WO2001063653A1 - Dispositif de circuit integre a semi-conducteurs et procede de production, et procede de production de masques - Google Patents
Dispositif de circuit integre a semi-conducteurs et procede de production, et procede de production de masques Download PDFInfo
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- WO2001063653A1 WO2001063653A1 PCT/JP2000/001096 JP0001096W WO0163653A1 WO 2001063653 A1 WO2001063653 A1 WO 2001063653A1 JP 0001096 W JP0001096 W JP 0001096W WO 0163653 A1 WO0163653 A1 WO 0163653A1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
Definitions
- the translator is the special logic ⁇ ⁇ H & 3 ⁇ 4r ⁇ W3 ⁇ 4 # 3 ⁇ 4S ⁇ «l3 ⁇ 4 3 ⁇ 4 ⁇ ⁇ ⁇ ⁇ 3 ⁇ 4 I ⁇ I I H ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
- LSIs are more suitable for transistor gates, and are fiber-reinforced by [ISM ⁇ It ⁇ ] per unit fiber; Because of this (3 ⁇ 4 »3 ⁇ 4a ⁇ pitch is watching EBf swiftly. Toriizumi pitch ⁇ « ma, current 3 ⁇ 4KrF eki, ⁇ use 0.8 power 0.4 ⁇ , further Ar F eki,) 1 It is thought that it can be destroyed down to 0.3 ⁇ m by using ⁇ . Then, as a ⁇ ? xn3 ⁇ 4 ⁇ ⁇ ⁇ The size is complex. On the other hand, the eye shift mask power S is known as ⁇ without changing ⁇ . This light is also referred to as the part on the mask.) The light passing through the mask is 18 Ot ⁇ ), and W ⁇ k ⁇ It will improve.
- LSI gate pattern LSI ⁇ Application is covered by ⁇ ⁇ ⁇ ⁇ 3 ⁇ 43 ⁇ 4 ⁇ 3 ⁇ 4 ⁇ 3 ⁇ 43 ⁇ 4 ⁇ 3 ⁇ 4 ”4 ⁇ ( ⁇ i 5-204131, 6-67403) 0 Reverted to Izumi by BJ Lin et al. Been! /, 8-227140).
- the present recommendation is applied to reduce the size of the fiber.
- ⁇ ⁇ ⁇ ⁇ tS can be applied to an arbitrary pattern created by the random key of the key LSI.
- FIG. 30 When the 3 ⁇ 4 pattern 5 is obtained, two masks V and 11 3 ⁇ 4 are formed as shown in FIG. 30 (a) (b) ⁇ rf, for example, a mask H ⁇ fe 2 Tied mouth
- the key may be set within the target 3 range, and the mask pattern may be further increased.
- the purpose of the bookshelf is to use the micro- ⁇ pattern with the gigantic method, the mochi-me shift mask, and the SS method of fcS: .
- a logic LSI such as a microcomputer having a random (unfamiliar IJ) and silent pattern can be implemented with low cost power Btf ⁇ 3 ⁇ 4 can do.
- ⁇ ⁇ optical lithography has been considered to be due to 0.15 ⁇ gap ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ 3 ⁇ 4 As a result, the cost can be reduced at a low cost.
- Honkan C (Ya's purpose is language LS Izumi putter ⁇ random (irregular ⁇ power swell large 3 ⁇ 43 ⁇ 4 «3 ⁇ 43 ⁇ 4putter ⁇ , but at most 2 (7X1 ⁇ eye shift mask In other words, a mask pattern that can be shifted by a period is added to the pattern at a low cost.
- the first shift mask iOT is a logic LSI, which has been regarded as a ⁇ pattern, and the ⁇ ⁇ ⁇ pattern is ⁇ Having a pattern It can be done by reversing.
- a photo-resistor, “Koto” and an opening pattern having L or ⁇ which are provided at the top of a book, may have an upper turn and an upper pattern of L or ⁇ .
- the first mask with the first c3 ⁇ 4te3 ⁇ 4 and above. Use the two masks consisting of the second mask with the second part, as described above. Many photoresists! ⁇ g The above is by light.
