WO2001057964A1 - Differential signal electrical connector - Google Patents
Differential signal electrical connector Download PDFInfo
- Publication number
- WO2001057964A1 WO2001057964A1 PCT/US2001/003238 US0103238W WO0157964A1 WO 2001057964 A1 WO2001057964 A1 WO 2001057964A1 US 0103238 W US0103238 W US 0103238W WO 0157964 A1 WO0157964 A1 WO 0157964A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- shield
- signal
- connector
- strips
- electrical connector
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
- H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
- H01R12/737—Printed circuits being substantially perpendicular to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
Definitions
- a traditional arrangement for joining several printed circuit boards is to have one printed circuit board serve as a backplane. Other printed circuit boards, called daughter boards, are connected through the backplane.
- a traditional backplane is a printed circuit board with many connectors.
- the width of the shielding strips is varied based on the length of the signal contacts adjacent to them in order to increase the resonant frequency of the connector.
- each pair of signal blades will be connected to traces that carry differential signal within backplane 1 10.
- the ground blades will be connected to ground traces within backplane 110.
- all of the ground blades could be connected together within header 114. This arrangement results in differential pairs being interspersed with ground contacts - which is a preferred application for carrying high speed signals. It should be appreciated, though, that the structure of the invention might be applied in alternative applications.
- Cap 216 has openings 250 that receive the mating contact portions 224 and 242.
- Cap 216 is preferably made of an insulative material, such as plastic.
- FIG. 2 shows cap 216 sized to receive four wafer assemblies 205.
- Cap 216 could be made of arbitrary width to receive any number of wafer assemblies. In some embodiments, cap 216 will be wide enough to receive only a single wafer subassembly. Such a configuration is preferred when backplane shields 128 are used. Any convenient method can be used to secure the wafer assemblies to cap 216. In the illustrated embodiment, snap fit features are used.
- cap 216 will have an opening 250 that creates an area to receive the receptacles 224 of the signal contact wafer and the beams 242 of the shield wafers.
- the cap will preferably have features inside of opening 250 to position the receptacles 224 and beams 242 in the appropriate locations. It will have holes with lead- ins that direct blades from, the mating electrical connector into engagement with the mating portions 224 and 242.
- features inside cap 216 will spread the beams of mating contacts 224 to a desired opening distance to reduce insertion force. Further, those features will protect the free ends of the beams of the mating contacts to ensure that they do not stub on the blades as they are inserted from the mating electrical connector.
- shield blank 300 is shown.
- shield wafers 214 will be formed by insert molding plastic around shield blank 300 to form housing 220C.
- Insert molding housing 220C around shield blank 300 will secure the shield strips 312A...312E in place.
- One way to form shield blank 300 is to stamp the structure from a single sheet of metal.
- a phosphor bronze or other similar springy and low resistance metal might be used.
- the non-planar features - such as mating contact portions 242 and tails 240 — are then formed. If desired, the contact regions and tail regions can be plated with gold or other soft metal to enhance electrical connections either before or after the forming operation.
- FIG. 6 shows an enlarged portion of a signal wafer 210. Intermediate portions 226 of the signal contacts are embedded in insulative housing 220A. Insulative housing 220A has an upward projection 610 around each signal conductor.
- each signal contact is surrounded on four sides by the projecting region 610 of the insulative housing.
- This orientation can be achieved in the molding process by having small posts in one the surfaces of the mold that hold the signal contacts in place during the molding operation.
- FIG. 8B shows an alternative configuration.
- the air space 712 can be formed in the molding operation by having a projection in the surface of the mold.
- Air space 712 might be desirable to increase the coupling between the signal conductors in a pair, which might reduce noise in a differential configuration.
- air space 712 might increase the impedance of the differential pair.
- FIG. 9A the overlay of signal conductors and shield strips is shown, with the insulative housings 220A...220C fully cut away.
- FIG. 9A shows that, within each wafer assembly the signal conductor pairs 710 A...71 OE are a uniform spacing above and a respective shield strip 312A...312E. The edges of the shield strips 312A...312E generally follow the contour of the signal conductors in each of the pairs 710A...710E.
- FIG. 9 also illustrates that the mating contact portions 224 of the signal wafers are in line with the contact portions 242 of the shield strips such that each wafer assembly forms one column of contacts in the overall connector.
