WO2001057794A1 - Method for production of an object with a transponder - Google Patents

Method for production of an object with a transponder Download PDF

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Publication number
WO2001057794A1
WO2001057794A1 PCT/EP2001/000822 EP0100822W WO0157794A1 WO 2001057794 A1 WO2001057794 A1 WO 2001057794A1 EP 0100822 W EP0100822 W EP 0100822W WO 0157794 A1 WO0157794 A1 WO 0157794A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna coil
carrier film
transponder
chip
bridge
Prior art date
Application number
PCT/EP2001/000822
Other languages
German (de)
French (fr)
Inventor
Johannes Lippert
Original Assignee
Skidata Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skidata Ag filed Critical Skidata Ag
Priority to EP01905688A priority Critical patent/EP1252606A1/en
Publication of WO2001057794A1 publication Critical patent/WO2001057794A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041—Constructional details
    • G06K19/042—Constructional details the record carrier having a form factor of a credit card and including a small sized disc, e.g. a CD or DVD
    • G06K19/045—Constructional details the record carrier having a form factor of a credit card and including a small sized disc, e.g. a CD or DVD the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material

Definitions

  • the invention relates to a method for producing an object with a transponder for contactless data transmission using a carrier film which is provided with at least one semiconductor chip and an antenna coil.
  • Such a method is used, for example, for the production of chip cards.
  • the energy supply and the contactless exchange of data between the semiconductor chip and a transmitter / receiver takes place via the antenna coil.
  • a spiral antenna coil is formed from an electrically conductive layer material on a plastic carrier film (compare, for example, DE 196 09 134 AI and DE 196 04 774 AI).
  • the carrier film can consist of polyester, PVC, ABS or another plastic.
  • a metal foil can be laminated onto the carrier film, or the electrically conductive layer is, for example, vapor-deposited, galvanically deposited or printed on.
  • the layer material can consist of metal, for example aluminum or copper or an electrically conductive plastic. Layer material is then removed, for example by a mask etching method or a laser, in order to form the coil, which is then connected to the semiconductor chip.
  • This provides a ready-to-use transponder for installation between the layers of the chip card on a carrier film.
  • Well-engineered mass production processes are available for a large number of items, which require considerable conversion effort to intervene. This applies, for example, to data carriers such as compact discs or DVDs (digital versatile discs) that have to be manufactured with extreme precision. It therefore requires considerable effort to provide such a data carrier with a transponder.
  • the object of the invention is therefore to provide a method with which objects can be provided with a transponder in a simple manner.
  • a carrier film is first provided with at least one semiconductor chip and an antenna coil.
  • a carrier film made of a material which is soluble in a solvent which does not attack the object.
  • the carrier film provided with the chip and the antenna coil is connected to the object, the chip and the antenna coil being arranged on the side of the carrier film facing the object, whereupon the carrier film is removed with the solvent.
  • the antenna coil remaining on the object with the chip is preferably included a protective coating, for example a protective lacquer.
  • the material of the carrier film can be a water-soluble plastic, for example polyvinyl alcohol (PVA).
  • PVA polyvinyl alcohol
  • Other plastic films soluble in aqueous alkaline solution are e.g. B. described in EP 78 553 A2 and EP 143 935 AI. Then solve z. B. Films made of homopolymers or copolymers with acrylic acid, crotonic acid or maleic acid in an alkaline aqueous solution. The same applies to cellulose derivatives, such as hydroxyethyl cellulose and hydroxypropyl cellulose, or polymers, such as Vinnapas C305 from Wacker Chemie GmbH or Phthalopal PP from BASF.
  • the solvent for dissolving the carrier film need not be water.
  • the carrier film can also consist of a plastic that dissolves in alcohol, acetone or a hydrocarbon, such as gasoline. It is only essential that the solvent does not attack the object and also not the antenna coil or the chip. A plastic that only dissolves in an acidic environment is therefore generally less suitable because this can lead to an attack by the thin antenna coil made of metal.
  • connection of the carrier film provided with the chip and the antenna coil with the object in question can, for. B. with an adhesive, in particular a thermoreactive adhesive, if the carrier film with the antenna coil and the chip on its side facing the object is to be connected to an object with a plastic surface.
