WO2002014846A3 - Multiple beam inspection apparatus and method - Google Patents

Multiple beam inspection apparatus and method Download PDF

Info

Publication number
WO2002014846A3
WO2002014846A3 PCT/US2001/024931 US0124931W WO0214846A3 WO 2002014846 A3 WO2002014846 A3 WO 2002014846A3 US 0124931 W US0124931 W US 0124931W WO 0214846 A3 WO0214846 A3 WO 0214846A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
substrate
light beams
inspection system
optical
Prior art date
Application number
PCT/US2001/024931
Other languages
French (fr)
Other versions
WO2002014846A9 (en
WO2002014846A2 (en
Inventor
Damon F Kvamme
Robert W Walsh
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/636,129 external-priority patent/US6636301B1/en
Priority claimed from US09/636,124 external-priority patent/US6879390B1/en
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Priority to JP2002519925A priority Critical patent/JP4810053B2/en
Publication of WO2002014846A2 publication Critical patent/WO2002014846A2/en
Publication of WO2002014846A3 publication Critical patent/WO2002014846A3/en
Publication of WO2002014846A9 publication Critical patent/WO2002014846A9/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Abstract

Disclosed is an optical inspection system for inspecting the surface of (11) a substrate (12). The optical inspection system includes a light source (52) for emitting an incident light beam (66) along an optical axis and a first set of optical elements arranged for separating the incident light beam into a plurality of light beams, directing the plurality of light beams to intersect with the surface of the substrate, and focusing the plurality of light beams to a plurality of scanning spots on the surface of the substrate. The inspection system further includes a light detector arrangement including in dividual light detectors (61A, 61B, 61C, 65A, 65B, 65C) that correspond to individual ones of a plurality of reflected or transmitted light beams caused by the intersection of the plurality of light beams with the surface of the substrate. The light detectors are arranged for sensing the light intensity of either the reflected or transmitted light.
PCT/US2001/024931 2000-08-10 2001-08-08 Multiple beam inspection apparatus and method WO2002014846A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002519925A JP4810053B2 (en) 2000-08-10 2001-08-08 Multiple beam inspection apparatus and method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/636,124 2000-08-10
US09/636,129 US6636301B1 (en) 2000-08-10 2000-08-10 Multiple beam inspection apparatus and method
US09/636,124 US6879390B1 (en) 2000-08-10 2000-08-10 Multiple beam inspection apparatus and method
US09/636,129 2000-08-10

Publications (3)

Publication Number Publication Date
WO2002014846A2 WO2002014846A2 (en) 2002-02-21
WO2002014846A3 true WO2002014846A3 (en) 2002-08-29
WO2002014846A9 WO2002014846A9 (en) 2003-04-03

Family

ID=27092528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/024931 WO2002014846A2 (en) 2000-08-10 2001-08-08 Multiple beam inspection apparatus and method

Country Status (2)

