WO2002011160A1 - Integrated dual frequency noise attenuator and transient suppressor - Google Patents
Integrated dual frequency noise attenuator and transient suppressor Download PDFInfo
- Publication number
- WO2002011160A1 WO2002011160A1 PCT/US2001/024125 US0124125W WO0211160A1 WO 2002011160 A1 WO2002011160 A1 WO 2002011160A1 US 0124125 W US0124125 W US 0124125W WO 0211160 A1 WO0211160 A1 WO 0211160A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- frequency noise
- noise attenuation
- varistor characteristics
- attenuation device
- electrode plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1783—Combined LC in series path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0064—Constructional details comprising semiconductor material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
Definitions
- TITLE INTEGRATED DUAL FREQUENCY NOISE ATTENUATOR AND TRANSIENT SUPRRESSOR
- the present invention is directed to a by-pass or attenuator device with varistor -properties and more specifically to a miniaturized ceramic device intended to attenuate noise at a plurality (at least two) discrete frequencies and provide transient suppression of voltage and current spikes.
- a particular utility of the device is as a noise attenuator and varistor in so-called dual mode cellular phones having both a digital and an analog output.
- devices of this sort where transmission is effected simultaneously on two discrete frequencies, it is desirable to minimize the "noise" generated by each of the two frequencies while protecting the circuitry from voltage and current" spikes arising from external sources such as electrostatic discharge or internal sources such as battery spikes .
- U.S. Pat. No. 5,430,601 discloses a multi-layer capacitor which includes a resistance connection.
- U.S. Pat. No. 5,170,317 discloses an MLC which includes, in addition to the main electrodes, a "correction" electrode which is narrower than the major electrodes to enable the provision of a capacitor having a precise value.
- U.S. Pat. No. 4,758,922 discloses a U-shaped "strip line" which functions as a resonance element (capacitor) having ground plane layers and interleaved dielectric layers.
- U.S. Pat. No. 4,479,100 relates to an impedance matching network which includes a plurality of electrodes of different cross-sectional areas. The electrodes are connectable in parallel with a major electrode to provide a selected desired capacitance.
- U.S. Pat. No. 4,074,340 discloses an MLC which includes adjusting electrodes extending to side surfaces of the monolith. Capacitance adjustment is effected by externally connecting or disconnecting the adjusting electrodes with the major electrodes.
- U.S. Pat. Nos. 4,048,593 and 2,758,256 disclose the concept of providing a multiplicity of discrete capacitors formed on a single substrate.
- U.S. Pat. No. 5,898,562 commonly owned with the subject application, discloses the concept of forming two discrete capacitors of different values within one device by providing two different overlapping areas through the use of U-shaped electrodes.
- the present invention is directed to a ceramic integrated dual frequency noise attenuator device providing transient energy protection. More particularly, the invention is directed to an attenuator device adapted to provide a low impedance path to ground at a plurality of discrete frequencies while being further adapted to provide protection from voltage and current spikes that may reach the device.
- the invention is directed to a dual frequency by-pass device with integrated varistor properties characterized in that the same is extremely simple to manufacture and provides accurate and precisely controlled dual LC circuits.
- the invention is directed to single or multilayer by-pass devices with varistor properties especially adapted for noise filtration and transient energy protection, examples of such devices comprising a pair of U-shaped electrodes in a ceramic semiconductor structure.
- Each of the electrodes includes a base and a pair of leg portions extending from the base.
- each base is disposed at a margin of its respective layer, the legs of each U being directed toward the base of the opposite U, the electrodes being disposed on the upper surface of individual layers of the ceramic semiconductor.
- a characterizing feature of such exemplary device is that the overlapping area defined by one pair of legs differs from the overlapping area defined by the second pair of legs, such that two discrete capacitances are formed.
- the differential overlap may be achieved by one pair of legs being longer than the other pair or by one pair of overlapping legs being wider than the other pair, or by combinations of these factors.
- a further characterizing feature of exemplary embodiments of the invention resides in the composite of the branches of the U coupled with the base of the U functioning as an inductor whereby the device, by the provision of the U-shaped electrode combination described, inherently provides a circuit comprised of two capacitors of different values connected in parallel, in series with a pair of inductors defined by the electrodes which also form the capacitance together with the base portions of the U configurations.
