WO2001067144A2 - Integrated optical transceiver and related methods - Google Patents
Integrated optical transceiver and related methods Download PDFInfo
- Publication number
- WO2001067144A2 WO2001067144A2 PCT/US2001/007053 US0107053W WO0167144A2 WO 2001067144 A2 WO2001067144 A2 WO 2001067144A2 US 0107053 W US0107053 W US 0107053W WO 0167144 A2 WO0167144 A2 WO 0167144A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- light source
- detector
- optical transceiver
- detectors
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
Definitions
- the present invention is therefore directed to an integrated optical transceiver which substantially overcomes one or more of the problems due to the limitations and disadvantages of the related art.
- an optical transceiver including at least one light source on a first surface of a substrate, at least one detector on the first surface of the substrate, at least one of the at least one light source and the at least one detector being mounted on the substrate, the at least one detector to receive light other than from the at least one light source, and an optics block having optics thereon.
- the optics are for both the at least one light source and the at least one detector.
- the optics block is attached to the substrate.
- the at least one light source and the at least one detector may be of different materials.
- One of the at least one light source and the at least one detector may be monolithically integrated with the substrate.
- a spacer may be provided between the substrate and the optics block. The spacer may completely surround the periphery of the optics block.
- the spacer may include a plurality of separate spacers provided in the periphery of the optics block.
- Optics for the at least one light source and the at least one detector have the same design.
- Optics for the at least one light source may be formed on an opposite side of the optics block from optics for the at least one detector.
- the at least one light source may be a vertical cavity surface emitting laser.
- Interconnection features may be provided on the first surface of the substrate for the at least one light source and the at least one detector. The interconnection features may be on a same side or may be on opposite side of the first surface of the substrate for the at least one light source and the at least one detector.
- the at least one light source may be an array of light sources and the at least one detector may be an array of detectors.
- the array of light sources and the array of detectors may be parallel or may form a line.
- an optical transceiver including providing a plurality of detectors on a first surface of a first wafer, providing a plurality of light sources on the first surface of the first wafer, at least one of the plurality of detectors and the plurality of light sources being mounted on the first wafer, providing electrical interconnections for each of the plurality of detectors and each of the plurality of light sources on the first surface of the first wafer, providing an optics block having at least one optical element for each of the plurality of detectors and each of the plurality of light sources, providing a vertical spacer between the optics block and the first wafer, attaching the vertical spacer, the optics block and the first wafer to one another, and separating the first wafer into a plurality of transceiver, each transceiver having at least one light source and at least one detector.
- the providing of the optics block may include forming the at least one optical element for each of the plurality of detectors and each of the plurality of light sources on a second wafer and attaching the second wafer to the first wafer before the separating, the separating allowing access to the electrical interconnections.
- the providing of the vertical spacer may include forming vertical spacers for each of the transceivers on a spacer wafer and attaching the spacer wafer to the first wafer before the separating, the separating allowing access to the electrical interconnections.
- the providing of the optics block may include forming the at least one optical element for each of the plurality of detectors and each of the plurality of light sources on a second wafer and attaching the second wafer to the spacer wafer and the first wafer before the separating, the separating allowing access to the electrical interconnections.
- the attaching may include directly attaching the second wafer to the spacer wafer.
- the providing of one of the plurality of light sources and the plurality of detectors may include monolithically integrating into the first wafer.
- the providing of electrical interconnections for each of the plurality of detectors and each of the plurality of light sources may include using a same mask for both interconnections to the detectors and the light sources.
- Figure 1 is an elevational exploded top view of an optical transceiver of the present invention
- Figure 2 is an elevational side view of another optical transceiver of the present invention.
- Figure 3 is a top view of another configuration of the light sources and detectors on the same substrate
- Figure 4 is a schematic side view of the creation of multiple transceivers in accordance with the present invention
- Figure 5 is an exploded elevational perspective view of an interface in conjunction with fibers in a housing and the transceiver of the present invention.
- an optical transceiver 100 includes a light source array 102, here shown as a vertical cavity side emitting laser (VCSEL) array, and a detector array 104 are integrated on a silicon wafer 106. Silicon interconnect tracks 108 supply power to the active elements 102, 106 and pads 110 allow the detector signals to be read out.
