WO2001087541A3 - Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same - Google Patents

Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same Download PDF

Info

Publication number
WO2001087541A3
WO2001087541A3 PCT/US2001/015306 US0115306W WO0187541A3 WO 2001087541 A3 WO2001087541 A3 WO 2001087541A3 US 0115306 W US0115306 W US 0115306W WO 0187541 A3 WO0187541 A3 WO 0187541A3
Authority
WO
WIPO (PCT)
Prior art keywords
plate
pressure control
same
retaining ring
pneumatic diaphragm
Prior art date
Application number
PCT/US2001/015306
Other languages
French (fr)
Other versions
WO2001087541A2 (en
Inventor
Jiro Kajiwara
Gerard S Moloney
Huey-Ming Wang
David A Hansen
Alejandro Reyes
Original Assignee
Multi Planar Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,369 external-priority patent/US6558232B1/en
Priority claimed from US09/570,370 external-priority patent/US6506105B1/en
Application filed by Multi Planar Technologies Inc filed Critical Multi Planar Technologies Inc
Priority to AU2001259745A priority Critical patent/AU2001259745A1/en
Priority to KR1020027015207A priority patent/KR100811172B1/en
Priority to JP2001583983A priority patent/JP2003533359A/en
Priority to EP01933311A priority patent/EP1284840A2/en
Publication of WO2001087541A2 publication Critical patent/WO2001087541A2/en
Publication of WO2001087541A3 publication Critical patent/WO2001087541A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Abstract

An apparatus and method for planarizing a substrate are provided. The apparatus (101) includes a carrier (202) having: a plate (212) for receiving the substrate (230) thereon; a first chamber (238) for forcing the plate in a predetermined direction; a spacer (260) coupled to an outer edge of the plate (212); a membrane (250) coupled to the plate via the spacer (260) and separated from the plate by a thickness of the spacer; and a second chamber (251) defined between the membrane and the plate for forcing the membrane in another predetermined direction. The method involves pressing a peripheral edge of the substrate (244) against a polishing pad (226) with a first pressure, and pressing an interior of the substrate (244) against the pad (226) with a second pressure.
PCT/US2001/015306 2000-05-12 2001-05-11 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same WO2001087541A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2001259745A AU2001259745A1 (en) 2000-05-12 2001-05-11 System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control
KR1020027015207A KR100811172B1 (en) 2000-05-12 2001-05-11 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
JP2001583983A JP2003533359A (en) 2000-05-12 2001-05-11 Pneumatic diaphragm head with independent retainer ring and multi-region pressure control and method using the pneumatic diaphragm head
EP01933311A EP1284840A2 (en) 2000-05-12 2001-05-11 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US20421200P 2000-05-12 2000-05-12
US60/204,212 2000-05-12
US09/570,369 2000-05-12
US09/570,369 US6558232B1 (en) 2000-05-12 2000-05-12 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US09/570,370 US6506105B1 (en) 2000-05-12 2000-05-12 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US09/570,370 2000-05-12

Publications (2)

Publication Number Publication Date
WO2001087541A2 WO2001087541A2 (en) 2001-11-22
WO2001087541A3 true WO2001087541A3 (en) 2002-03-28

Family

ID=27394636

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/015306 WO2001087541A2 (en) 2000-05-12 2001-05-11 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same

Country Status (6)

Country Link
EP (1) EP1284840A2 (en)
JP (1) JP2003533359A (en)
KR (1) KR100811172B1 (en)
CN (2) CN100433269C (en)
AU (1) AU2001259745A1 (en)
WO (1) WO2001087541A2 (en)