- the sensation 1 mask and the 2nd mask are passed through the eye shift mask.
- the sensation 1 mask and the 2nd mask are passed through the eye shift mask.
- the first shift mask which has both the pattern and the pattern, the pattern of the pattern and the pattern of the turn, and the above-mentioned
- the pseudo pattern is used in addition to the above, and the multi pattern exposure is performed so that the above pattern is obtained.
- Yet another ⁇ method for bookshelves is to use a mask with a «pattern, using a mask ( ⁇ ⁇ Pattern with line pattern
- Ur ⁇ i First ⁇ eyes shift mask and ⁇ 1 and 3 ⁇ 43 ⁇ 43 ⁇ 42 (3 ⁇ 43 ⁇ 43 ⁇ 41 ⁇ 3 ⁇ 43 ⁇ 43 ⁇ 4 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
- the ⁇ r ⁇ 2nd (the shift mask) is applied to the crane H3 ⁇ 4pattern profession ⁇ M by multi-lighting using an eye shift mask.
- the bookshelf which is also called a pattern and a disc on the disk
- a photoresist There is a photoresist in the opening provided, and there is a rooster in the opening.
- Mask ⁇ express (ie, opening clothes, photoresist film, fine power, conductive film, ⁇ mmm mmm ⁇ , -m ⁇ i ⁇ power patterning process) ⁇ ⁇ , f f 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇ 4 ⁇
- Fig. 1 (a) (b) ⁇ # This is a pattern that mimics the rooster spring pattern, which is a transitory pattern.
- Fig. 3 is a pattern diagram of the translation of the second watermelon in the translation and the second watermelon in this translation.
- Fig. 4 (a), (b), (c) The further illustration of the watermelon and the watermelon. It is a pattern of the other thigh ⁇ rf pattern in Fig. 5 ⁇ # ⁇ ⁇ 3 ⁇ 4 ⁇ 3 ⁇ 4 3 ⁇ 4 ⁇ 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 3 ⁇ 4 ⁇ 4 ⁇ ⁇ ⁇ ⁇ 3 ⁇ 4 ⁇ ⁇ ⁇ .
- Figure 8 is a retrospective showing the pattern
- FIG. 16 shows a pattern of ⁇ ⁇ that is related to a ⁇ pattern (3 ⁇ 43 ⁇ 4 ⁇ ⁇ 3 ⁇ 43 ⁇ 4 3 ⁇ 43 ⁇ 4, and Fig. 17 another one of f # (( ⁇ ⁇ 3 ⁇ 4 ⁇ ) (b) (c)
- the grip (M () (Yasari 3 ⁇ 4r ⁇ f Mo ⁇ 3 ⁇ 4, and Fig. 19
- Figure 20 (a)-(f) is another example of the ⁇ tj ⁇ pattern and Figure 21.
- the fountain pitch in Fig. 1 is the eye shift exposure 3 ⁇ 47 ⁇ « kyokai, wm ⁇ mx below (for example, 0.
- the black circle 8 putter is the lower 3H ⁇ (for example, a long via).
- Figure 1 (b) shows that a pattern of 0 on the eaves 0 of 0 and a pattern of 0 on the lattice ⁇ of ⁇ and a corresponding pattern of ⁇ on the pattern of ⁇ .
- the white background ( ⁇ Fuji 0 has a pattern of 0 degrees
- the fan has a pattern of 180 degrees with the remote eyes shifted (hereinafter ⁇ 3 ⁇ 4).
- the vein shield is (l) 3 te, to be laid down, to be laid on the eye. 2)
- the pattern of the remote eye o and the pattern of the eye ⁇ are mutually overlapping or overlapping.
- Figure 1 (b) shows these two types O (l3 ⁇ 43 ⁇ 43 ⁇ 4fA, B)
- each » ⁇ is ii3 ⁇ 4fc in Fig. 2 and _h3 ⁇ 4fc ⁇ ⁇ in Fig. 3.
- the shield must be at the point, or at the end of the f-turn or at the corner or at the head.