- VCSEL vertical cavity side emitting laser
- An optics block 120 contains two sets of integrated optics, one set 122 for the light source array 102 and one set 124 for the detector array 104.
- the integrated optics 122 for the light source receive light from the light source array 102 and direct the light to a desired application.
- the integrated optics 124 for the detectors receive light from a desired application and direct the light to the detector array 104.
- the optics may be diffractives, refractives or hybrids thereof and may be formed lithographically on the optics block 120.
- the integrated optics 122, 124 for the light source array and the detector array may include optical elements formed on either or both surfaces of the optics block 120. Since the optics for both the light source array and the detector array are aligned simultaneously, the assembly and alignment steps required for creating a transceiver are reduced. Further, the integration allows the transceiver to be smaller and have fewer parts. Depending upon the material used for the substrate, either the detector array or the light source array may be monolithically integrated therein.
- the transceiver 100 also includes a spacer 130 between the active elements and the optics block 120.
- the spacer may be an integrated spacer surrounding the perimeter of the optics block, as shown in Figure 1.
- the spacer may be a separate element, formed in the optics block or formed in the substrate.
- the bonded structure of a transceiver 200 is shown. Rather than having a spacer 130 around the perimeter of the optics block 120, separate spacer elements 230 are positioned at the corners of the optics block. Also, the optics 222 for the light sources 202 are on a different surface of the optics block 220 than the optics 224 for the detectors 204. These optics for both the light sources and the detectors may have the same design. Again light sources 202 and detectors 204 are on the same substrate 206, and one of them may be monolithically integrated therein. Silicon tracks 208 and pads 208 for providing power and signals to and from the active elements are also on the substrate.
- Figure 3 is a top view of a transceiver 300 in accordance with another embodiment of the present invention.
- the active elements rather than having the active elements 102, 104 arranged in parallel arrays, the active elements form a linear array.
- four light sources 102 and four detectors 104 are in a line. The spacing there between reduces cross-talk between the active devices.
- Corresponding optical elements 122,124 are also now in a single line. This configuration allows a standard 1 x 12 fiber array to be connected with the transceiver. This configuration also allows all the required interconnection to be provided on a same side of the substrate 106, thereby allowing the optics block 120 and the substrate 106 to share a common edge, which may facilitate manufacturing at the wafer level.
- the spacer wafer 130 in addition to surrounding the perimeter of the optics block 120, also includes an isolating portion 132 between the two types of electro- optical elements 102, 104.
- This isolating portion 132 may be coated with a metal to further reduce cross-talk between the electro-optical elements. The closer the electro-optical components, the more important isolation becomes.
- the isolating portion 132 may also be provided in any of the other configurations.
- the components may be attached using wafer-to-wafer bonding techniques, as set forth, for example, in U.S. Patent Nos. 6,096,155 and 6,104,690, commonly assigned, which are hereby incorporated by reference in their entirety for all purposes.
- wafer is meant to generally refer to any structure having more than one component which is to be separated for final use.
- FIG. 4 A particular example of wafer bonding all three substrates together before separating is shown in Figure 4.
- the individual transceivers may be realized by separating the substrate 106 containing the light sources 102 and detectors 304 at the appropriate points.
- the detectors 304 are monolithically integrated into the substrate 106. Whichever active element to be provided on the substrate has the higher effective yield is preferably the monolithically integrated element, since the monolithically integrated elements will not be able to be substituted out.
- the metalization required for the electrical connections for both the monolithically integrated element and the additional active element on the substrate are formed using the same mask set as that for forming the monolithically integrated element. This helps insure precise alignment, since the active element to be mounted can use its metalization to provide its alignment, e.g., by solder self-alignment.
- the active elements that are to be mounted on the substrate may then be tested before being mounted. After mounting, they may be tested again and replaced if required before the wafer bonding.
- bonding may include any type of attachment, including the use of bonding materials, surface tension or directly forming on the same substrate.