- the differential capacitance is provided by the overlapping legs being longer on one side of the U than the legs of the opposite side of the U, there will inherently be provided a proportionately greater inductance due to the longer conductive path of the longer legs .
- a further feature of the invention resides in the ability, due to the U-shaped configuration of the electrodes, to increase the inductance by elongating the base of the U, whereby it is feasible to separately provide an increased inductance without materially increasing the capacitance .
- a further characterizing feature of exemplary embodiments of the device resides in the semiconductor material used in place of the dielectric otherwise heretofore used to construct capacitors, the semiconductor material having dielectric properties that allow the device to function as a capacitor at voltage levels below the breakdown voltage of the semiconductor material as well as conductive properties at voltage levels at or above the breakdown voltage of the semiconductor that allow the device to function as a varistor.
- the device of the invention provides a compact and readily manufactured component providing optimal by-pass and noise reduction as well as varistor properties in a single chip having but two leads (surface-mount or wire) to be connected to the motherboard.
- a great degree of control of the characteristics of the by-pass device is achieved. This is in contrast to bypass techniques employing discrete capacitors and inductors which inherently require elongated conductive paths on the PC board and, hence, greater and less controlled inductances.
- a further object of the invention is the provision of a device of the class described wherein the capacitive and inductive values may be precisely determined, the device being compatible with the desired highly efficient use of the geography of an associated motherboard.
- a further aspect of the invention is directed to the integration of a dual frequency noise attenuator device with the transient energy protection characteristics of a varistor.
- the protection characteristics of a varistor are achieved through the use of a semiconductor such as zinc oxide (ZnO) in place of the dielectric otherwise used to construct capacitors.
- FIG. 1 is a representative exploded perspective view of an exemplary device of the invention.
- FIGS. 2 and 3 are respectively plan views of the top and bottom electrodes of an exemplary device in accordance with the invention.
- FIG. 4 is a diagram of the circuitry defined by the exemplary device of the invention as represented in present FIG. 1.
- FIGS. 5 and 6 are respectively plan views of the top and bottom electrodes of an exemplary device of the invention discussed in detail below.
- FIGS. 7 and 8 are respectively plan views of the top and bottom electrodes as placed relative to an exemplary device shown with specific locations for certain dimensions for the exemplary device discussed in accordance with the invention discussed in conjunction with FIGS. 5 and 6.
- FIG. 9 is a schematic exploded perspective view of the exemplary device of the invention as discussed in conjunction with FIGS. 5 through 8.
- FIG. 10 is a diagram of the circuitry defined by the exemplary device of the invention as discussed in conjunction with FIGS. 5 through 9.
- FIG. 11 is a graph showing the attenuation versus frequency for the exemplary device of the invention as discussed in conjunction with FIGS. 5 through 10.
- Repeat use of reference characters is intended to represent same or analogous features or elements of the subject invention.
- the figures are not necessarily drawn to scale and in some instances have been enlarged in pertinent part to illustrate detail for better visualization and understanding of the invention.
- FIG. l a representative exploded perspective of a " device in accordance with the invention, the dimension and thickness of the various elements being greatly increased to facilitate visualization and understanding of the structure.
- the by-pass varistor device generally 10 is comprised of at least two semiconductor layers 11 and 31, the upper surfaces of which have formed thereon U-shaped upper and lower electrodes 12 and 13.
- Electrode 12 includes a base portion 14 having legs 15 and 16 projecting from the opposite ends.
- Electrode 13 includes a base portion 14a from the opposite ends of which project leg portions 15a and 16a.
- electrodes 12 and 13 are disposed respectively above semiconductor layers 11 and 31 in such manner that the respective base portions 14,14a are exposed at opposite edges of the semiconductor layers.
- FIG. 1 wherein a single unit comprised of upper and lower electrodes and an intervening semiconductor layer are shown in solid lines, any number of .layers may be formed in the multi-layer device to achieve the desired values of capacitance and inductance.
- Terminations 17,18 are formed at the end margins of the semiconductor layers, the termination 17 being electrically coupled to the base portions 14a of the electrodes 13 and termination 18 being electrically coupled to the base portion or portions of electrodes 12. As is evident from FIGS.
- the registering or overlapping area 19 defined by the legs 15,15a will be less than the overlapping area 20 defined by longer and wider legs 16,16a whose length is represented by the notation LI.