- the second mask uses the [ ⁇ ⁇ ⁇ eyes (the interval between the two patterns 55, 5 6 At least f3 ⁇ 4 ⁇ l3 ⁇ 4, the type A can be used. In addition, in this case, everything is uniformly set as a mask, but without doing so, only the typed distribution 3 ⁇ 4 ⁇ ; 3 ⁇ 43 ⁇ 4 is extracted as a mask.
- L3 ⁇ 4 In Fig. B3, it is caused by 59, which covers over the eaves of rice cake 0, and encroaches on the grid of eyes ⁇ . 1 ⁇ « ⁇ , 13 ⁇ 43 ⁇ 40 ⁇ part (L3 ⁇ 4) or vertical spring and tree ⁇ (T3 ⁇ 4)
- the power that occurs in this type ⁇ This is the type of digging and the two patterns that should be excavated. Will be separated.
- the original pattern is made into two mask patterns, such as the lower part in FIG. 3: ⁇ rf, and exposed to ⁇ H resist.
- the intuition of fih ⁇ : (LG or T) return to the town of No. 60
- the lower intuition is (Xya ⁇ 61, 6 2 Be cultivated. Even if it's hard, it's all about the turn's reciting.
- "W-type BCT ⁇ shield is resolved by self-advisory. It doesn't always turn like that, type B ((3 ⁇ 43 ⁇ 43 ⁇ 4f ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ .
- the turn and the mask no-turn, which is a grid of the remote shield position for Type B (73 ⁇ 43 ⁇ 43 ⁇ 4 ⁇ shield3 ⁇ 4), can be applied on a single ⁇ H mask. Or, by using the checker flag shape, it is possible to make a positive decision.
- the thick rooster spring 65 is filled by filling the ⁇ ⁇ 3 ⁇ 4 along the ⁇ ⁇ ⁇ child as shown in Fig. 4 (a) i ⁇ rf.
- This type C (fa3 ⁇ 4 ⁇ shield belongs to the » ⁇ case pattern on the child, which occurs in the 2 ⁇ 3 ⁇ 43 ⁇ 4 ⁇ ⁇ included in the above turn.
- This type of shield has a similarity to the original pattern in Fig. 5.
- the fiber is connected to two mask patterns as shown in the lower part of Fig. 5 in Fig. 5 and exposed by a ⁇ H resist.
- the shield that is, the pattern of the two masks, the pattern 66, the pattern of the second mask opposition, and the eye shift pattern 67, 68 From here, type C (3 ⁇ 43 ⁇ 4 ⁇ ; f ⁇ is touched.
- the type A or B (the pattern for ⁇ ) and the pattern for type C f! 3 ⁇ 43 ⁇ 4 ⁇ ⁇ ⁇ ⁇ ⁇ [[[[[[ While the pattern for the shield is placed at grid point Jd l, the pattern is type C ( ⁇ 3 ⁇ 43 ⁇ 4 ⁇ shield 3 ⁇ 4 ⁇ The pattern for the child is linear! ⁇ You need to jump on the H mask to make the sphere »r.
- ( ⁇ &) wants type A or ⁇ ⁇ and C3 ⁇ 4EHX can do ⁇ ⁇ ⁇ ⁇ rn rn ⁇ , while ⁇ ⁇ rn can type C fl3 ⁇ 43 ⁇ 4 ⁇ shield ⁇ Get close to roosters.
- Fig. 7 ⁇ ⁇ ⁇ of (Suppose that it is destroyed by a fan. This is i ⁇ i, ⁇ ( ⁇
- the shield pattern can be formed on a single ⁇ H first arrogant mask.Each pattern ( ⁇ eyes are, for example, individual pattern force 0, grid ⁇ , grid 0,.
- the mochi is a checkered flag-like ( ⁇ ⁇ ⁇ Eye shift Small ⁇ t method Equivalent to the above: HI: ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ .
- ⁇ PC is the first steel available for bookshelves
- Fig. 14 (a) shows the OP C ( ⁇ ) that matches the pattern on the line pattern mask.
- 80 is the original 3 ⁇ 4f tens pattern
- ⁇ is the last pattern.