- separating may include any means for realizing individual components, e.g., dicing. Further examples of separating wafers when creating modules having electro-optical elements may be found in related to the commonly assigned, co-pending application entitled “Separating of Electro-Optical Integrated Modules and Structures Formed Thereby", attorney docket number DOC.072P, filed concurrently herewith, the entire contents of which are hereby incorporated by reference for all purposes.
- the alignment of the active elements to the input and output ports corresponding thereto, typically fibers, is particularly important.
- FIG. 5 One configuration for insuring proper alignment between the transceiver and fibers is shown in Figure 5.
- a plurality of fibers 410 are inserted into a ferrule 412.
- the active elements of the present invention here the linear configuration as shown in Figure 3, which are to be in communication with the fibers 410, are preferably provided on a silicon bench or sub- mount 416, corresponding to the common substrate 106 in Figure 3.
- this silicon bench 416 is preferably provided on a substrate 418.
- An optics block 420 provides at least one optical element between each opto-electronic device on the sub-mount 416 and a corresponding fiber 410.
- the optics block 420 is preferably spaced from the opto- electronic devices by a spacer 415.
- the optical elements preferably include elements which collimate, focus, homogenize or otherwise couple the light. Since the optics block has two surfaces, two optical elements may be provided thereon. Further, if required, additional optics blocks may be bonded to and spaced from the optics block 420 to provide additional surfaces, as with any of the previous transceiver configurations..
- a mechanical interface 422 aligns the optics block 420, which is already aligned with the electro-optical devices, with the fibers 410. This may be achieved by the provision of alignment features on both the mechanical interface 422 and the ferrule 412 housing the fibers 410.
- these alignment features consist of holes 424 in the ferrule 412, which are already typically present for aligning the ferrule with other devices, and alignment holes 426 in the mechanical interface 422. Once these alignment holes 424, 426 are aligned, an alignment pin, not shown, may then be inserted therein to maintain the aligned position. Further details of such interfaces may be found, for example, in commonly assigned, co-pending application U.S. Serial No. 09/418,022 entitled "Optical Subassembly" which is incorporated by reference in its entirety for all purposes. While the present invention is described herein with reference to illustrative embodiments for particular applications, it should be understood that the present invention is not limited thereto.
Abstract
Description
Claims
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001566062A JP2003526909A (en) | 2000-03-06 | 2001-03-06 | Integrated optical transceiver and related method |
CA002401976A CA2401976A1 (en) | 2000-03-06 | 2001-03-06 | Integrated optical transceiver and related methods |
AU2001247286A AU2001247286A1 (en) | 2000-03-06 | 2001-03-06 | Integrated optical transceiver and related methods |
EP01920210A EP1269239A2 (en) | 2000-03-06 | 2001-03-06 | Integrated optical transceiver and related methods |
US11/127,284 US7375315B2 (en) | 2001-03-06 | 2005-05-12 | Integrated optical transceiver and related methods |
US11/651,525 US20070181781A1 (en) | 2001-03-06 | 2007-01-10 | Integrated optical transceiver |
US11/931,767 US7842914B2 (en) | 2000-03-06 | 2007-10-31 | Optoelectronic package, camera including the same and related methods |
US12/379,279 US7750289B2 (en) | 2000-03-06 | 2009-02-18 | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon |
US12/801,941 US20100272390A1 (en) | 2000-03-06 | 2010-07-02 | Integrated optical transceiver |
US13/285,706 US20120155798A1 (en) | 1999-10-14 | 2011-10-31 | Integrated optical device including substrates stacked along an optical axis thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18703400P | 2000-03-06 | 2000-03-06 | |