  • the soluble carrier film used according to the invention can be provided in the same way with an antenna coil and a semiconductor chip as in the prior art.
  • the carrier film z. B. by laminating a metal foil or a film made of conductive plastic or by vapor deposition, galvanic deposition or printing with the electrically conductive layer material.
  • the layer material can be a metal, for example aluminum or copper, or an electrically conductive paint or the like.
  • the excess layer material is removed to form the antenna coil, for example by a mask etching process, with a laser, mechanically or the like.
  • the antenna coil can also directly, for. B. with screen printing with an electrically conductive ink on the carrier film.
  • the semiconductor chip is then arranged on the carrier film and connected to the antenna coil in a known manner.
  • transponders on a carrier film are nowadays produced in mature mass production.
  • a spiral antenna coil applied as a layer material to a polyester film, in which the inner end and the outer end of the coil are electrically connected by a bridge which extends on the other side of the carrier film over the windings of the antenna coil lying between them and through the carrier film is contacted with both ends of the antenna coil.
  • This mass production process is preferably adopted according to the invention, only the polyester film being replaced by a soluble film and the bridge opposite the turns of the antenna lying between the two ends of the antenna coil. need to be provided at least on its side facing these intermediate windings with electrical insulation which does not dissolve in the solvent, for example an insulating varnish.
  • the object with which the transponder is provided can e.g. B. be a record carrier, for example a CD or a DVD.
  • the antenna coil can have a frame shape that extends around the center hole of the CD or of the other recording medium.
  • Figure 1 is a plan view of a CD, which is provided with a transponder for contactless data transmission;
  • FIG. 1 schematically the method with which the CD shown in section is provided with the transponder.
  • a CD 1 is provided with a center hole 2 with a transponder for contactless data transmission, which consists of an antenna coil 3 to which a chip 4 is connected.
  • the CD 1 has a credit card format. Otherwise, it has the usual strength of z. B. 1.2 mm and is assembled by a conventional mass production process from two correspondingly thin plates (5 and 6; Figure 2) and in a precisely defined manner, under clean room conditions, free of static charges, etc.
  • the antenna coil 3 is formed by a spiral, electrically conductive layer material which has a rectangular frame shape which extends around the central hole 2, with the longitudinal sides of the frame parallel to the long sides of the card-shaped CD 1.
  • the inner end 3.1 and the outer end 3.2 of the spiral antenna coil 3 are connected to one another by an electrically conductive bridge 7, which extends over the turns of the antenna coil 3.
  • an electrically conductive bridge 7 which extends over the turns of the antenna coil 3.
  • an insulating varnish is applied to the underside of the bridge 7, that is to say between the bridge 7 and the turns of the antenna coil 3.
  • the bridge 7 is arranged in a corner region of the frame-shaped antenna coil 3.
  • the outer coil turn is interrupted by a recess 8.
  • the chip 4 is arranged in the cutout 8 and is bonded to the ends 3.3 and 3.4 of the antenna 3 formed by the interruption.
  • a carrier film 10 is used to produce the CD 1 provided with the transponder, on the side facing the CD 1, the antenna coil 3 z. B. is produced by means of an etching process from a metal layer applied to the film 10.
  • the carrier film 10 also has the chip 4 bonded to the antenna coil 3, and furthermore, what cannot be seen in FIGS. According to Figures 2a and 2b, the carrier film 10 with antenna coil 3, chip 4 and bridge 7 z. B. connected with an adhesive 9 to the side of the CD 1, which is opposite the side of the CD 1 scanned by the laser.
  • the carrier film 10 is then removed with a solvent in which it dissolves, so that the transponder connected to the CD 1 remains from the antenna coil 3, the chip 4 and the bridge 7 on the CD 1 (FIG. 2 c). Then a coating 11 is applied, which covers the antenna coil 3, the chip 4 and the bridge 7.
  • the transponder is thus applied to the otherwise finished CD like a label.
  • the method according to the invention does not intervene in CD production, rather it follows CD production.

