WO2002033706A3 - Noise suppression for open bit line dram architectures - Google Patents

Noise suppression for open bit line dram architectures Download PDF

Info

Publication number
WO2002033706A3
WO2002033706A3 PCT/US2001/031159 US0131159W WO0233706A3 WO 2002033706 A3 WO2002033706 A3 WO 2002033706A3 US 0131159 W US0131159 W US 0131159W WO 0233706 A3 WO0233706 A3 WO 0233706A3
Authority
WO
WIPO (PCT)
Prior art keywords
bit line
dram
cells
coupling
approach
Prior art date
Application number
PCT/US2001/031159
Other languages
French (fr)
Other versions
WO2002033706A2 (en
Inventor
Shih-Lien Lu
Dinesh Somasekhar
Vivek De
Original Assignee
Intel Corp
Shih-Lien Lu
Dinesh Somasekhar
Vivek De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Shih-Lien Lu, Dinesh Somasekhar, Vivek De filed Critical Intel Corp
Priority to AU2002211437A priority Critical patent/AU2002211437A1/en
Priority to DE10196802T priority patent/DE10196802B4/en
Priority to GB0310604A priority patent/GB2385201B/en
Publication of WO2002033706A2 publication Critical patent/WO2002033706A2/en
Publication of WO2002033706A3 publication Critical patent/WO2002033706A3/en
Priority to HK03107698A priority patent/HK1055506A1/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4097Bit-line organisation, e.g. bit-line layout, folded bit lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4094Bit-line management or control circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/02Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals

Abstract

An open bit line dynamic random access memory (DRAM) architecture uses a multiple layer bit line configuration to reduce coupling between switching bit lines in the device. In one approach, each successive cell within a row of DRAM cells is coupled to a bit line segment that is on a different metallization layer than a previous cell in the row. Shielding members are also provided between adjacent bit lines on a common metallization layer to further reduce noise coupling. Functionality is also provided for reducing the effect of word line to bit line coupling in the DRAM device using dummy signal injection techniques. In this manner, common mode noise that could otherwise saturate one or more sense amplifiers within the DRAM device is reduced or eliminated before such saturation can take place. In one approach, dummy cells and reference cells are provided for use in performing the signal injection. The principles of the present invention are particularly well suited for use within embedded DRAM structures where low charge storage capacity within individual cells reduces the signal voltage levels that are achievable.
PCT/US2001/031159 2000-10-17 2001-10-03 Noise suppression for open bit line dram architectures WO2002033706A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002211437A AU2002211437A1 (en) 2000-10-17 2001-10-03 Noise suppression for open bit line dram architectures
DE10196802T DE10196802B4 (en) 2000-10-17 2001-10-03 Noise reduction for open bit-line DRAM architectures
GB0310604A GB2385201B (en) 2000-10-17 2001-10-03 Noise suppression for open bit line dram architectures
HK03107698A HK1055506A1 (en) 2000-10-17 2003-10-24 Noise suppression for open bit line dram architectures.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/690,513 US6496402B1 (en) 2000-10-17 2000-10-17 Noise suppression for open bit line DRAM architectures
US09/690,513 2000-10-17

Publications (2)

Publication Number Publication Date
WO2002033706A2 WO2002033706A2 (en) 2002-04-25
WO2002033706A3 true WO2002033706A3 (en) 2003-04-17

Family

ID=24772765

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/031159 WO2002033706A2 (en) 2000-10-17 2001-10-03 Noise suppression for open bit line dram architectures

Country Status (8)