- the capacitance defined in the area 19 will be less than the capacitance defined in the area 20, since capacitance is directly proportional to the areas of overlap. It will thus be appreciated that the desired capacitive differential between capacitor Cl defined by overlapping areas 19 from the larger capacitance C2 defined by overlapping areas 20 can be achieved by varying the width of the respective overlapping leg components or by varying the length of the overlapping components or by both expedients .
- the semiconductor 11 interleaved between upper and lower electrodes 12 and 13 has all of the requisite electrical insulative characteristics of a dielectric for the creation of a capacitance when integrated into the aforesaid dual frequency noise attenuator.
- the use of a semiconductor in place of the typically used dielectric provides other useful qualities to the integrated device.
- the use of a semiconductor in the place of the dielectric allows the device to further function as a varistor.
- a semiconductor begins to conduct at a particular breakdown voltage. If a voltage level at or above the breakdown voltage level of the semiconductor is introduced into the dual resonant capacitor device, the semiconductor will begin to conduct and effectively shunt the undesired signal to ground.
- the device will now protect the circuitry from voltage and current spikes that can commonly occur as a result of events such as electrostatic discharge (ESD) or battery spikes.
- ESD electrostatic discharge
- the integration of these functions into one device is very desirable in the electronics industry as the trend toward miniaturization continues.
- the semiconductor components are formed by casting a thin layer of a slurry of finely divided semiconductor forming material such as zinc oxide suspended in a liquid matrix including binder.
- the "green" ceramic is screen printed with electrode forming ink in the desired U-shaped patterns.
- the ink will include a metal, such as platinum.
- Patterned green ceramics are superposed to provide the desired number of layers, the patterns of adjacent layers being coordinated to achieve the desired overlapped condition.
- Individual units are diced from the superposed layers in such manner as to expose base portions 14,14a at opposite ends of the pre-fired chips. The diced units are thereafter subjected to binder burn-off at a first temperature and thereafter sintered at a higher temperature to define the structure.
- Terminations 17,18 are applied to the respective exposed base portions 14 at one end and 14a at the other end. Terminations may be formed in any of a number of known manners including vapor deposition to provide electrical and mechanical bond to the exposed electrode bases at opposite ends of the semiconductor layers followed by application of one or more metallic layers over the sputtered layer to enable soldering to the motherboard. The terminations may extend beyond the end margins where suface mounting is desired. Alternative termination methods include applications of carbon followed by an outer silver layer with or without intervening metallic layers between carbon and silver.
- a multi-layer device is formed utilizing 8 active layers of a zinc oxide ceramic approximately 0.002268 inches thick. In such example, 8 active electrodes are employed.
- the widths Zl and Z3 of the legs 115 and 116, respectively are identical and comprise 0.004860 inches.
- the widths Z5 and Z7 of the legs 115a and 116a, respectively, are identical and comprise
- the length Z2 of the base portion 114 is 0.01620 inches.
- the length Z4 of the base portion 114a is 0.019440 inches.
- the length Yl of leg 115 is 0.029970 inches.
- the length Y2 of leg 116 is 0.01701 inches.
- the lengths Y3 and Y4 of legs 115a and 116a are identical and comprise 0.050220 inches.
- the widths XI and X2 of branches 114 and 114a are identical and comprise 0.006480 inches.
- the distance Rl between legs 115 and 116 is 0.006480 inches.
- the distance R2 between legs 115a and 116a is 0.004860 inches.
- the overall length SI of each layer is 0.059940 inches.
- each layer is 0.03240 inches.
- the distance Ql between the end of legs 115a and 116a and the outer edge of the layer is 0.009720 inches.
- the electrodes are stacked such that the overlap or registering area 119 of legs 115 and 115a is approximately three times the overlap area 200 of legs 116 and 116a.
- the desired inductances may be tailored to fit specific situations.
- the representative resistive values Rll and R21 associated with these devices are nominal and are inherently dependent upon the device's physical construction and specific examples thereof are not important to the discussion of the exemplary embodiment herein.
- the values of the illustrated example have been found highly efficient as by-pass devices for dual mode cellular phones operating on respective analog and digital frequencies of 900 MHz and 1.9 GHz.