- the pattern that has no foot up to the p job pattern is ⁇ mm!: ⁇ Small turn ⁇ li ⁇ Thicker than the length, (Length line pattern Izumi width, 13 ⁇ 4 ⁇ ⁇ « »It is very important to increase the number of turns left in the turn.
- the so-called hammer ⁇ riff ⁇ ) is applied to the patterns of the coftil on the mask. Nare, but [] Even if it's a killer, I'm a killer.
- FIGS. 14 (b) and (c) show the OP C ( ⁇ ) which corresponds to the pattern on the mask for lithography.
- these two-node patterns 86 may be inserted in order to prevent the occurrence of the above-mentioned contradictory patterns: t, c3 ⁇ 4 ⁇ ) S peripheral power S. If you have a strong job, these two-node patterns 86 should not be covered by the pattern originally.
- a fine EE ⁇ ⁇ mee pattern 87 7ag may be preliminarily placed at the surrounding lattice point Ji of the c3 ⁇ 43 ⁇ 4 pattern. (B)). ⁇ of these dummy patterns 87 may be performed according to the eyes. These node patterns 86 or dummy patterns 87 can be self-defining, but FIG. 15 (c); Auxiliary turn 88 can also be used. This ⁇ turn 8 8 (3 ⁇ 4m ⁇ ⁇ , the child point ⁇ is not intense, ⁇ ⁇ ⁇ i3 ⁇ 43 ⁇ 4ift from the center of the turn.
- FIGS. 18 (a), (b), and (c) a line pattern mask 99 is shown on the left side, and a remote office ⁇ is shown on the right side.
- the mask for the turn 100 is shown.
- FIG. 18 (a) shows the mask pattern before the masking
- FIGS. 18 (b) and (c) the mask pattern after the daughter.
- 3 ⁇ 4 ⁇ 1 ⁇ 2 has a type B (3 ⁇ 4ig ⁇ f ⁇ ⁇ , ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ; ⁇ ⁇ ⁇ ⁇ ).
- Figure 19 shows the type B inconsistency ⁇ ! ⁇ Turn and its (3 ⁇ 43 ⁇ 43 ⁇ 43 ⁇ 43 ⁇ 4 «3 ⁇ 4 ⁇ ⁇ .
- Type B The pattern of the TO form 106 drawn with ⁇ in Fig. 19 ⁇ h3 ⁇ 4, centered on 9, can be replaced with the pattern of ⁇ ⁇ ⁇ ⁇ ⁇ as shown in the figure ⁇ .
- the result of obtaining the common unit of the northern pattern 101 and the ten patterns 102 is HE, and the type B restaurant on the @ ⁇ translation?
- a pattern obtained by finding a common pattern of the pattern 104 and the intellectual pattern 102 is referred to as a type B fan-turn 105 on the line sound laboratory shelf mask.
- the pattern and rules of the rule are: r. ⁇ ⁇ ⁇ Type B on the translator mask ⁇ turn ( ⁇ eyes can move to the coordinates of the grid point where each pattern is ⁇ .
- the width is thick!
- I have to force the face to be Bg, but in the distance, it is also possible to go to the ⁇ ⁇ 3 ⁇ 4 ⁇ 3 ⁇ 4 ⁇ mansion and the lake.
- he is warned by a male, for example, as if he had been holding back 27 f.
- the ry M3 ⁇ 4 angle ⁇ ⁇ is extracted from the 27th Lb3 ⁇ 43 ⁇ 43 ⁇ 4s tenth degree.
- a certain pattern is extracted, and it is assumed that the shift near the 3 ⁇ 4f is a remote shift, and that the shift of the rice cake is adopted as shown in FIG.
- the mochi-eye shift TOW ⁇ pattern is assigned, for example, an eye of 0 degrees, and after being pressed, the eye shift iiTO ⁇ ] and the above pattern, respectively, are assigned.
- the pattern 1 1 1 like ⁇ 2 1 3 ⁇ 4 ⁇ 3 ⁇ 4 ⁇ ⁇ is extracted, and the contradiction is extracted; ⁇ I with the pattern, the original pattern 1 1 1 3 ⁇ 4 ⁇ 2 1 In the figure, ⁇ is applied to the masks 1 2, 1 1 3 in the form of 2 ⁇ like 3 ⁇ 4 ⁇ 3 ⁇ 4 ⁇ rf.