US60/187,034 | 2000-03-06 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/418,365 Continuation-In-Part US6406195B1 (en) | 1999-10-14 | 1999-10-14 | Interface between opto-electronic devices and fibers |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/231,483 Continuation-In-Part US20040041081A1 (en) | 1999-10-14 | 2002-08-30 | Integrated optical transceiver and related methods |
US10/231,483 Continuation US20040041081A1 (en) | 1999-10-14 | 2002-08-30 | Integrated optical transceiver and related methods |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001067144A2 true WO2001067144A2 (en) | 2001-09-13 |
WO2001067144A3 WO2001067144A3 (en) | 2002-08-15 |
Family
ID=22687346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/007053 WO2001067144A2 (en) | 1999-10-14 | 2001-03-06 | Integrated optical transceiver and related methods |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1269239A2 (en) |
JP (1) | JP2003526909A (en) |
CN (1) | CN100354671C (en) |
AU (1) | AU2001247286A1 (en) |
CA (1) | CA2401976A1 (en) |
WO (1) | WO2001067144A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2462525A (en) * | 2008-08-13 | 2010-02-17 | Avago Technologies Fiber Ip | Optical transceiver system |
US10099554B2 (en) | 2011-08-29 | 2018-10-16 | Automotive Coalition For Traffic Safety, Inc. | System for non-invasive measurement of an analyte in a vehicle driver |
US10710455B2 (en) | 2013-08-27 | 2020-07-14 | Automotive Coalition For Traffic Safety | Systems and methods for controlling vehicle ignition using biometric data |
US11513070B2 (en) | 2019-06-12 | 2022-11-29 | Automotive Coalition For Traffic Safety, Inc. | System for non-invasive measurement of an analyte in a vehicle driver |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4871224A (en) * | 1988-03-31 | 1989-10-03 | Siemens Aktiengesellschaft | Device for optical connections of one or more optical emitters with one or more optical detectors of one or more integrated circuits |
US5170269A (en) * | 1991-05-31 | 1992-12-08 | Texas Instruments Incorporated | Programmable optical interconnect system |
US5266794A (en) * | 1992-01-21 | 1993-11-30 | Bandgap Technology Corporation | Vertical-cavity surface emitting laser optical interconnect technology |
EP0729143A2 (en) * | 1995-02-24 | 1996-08-28 | Sony Corporation | Optical device |
US5638469A (en) * | 1991-11-05 | 1997-06-10 | Mcnc | Microelectronic module having optical and electrical interconnects |
US5764832A (en) * | 1993-03-24 | 1998-06-09 | Fujitsu Limited | Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove |
US5771218A (en) * | 1996-09-27 | 1998-06-23 | Digital Optics Corporation | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
WO1999040578A1 (en) * | 1998-02-05 | 1999-08-12 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
US5978401A (en) * | 1995-10-25 | 1999-11-02 | Honeywell Inc. | Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5093879A (en) * | 1990-06-22 | 1992-03-03 | International Business Machines Corporation | Electro-optical connectors |
JPH10126002A (en) * | 1996-10-23 | 1998-05-15 | Matsushita Electron Corp | Optical transmission module |
JPH11311721A (en) * | 1998-02-27 | 1999-11-09 | Oki Electric Ind Co Ltd | Optical coupling module and its manufacture |
JP3610235B2 (en) * | 1998-07-22 | 2005-01-12 | キヤノン株式会社 | Surface light emitting device |
-
2001
- 2001-03-06 CA CA002401976A patent/CA2401976A1/en not_active Abandoned
- 2001-03-06 WO PCT/US2001/007053 patent/WO2001067144A2/en not_active Application Discontinuation
- 2001-03-06 CN CNB018061753A patent/CN100354671C/en not_active Expired - Fee Related
- 2001-03-06 EP EP01920210A patent/EP1269239A2/en not_active Withdrawn
- 2001-03-06 JP JP2001566062A patent/JP2003526909A/en active Pending
- 2001-03-06 AU AU2001247286A patent/AU2001247286A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4871224A (en) * | 1988-03-31 | 1989-10-03 | Siemens Aktiengesellschaft | Device for optical connections of one or more optical emitters with one or more optical detectors of one or more integrated circuits |
US5170269A (en) * | 1991-05-31 | 1992-12-08 | Texas Instruments Incorporated | Programmable optical interconnect system |
US5638469A (en) * | 1991-11-05 | 1997-06-10 | Mcnc | Microelectronic module having optical and electrical interconnects |