Country Link
US (2) US6496402B1 (en)
CN (3) CN101330086B (en)
AU (1) AU2002211437A1 (en)
DE (1) DE10196802B4 (en)
GB (4) GB2385201B (en)
HK (1) HK1055506A1 (en)
TW (1) TW529027B (en)
WO (1) WO2002033706A2 (en)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043562A (en) * 1996-01-26 2000-03-28 Micron Technology, Inc. Digit line architecture for dynamic memory
US6496402B1 (en) * 2000-10-17 2002-12-17 Intel Corporation Noise suppression for open bit line DRAM architectures
US7411573B2 (en) * 2001-06-08 2008-08-12 Thomson Licensing LCOS column memory effect reduction
EP1355316B1 (en) * 2002-04-18 2007-02-21 Innovative Silicon SA Data storage device and refreshing method for use with such device
US6836427B2 (en) * 2002-06-05 2004-12-28 Micron Technology, Inc. System and method to counteract voltage disturbances in open digitline array dynamic random access memory systems
US6624460B1 (en) * 2002-08-15 2003-09-23 Macronix International Co., Ltd. Memory device with low resistance buried bit lines
US6912150B2 (en) * 2003-05-13 2005-06-28 Lionel Portman Reference current generator, and method of programming, adjusting and/or operating same
US20040228168A1 (en) * 2003-05-13 2004-11-18 Richard Ferrant Semiconductor memory device and method of operating same
US7085153B2 (en) * 2003-05-13 2006-08-01 Innovative Silicon S.A. Semiconductor memory cell, array, architecture and device, and method of operating same
US7184298B2 (en) * 2003-09-24 2007-02-27 Innovative Silicon S.A. Low power programming technique for a floating body memory transistor, memory cell, and memory array
US7123500B2 (en) * 2003-12-30 2006-10-17 Intel Corporation 1P1N 2T gain cell
US20050248042A1 (en) * 2004-05-04 2005-11-10 Lee Jong-Eon Semiconductor memory device
US7244995B2 (en) * 2004-10-18 2007-07-17 Texas Instruments Incorporated Scrambling method to reduce wordline coupling noise
US7301803B2 (en) * 2004-12-22 2007-11-27 Innovative Silicon S.A. Bipolar reading technique for a memory cell having an electrically floating body transistor
US7287103B2 (en) * 2005-05-17 2007-10-23 International Business Machines Corporation Method and apparatus for generating a mask value and command for extreme data rate memories utilizing error correction codes
US20070023833A1 (en) * 2005-07-28 2007-02-01 Serguei Okhonin Method for reading a memory cell having an electrically floating body transistor, and memory cell and array implementing same
US7606066B2 (en) 2005-09-07 2009-10-20 Innovative Silicon Isi Sa Memory cell and memory cell array having an electrically floating body transistor, and methods of operating same
US7683430B2 (en) * 2005-12-19 2010-03-23 Innovative Silicon Isi Sa Electrically floating body memory cell and array, and method of operating or controlling same
US7542345B2 (en) * 2006-02-16 2009-06-02 Innovative Silicon Isi Sa Multi-bit memory cell having electrically floating body transistor, and method of programming and reading same
US7382012B2 (en) * 2006-02-24 2008-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Reducing parasitic capacitance of MIM capacitor in integrated circuits by reducing effective dielectric constant of dielectric layer
US7492632B2 (en) * 2006-04-07 2009-02-17 Innovative Silicon Isi Sa Memory array having a programmable word length, and method of operating same
WO2007128738A1 (en) * 2006-05-02 2007-11-15 Innovative Silicon Sa Semiconductor memory cell and array using punch-through to program and read same
US8069377B2 (en) 2006-06-26 2011-11-29 Micron Technology, Inc. Integrated circuit having memory array including ECC and column redundancy and method of operating the same
US7542340B2 (en) * 2006-07-11 2009-06-02 Innovative Silicon Isi Sa Integrated circuit including memory array having a segmented bit line architecture and method of controlling and/or operating same
KR101277402B1 (en) 2007-01-26 2013-06-20 마이크론 테크놀로지, 인코포레이티드 Floating-body dram transistor comprising source/drain regions separated from the gated body region
WO2009031052A2 (en) * 2007-03-29 2009-03-12 Innovative Silicon S.A. Zero-capacitor (floating body) random access memory circuits with polycide word lines and manufacturing methods therefor
US20080237672A1 (en) * 2007-03-30 2008-10-02 Doyle Brian S High density memory
US8064274B2 (en) 2007-05-30 2011-11-22 Micron Technology, Inc. Integrated circuit having voltage generation circuitry for memory cell array, and method of operating and/or controlling same
US8085594B2 (en) * 2007-06-01 2011-12-27 Micron Technology, Inc. Reading technique for memory cell with electrically floating body transistor
US8368137B2 (en) * 2007-06-26 2013-02-05 Sandisk Technologies Inc. Dual bit line metal layers for non-volatile memory
US8097504B2 (en) * 2007-06-26 2012-01-17 Sandisk Technologies Inc. Method for forming dual bit line metal layers for non-volatile memory
US7652910B2 (en) 2007-06-30 2010-01-26 Intel Corporation Floating body memory array
JP5189809B2 (en) * 2007-09-13 2013-04-24 ルネサスエレクトロニクス株式会社 Semiconductor memory device
US8194487B2 (en) 2007-09-17 2012-06-05 Micron Technology, Inc. Refreshing data of memory cells with electrically floating body transistors
US8536628B2 (en) 2007-11-29 2013-09-17 Micron Technology, Inc. Integrated circuit having memory cell array including barriers, and method of manufacturing same
US8349662B2 (en) * 2007-12-11 2013-01-08 Micron Technology, Inc. Integrated circuit having memory cell array, and method of manufacturing same
US8773933B2 (en) 2012-03-16 2014-07-08 Micron Technology, Inc. Techniques for accessing memory cells
US8014195B2 (en) 2008-02-06 2011-09-06 Micron Technology, Inc. Single transistor memory cell
US8189376B2 (en) * 2008-02-08 2012-05-29 Micron Technology, Inc. Integrated circuit having memory cells including gate material having high work function, and method of manufacturing same
US7957206B2 (en) * 2008-04-04 2011-06-07 Micron Technology, Inc. Read circuitry for an integrated circuit having memory cells and/or a memory cell array, and method of operating same
