WO2001093648A3 - Filling device - Google Patents

Filling device Download PDF

Info

Publication number
WO2001093648A3
WO2001093648A3 PCT/US2001/016986 US0116986W WO0193648A3 WO 2001093648 A3 WO2001093648 A3 WO 2001093648A3 US 0116986 W US0116986 W US 0116986W WO 0193648 A3 WO0193648 A3 WO 0193648A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure head
flow
main body
feed tube
openings
Prior art date
Application number
PCT/US2001/016986
Other languages
French (fr)
Other versions
WO2001093648A2 (en
Inventor
Jesse L Pedigo
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/752,629 external-priority patent/US6454154B1/en
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Priority to DE10196259T priority Critical patent/DE10196259T1/en
Priority to AU2001264968A priority patent/AU2001264968A1/en
Priority to JP2001588300A priority patent/JP2003535465A/en
Publication of WO2001093648A2 publication Critical patent/WO2001093648A2/en
Publication of WO2001093648A3 publication Critical patent/WO2001093648A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0182—Using a temporary spacer element or stand-off during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Abstract

A delivery system (100) for delivering a paste to an electronic substrate (130) includes a pressurized supply (141, 142) of via fill paste and a pressure head (200) attached to the pressurized supply (141, 142) of via fill paste. The pressure head (200) includes a main body (210) and a wear portion (220). Attached to the wear portion (220) is a gasket (230) positioned along one surface of the pressure head (200). The pressure head (200) also includes a flow dispersion regulator (310) which includes a feed tube positioned within the main body (210), the feed tube has a plurality of flow regulating openings (311). The flow regulating openings (311) in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings (311). Positioned between the main body (210) and the wear portion (220) is a flow equalization grid (500). The flow equalization grid (500) includes a multiplicity of openings (510).
PCT/US2001/016986 2000-05-31 2001-05-24 Filling device WO2001093648A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10196259T DE10196259T1 (en) 2000-05-31 2001-05-24 filling
AU2001264968A AU2001264968A1 (en) 2000-05-31 2001-05-24 Filling device
JP2001588300A JP2003535465A (en) 2000-05-31 2001-05-24 Filling device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US20845400P 2000-05-31 2000-05-31
US60/208,454 2000-05-31
US09/752,629 2000-12-28
US09/752,629 US6454154B1 (en) 2000-05-31 2000-12-28 Filling device

Publications (2)

Publication Number Publication Date
WO2001093648A2 WO2001093648A2 (en) 2001-12-06
WO2001093648A3 true WO2001093648A3 (en) 2002-05-23

Family

ID=26903209

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/016986 WO2001093648A2 (en) 2000-05-31 2001-05-24 Filling device

Country Status (8)

Country Link
US (3) US6840425B2 (en)
JP (1) JP2003535465A (en)
KR (1) KR20030007755A (en)
CN (1) CN1444840A (en)
AU (1) AU2001264968A1 (en)
DE (1) DE10196259T1 (en)
TW (1) TW486782B (en)
WO (1) WO2001093648A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001093648A2 (en) * 2000-05-31 2001-12-06 Honeywell International Inc. Filling device
WO2009147936A1 (en) * 2008-06-02 2009-12-10 イビデン株式会社 Method for manufacturing multilayer printed wiring board
TWI419282B (en) * 2009-10-05 2013-12-11 Advance Materials Corp Method for forming window bga substrate
WO2012074563A2 (en) * 2010-01-21 2012-06-07 Henkel Corporation Ultrasonic assisted filling of cavities
JP2013171862A (en) * 2012-02-17 2013-09-02 Tokyo Electron Ltd Metal paste filling method, metal paste filling device, and via plug manufacturing method
DE102012216101B4 (en) * 2012-09-12 2016-03-24 Festo Ag & Co. Kg Method for producing a coil integrated in a substrate, method for producing a multilayer printed circuit board and electronic device
CN105873709B (en) * 2013-12-05 2018-09-28 富士机械制造株式会社 Solder feedway
EP3078442B1 (en) * 2013-12-05 2018-10-24 FUJI Corporation Solder supply device
EP3085484B1 (en) * 2013-12-18 2019-01-30 FUJI Corporation Solder supply device
JP6532475B2 (en) 2014-02-13 2019-06-19 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． Compressible thermal interface material
CN106132613B (en) * 2014-03-07 2018-11-09 株式会社富士 Solder feedway
US9974170B1 (en) 2015-05-19 2018-05-15 Apple Inc. Conductive strands for fabric-based items
CN105499710B (en) * 2016-01-13 2017-11-14 浙江大学台州研究院 Scraper with complex track
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US20170266948A1 (en) * 2016-03-16 2017-09-21 Intel Corporation Modular squeegee head apparatus for printing materials
US10722964B2 (en) * 2016-03-18 2020-07-28 Fuji Corporation Viscous fluid supply device
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN116217258B (en) * 2023-01-03 2024-01-16 东阳东磁自动化科技有限公司 Full-automatic hole filling equipment for ceramic substrate and hole filling method thereof

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US20020088840A1 (en) 2002-07-11
US6832714B2 (en) 2004-12-21
CN1444840A (en) 2003-09-24
US20020084305A1 (en) 2002-07-04
US20020084306A1 (en) 2002-07-04
TW486782B (en) 2002-05-11
US6995321B2 (en) 2006-02-07
JP2003535465A (en) 2003-11-25
AU2001264968A1 (en) 2001-12-11
WO2001093648A2 (en) 2001-12-06
US6840425B2 (en) 2005-01-11
KR20030007755A (en) 2003-01-23
DE10196259T1 (en) 2003-05-15

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