US5266794A (en) * | 1992-01-21 | 1993-11-30 | Bandgap Technology Corporation | Vertical-cavity surface emitting laser optical interconnect technology |
US5764832A (en) * | 1993-03-24 | 1998-06-09 | Fujitsu Limited | Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove |
EP0729143A2 (en) * | 1995-02-24 | 1996-08-28 | Sony Corporation | Optical device |
US5978401A (en) * | 1995-10-25 | 1999-11-02 | Honeywell Inc. | Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver |
US5771218A (en) * | 1996-09-27 | 1998-06-23 | Digital Optics Corporation | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
WO1999040578A1 (en) * | 1998-02-05 | 1999-08-12 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
Non-Patent Citations (1)
Title |
---|
HIBBS-BRENNER M ET AL: "PACKAGING OF VCSEL ARRAYS FOR COST-EFFECTIVE INTERCONNECTS AT<10 METERS" 1999 PROCEEDINGS 49TH. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 1999. SAN DIEGO, CA, JUNE 1 - 4, 1999, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, NEW YORK, NY: IEEE, US, 1 June 1999 (1999-06-01), pages 747-752, XP000903853 ISBN: 0-7803-5232-7 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2462525A (en) * | 2008-08-13 | 2010-02-17 | Avago Technologies Fiber Ip | Optical transceiver system |
GB2462525B (en) * | 2008-08-13 | 2012-09-26 | Avago Tech Fiber Ip Sg Pte Ltd | Transceiver system |
US9112616B2 (en) | 2008-08-13 | 2015-08-18 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second |
US10099554B2 (en) | 2011-08-29 | 2018-10-16 | Automotive Coalition For Traffic Safety, Inc. | System for non-invasive measurement of an analyte in a vehicle driver |
US11001142B2 (en) | 2011-08-29 | 2021-05-11 | Automotive Coalition For Traffic Safety, Inc. | System for non-invasive measurement of an analyte in a vehicle driver |
US10710455B2 (en) | 2013-08-27 | 2020-07-14 | Automotive Coalition For Traffic Safety | Systems and methods for controlling vehicle ignition using biometric data |
US11513070B2 (en) | 2019-06-12 | 2022-11-29 | Automotive Coalition For Traffic Safety, Inc. | System for non-invasive measurement of an analyte in a vehicle driver |
Also Published As
Publication number | Publication date |
---|---|
CN100354671C (en) | 2007-12-12 |
EP1269239A2 (en) | 2003-01-02 |
JP2003526909A (en) | 2003-09-09 |
CA2401976A1 (en) | 2001-09-13 |
AU2001247286A1 (en) | 2001-09-17 |
CN1419659A (en) | 2003-05-21 |
WO2001067144A3 (en) | 2002-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9343450B2 (en) | Wafer scale packaging platform for transceivers | |
EP1553433B1 (en) | Parallel multiwavelength optical subassembly | |
US7046868B2 (en) | Optical waveguide transmitter-receiver module | |
US6533471B2 (en) | Optical subassembly | |
US7352924B2 (en) | Micro-optical device | |
WO2016145310A1 (en) | Optical module including silicon photonics chip and coupler chip | |
JP4060023B2 (en) | Optical waveguide transceiver module | |
US7750289B2 (en) | Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon | |
EP0893720B1 (en) | A micro-photonics module with a partition wall | |
CN210401753U (en) | Optical transceiver module and optical module | |
US20110274395A1 (en) | Wafer integrated optical sub-modules | |
WO2001027675A1 (en) | Interface between opto-electronic devices and fibers | |
US5123067A (en) | Optical head capable of being fitted into a hybrid circuit | |
US7375315B2 (en) | Integrated optical transceiver and related methods | |
WO2001067144A2 (en) | Integrated optical transceiver and related methods | |
US20030123814A1 (en) | Optical subassembly | |
US7177506B2 (en) | Method for forming an aligned optical sub-assembly | |
US6453081B1 (en) | Optoelectronic device with integrated passive optical elements and method | |
US7842914B2 (en) | Optoelectronic package, camera including the same and related methods |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
ENP | Entry into the national phase in: |
Ref country code: JP Ref document number: 2001 566062 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2401976 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 018061753 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2001920210 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2001920210 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2001920210 Country of ref document: EP |