US7920434B2 (en) * 2008-08-27 2011-04-05 International Business Machines Corporation Memory sensing method and apparatus
US7947543B2 (en) 2008-09-25 2011-05-24 Micron Technology, Inc. Recessed gate silicon-on-insulator floating body device with self-aligned lateral isolation
US7933140B2 (en) 2008-10-02 2011-04-26 Micron Technology, Inc. Techniques for reducing a voltage swing
US7924630B2 (en) * 2008-10-15 2011-04-12 Micron Technology, Inc. Techniques for simultaneously driving a plurality of source lines
US8223574B2 (en) * 2008-11-05 2012-07-17 Micron Technology, Inc. Techniques for block refreshing a semiconductor memory device
US8213226B2 (en) * 2008-12-05 2012-07-03 Micron Technology, Inc. Vertical transistor memory cell and array
US8319294B2 (en) * 2009-02-18 2012-11-27 Micron Technology, Inc. Techniques for providing a source line plane
US8710566B2 (en) 2009-03-04 2014-04-29 Micron Technology, Inc. Techniques for forming a contact to a buried diffusion layer in a semiconductor memory device
CN102365628B (en) * 2009-03-31 2015-05-20 美光科技公司 Techniques for providing a semiconductor memory device
US8139418B2 (en) 2009-04-27 2012-03-20 Micron Technology, Inc. Techniques for controlling a direct injection semiconductor memory device
US8508994B2 (en) 2009-04-30 2013-08-13 Micron Technology, Inc. Semiconductor device with floating gate and electrically floating body
US8498157B2 (en) 2009-05-22 2013-07-30 Micron Technology, Inc. Techniques for providing a direct injection semiconductor memory device
US8537610B2 (en) 2009-07-10 2013-09-17 Micron Technology, Inc. Techniques for providing a semiconductor memory device
US9076543B2 (en) 2009-07-27 2015-07-07 Micron Technology, Inc. Techniques for providing a direct injection semiconductor memory device
US8199595B2 (en) * 2009-09-04 2012-06-12 Micron Technology, Inc. Techniques for sensing a semiconductor memory device
US8174881B2 (en) 2009-11-24 2012-05-08 Micron Technology, Inc. Techniques for reducing disturbance in a semiconductor device
US8310893B2 (en) * 2009-12-16 2012-11-13 Micron Technology, Inc. Techniques for reducing impact of array disturbs in a semiconductor memory device
KR101678413B1 (en) * 2009-12-29 2016-11-23 삼성전자주식회사 Semiconductor memory device and method of training the same
US8416636B2 (en) * 2010-02-12 2013-04-09 Micron Technology, Inc. Techniques for controlling a semiconductor memory device
US7999361B1 (en) * 2010-02-19 2011-08-16 Altera Corporation Shielding structure for transmission lines
US8411513B2 (en) * 2010-03-04 2013-04-02 Micron Technology, Inc. Techniques for providing a semiconductor memory device having hierarchical bit lines
US8576631B2 (en) * 2010-03-04 2013-11-05 Micron Technology, Inc. Techniques for sensing a semiconductor memory device
US8369177B2 (en) * 2010-03-05 2013-02-05 Micron Technology, Inc. Techniques for reading from and/or writing to a semiconductor memory device
US8547738B2 (en) 2010-03-15 2013-10-01 Micron Technology, Inc. Techniques for providing a semiconductor memory device
US8411524B2 (en) 2010-05-06 2013-04-02 Micron Technology, Inc. Techniques for refreshing a semiconductor memory device
CN102456396A (en) * 2010-10-26 2012-05-16 中国科学院上海微系统与信息技术研究所 Bit line structure of phase change memory array
KR101850536B1 (en) * 2010-10-27 2018-04-19 삼성전자주식회사 Semiconductor memory device and semiconductor memory system
US8531878B2 (en) 2011-05-17 2013-09-10 Micron Technology, Inc. Techniques for providing a semiconductor memory device
US9559216B2 (en) 2011-06-06 2017-01-31 Micron Technology, Inc. Semiconductor memory device and method for biasing same
US9111591B2 (en) 2013-02-22 2015-08-18 Micron Technology, Inc. Interconnections for 3D memory
CN109155145B (en) * 2016-08-31 2022-11-01 美光科技公司 Memory array
US11211384B2 (en) 2017-01-12 2021-12-28 Micron Technology, Inc. Memory cells, arrays of two transistor-one capacitor memory cells, methods of forming an array of two transistor-one capacitor memory cells, and methods used in fabricating integrated circuitry
CN108172565B (en) * 2017-12-27 2020-12-11 上海艾为电子技术股份有限公司 MOM capacitor and integrated circuit
KR102615012B1 (en) 2018-11-12 2023-12-19 삼성전자주식회사 Memory device and operation method thereof
US10861787B1 (en) * 2019-08-07 2020-12-08 Micron Technology, Inc. Memory device with bitline noise suppressing scheme
US11636882B2 (en) 2019-10-29 2023-04-25 Micron Technology, Inc. Integrated assemblies having shield lines between neighboring transistor active regions
CN112885400B (en) * 2021-03-25 2022-05-31 长鑫存储技术有限公司 Method and device for determining mismatching of induction amplifier, storage medium and electronic equipment
US11928355B2 (en) 2021-03-25 2024-03-12 Changxin Memory Technologies, Inc. Method and apparatus for determining mismatch of sense amplifier, storage medium, and electronic equipment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247917A (en) * 1979-08-27 1981-01-27 Intel Corporation MOS Random-access memory
US4363111A (en) * 1980-10-06 1982-12-07 Heightley John D Dummy cell arrangement for an MOS memory
US4622655A (en) * 1983-05-04 1986-11-11 Nec Corporation Semiconductor memory
US5031153A (en) * 1988-12-13 1991-07-09 Oki Electric Industry Co., Ltd. MOS semiconductor memory device having sense control circuitry simplified
EP0452648A1 (en) * 1990-04-20 1991-10-23 International Business Machines Corporation Stacked bit line architecture for high density cross-point memory cell array
US5292678A (en) * 1991-11-04 1994-03-08 International Business Machines Corporation Forming a bit line configuration for semiconductor memory
US5424977A (en) * 1992-06-25 1995-06-13 Texas Instruments Incorporated Sense amplifier having shared dummy cell
US6118708A (en) * 1998-05-14 2000-09-12 Fujitsu Limited Semiconductor memory device
WO2001026139A2 (en) * 1999-10-04 2001-04-12 Infineon Technologies North America Corp. Dram bit lines and support circuitry contacting scheme