Abstract

According to the invention, a support film (10) with at least one semiconductor chip (4) and one antenna coil (3), is used in order to produce an object, for example a CD (1) with a transponder for contactless data transfer. The support film (10) is made from a material which is soluble in a solvent which does not attack the object (1). The support film (10) with the chip (4) and the antenna coil (3) is connected to the object (1) and then the support film (10) is removed with the solvent.

Description

Verfahren zur Herstellung eines Gegenstandes mit einem Transponder Process for the manufacture of an object with a transponder
Die Erfindung bezieht sich auf ein Verfahren zur Herstellung eines Gegenstandes mit einem Transponder zur berührungslosen Datenübertragung unter Verwendung einer Träger- folie, die mit wenigstens einem Halbleiterchip und einer Antennenspule versehen ist .The invention relates to a method for producing an object with a transponder for contactless data transmission using a carrier film which is provided with at least one semiconductor chip and an antenna coil.
Ein solches Verfahres wird beispielsweise zur Herstellung von Chipkarten angewendet . Über die Antennenspule erfolgt die Energieversorgung und der berührungslose Austausch von Daten zwischen dem Halbleiterchip und einem Sender/Empfänger. Dazu wird aus einem elektrisch leitenden Schichtmatenal auf einer Trägerfolie aus Kunststoff eine spiralförmige Antennenspule gebildet (vergleiche z. B. DE 196 09 134 AI und DE 196 04 774 AI) .Such a method is used, for example, for the production of chip cards. The energy supply and the contactless exchange of data between the semiconductor chip and a transmitter / receiver takes place via the antenna coil. For this purpose, a spiral antenna coil is formed from an electrically conductive layer material on a plastic carrier film (compare, for example, DE 196 09 134 AI and DE 196 04 774 AI).
Die Trägerfolie kann dazu aus Polyester, PVC, ABS oder einem anderen Kunststoff bestehen. Zum Beschichten kann auf die Trägerfolie eine Metallfolie auflaminiert werden, oder die elektrisch leitende Schicht wird beispielsweise aufgedampft, galvanisch abgeschieden oder aufgedruckt. Das Schichtmaterial kann aus Metall, beispielsweise Aluminium oder Kupfer oder einem elektrisch leitendem Kunststoff bestehen. Anschließend wird beispielsweise durch e n Masken- Ätzverfahren oder einen Laser Schichtmaterial entfernt, um die Spule zu bilden, die dann mit dem Halbleiterchip verbunden wird. Damit wird ein für den Einbau zwischen die Schichten der Chipkarte gut handhabbarer fertiger Transponder auf einer Trägerfolie zur Verfügung gestellt. Für eine Vielzahl von Gegenständen stehen bereits ausgereifte Massenproduktionsverfahren zur Verfügung, in die einzugreifen einen erheblichen Umstellungsaufwand erfordert. Dies gilt beispielsweise für Datenträger, wie Kom- paktdisks oder DVD (Digital Versatile Discs) , die mit äußerster Präzision hergestellt werden müssen. Es bedarf deshalb eines erheblichen Aufwandes, um einen solchen Datenträger mit einem Transponder zu versehen.The carrier film can consist of polyester, PVC, ABS or another plastic. For coating, a metal foil can be laminated onto the carrier film, or the electrically conductive layer is, for example, vapor-deposited, galvanically deposited or printed on. The layer material can consist of metal, for example aluminum or copper or an electrically conductive plastic. Layer material is then removed, for example by a mask etching method or a laser, in order to form the coil, which is then connected to the semiconductor chip. This provides a ready-to-use transponder for installation between the layers of the chip card on a carrier film. Well-engineered mass production processes are available for a large number of items, which require considerable conversion effort to intervene. This applies, for example, to data carriers such as compact discs or DVDs (digital versatile discs) that have to be manufactured with extreme precision. It therefore requires considerable effort to provide such a data carrier with a transponder.
Aufgabe der Erfindung ist es daher, ein Verfahren anzugeben, mit dem Gegenstände auf einfache Weise mit einem Transponder versehen werden können.The object of the invention is therefore to provide a method with which objects can be provided with a transponder in a simple manner.
