WO2002035555A1 - Particule enrobee - Google Patents
Particule enrobee Download PDFInfo
- Publication number
- WO2002035555A1 WO2002035555A1 PCT/JP2001/004543 JP0104543W WO0235555A1 WO 2002035555 A1 WO2002035555 A1 WO 2002035555A1 JP 0104543 W JP0104543 W JP 0104543W WO 0235555 A1 WO0235555 A1 WO 0235555A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- particles
- group
- metal
- functional group
- particle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/10—Treatment with macromolecular organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01934417A EP1335389A4 (en) | 2000-10-23 | 2001-05-30 | COATED PARTICLE |
CA002425983A CA2425983A1 (en) | 2000-10-23 | 2001-05-30 | Coated particle |
US10/399,687 US7252883B2 (en) | 2000-10-23 | 2001-05-30 | Coated particles |
KR1020077003462A KR100832282B1 (ko) | 2000-10-23 | 2001-05-30 | 피복 입자 |
JP2002538447A JP4547128B2 (ja) | 2000-10-23 | 2001-05-30 | 被覆粒子 |
KR10-2003-7005581A KR20030051732A (ko) | 2000-10-23 | 2001-05-30 | 피복 입자 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000322974 | 2000-10-23 | ||
JP2000-322974 | 2000-10-23 | ||
JP2000-322975 | 2000-10-23 | ||
JP2000322975 | 2000-10-23 | ||
JP2001-28324 | 2001-02-05 | ||
JP2001028324 | 2001-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002035555A1 true WO2002035555A1 (fr) | 2002-05-02 |
Family
ID=27345011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/004543 WO2002035555A1 (fr) | 2000-10-23 | 2001-05-30 | Particule enrobee |
Country Status (7)
Country | Link |
---|---|
US (1) | US7252883B2 (ja) |
EP (1) | EP1335389A4 (ja) |
JP (1) | JP4547128B2 (ja) |
KR (3) | KR100832282B1 (ja) |
CN (1) | CN1244112C (ja) |
CA (1) | CA2425983A1 (ja) |
WO (1) | WO2002035555A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003026813A (ja) * | 2001-07-13 | 2003-01-29 | Nippon Shokubai Co Ltd | 異方導電性材料 |
WO2005004171A1 (ja) * | 2003-07-04 | 2005-01-13 | Natoco Co., Ltd. | 被覆導電性粒子、導電性材料、異方性導電接着剤および異方性導電接合構造 |
WO2005033159A1 (ja) * | 2003-10-06 | 2005-04-14 | Kaneka Corporation | ポリオレフィン系グラフト共重合体 |
WO2005035605A1 (ja) * | 2003-10-14 | 2005-04-21 | Murata Manufacturing Co., Ltd. | 樹脂被覆金属粉体の製造方法及び樹脂被覆金属粉体並びに回路形成用トナー |
JP2005200652A (ja) * | 2004-01-15 | 2005-07-28 | Ivoclar Vivadent Ag | Romp組成物に基づく歯科材料 |
WO2006090467A1 (ja) * | 2005-02-24 | 2006-08-31 | Sony Chemical & Information Device Corporation | 絶縁被覆導電粒子 |
WO2008047600A1 (fr) * | 2006-10-17 | 2008-04-24 | Hitachi Chemical Company, Ltd. | particule revêtue et son procédé de fabrication, composition adhésive conductrice anisotrope utilisant la particule revêtue et film adhésif conducteur anisotrope |
EP1426979A4 (en) * | 2001-09-14 | 2009-02-18 | Sekisui Chemical Co Ltd | COATED CONDUCTIVE PARTICLE, MANUFACTURING METHOD FOR COATED CONDUCTIVE CONDUCTIVE PARTICLES, ANISOTROPIC CONDUCTIVE MATERIAL AND CONDUCTIVE CONNECTION STRUCTURE |
WO2009054387A1 (ja) * | 2007-10-22 | 2009-04-30 | Nippon Chemical Industrial Co., Ltd. | 被覆導電性粉体およびそれを用いた導電性接着剤 |
JP2009280790A (ja) * | 2008-04-22 | 2009-12-03 | Hitachi Chem Co Ltd | 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤 |
JP2013016414A (ja) * | 2011-07-06 | 2013-01-24 | Sekisui Chem Co Ltd | 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 |
WO2018207627A1 (ja) * | 2017-05-08 | 2018-11-15 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
WO2018207628A1 (ja) * | 2017-05-08 | 2018-11-15 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100369939C (zh) * | 2000-10-23 | 2008-02-20 | 积水化学工业株式会社 | 各向异性导电性颗粒 |
EP1388903B1 (en) * | 2002-08-09 | 2016-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Organic electroluminescent device |
US7226661B2 (en) * | 2003-02-03 | 2007-06-05 | Board Of Regents, The University Of Texas System | Synthesis of quinones and phenols on solid support |
JP4539813B2 (ja) * | 2003-08-19 | 2010-09-08 | ソニーケミカル&インフォメーションデバイス株式会社 | 絶縁被覆導電粒子 |
FR2859117B1 (fr) * | 2003-08-27 | 2006-02-03 | Commissariat Energie Atomique | Utilisation de nanoparticules a coeur metallique et double enrobage organique en tant que catalyseurs et nanoparticules utiles comme catalyseurs |
