WO2002029390A3 - Method and apparatus to provide for automated process verification and hierarchical substrate examination - Google Patents
Method and apparatus to provide for automated process verification and hierarchical substrate examination Download PDFInfo
- Publication number
- WO2002029390A3 WO2002029390A3 PCT/US2001/042483 US0142483W WO0229390A3 WO 2002029390 A3 WO2002029390 A3 WO 2002029390A3 US 0142483 W US0142483 W US 0142483W WO 0229390 A3 WO0229390 A3 WO 0229390A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inspection
- optical
- substrate
- optical inspection
- systems
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020037004935A KR100871495B1 (en) | 2000-10-06 | 2001-10-05 | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
JP2002532913A JP2004529485A (en) | 2000-10-06 | 2001-10-05 | Method and apparatus for defining automated process inspection and hierarchical substrate testing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/685,191 US7012684B1 (en) | 1999-09-07 | 2000-10-06 | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
US09/685,191 | 2000-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002029390A2 WO2002029390A2 (en) | 2002-04-11 |
WO2002029390A3 true WO2002029390A3 (en) | 2003-04-17 |
Family
ID=24751113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/042483 WO2002029390A2 (en) | 2000-10-06 | 2001-10-05 | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2004529485A (en) |
KR (1) | KR100871495B1 (en) |
TW (1) | TW533526B (en) |
WO (1) | WO2002029390A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
US7265382B2 (en) * | 2002-11-12 | 2007-09-04 | Applied Materials, Inc. | Method and apparatus employing integrated metrology for improved dielectric etch efficiency |
US8433102B2 (en) * | 2005-12-06 | 2013-04-30 | Shibaura Mechatronics Corporation | Surface roughness inspection system |
JP5002367B2 (en) * | 2007-08-10 | 2012-08-15 | 浜松ホトニクス株式会社 | Optical inspection device, pinhole inspection device, film thickness inspection device, and surface inspection device |
JP6245445B2 (en) * | 2014-07-07 | 2017-12-13 | Smc株式会社 | Actuator tact measurement device and sensor signal detection device |
US10269545B2 (en) * | 2016-08-03 | 2019-04-23 | Lam Research Corporation | Methods for monitoring plasma processing systems for advanced process and tool control |
JP2022552961A (en) | 2019-10-15 | 2022-12-21 | 東京エレクトロン株式会社 | Systems and methods for monitoring one or more properties of a substrate |
JP2023502872A (en) | 2019-11-04 | 2023-01-26 | 東京エレクトロン株式会社 | System and method for calibrating multiple wafer inspection system (WIS) modules |
US11637031B2 (en) | 2019-11-04 | 2023-04-25 | Tokyo Electron Limited | Systems and methods for spin process video analysis during substrate processing |
US11276157B2 (en) | 2019-11-14 | 2022-03-15 | Tokyo Electron Limited | Systems and methods for automated video analysis detection techniques for substrate process |
US11624607B2 (en) | 2020-01-06 | 2023-04-11 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
TWI757907B (en) * | 2020-10-07 | 2022-03-11 | 財團法人國家實驗研究院 | A cluster real-time online process and analysis transmission system in a vacuum environment |
KR20220133102A (en) * | 2021-03-24 | 2022-10-04 | 가부시키가이샤 스크린 홀딩스 | Substrate processing apparatus, analysis method, display device and program |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999049500A1 (en) * | 1998-03-24 | 1999-09-30 | Applied Materials, Inc. | Cluster tool |
US6020957A (en) * | 1998-04-30 | 2000-02-01 | Kla-Tencor Corporation | System and method for inspecting semiconductor wafers |
EP1083424A2 (en) * | 1999-09-07 | 2001-03-14 | Applied Materials, Inc. | Particle detection and embedded vision system to enhance substrate yield and throughput |
-
2001
- 2001-10-05 KR KR1020037004935A patent/KR100871495B1/en not_active IP Right Cessation
- 2001-10-05 TW TW090124775A patent/TW533526B/en not_active IP Right Cessation
- 2001-10-05 WO PCT/US2001/042483 patent/WO2002029390A2/en active Application Filing
- 2001-10-05 JP JP2002532913A patent/JP2004529485A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999049500A1 (en) * | 1998-03-24 | 1999-09-30 | Applied Materials, Inc. | Cluster tool |
US6020957A (en) * | 1998-04-30 | 2000-02-01 | Kla-Tencor Corporation | System and method for inspecting semiconductor wafers |
EP1083424A2 (en) * | 1999-09-07 | 2001-03-14 | Applied Materials, Inc. | Particle detection and embedded vision system to enhance substrate yield and throughput |
Also Published As
Publication number | Publication date |
---|---|
JP2004529485A (en) | 2004-09-24 |
WO2002029390A2 (en) | 2002-04-11 |
TW533526B (en) | 2003-05-21 |
KR100871495B1 (en) | 2008-12-05 |
KR20040012667A (en) | 2004-02-11 |
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