- the shield strips 312A...312E all have the same width. Because the overall connector performance is limited by the performance of the poorest performing pair, it might be desirable to increase the performance of some pairs even at the expense of others. Often, the longest leads in a connector perform the poorest. Electrical properties of the connector might be improved by selectively reducing the inductance of the various strips. For example, the resonant frequency of each of the strips might be equalized by reducing the inductance of the longer strips, such as 312E, more than the inductance of the shorter shield strips, such as 312A.
- the wafer assemblies are severed from the carrier strip and inserted into a cap to create a module.
- a plurality of modules are made and then, in a preferred embodiment, attached to a stiffener.
- Other components such as guidance pins and power modules are then attached to create a complete connector assembly.
- shield strips were formed by insert molding a plastic housing around metal strips. It would be possible to form the shield strips by metalizing the outer surface of the housings on the signal wafers. The same general shielding configuration could be attained. To ground the metallized regions, ground contacts could be disposed within the signal wafers 210 or 212.
- connector is described in connection with a right angle daughter card to backplane assembly application.
- the invention need not be so limited. Similar structures could be used for cable connectors, mezzanine connectors or connectors with other shapes.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01908772A EP1256148A1 (en) | 2000-02-03 | 2001-01-31 | Differential signal electrical connector |
AU2001236607A AU2001236607A1 (en) | 2000-02-03 | 2001-01-31 | Differential signal electrical connector |
JP2001557119A JP2003522387A (en) | 2000-02-03 | 2001-01-31 | Differential signal electrical connector |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/498,256 US6293827B1 (en) | 2000-02-03 | 2000-02-03 | Differential signal electrical connector |
US09/498,256 | 2000-02-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001057964A1 true WO2001057964A1 (en) | 2001-08-09 |
Family
ID=23980254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/003238 WO2001057964A1 (en) | 2000-02-03 | 2001-01-31 | Differential signal electrical connector |
Country Status (6)
Country | Link |
---|---|
US (1) | US6293827B1 (en) |
EP (1) | EP1256148A1 (en) |
JP (1) | JP2003522387A (en) |
CN (1) | CN1401147A (en) |
AU (1) | AU2001236607A1 (en) |
WO (1) | WO2001057964A1 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2007082763A1 (en) * | 2006-01-20 | 2007-07-26 | Tyco Electronics Nederland B.V. | Electrical connector |
WO2008002376A2 (en) | 2006-06-27 | 2008-01-03 | Fci Americas Technology, Inc. | Electrical connector with elongated ground contacts |
EP1662568A3 (en) * | 2004-11-24 | 2008-01-23 | General Electric Company | Power module, phase leg, and three-phase inverter |
JP2008262932A (en) * | 2001-11-14 | 2008-10-30 | Fci | Crosstalk reduction for electrical connector |
WO2008156857A2 (en) * | 2007-06-20 | 2008-12-24 | Molex Incorporated | Backplane connector with improved pin header |
WO2009102415A1 (en) * | 2008-02-12 | 2009-08-20 | Tyco Electronics Corporation | High-speed backplane connector |
US7731537B2 (en) | 2007-06-20 | 2010-06-08 | Molex Incorporated | Impedance control in connector mounting areas |
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US7789708B2 (en) | 2007-06-20 | 2010-09-07 | Molex Incorporated | Connector with bifurcated contact arms |
US7798852B2 (en) | 2007-06-20 | 2010-09-21 | Molex Incorporated | Mezzanine-style connector with serpentine ground structure |
US7867031B2 (en) | 2007-06-20 | 2011-01-11 | Molex Incorporated | Connector with serpentine ground structure |
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WO2021154813A1 (en) * | 2020-01-27 | 2021-08-05 | Amphenol Corporation | Electrical connector with high speed mounting interface |
US11637389B2 (en) | 2020-01-27 | 2023-04-25 | Amphenol Corporation | Electrical connector with high speed mounting interface |
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Also Published As
Publication number | Publication date |
---|---|
AU2001236607A1 (en) | 2001-08-14 |
US6293827B1 (en) | 2001-09-25 |
JP2003522387A (en) | 2003-07-22 |
EP1256148A1 (en) | 2002-11-13 |
CN1401147A (en) | 2003-03-05 |
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