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413290A (en) * 1987-07-07 1989-01-18 Oki Electric Ind Co Ltd Semiconductor memory
US5792686A (en) * 1995-08-04 1998-08-11 Mosel Vitelic, Inc. Method of forming a bit-line and a capacitor structure in an integrated circuit
US5864496A (en) * 1997-09-29 1999-01-26 Siemens Aktiengesellschaft High density semiconductor memory having diagonal bit lines and dual word lines
US6249452B1 (en) * 1998-09-28 2001-06-19 Texas Instruments Incorporated Semiconductor device having offset twisted bit lines
JP3159191B2 (en) * 1998-12-09 2001-04-23 日本電気株式会社 Semiconductor device
US6201272B1 (en) * 1999-04-28 2001-03-13 International Business Machines Corporation Method for simultaneously forming a storage-capacitor electrode and interconnect
US6496402B1 (en) * 2000-10-17 2002-12-17 Intel Corporation Noise suppression for open bit line DRAM architectures

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4247917A (en) * 1979-08-27 1981-01-27 Intel Corporation MOS Random-access memory
US4363111A (en) * 1980-10-06 1982-12-07 Heightley John D Dummy cell arrangement for an MOS memory
US4622655A (en) * 1983-05-04 1986-11-11 Nec Corporation Semiconductor memory
US5031153A (en) * 1988-12-13 1991-07-09 Oki Electric Industry Co., Ltd. MOS semiconductor memory device having sense control circuitry simplified
EP0452648A1 (en) * 1990-04-20 1991-10-23 International Business Machines Corporation Stacked bit line architecture for high density cross-point memory cell array
US5292678A (en) * 1991-11-04 1994-03-08 International Business Machines Corporation Forming a bit line configuration for semiconductor memory
US5424977A (en) * 1992-06-25 1995-06-13 Texas Instruments Incorporated Sense amplifier having shared dummy cell
US6118708A (en) * 1998-05-14 2000-09-12 Fujitsu Limited Semiconductor memory device
WO2001026139A2 (en) * 1999-10-04 2001-04-12 Infineon Technologies North America Corp. Dram bit lines and support circuitry contacting scheme