- the inconsistency of all the existing lines was masked by adding the inconsistency pattern.
- two masks 1 1 4 1 1 5 Again, the pattern on the first mask may be changed between the patterns on the second mask.
- SEE (A dX XSIZE (A dX YSIZE (A d) represents each side of the medical form A, and ⁇ f3 ⁇ 4, x ⁇ [3 ⁇ 4, and y represent state shells from the law of d A!
- the w is the wisteria which is difficult only by d, AND, ten, — is the Xie Buno: ⁇ f.
- the input is the original ( ⁇ ten patterns ⁇ ⁇ one, the es mask is the rice cake ⁇
- the open pattern of the mask for Xiao Line mask is the line pattern, and the opening pattern of the mask is cut off.
- w ⁇ 3H pattern ⁇ equal to 3 ⁇ 4 ⁇ 3 ⁇ 4 ⁇ periodic powder.
- ⁇ ⁇ ⁇ and ⁇ are the E parameters of the type ⁇ and the type BcOfia3 ⁇ 4 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
- VL YSIZE (VS; w): vertical lines
- HL— 0 AND (HL, H—0 degree): horizontal lines with 0 degree
- HL_p AND (HL, H_p degree): horizontal lines with p degree
- VL— 0 AND (VL, V— 0 degree): "vertical lines with 0 degree"
- VLJD two AND (VL, V_p degree): "vertical lines with p degree"
- LN-1 0 HL_0 + VL_0 (lines with 0 degree "
- X_pp m (HL_p, VLJD) "cross point of p degree H-lme and p degree V-line"
- typeA-1 0 XSIZE (XSIZE (L _0; w / 2); -w / 2) + YSIZE (YSIZE (0; w / 2); i / 2)-L-0
- Res— A AND ((XSIZE (typeA; w) + YSIZE (typeA; w)), LE)
- P_nodel AND (XSIZE (Node; 2w) + YSIZE (Node; 2w)-SIZE (Nodelw), input) possible peripheral node
- B SIZE (AND (A , input) -Node; w)
- C SIZE (AB; w)
- Res—mask SIZE (Res A; dA) + AND (SIZE (Res— B; dB), input) + SIZE (P-node; 'Patterns for line mask ":
- a mask 1A was attached to the fiber ( ⁇ Aha) side as shown in the following figure 2A, and a fffi combination ⁇ ⁇ r ⁇ attached to the mask 1A. Exposure was performed after the combination of Fig. 22 (b)). For exposure, use the opening 3 ⁇ 4 ⁇ 0.6, which is the KrF exotherm contractor ⁇ g ⁇ f), then expose the mask ⁇ ⁇ ⁇ @ ⁇ ( Figure 22 (c)) 0 At this time, the side attached ⁇ i: ⁇ ® In order to do the ⁇ that arises, ⁇ ⁇ , ⁇ , ⁇ ⁇ , this is fixed on one stage These two masks are exposed. Fig.
- FIG. 23 shows the exposure of the light that In the resist, the iSoS of the light is converted into light, and the resist becomes soluble.
- the pattern was almost as perceived as a knowledge pattern ( ⁇ it can be seen that the force was able to be generated by fraud.
- door rotation was performed, and the resist film starved image As a result, the door; the pattern should be 15 resists. A resist was observed (Fig. 22 (d)).
- the resist pattern 16 is used as an etching mask.
- use »» ⁇ ⁇ apply a hard mask to Al IUi and use # ihl ⁇ ⁇ , apply a resist on top, and expose and develop two masks. Use the resulting resist pattern as a mask
- An Ai rooster pattern may be obtained by etching the base. Also, the exposure of the above two masks was not affected. After exposing the first mask to ⁇ : ⁇ , the upper mask c ⁇ ⁇ and then re-applying the second mask It's okay to expose it according to the above statement.
- the first mask 24 is fixed to the mask 3 ⁇ 43 ⁇ 4 stage mf), and a ( ⁇ > 3 ⁇ 4 ⁇ mark 25 on the first mask 24 is detected.
