WO2002017698A3 - Distributed thermal management system for electronic components - Google Patents

Distributed thermal management system for electronic components Download PDF

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Publication number
WO2002017698A3
WO2002017698A3 PCT/CA2001/001167 CA0101167W WO0217698A3 WO 2002017698 A3 WO2002017698 A3 WO 2002017698A3 CA 0101167 W CA0101167 W CA 0101167W WO 0217698 A3 WO0217698 A3 WO 0217698A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
electronic components
management system
electronic component
thermal management
Prior art date
Application number
PCT/CA2001/001167
Other languages
French (fr)
Other versions
WO2002017698A8 (en
WO2002017698A2 (en
Inventor
Howard R Harrison
Jeffrey R Brown
Original Assignee
Hb Innovation Ltd
Howard R Harrison
Jeffrey R Brown
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hb Innovation Ltd, Howard R Harrison, Jeffrey R Brown filed Critical Hb Innovation Ltd
Priority to AU2001281624A priority Critical patent/AU2001281624A1/en
Publication of WO2002017698A2 publication Critical patent/WO2002017698A2/en
Publication of WO2002017698A8 publication Critical patent/WO2002017698A8/en
Publication of WO2002017698A3 publication Critical patent/WO2002017698A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A distributed thermal management system for electronic components has a heat pipe, a first heat pump in thermal communication with the evaporator end of said heat pipe and a second heat pump in thermal communication with the condenser end of said heat pipe, said first heat pump adapted to withdraw heat from an electronic component and said second heat pump adapted to deliver said heat to an external heat sink. A controller is adapted to control the system such that said electronic component, said heat pipe, and said heat sink operate at below, approximately at, and above ambient temperature respectively. Also taught is an interface plate adapted to cool multiple electronic components using a single external heat sink. Also taught is a thermal diode located between the heat sink and the electronic component(s), and adapted to block the reverse flow of heat.
PCT/CA2001/001167 2000-08-22 2001-08-22 Distributed thermal management system for electronic components WO2002017698A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001281624A AU2001281624A1 (en) 2000-08-22 2001-08-22 Distributed thermal management system for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22668900P 2000-08-22 2000-08-22
US60/226,689 2000-08-22

Publications (3)

Publication Number Publication Date
WO2002017698A2 WO2002017698A2 (en) 2002-02-28
WO2002017698A8 WO2002017698A8 (en) 2002-04-11
WO2002017698A3 true WO2002017698A3 (en) 2002-09-06

Family

ID=22849988

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2001/001167 WO2002017698A2 (en) 2000-08-22 2001-08-22 Distributed thermal management system for electronic components

Country Status (2)

Country Link
AU (1) AU2001281624A1 (en)
WO (1) WO2002017698A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4408224B2 (en) * 2004-01-29 2010-02-03 富士通株式会社 Housing with heat dissipation function
EP2117288A1 (en) * 2008-05-07 2009-11-11 3M Innovative Properties Company Heat-management system for a cabinet containing electronic equipment
DE102018105768B3 (en) 2018-03-13 2019-07-04 Apelsin Enterprises GmbH Cabinet for installation of IT, EDP, network and / or telecommunication systems

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812733A (en) * 1987-10-27 1989-03-14 Richard Tobey Computer element performance enhancer
EP0757385A2 (en) * 1995-07-31 1997-02-05 ANCeram GmbH & Co. KG Cooling device for electronic circuits
WO1999047994A1 (en) * 1998-03-16 1999-09-23 Lee Mok Hyoung System for cooling device in computer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812733A (en) * 1987-10-27 1989-03-14 Richard Tobey Computer element performance enhancer
EP0757385A2 (en) * 1995-07-31 1997-02-05 ANCeram GmbH & Co. KG Cooling device for electronic circuits
WO1999047994A1 (en) * 1998-03-16 1999-09-23 Lee Mok Hyoung System for cooling device in computer

Also Published As

Publication number Publication date
AU2001281624A1 (en) 2002-03-04
WO2002017698A8 (en) 2002-04-11
WO2002017698A2 (en) 2002-02-28

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