WO2002017357A3 - Three dimensional inspection of leaded ics - Google Patents

Three dimensional inspection of leaded ics Download PDF

Info

Publication number
WO2002017357A3
WO2002017357A3 PCT/SG2001/000167 SG0100167W WO0217357A3 WO 2002017357 A3 WO2002017357 A3 WO 2002017357A3 SG 0100167 W SG0100167 W SG 0100167W WO 0217357 A3 WO0217357 A3 WO 0217357A3
Authority
WO
WIPO (PCT)
Prior art keywords
projection
prism
contour
aperture
leaded
Prior art date
Application number
PCT/SG2001/000167
Other languages
French (fr)
Other versions
WO2002017357A2 (en
Inventor
Chee-Kheong Wong
Ying-Jian Wang
Peng-Seng Toh
Chiat-Pin Tay
Original Assignee
Agilent Technologies Inc
Chee-Kheong Wong
Ying-Jian Wang
Peng-Seng Toh
Chiat-Pin Tay
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc, Chee-Kheong Wong, Ying-Jian Wang, Peng-Seng Toh, Chiat-Pin Tay filed Critical Agilent Technologies Inc
Priority to AU2001282842A priority Critical patent/AU2001282842A1/en
Publication of WO2002017357A2 publication Critical patent/WO2002017357A2/en
Publication of WO2002017357A3 publication Critical patent/WO2002017357A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

Abstract

The invention refers to an optical inspection system for an inspection of an object in form of a leaded IC component, wherein the object is positioned in an overlapping relationship with an aperture of a datum and illuminated by a lateral diffuse light source, thereby projecting contour images of the object and of a reference contour of the reference edge through the aperture in several projection directions. An optical side prism and a center prism is provided to receive the projection light under two different incident angles thus defining two different projection paths so that a three dimensional image can be captured by analyzing the light of these two projection paths coming from one object point. The side prism and the center prism are designed and arranged such that the projection paths of the first and second projections have the same optical length between the lead-including contour of the object and an imaging plane of the system.
PCT/SG2001/000167 2000-08-22 2001-08-22 Three dimensional inspection of leaded ics WO2002017357A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001282842A AU2001282842A1 (en) 2000-08-22 2001-08-22 Three dimensional inspection of leaded ics

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200004224 2000-08-22
SG200004224-2 2000-08-22

Publications (2)

Publication Number Publication Date
WO2002017357A2 WO2002017357A2 (en) 2002-02-28
WO2002017357A3 true WO2002017357A3 (en) 2002-11-28

Family

ID=20430635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2001/000167 WO2002017357A2 (en) 2000-08-22 2001-08-22 Three dimensional inspection of leaded ics

Country Status (3)

Country Link
CN (1) CN1448043A (en)
AU (1) AU2001282842A1 (en)
WO (1) WO2002017357A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001336919A (en) * 2000-03-31 2001-12-07 Agilent Technol Inc Inspection system of integrated circuit with lead
KR20050113602A (en) 2003-03-07 2005-12-02 이스메카 세미컨덕터 홀딩 에스.아. Optical device and inspection module
JP5622068B2 (en) * 2005-11-15 2014-11-12 株式会社ニコン Surface position detection apparatus, exposure apparatus, and device manufacturing method
US7869021B2 (en) * 2007-04-05 2011-01-11 Asti Holdings Limited Multiple surface inspection system and method
US7768633B2 (en) * 2007-04-05 2010-08-03 Asti Holdings Limited Multiple surface inspection system and method
CN102116745A (en) * 2009-12-30 2011-07-06 上海允科自动化有限公司 IC element detection system
CN106879245A (en) * 2012-02-08 2017-06-20 Juki株式会社 Electronic component mounting apparatus, electronic component mounting system and electronic component mounting method
EP2838333B1 (en) * 2012-04-12 2019-08-21 FUJI Corporation Component mounting machine
CN104509235B (en) * 2012-08-01 2017-04-26 富士机械制造株式会社 Component mounting apparatus
US10883823B2 (en) * 2018-10-18 2021-01-05 Cyberoptics Corporation Three-dimensional sensor with counterposed channels
CN114167622A (en) * 2021-12-14 2022-03-11 樊宸 Optical system for acquiring three-dimensional information of surface of shot object

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997030572A1 (en) * 1996-02-12 1997-08-21 Icos Vision Systems N.V. Process for forming on an opto-electronic transducer a shadow image of at least a part of an electronic component
JPH1093846A (en) * 1996-09-12 1998-04-10 Copal Co Ltd Image pickup device
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US5910844A (en) * 1997-07-15 1999-06-08 Vistech Corporation Dynamic three dimensional vision inspection system
US6088108A (en) * 1998-08-27 2000-07-11 Hewlett-Packard Company Leaded components inspection system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997030572A1 (en) * 1996-02-12 1997-08-21 Icos Vision Systems N.V. Process for forming on an opto-electronic transducer a shadow image of at least a part of an electronic component
JPH1093846A (en) * 1996-09-12 1998-04-10 Copal Co Ltd Image pickup device
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US5910844A (en) * 1997-07-15 1999-06-08 Vistech Corporation Dynamic three dimensional vision inspection system
US6088108A (en) * 1998-08-27 2000-07-11 Hewlett-Packard Company Leaded components inspection system

Also Published As

Publication number Publication date
CN1448043A (en) 2003-10-08
AU2001282842A1 (en) 2002-03-04
WO2002017357A2 (en) 2002-02-28

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