- the first mask 2 4 is exposed to the resist film Oa ⁇ rf) on the surface 21 in the form of a dilatation lens 26 3 ⁇ 4 ⁇ Figure 24 (a)).
- stepper ⁇ performed with ⁇ H, which stopped the light with the mask as a mask
- the exposure was performed while scanning the surface as @@ 1.
- the chip size on the mask is less than 1 )
- the size of the powder on the mask is smaller than the powder of 1 ⁇ , and the pattern on the mask 1 (1 pattern) and the pattern on the mask 2
- the first pattern and the second pattern or the like are collectively exposed to the door of Sfeii.
- the ⁇ A stage is made difficult by an offset corresponding to the first pattern and the second pattern on the mask by the ⁇ A space, and the n 1 pattern and the second pattern are seeded.
- the second exposure i can be superimposed on the second exposure i W on the first exposure and the second exposure i.
- the first pattern: ⁇ extinction and the second pattern: ⁇ from can be applied to the wafer without using the masking mask ⁇ " «
- FIG. 25 is a schematic diagram 3 showing the $ £ t process of the above ⁇ using a denomination.
- Fig. 28 shows the pattern of the NAND cell itself ⁇ .
- the ⁇ # is converted to «3 ⁇ 43 ⁇ 4 and « ⁇ Sf «3 ⁇ 43 ⁇ 4 is used for t $ ⁇ .
- source drain gate gate electronics is cast!
- iiffl dew and resist process ⁇ ! By doing Since the size of the pattern can be J, it is also possible that ⁇ is smaller than 0.3 ⁇ m pitch, that is, smaller than 0.15 m. It is possible to obtain a patrol that can take over the LSI by arresting the rivalry. For example, by setting the numerical aperture of Kr F ex ⁇ "to 0.6 force 0.68 The main putter ISf 10 "is removed by 10 0 / separate, and the ArF excimer is put by iOT.
- this translation is not limited to such a pattern ⁇ castle ⁇ iffl, but also «« element structure m- ⁇ ⁇ ⁇ m: si «body» 3 ⁇ 4 » ⁇ ] ⁇ 3 ⁇ 4 ⁇ ⁇ ⁇ ⁇ field pattern I can do it.
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/149,714 US6811954B1 (en) | 2000-02-25 | 2000-02-25 | Semiconductor integrated circuit device and method of manufacturing the same, and method of manufacturing masks |
CNB008174814A CN1191610C (zh) | 2000-02-25 | 2000-02-25 | 半导体集成电路器件、其制造方法和掩模的制作方法 |
PCT/JP2000/001096 WO2001063653A1 (fr) | 2000-02-25 | 2000-02-25 | Dispositif de circuit integre a semi-conducteurs et procede de production, et procede de production de masques |
AU2000226927A AU2000226927A1 (en) | 2000-02-25 | 2000-02-25 | Semiconductor integrated circuit device and method of producing the same, and method of producing masks |
KR10-2002-7007856A KR100475621B1 (ko) | 2000-02-25 | 2000-02-25 | 반도체 집적 회로 장치, 그 제조 방법 및 마스크의 제작방법 |
JP2001562742A JP4009459B2 (ja) | 2000-02-25 | 2000-02-25 | 半導体集積回路装置の製造方法及びマスクの作製方法 |
TW089107694A TW464945B (en) | 2000-02-25 | 2000-04-24 | Manufacturing method of semiconductor IC device and fabrication method of mask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2000/001096 WO2001063653A1 (fr) | 2000-02-25 | 2000-02-25 | Dispositif de circuit integre a semi-conducteurs et procede de production, et procede de production de masques |
Publications (1)
Publication Number | Publication Date |