Dies wird erfindungsgemäß mit dem im Anspruch 1 gekennzeichneten Verfahren erreicht. In den Unteransprüchen sind vorteilhafte Ausgestaltungen der Erfindung wiedergegeben.This is achieved according to the invention with the method characterized in claim 1. Advantageous embodiments of the invention are given in the subclaims.
Mit dem erfindungsgemäßen Verfahren kann praktisch jeder fertige, durch ausgereifte Massenproduktion hergestellte Gegenstand nachträglich auf einfache Weise mit einem Transponder versehen werden. Dazu wird erfindungsgemäß, wie nach dem Stand der Technik, zunächst eine Trägerfolie mit wenigstens einem Halbleiterchip und einer Antennenspule versehen.With the method according to the invention, practically any finished article produced by sophisticated mass production can be subsequently provided with a transponder in a simple manner. For this purpose, according to the invention, as in the prior art, a carrier film is first provided with at least one semiconductor chip and an antenna coil.
Erfindungsgemäß wird jedoch eine Trägerfolie aus einem Material eingesetzt, das in einem den Gegenstand nicht angreifenden Lösungsmittel löslich ist. Die mit dem Chip und der Antennenspule versehene Trägerfolie wird mit dem Gegenstand verbunden, wobei der Chip und die Antennenspule auf der dem Gegenstand zugewandten Seite der Trägerfolie angeordnet sind, worauf die Trägerfolie mit dem Lösungsmittel entfernt wird. Anschließend wird vorzugsweise die auf dem Gegenstand zurückbleibende Antennenspule mit dem Chip mit einem Schutzüberzug, beispielsweise einem Schutzlack versehen.According to the invention, however, a carrier film made of a material is used which is soluble in a solvent which does not attack the object. The carrier film provided with the chip and the antenna coil is connected to the object, the chip and the antenna coil being arranged on the side of the carrier film facing the object, whereupon the carrier film is removed with the solvent. Subsequently, the antenna coil remaining on the object with the chip is preferably included a protective coating, for example a protective lacquer.
Das Material der Trägerfolie kann dazu ein wasserlöslicher Kunststoff sein, beispielsweise Polyvinylalkohol (PVA) . So werden mit einem Dekor versehene wasserlösliche PVA-Folien zum optischen Veredeln von Werkstücken eingesetzt. Weitere in wässriger alkalischer Lösung lösliche Kunststoffolien sind z. B. in EP 78 553 A2 und EP 143 935 AI beschrieben. Danach lösen sich z. B. Folien aus Homopolymeren oder Copo- lymeren mit Acrylsäure, Croton- oder Maleinsäure in alkalischer wässriger Lösung auf. Gleiches gilt für Cellulosede- rivate, wie Hydroxyethyl-Cellulose und Hydroxypropyl - Cellulose, oder Polymerisate, wie Vinnapas C305 der Firma Wacker Chemie GmbH oder Phthalopal PP der Firma BASF.For this purpose, the material of the carrier film can be a water-soluble plastic, for example polyvinyl alcohol (PVA). For example, water-soluble PVA foils with a decor are used for the optical finishing of workpieces. Other plastic films soluble in aqueous alkaline solution are e.g. B. described in EP 78 553 A2 and EP 143 935 AI. Then solve z. B. Films made of homopolymers or copolymers with acrylic acid, crotonic acid or maleic acid in an alkaline aqueous solution. The same applies to cellulose derivatives, such as hydroxyethyl cellulose and hydroxypropyl cellulose, or polymers, such as Vinnapas C305 from Wacker Chemie GmbH or Phthalopal PP from BASF.