Country Link
JP (1) JP4810053B2 (en)
WO (1) WO2002014846A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335312A1 (en) * 2003-08-01 2005-02-24 Asys Automatisierungssysteme Gmbh Generation of a reference pattern for testing a substrate on which a reference pattern has been applied, e.g. for testing a circuit board with applied solder paste, whereby a reference data set is generated from control data
FR2864338B1 (en) * 2003-12-23 2006-03-10 Commissariat Energie Atomique METHOD AND DEVICE FOR INSPECTING DEFECTS IN THIN FILM
JP2008249921A (en) * 2007-03-30 2008-10-16 Advanced Mask Inspection Technology Kk Reticle defect inspection device and reticle defect inspection method
JP4600476B2 (en) 2007-12-28 2010-12-15 日本電気株式会社 Defect inspection method and defect inspection apparatus for fine structure
US9395340B2 (en) * 2013-03-15 2016-07-19 Kla-Tencor Corporation Interleaved acousto-optical device scanning for suppression of optical crosstalk
JP5950473B2 (en) * 2014-06-12 2016-07-13 レーザーテック株式会社 Laser microscope and scanner
JP6031731B2 (en) * 2014-07-18 2016-11-24 レーザーテック株式会社 Inspection apparatus and autofocus method
US10473766B2 (en) * 2017-03-13 2019-11-12 The Charles Stark Draper Laboratory, Inc. Light detection and ranging (LiDAR) system and method
US20190355110A1 (en) * 2018-05-15 2019-11-21 Camtek Ltd. Cross talk reduction
KR20210140774A (en) * 2019-04-15 2021-11-23 어플라이드 머티어리얼스, 인코포레이티드 Method and measurement system for diffracting light
WO2023197310A1 (en) * 2022-04-15 2023-10-19 华为技术有限公司 Measurement system and method
CN117029704A (en) * 2023-09-27 2023-11-10 成都曙创大能科技有限公司 Multi-lens wire drawing die aperture measurement system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268747A (en) * 1988-10-30 1993-12-07 Schwizerische Eidgenossenschaft Paul Scherrer Institute Apparatus for the simultaneous non-contacting testing of a plurality of points on a test material, as well as the use thereof
US5506676A (en) * 1994-10-25 1996-04-09 Pixel Systems, Inc. Defect detection using fourier optics and a spatial separator for simultaneous optical computing of separated fourier transform components
US5576825A (en) * 1992-11-13 1996-11-19 Laurel Bank Machines Co., Ltd. Pattern detecting apparatus
EP0831295A1 (en) * 1996-09-23 1998-03-25 International Business Machines Corporation Optical differential profile measurement apparatus and process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3339591B2 (en) * 1993-02-19 2002-10-28 株式会社ニコン Position detection device
JP3411780B2 (en) * 1997-04-07 2003-06-03 レーザーテック株式会社 Laser microscope and pattern inspection apparatus using this laser microscope
JP2000180133A (en) * 1998-12-10 2000-06-30 Toshiba Corp Configuration sensor
JP4543141B2 (en) * 1999-07-13 2010-09-15 レーザーテック株式会社 Defect inspection equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268747A (en) * 1988-10-30 1993-12-07 Schwizerische Eidgenossenschaft Paul Scherrer Institute Apparatus for the simultaneous non-contacting testing of a plurality of points on a test material, as well as the use thereof
US5576825A (en) * 1992-11-13 1996-11-19 Laurel Bank Machines Co., Ltd. Pattern detecting apparatus
US5506676A (en) * 1994-10-25 1996-04-09 Pixel Systems, Inc. Defect detection using fourier optics and a spatial separator for simultaneous optical computing of separated fourier transform components
EP0831295A1 (en) * 1996-09-23 1998-03-25 International Business Machines Corporation Optical differential profile measurement apparatus and process

Also Published As

Publication number Publication date
WO2002014846A9 (en) 2003-04-03
JP4810053B2 (en) 2011-11-09
JP2004515750A (en) 2004-05-27
WO2002014846A2 (en) 2002-02-21

Similar Documents

Publication Publication Date Title
CA2319420A1 (en) Integrated optical apparatus providing separated beams on a detector and associated methods
EP1353165A3 (en) Automated photomask inspection apparatus and method
WO2002014846A3 (en) Multiple beam inspection apparatus and method
DE69712872D1 (en) THREE-DIMENSIONAL COLOR IMAGE
AU6848798A (en) Sensor unit, process and device for inspecting the surface of an object
EP0266881A3 (en) Method and apparatus for multiple optical assaying
EP0257559A3 (en) Multi-color fluorescence analysis with single wavelength excitation
BR9305149A (en) Ophthalmic lens inspection method and system for inspecting ophthalmic lenses.
WO1998044330A3 (en) Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
ATE347099T1 (en) MATERIAL INSPECTION
EP0360126A3 (en) Operation method for an optical smoke detector and smoke detector for carrying out the method
EP0350874A3 (en) Surface analysis method and apparatus
KR890014994A (en) Multichannel Scattering Triangulation Ranger System
ES2020368A6 (en) Apparatus and method for detecting defects in an optical fiber.
CA1139862A (en) Apparatus for inspecting translucent articles for faults
ATE169400T1 (en) SIMULTANEOUS MULTIPLE ANGLE/MULTIPLE WAVELENGTH ELLIPSOMETER AND METHOD
WO1996027808A3 (en) Method and apparatus for detecting the presence and location of objects in a field
AU4856393A (en) Pit detector and method
WO2005062941A3 (en) Multi-channel laser interferometric method and apparatus for detection of ultrasonic motion from a surface
DE69019903D1 (en) Differential fluorescence lidar and associated detection method.
CA2126387A1 (en) High s/n ratio optical detection apparatus and method
KR930018270A (en) Defect detection system and coating method in coating layer
TW200629262A (en) Optical device with multi-spot scanning
KR930016358A (en) In-pattern on-line coating defect detection system
JPS5699360A (en) Beam recorder

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP SG

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2002519925

Country of ref document: JP

COP Corrected version of pamphlet

Free format text: PAGE 13, DESCRIPTION, REPLACED BY CORRECT PAGE 13

122 Ep: pct application non-entry in european phase