Also Published As

Publication number Publication date
GB2385201A (en) 2003-08-13
GB2406199A (en) 2005-03-23
GB0425950D0 (en) 2004-12-29
GB2406197B (en) 2005-06-08
GB0310604D0 (en) 2003-06-11
GB2406198B (en) 2005-05-18
CN1572002A (en) 2005-01-26
GB2385201B (en) 2005-04-27
US6496402B1 (en) 2002-12-17
GB2406197A (en) 2005-03-23
DE10196802B4 (en) 2013-06-06
US20030072172A1 (en) 2003-04-17
HK1055506A1 (en) 2004-01-09
GB2406198A (en) 2005-03-23
CN101330086A (en) 2008-12-24
CN101329904B (en) 2012-01-25
GB0425947D0 (en) 2004-12-29
GB0425949D0 (en) 2004-12-29
CN100511474C (en) 2009-07-08
TW529027B (en) 2003-04-21
DE10196802T5 (en) 2004-04-15
WO2002033706A2 (en) 2002-04-25
US6721222B2 (en) 2004-04-13
GB2406199B (en) 2005-05-18
CN101329904A (en) 2008-12-24
AU2002211437A1 (en) 2002-04-29
CN101330086B (en) 2011-02-23

Similar Documents

Publication Publication Date Title
WO2002033706A3 (en) Noise suppression for open bit line dram architectures
US6016268A (en) Three transistor multi-state dynamic memory cell for embedded CMOS logic applications
KR100574242B1 (en) Space-efficient semiconductor memory having hierarchical column select line architecture
US5966315A (en) Semiconductor memory having hierarchical bit line architecture with non-uniform local bit lines
US20050226070A1 (en) Semiconductor memory device
US20060250869A1 (en) Semiconductor memory device
WO2001069603A3 (en) Multiple bank simultaneous operation for a flash memory
US20020048210A1 (en) Semiconductor memory device having hierarchical word line structure
TW200620281A (en) MRAM with staggered cell structure
US5422839A (en) Semiconductor memory device
WO2002001571A3 (en) Shielded bit line architecture for memory arrays
US6567329B2 (en) Multiple word-line accessing and accessor
TW286378B (en) A data sense circuit for dynamic random access memories
US20030095446A1 (en) Memory array
US7215595B2 (en) Memory device and method using a sense amplifier as a cache
EP0994483B1 (en) Apparatus and method for noise reduction in DRAM
US5666318A (en) Semiconductor memory device
TW342500B (en) Charge storage for sensing operations in a DRAM
KR100269618B1 (en) A self refresh control circuit
US6191996B1 (en) Semiconductor memory device and data transmission method
KR100328374B1 (en) Semiconductor memory and its driving method
WO2005008736A3 (en) 1t1c sram
JP3241351B2 (en) Sense amplifier, semiconductor device, and semiconductor storage device
JPS62154293A (en) Semiconductor storage device
KR20020072020A (en) sub-block selection address decoder and method for operating refresh of SDRAM using the same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

ENP Entry into the national phase

Ref document number: 0310604

Country of ref document: GB

Kind code of ref document: A

Free format text: PCT FILING DATE = 20011003

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 018175287

Country of ref document: CN

122 Ep: pct application non-entry in european phase
RET De translation (de og part 6b)

Ref document number: 10196802

Country of ref document: DE

Date of ref document: 20040415

Kind code of ref document: P

WWE Wipo information: entry into national phase

Ref document number: 10196802

Country of ref document: DE

NENP Non-entry into the national phase

Ref country code: JP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8607