Das Lösungsmittel zum Auflösen der Trägerfolie braucht jedoch nicht Wasser zu sein. Beispielsweise kann die Trägerfolie auch aus einem Kunststoff bestehen, der sich in Alkohol, Aceton oder einem Kohlenwasserstoff, wie Benzin, löst. Wesentlich ist lediglich, dass das Lösungsmittel den Gegenstand nicht angreift und auch nicht die Antennenspule oder den Chip. Ein Kunststoff, der sich nur in saurem Milieu auflöst, ist daher im allgemeinen weniger geeignet, weil dies zu einem Angriff der dünnen Antennenspule aus Metall führen kann.However, the solvent for dissolving the carrier film need not be water. For example, the carrier film can also consist of a plastic that dissolves in alcohol, acetone or a hydrocarbon, such as gasoline. It is only essential that the solvent does not attack the object and also not the antenna coil or the chip. A plastic that only dissolves in an acidic environment is therefore generally less suitable because this can lead to an attack by the thin antenna coil made of metal.
Die Verbindung der mit dem Chip und der Antennenspule versehenen Trägerfolie mit dem betreffenden Gegenstand, kann z. B. mit einem Klebstoff erfolgen, insbesondere einem thermoreaktiven Klebstoff, wenn die Trägerfolie mit der Antennenspule und dem Chip auf ihrer dem Gegenstand zugewandten Seite mit einem Gegenstand mit einer KunststoffOberfläche verbunden werden soll . Die erfindungsgemäß verwendete, lösliche Trägerfolie kann in gleicher Weise mit einer Antennenspule und einem Halbleiterchip versehen werden, wie nach dem Stand der Technik.The connection of the carrier film provided with the chip and the antenna coil with the object in question can, for. B. with an adhesive, in particular a thermoreactive adhesive, if the carrier film with the antenna coil and the chip on its side facing the object is to be connected to an object with a plastic surface. The soluble carrier film used according to the invention can be provided in the same way with an antenna coil and a semiconductor chip as in the prior art.
So kann die Trägerfolie z. B. durch Auflaminieren einer Metallfolie oder einer Folie aus leitendem Kunststoff oder durch Aufdampfung, galvanisches Abscheiden oder Aufdrucken mit dem elektrisch leitenden Schichtmaterial versehen werden. Das Schichtmaterial kann dazu ein Metall, beispielsweise Aluminium oder Kupfer sein, oder eine elektrisch leitende Farbe oder dergleichen. Nach dem Beschichten wird das überschüssige Schichtmaterial unter Bildung der Antennenspule entfernt, beispielsweise durch ein Masken- Ätzverfahren, mit einem Laser, mechanisch oder dergleichen. Auch kann die Antennenspule direkt, z. B. mit Siebdruck mit einer elektrisch leitenden Farbe auf die Trägerfolie aufgedruckt werden. Anschließend wird der Halbleiterchip auf der Trägerfolie angeordnet und mit der Antennenspule in bekannter Weise verbunden.So the carrier film z. B. by laminating a metal foil or a film made of conductive plastic or by vapor deposition, galvanic deposition or printing with the electrically conductive layer material. For this purpose, the layer material can be a metal, for example aluminum or copper, or an electrically conductive paint or the like. After coating, the excess layer material is removed to form the antenna coil, for example by a mask etching process, with a laser, mechanically or the like. The antenna coil can also directly, for. B. with screen printing with an electrically conductive ink on the carrier film. The semiconductor chip is then arranged on the carrier film and connected to the antenna coil in a known manner.
Nicht nur die Gegenstände, auf denen der Transponder angebracht werden soll, sondern auch solche Transponder auf einer Trägerfolie werden heutzutage in ausgereifter Massenproduktion erzeugt. So existiert eine als Schichtmaterial auf eine Polyesterfolie aufgebrachte spiralförmige Antennenspule, bei der das innere Ende und das äußere Ende der Spule durch eine Brücke elektrisch verbunden sind, die sich auf der anderen Seite der Trägerfolie über die dazwischen liegenden Windungen der Antennenspule erstreckt und durch die Trägerfolie hindurch mit den beiden Enden der Antennenspule kontaktiert ist . Vorzugsweise wird dieses Massenproduktionsverfahren erfindungsgemäß übernommen, wobei lediglich die Polyesterfolie durch eine lösliche Folie ausgetauscht wird und die Brücke gegenüber den zwischen den beiden Enden der Antennenspule liegenden Windungen der Anten- nenspule zumindest an ihrer diesen Zwischenwindungen zugewandten Seite mit einer elektrischen Isolierung, die sich in dem Lösungsmittel nicht löst, beispielsweise einem Isolierlack, versehen werden zu braucht.Not only the objects on which the transponder is to be attached, but also such transponders on a carrier film are nowadays produced in mature mass production. For example, there is a spiral antenna coil applied as a layer material to a polyester film, in which the inner end and the outer end of the coil are electrically connected by a bridge which extends on the other side of the carrier film over the windings of the antenna coil lying between them and through the carrier film is contacted with both ends of the antenna coil. This mass production process is preferably adopted according to the invention, only the polyester film being replaced by a soluble film and the bridge opposite the turns of the antenna lying between the two ends of the antenna coil. need to be provided at least on its side facing these intermediate windings with electrical insulation which does not dissolve in the solvent, for example an insulating varnish.