- Of particular advantage is the predictable nature of the inductance as contrasted with the large variations resulting from the utilization of separate capacitors with the attendant variations in path lengths of the leads between the capacitors .
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001283077A AU2001283077A1 (en) | 2000-08-01 | 2001-08-01 | Integrated dual frequency noise attenuator and transient suppressor |
GB0229769A GB2379799A (en) | 2000-08-01 | 2001-08-01 | Integrated dual frequency noise attenuator and transient suppressor |
JP2002516796A JP2004505577A (en) | 2000-08-01 | 2001-08-01 | Integrated dual frequency noise attenuator and transient suppressor |
DE10196201T DE10196201T1 (en) | 2000-08-01 | 2001-08-01 | Integrated two-frequency noise damper and transient suppression |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22217100P | 2000-08-01 | 2000-08-01 | |
US60/222,171 | 2000-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002011160A1 true WO2002011160A1 (en) | 2002-02-07 |
Family
ID=22831165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/024125 WO2002011160A1 (en) | 2000-08-01 | 2001-08-01 | Integrated dual frequency noise attenuator and transient suppressor |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2004505577A (en) |
CN (1) | CN1436354A (en) |
AU (1) | AU2001283077A1 (en) |
DE (1) | DE10196201T1 (en) |
GB (1) | GB2379799A (en) |
WO (1) | WO2002011160A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003063185A2 (en) * | 2002-01-25 | 2003-07-31 | Epcos Ag | Electroceramic component comprising inner electrodes |
GB2419034A (en) * | 2004-10-11 | 2006-04-12 | Samsung Electro Mech | Combined varistor and LC filter device |
US9001486B2 (en) | 2005-03-01 | 2015-04-07 | X2Y Attenuators, Llc | Internally overlapped conditioners |
US9019679B2 (en) | 1997-04-08 | 2015-04-28 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9036319B2 (en) | 1997-04-08 | 2015-05-19 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022114552A1 (en) | 2022-06-09 | 2023-12-14 | Tdk Electronics Ag | Process for producing a multilayer varistor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5898562A (en) * | 1997-05-09 | 1999-04-27 | Avx Corporation | Integrated dual frequency noise attenuator |
-
2001
- 2001-08-01 AU AU2001283077A patent/AU2001283077A1/en not_active Abandoned
- 2001-08-01 JP JP2002516796A patent/JP2004505577A/en active Pending
- 2001-08-01 DE DE10196201T patent/DE10196201T1/en not_active Withdrawn
- 2001-08-01 CN CN 01811267 patent/CN1436354A/en active Pending
- 2001-08-01 GB GB0229769A patent/GB2379799A/en not_active Withdrawn
- 2001-08-01 WO PCT/US2001/024125 patent/WO2002011160A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5898562A (en) * | 1997-05-09 | 1999-04-27 | Avx Corporation | Integrated dual frequency noise attenuator |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9019679B2 (en) | 1997-04-08 | 2015-04-28 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9036319B2 (en) | 1997-04-08 | 2015-05-19 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US9373592B2 (en) | 1997-04-08 | 2016-06-21 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
WO2003063185A2 (en) * | 2002-01-25 | 2003-07-31 | Epcos Ag | Electroceramic component comprising inner electrodes |
WO2003063185A3 (en) * | 2002-01-25 | 2004-03-18 | Epcos Ag | Electroceramic component comprising inner electrodes |
US7084732B2 (en) | 2002-01-25 | 2006-08-01 | Epcos Ag | Electroceramic component comprising inner electrodes |
GB2419034A (en) * | 2004-10-11 | 2006-04-12 | Samsung Electro Mech | Combined varistor and LC filter device |
GB2419034B (en) * | 2004-10-11 | 2007-07-04 | Samsung Electro Mech | Combined varistor and lc filter device |
US9001486B2 (en) | 2005-03-01 | 2015-04-07 | X2Y Attenuators, Llc | Internally overlapped conditioners |
Also Published As
Publication number | Publication date |
---|---|
DE10196201T1 (en) | 2003-04-17 |
AU2001283077A1 (en) | 2002-02-13 |
GB2379799A (en) | 2003-03-19 |
JP2004505577A (en) | 2004-02-19 |
GB0229769D0 (en) | 2003-01-29 |
CN1436354A (en) | 2003-08-13 |
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