | 1999-12-02 | 2000-12-01 | Chipkartenmodul mit anisotrop leitfähiger trägerfolie |
DE50005936T DE50005936D1 (de) | 1999-12-02 | 2000-12-01 | Chipkartenmodul mit anisotrop leitfähiger trägerfolie |
AT00989819T ATE263398T1 (de) | 1999-12-02 | 2000-12-01 | Chipkartenmodul mit anisotrop leitfähiger trägerfolie |
US10/160,629 US6992898B2 (en) | 1999-12-02 | 2002-06-03 | Smart-card module with an anisotropically conductive substrate film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99124141 | 1999-12-02 | ||
EP99124141.5 | 1999-12-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/160,629 Continuation US6992898B2 (en) | 1999-12-02 | 2002-06-03 | Smart-card module with an anisotropically conductive substrate film |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001041054A2 true WO2001041054A2 (de) | 2001-06-07 |
WO2001041054A3 WO2001041054A3 (de) | 2001-12-13 |
Family
ID=8239522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/004282 WO2001041054A2 (de) | 1999-12-02 | 2000-12-01 | Chipkartenmodul mit anisotrop leitfähiger trägerfolie |
Country Status (5)
Country | Link |
---|---|
US (1) | US6992898B2 (de) |
EP (1) | EP1234275B1 (de) |
AT (1) | ATE263398T1 (de) |
DE (1) | DE50005936D1 (de) |
WO (1) | WO2001041054A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3077676A1 (fr) * | 2018-02-05 | 2019-08-09 | Linxens Holding | Procede de fabrication d’un circuit electrique comprenant au moins un connecteur pour carte a puce, et circuit electrique obtenu, notamment, par ce procede |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719140A (en) * | 1984-11-05 | 1988-01-12 | Casio Computer Co., Ltd. | Electronic memory card |
EP0766197A1 (de) * | 1995-04-13 | 1997-04-02 | Dai Nippon Printing Co., Ltd. | Chipkarte und -modul |
FR2761497A1 (fr) * | 1997-03-27 | 1998-10-02 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
EP0908844A1 (de) * | 1997-10-07 | 1999-04-14 | De La Rue Cartes Et Systemes | Karte mit Mikroschaltung, welche die Strecken des externen Kontaktes und einer Antenne kombiniert und Herstellungsverfahren einer solchen Karte |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2980496B2 (ja) * | 1993-11-10 | 1999-11-22 | シャープ株式会社 | フレキシブル配線板の端子構造 |
JP2814477B2 (ja) * | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | 非接触式icカード及びその製造方法 |
JPH09148378A (ja) | 1995-11-20 | 1997-06-06 | Dainippon Printing Co Ltd | Icカード用icモジュールとその製造方法および当該icモジュールを使用したicカード |
US5936847A (en) * | 1996-05-02 | 1999-08-10 | Hei, Inc. | Low profile electronic circuit modules |
DE19632113C1 (de) | 1996-08-08 | 1998-02-19 | Siemens Ag | Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte |
EP0824301A3 (de) * | 1996-08-09 | 1999-08-11 | Hitachi, Ltd. | Gedruckte Schaltungsplatte, Chipkarte, und Verfahren zu deren Herstellung |
US6146753A (en) * | 1997-05-26 | 2000-11-14 | Dai Nippon Printing Co., Ltd. | Antistatic hard coat film |
EP0952542B1 (de) * | 1997-06-23 | 2003-10-29 | Rohm Co., Ltd. | Ic modul und ic karte |
JPH1131784A (ja) * | 1997-07-10 | 1999-02-02 | Rohm Co Ltd | 非接触icカード |
JPH1140522A (ja) * | 1997-07-17 | 1999-02-12 | Rohm Co Ltd | 半導体ウエハの製造方法、この方法により作製された半導体ウエハ、半導体チップの製造方法、およびこの方法により製造された半導体チップ、ならびにこの半導体チップを備えたicカード |
JPH11163501A (ja) * | 1997-12-02 | 1999-06-18 | Rohm Co Ltd | 電子部品の実装方法、およびその方法によって製造された電子回路装置 |
US6319594B1 (en) * | 1998-03-17 | 2001-11-20 | Dai Nippon Printing Co., Ltd. | Low reflective antistatic hardcoat film |
-
2000
- 2000-12-01 DE DE50005936T patent/DE50005936D1/de not_active Expired - Lifetime
- 2000-12-01 AT AT00989819T patent/ATE263398T1/de not_active IP Right Cessation
- 2000-12-01 WO PCT/DE2000/004282 patent/WO2001041054A2/de active IP Right Grant
- 2000-12-01 EP EP00989819A patent/EP1234275B1/de not_active Expired - Lifetime
-
2002
- 2002-06-03 US US10/160,629 patent/US6992898B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4719140A (en) * | 1984-11-05 | 1988-01-12 | Casio Computer Co., Ltd. | Electronic memory card |
EP0766197A1 (de) * | 1995-04-13 | 1997-04-02 | Dai Nippon Printing Co., Ltd. | Chipkarte und -modul |
FR2761497A1 (fr) * | 1997-03-27 | 1998-10-02 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
EP0908844A1 (de) * | 1997-10-07 | 1999-04-14 | De La Rue Cartes Et Systemes | Karte mit Mikroschaltung, welche die Strecken des externen Kontaktes und einer Antenne kombiniert und Herstellungsverfahren einer solchen Karte |
Non-Patent Citations (1)
Title |
---|
See also references of EP1234275A2 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3077676A1 (fr) * | 2018-02-05 | 2019-08-09 | Linxens Holding | Procede de fabrication d’un circuit electrique comprenant au moins un connecteur pour carte a puce, et circuit electrique obtenu, notamment, par ce procede |
Also Published As
Publication number | Publication date |
---|---|
US6992898B2 (en) | 2006-01-31 |
EP1234275B1 (de) | 2004-03-31 |
ATE263398T1 (de) | 2004-04-15 |
WO2001041054A3 (de) | 2001-12-13 |
EP1234275A2 (de) | 2002-08-28 |
DE50005936D1 (de) | 2004-05-06 |
US20020172018A1 (en) | 2002-11-21 |
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