Der Gegenstand, mit dem der Transponder versehen wird, kann z. B. ein Aufzeichnungsträger sein, beispielsweise eine CD oder eine DVD. Die Antennenspule kann dabei eine sich um das Mittelloch der CD oder des sonstigen Aufzeichnungsträ- gers erstreckende Rahmenform aufweisen.The object with which the transponder is provided can e.g. B. be a record carrier, for example a CD or a DVD. The antenna coil can have a frame shape that extends around the center hole of the CD or of the other recording medium.
Nachstehend ist die Erfindung anhand der beigefügten Zeichnung beispielhaft näher erläutert. Darin zeigen:The invention is explained in more detail below by way of example with reference to the accompanying drawing. In it show:
Figur 1 eine Draufsicht auf eine CD, die mit einem Transponder zur berührungslosen Datenübertragung versehen ist; undFigure 1 is a plan view of a CD, which is provided with a transponder for contactless data transmission; and
Figur 2a bis 2d schematisch das Verfahren, mit dem die im Schnitt dargestellte CD mit dem Transponder versehen wird.Figure 2a to 2d schematically the method with which the CD shown in section is provided with the transponder.
Gemäß Figur 1 ist eine CD 1 mit einem Mittelloch 2 mit einem Transponder zur berührungslosen Datenübertragung versehen, welcher aus einer Antennenspule 3 besteht, an die ein Chip 4 angeschlossen ist.According to FIG. 1, a CD 1 is provided with a center hole 2 with a transponder for contactless data transmission, which consists of an antenna coil 3 to which a chip 4 is connected.
Die CD 1 weist ein Scheckkartenformat auf. Ansonsten besitzt sie die übliche Stärke von z. B. 1,2 mm und ist nach einem üblichen Massenproduktionsverfahren aus zwei entsprechend dünnen Platten (5 und 6; Figur 2) zusammengefügt und zwar in genau definierter Art und Weise, unter Reinraumbedingungen, frei von statischen Aufladungen usw. Die Antennenspule 3 wird durch ein spiralförmiges, elektrisch leitendes Schichtmaterial gebildet, das eine rechteckige Rahmenform besitzt, die sich um das Mittelloch 2 erstreckt, mit zu den Längsseiten der kartenförmigen CD 1 parallelen Längsseiten des Rahmens.The CD 1 has a credit card format. Otherwise, it has the usual strength of z. B. 1.2 mm and is assembled by a conventional mass production process from two correspondingly thin plates (5 and 6; Figure 2) and in a precisely defined manner, under clean room conditions, free of static charges, etc. The antenna coil 3 is formed by a spiral, electrically conductive layer material which has a rectangular frame shape which extends around the central hole 2, with the longitudinal sides of the frame parallel to the long sides of the card-shaped CD 1.
Das innere Ende 3.1 und das äußere Ende 3.2 der spiralförmigen Antennenspule 3 sind durch eine elektrisch leitende Brücke 7 miteinander verbunden, welche sich über die Windungen der Antennenspule 3 erstreckt. Um die Brücke 7 gegenüber den Windungen der Antennenspule zu isolieren, ist beispielsweise ein nicht dargestellter Isolierlack an der Unterseite der Brücke 7, also zwischen der Brücke 7 und den Windungen der Antennenspule 3 aufgetragen.The inner end 3.1 and the outer end 3.2 of the spiral antenna coil 3 are connected to one another by an electrically conductive bridge 7, which extends over the turns of the antenna coil 3. In order to isolate the bridge 7 from the turns of the antenna coil, for example an insulating varnish, not shown, is applied to the underside of the bridge 7, that is to say between the bridge 7 and the turns of the antenna coil 3.