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WO2001063653A1 true WO2001063653A1 (fr) | 2001-08-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2000/001096 WO2001063653A1 (fr) | 2000-02-25 | 2000-02-25 | Dispositif de circuit integre a semi-conducteurs et procede de production, et procede de production de masques |
Country Status (7)
Country | Link |
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US (1) | US6811954B1 (ja) |
JP (1) | JP4009459B2 (ja) |
KR (1) | KR100475621B1 (ja) |
CN (1) | CN1191610C (ja) |
AU (1) | AU2000226927A1 (ja) |
TW (1) | TW464945B (ja) |
WO (1) | WO2001063653A1 (ja) |
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JP2004110035A (ja) * | 2002-09-16 | 2004-04-08 | Numerical Technologies Inc | 大きいフィーチャに隣接する狭いスペースをプリントする際にpsm露光を支援するための第2の露光の使用 |
JP2007086587A (ja) * | 2005-09-26 | 2007-04-05 | Renesas Technology Corp | マスクパターン設計方法および半導体装置の製造方法 |
JP2007086586A (ja) * | 2005-09-26 | 2007-04-05 | Renesas Technology Corp | マスクパターン設計方法および半導体装置の製造方法 |
JP2007328323A (ja) * | 2006-04-06 | 2007-12-20 | Asml Masktools Bv | ダークフィールド二重双極子リソグラフィ(ddl)を実行する方法および装置 |
JP2009076677A (ja) * | 2007-09-20 | 2009-04-09 | Fujitsu Microelectronics Ltd | 半導体装置の製造方法及びフォトマスクの設計方法 |
US7820364B2 (en) | 2006-01-16 | 2010-10-26 | Fujitsu Semiconductor Limited | Semiconductor device manufacturing method, mask manufacturing method, and exposure method |
CN104459998A (zh) * | 2015-01-06 | 2015-03-25 | 四川大学 | 一种基于液体棱镜的rgb三色光转换器 |
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- 2000-02-25 CN CNB008174814A patent/CN1191610C/zh not_active Expired - Fee Related
- 2000-02-25 WO PCT/JP2000/001096 patent/WO2001063653A1/ja active IP Right Grant
- 2000-02-25 AU AU2000226927A patent/AU2000226927A1/en not_active Abandoned
- 2000-02-25 US US10/149,714 patent/US6811954B1/en not_active Expired - Fee Related
- 2000-02-25 KR KR10-2002-7007856A patent/KR100475621B1/ko not_active IP Right Cessation
- 2000-02-25 JP JP2001562742A patent/JP4009459B2/ja not_active Expired - Fee Related
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Cited By (12)
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JP2004110035A (ja) * | 2002-09-16 | 2004-04-08 | Numerical Technologies Inc | 大きいフィーチャに隣接する狭いスペースをプリントする際にpsm露光を支援するための第2の露光の使用 |
JP2007086587A (ja) * | 2005-09-26 | 2007-04-05 | Renesas Technology Corp | マスクパターン設計方法および半導体装置の製造方法 |
JP2007086586A (ja) * | 2005-09-26 | 2007-04-05 | Renesas Technology Corp | マスクパターン設計方法および半導体装置の製造方法 |
US7820364B2 (en) | 2006-01-16 | 2010-10-26 | Fujitsu Semiconductor Limited | Semiconductor device manufacturing method, mask manufacturing method, and exposure method |
JP2007328323A (ja) * | 2006-04-06 | 2007-12-20 | Asml Masktools Bv | ダークフィールド二重双極子リソグラフィ(ddl)を実行する方法および装置 |
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JP4729527B2 (ja) * | 2006-04-06 | 2011-07-20 | エーエスエムエル マスクツールズ ビー.ブイ. | ダークフィールド二重双極子リソグラフィ(ddl)を実行する方法および装置 |
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CN104459998A (zh) * | 2015-01-06 | 2015-03-25 | 四川大学 | 一种基于液体棱镜的rgb三色光转换器 |
Also Published As
Publication number | Publication date |
---|---|
TW464945B (en) | 2001-11-21 |
CN1191610C (zh) | 2005-03-02 |
JP4009459B2 (ja) | 2007-11-14 |
CN1413356A (zh) | 2003-04-23 |
US6811954B1 (en) | 2004-11-02 |
KR100475621B1 (ko) | 2005-03-15 |
AU2000226927A1 (en) | 2001-09-03 |
KR20020060269A (ko) | 2002-07-15 |
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