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US6506105B1 (en) 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
KR100470227B1 (en) * 2001-06-07 2005-02-05 두산디앤디 주식회사 Carrier Head for Chemical Mechanical Polishing
JP4353673B2 (en) * 2002-04-18 2009-10-28 株式会社荏原製作所 Polishing method
JP4490822B2 (en) * 2002-09-27 2010-06-30 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Polishing apparatus and wafer polishing method
TWI238754B (en) 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
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US20080032603A1 (en) * 2006-08-03 2008-02-07 3M Innovative Properties Company Sanding tool
JP5464820B2 (en) * 2007-10-29 2014-04-09 株式会社荏原製作所 Polishing equipment
KR101617716B1 (en) 2008-03-25 2016-05-03 어플라이드 머티어리얼스, 인코포레이티드 Improved carrier head membrane
DE102009030298B4 (en) * 2009-06-24 2012-07-12 Siltronic Ag Process for local polishing of a semiconductor wafer
US20120021673A1 (en) * 2010-07-20 2012-01-26 Applied Materials, Inc. Substrate holder to reduce substrate edge stress during chemical mechanical polishing
CN102172887B (en) * 2011-02-16 2013-01-30 清华大学 Polishing head
KR101196652B1 (en) * 2011-05-31 2012-11-02 주식회사 케이씨텍 Membrane assembly in carrier head
CN102922411B (en) * 2011-08-10 2015-12-16 无锡华润上华科技有限公司 Prevent the chemical and mechanical grinding method of wafer slide plate
KR101902049B1 (en) 2012-01-25 2018-09-27 어플라이드 머티어리얼스, 인코포레이티드 Retaining ring monitoring and control of pressure
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
JP5807580B2 (en) * 2012-02-15 2015-11-10 信越半導体株式会社 Polishing head and polishing apparatus
KR101301001B1 (en) * 2012-06-14 2013-08-28 에스엔유 프리시젼 주식회사 Substrate processing system with function for preventing damage
KR200465446Y1 (en) 2012-09-09 2013-02-19 전용준 Carrier head in chemical mechanical polishing apparatus capable of checking conjunction status between carrier head housing and retaining ring
CN103817591B (en) * 2012-11-16 2016-08-03 有研半导体材料有限公司 A kind of buffing machine debris handling devices
KR102191916B1 (en) * 2013-06-26 2020-12-16 주식회사 케이씨텍 Membrane in carrier head
CN104347467A (en) * 2013-07-23 2015-02-11 Ap系统股份有公司 Substrate holding module and substrate processing device comprising same
KR101494757B1 (en) * 2013-07-23 2015-02-25 에이피시스템 주식회사 Substrate holder module and apparatus for treatmenting substrate having the same
KR101487414B1 (en) * 2013-09-11 2015-01-29 주식회사 엘지실트론 Apparatus for polishing a wafer
JP6232297B2 (en) 2014-01-21 2017-11-15 株式会社荏原製作所 Substrate holding device and polishing device
TWI656944B (en) 2014-05-14 2019-04-21 日商荏原製作所股份有限公司 Polishing apparatus
KR101559282B1 (en) 2014-05-19 2015-10-19 주식회사 티에스시 Membrane for Chemical-Mechanical Polishing of Wafer and Apparatus therewith
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN105856056B (en) * 2015-01-19 2018-03-02 大族激光科技产业集团股份有限公司 A kind of shaped face automatic polishing device
CN105058225A (en) * 2015-07-07 2015-11-18 武汉新芯集成电路制造有限公司 Grinding pad fixing device and chemical machinery grinder
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CN105397574B (en) * 2015-12-09 2017-08-25 浙江工业大学 The adjustable pressure suspension polishing device that surges in one kind processing gap
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CN105479325B (en) * 2015-12-30 2018-04-17 天通吉成机器技术有限公司 A kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment
US9873179B2 (en) * 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
US10654216B2 (en) * 2016-03-30 2020-05-19 Canon Kabushiki Kaisha System and methods for nanoimprint lithography
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JP6986930B2 (en) * 2017-11-07 2021-12-22 株式会社荏原製作所 Substrate polishing equipment and polishing method
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CN110142689B (en) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 Wafer loading support, wafer loading system and wafer loading method
CN110802507A (en) * 2019-11-11 2020-02-18 上海华力微电子有限公司 Grinding head and chemical mechanical grinding equipment
CN111496658B (en) * 2020-03-13 2021-06-04 郑玲佳 Light machine is swept to strong adaptability
CN111496598B (en) * 2020-04-24 2021-08-24 广东博智林机器人有限公司 Plane grinding device and plane grinding robot
CN111571444A (en) * 2020-05-15 2020-08-25 中国科学院微电子研究所 Polishing pad dressing device
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Also Published As

Publication number Publication date
CN1638057A (en) 2005-07-13
AU2001259745A1 (en) 2001-11-26
CN1179821C (en) 2004-12-15
CN1440321A (en) 2003-09-03
JP2003533359A (en) 2003-11-11
KR100811172B1 (en) 2008-03-10
EP1284840A2 (en) 2003-02-26
CN100433269C (en) 2008-11-12
WO2001087541A2 (en) 2001-11-22
KR20030010621A (en) 2003-02-05

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