Die Brücke 7 ist in einem Eckbereich der rahmenförmigen Antennenspule 3 angeordnet. In dem anderen Eckbereich auf der gleichen Schmalseite der rahmenförmigen Antennenspule 3 ist die äußere Spulenwindung durch eine Aussparung 8 unterbrochen. In der Aussparung 8 ist der Chip 4 angeordnet, der an die durch die Unterbrechung gebildeten Enden 3.3 und 3.4 der Antenne 3 angebondet ist.The bridge 7 is arranged in a corner region of the frame-shaped antenna coil 3. In the other corner area on the same narrow side of the frame-shaped antenna coil 3, the outer coil turn is interrupted by a recess 8. The chip 4 is arranged in the cutout 8 and is bonded to the ends 3.3 and 3.4 of the antenna 3 formed by the interruption.
Gemäß Figur 2a bis 2d wird zur Herstellung der mit dem Transponder versehenen CD 1 eine Trägerfolie 10 verwendet, auf der auf der CD 1 zugewandten Seite die Antennenspule 3 z. B. mittels eines Ätzverfahrens aus einer auf die Folie 10 aufgebrachten Metallschicht hergestellt ist. Die Trägerfolie 10 weist zudem den an die Antennespule 3 angebondeten Chip 4 auf, ferner, was in Figur 2a bis 2d nicht zu sehen ist, die Brücke 7, und zwar auf der anderen, also von der CD 1 abgewandten Seite der Trägerfolie 10. Gemäß Figur 2a und 2b wird die Trägerfolie 10 mit Antennenspule 3, Chip 4 und Brücke 7 z. B. mit einem Kleber 9 mit der Seite der CD 1 verbunden, die der vom Laser abgetasteten Seite der CD 1 gegenüberliegt.According to FIGS. 2a to 2d, a carrier film 10 is used to produce the CD 1 provided with the transponder, on the side facing the CD 1, the antenna coil 3 z. B. is produced by means of an etching process from a metal layer applied to the film 10. The carrier film 10 also has the chip 4 bonded to the antenna coil 3, and furthermore, what cannot be seen in FIGS. According to Figures 2a and 2b, the carrier film 10 with antenna coil 3, chip 4 and bridge 7 z. B. connected with an adhesive 9 to the side of the CD 1, which is opposite the side of the CD 1 scanned by the laser.
Danach wird die Trägerfolie 10 mit einem Lösungsmittel, in dem sie sich auflöst, entfernt, sodass der mit der CD 1 verbundene Transponder aus der Antennenspule 3, dem Chip 4 und der Brücke 7 auf der CD 1 zurückbleibt (Figur 2c) . Anschließend wird ein Überzug 11 aufgetragen, der die Antennenspule 3, den Chip 4 und die Brücke 7 bedeckt.The carrier film 10 is then removed with a solvent in which it dissolves, so that the transponder connected to the CD 1 remains from the antenna coil 3, the chip 4 and the bridge 7 on the CD 1 (FIG. 2 c). Then a coating 11 is applied, which covers the antenna coil 3, the chip 4 and the bridge 7.
Erfindungsgemäß wird also der Transponder wie ein Label auf die sonst fertige CD aufgebracht. Mit dem erfindungsgemäßen Verfahren wird also nicht in die CD-Produktion eingegriffen, vielmehr schließt es sich an die CD-Produktion an. According to the invention, the transponder is thus applied to the otherwise finished CD like a label. The method according to the invention does not intervene in CD production, rather it follows CD production.

Claims

Patentansprüche claims
1. Verfahren zur Herstellung eines Gegenstandes (1) mit einem Transponder zur berührungslosen Datenübertragung unter Verwendung einer Trägerfolie (10) , die mit wenigstens einem Halbleiterchip (4) und einer Antennenspule (3) versehen ist, dadurch gekennzeichnet, dass eine Trägerfolie (10) aus einem Material verwendet wird, das in einem den Gegenstand (1) nicht angreifenden Lösungsmittel löslich ist, die mit dem Chip (4) und der Antennenspule (3) versehene Trägerfolie (10) mit dem Gegenstand (1) verbunden wird und anschließend die Trägerfolie (10) mit dem Lösungsmittel entfernt wird.1. A method for producing an object (1) with a transponder for contactless data transmission using a carrier film (10) which is provided with at least one semiconductor chip (4) and an antenna coil (3), characterized in that a carrier film (10) Made of a material that is soluble in a solvent that does not attack the object (1), the carrier film (10) provided with the chip (4) and the antenna coil (3) is connected to the object (1) and then the carrier film (10) is removed with the solvent.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Trägerfolie (10) mit dem Gegenstand (1) durch Kleben verbunden wird.2. The method according to claim 1, characterized in that the carrier film (10) with the object (1) is connected by gluing.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die mit dem Gegenstand (1) verbundene Antennenspule (3) und der Chip (4) nach dem Entfernen der Trägerfolie (10) mit einem Schutzüberzug (11) versehen werden.3. The method according to claim 1 or 2, characterized in that the antenna coil (3) connected to the object (1) and the chip (4) are provided with a protective coating (11) after the removal of the carrier film (10).
4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass als Antennenspule (3) ein spiralförmiges, elektrisch leitendes Schichtmaterial auf der Trägerfolie (10) verwendet wird.4. The method according to claim 1, characterized in that a spiral, electrically conductive layer material on the carrier film (10) is used as the antenna coil (3).
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass das innere (3.1) und das äußere (3.2) Ende der Antennenspule (3) durch eine Brücke (7) elektrisch verbunden werden, die sich über die dazwischen liegenden Windungen der Antennenspule (3) unter Zwischenschaltung einer elektrischen Isolierung erstreckt. 5. The method according to claim 4, characterized in that the inner (3.1) and the outer (3.2) end of the antenna coil (3) are electrically connected by a bridge (7) which extends over the turns between the antenna coil (3) extends with the interposition of electrical insulation.
6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass die Brücke (7) auf der der Antennenspule (3) und dem Halbleiterchip (4) gegenüberliegenden Seite der Trägerfolie (10) angeordnet ist und durch die Trägerfolie (10) hindurch mit den beiden Enden (3.1 und 3.2) der Antennenspule (3) kontaktiert ist.6. The method according to claim 5, characterized in that the bridge (7) on the antenna coil (3) and the semiconductor chip (4) opposite side of the carrier film (10) is arranged and through the carrier film (10) with both ends (3.1 and 3.2) of the antenna coil (3) is contacted.
7. Verfahren nach Anspruch 5 oder 6, dadurch gekennzeichnet, dass die Antennenspule (3) mit einer Unterbrechung versehen ist und der Halbleiterchip (4) an die durch die Unterbrechung gebildeten Enden (3.3 und 3.4) an die Antennenspule (3) angeschlossen ist.7. The method according to claim 5 or 6, characterized in that the antenna coil (3) is provided with an interruption and the semiconductor chip (4) is connected to the ends formed by the interruption (3.3 and 3.4) to the antenna coil (3).
8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Gegenstand (1) , mit dem der Transponder versehen wird, ein Aufzeichnungsträger ist . 8. The method according to any one of the preceding claims, characterized in that the object (1) with which the transponder is provided is a record carrier.
PCT/EP2001/000822 2000-02-02 2001-01-25 Method for production of an object with a transponder WO2001057794A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01905688A EP1252606A1 (en) 2000-02-02 2001-01-25 Method for production of an object with a transponder

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000104429 DE10004429C1 (en) 2000-02-02 2000-02-02 Manufacturing method for object provided with data transponder e.g. CD or DVD, has carrier foil supporting semiconductor chip and antenna coil applied to object surface and subsequently dissolved
DE10004429.8 2000-02-02

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