US8445159B2 (en) | 2004-11-30 | 2013-05-21 | The Regents Of The University Of California | Sealed joint structure for electrochemical device |
KR100763389B1 (ko) * | 2005-07-01 | 2007-10-05 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널 및 그 제조방법 |
JP4534998B2 (ja) * | 2006-02-21 | 2010-09-01 | セイコーエプソン株式会社 | 帯電粒子の製造方法、帯電粒子、電気泳動分散液、電気泳動シート、電気泳動装置および電子機器 |
US20100065311A1 (en) * | 2006-07-03 | 2010-03-18 | Hitachi Chemical Company, Ltd. | Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
JP4636183B2 (ja) * | 2006-09-26 | 2011-02-23 | 日立化成工業株式会社 | 異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法 |
WO2010071134A1 (ja) * | 2008-12-15 | 2010-06-24 | 旭硝子株式会社 | 光硬化性材料の製造方法、光硬化性材料および物品 |
JP5677078B2 (ja) * | 2010-01-21 | 2015-02-25 | キヤノン株式会社 | 有機・無機複合粒子の製造方法、光学材料の製造方法、光学素子の製造方法、レンズの製造方法、及び、有機・無機複合粒子 |
JP5633285B2 (ja) * | 2010-01-25 | 2014-12-03 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池 |
JP5521848B2 (ja) * | 2010-07-21 | 2014-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体及びそれらの製造方法 |
CN102136313B (zh) * | 2010-12-06 | 2013-07-24 | 苏州纳微生物科技有限公司 | 一种复合微球及各向异性导电材料和各向异性导电膜与导电结构 |
CN103045161B (zh) * | 2011-10-11 | 2016-03-30 | 北京格加纳米技术有限公司 | 一种有机物表面修饰的金属和金属氧化物材料及其制造方法 |
JP6028373B2 (ja) * | 2012-04-05 | 2016-11-16 | セイコーエプソン株式会社 | 電気泳動粒子、電気泳動粒子の製造方法、電気泳動分散液、電気泳動シート、電気泳動装置および電子機器 |
CN104212202A (zh) * | 2013-05-29 | 2014-12-17 | 北京格加纳米技术有限公司 | 一种有机胺表面改性的金属硫化物材料及其制造方法和用途 |
US20150072109A1 (en) * | 2013-09-10 | 2015-03-12 | Trillion Science, Inc. | Fixed-array anisotropic conductive film using conductive particles with block copolymer coating |
KR102650760B1 (ko) * | 2018-07-10 | 2024-03-22 | 니폰 가가쿠 고교 가부시키가이샤 | 피복 입자 |
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GB2178182A (en) * | 1985-07-16 | 1987-02-04 | Fuji Photo Film Co Ltd | Electrostatographic encapsulated toner |
JPH02300205A (ja) * | 1989-05-16 | 1990-12-12 | Nippon Shokubai Kagaku Kogyo Co Ltd | 磁性体含有球状微粒子、その製造方法およびその用途 |
JPH07105716A (ja) * | 1993-10-05 | 1995-04-21 | Soken Kagaku Kk | 被覆粒子および異方導電性接着剤 |
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US4042534A (en) | 1974-02-28 | 1977-08-16 | Andrianov Kuzma A | Conducting anisotropic polymer material |
JPS6217754A (ja) * | 1985-07-16 | 1987-01-26 | Fuji Photo Film Co Ltd | 電子写真用トナー |
JP2501100B2 (ja) | 1985-08-15 | 1996-05-29 | ソニー株式会社 | 連結シ−ト |
JP2895872B2 (ja) * | 1989-09-26 | 1999-05-24 | 触媒化成工業株式会社 | 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
JPH04115407A (ja) | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
JP2748705B2 (ja) * | 1991-02-14 | 1998-05-13 | 日立化成工業株式会社 | 回路の接続部材 |
JP3231814B2 (ja) | 1991-07-12 | 2001-11-26 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
CA2081222C (en) * | 1991-10-24 | 1998-10-27 | Hiroaki Date | Method for production of microcapsule type conductive filler |
JPH06302222A (ja) * | 1993-04-15 | 1994-10-28 | Sekisui Finechem Co Ltd | 導電性重合体微粒子及びその製造方法 |
JPH07105725A (ja) * | 1993-10-05 | 1995-04-21 | Soken Kagaku Kk | 異方導電性接着剤 |
JPH0850808A (ja) * | 1994-08-05 | 1996-02-20 | Sekisui Finechem Co Ltd | 導電性微粒子の製造方法 |
US5565143A (en) * | 1995-05-05 | 1996-10-15 | E. I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
JP2794009B2 (ja) | 1996-01-29 | 1998-09-03 | 富士ゼロックス株式会社 | 電気接続用異方導電性粒子の製造方法および電気接続用異方導電材料の製造方法 |
US5807506A (en) * | 1997-04-01 | 1998-09-15 | Xerox Corporation | Conductive polymers |
JP3455871B2 (ja) * | 1997-06-23 | 2003-10-14 | 株式会社スリーボンド | マイクロカプセル型導電性フィラーの製造方法 |
JP3679618B2 (ja) * | 1998-08-25 | 2005-08-03 | 積水化学工業株式会社 | 絶縁被覆導電性微粒子、異方性導電接着剤及び導電接続構造体 |
WO2001074119A1 (en) * | 2000-03-24 | 2001-10-04 | World Properties, Inc. | Polymeric organic coatings and method of manufacture thereof |
-
2001
- 2001-05-30 KR KR1020077003462A patent/KR100832282B1/ko active IP Right Grant
- 2001-05-30 KR KR1020087003243A patent/KR20080027388A/ko not_active Application Discontinuation
- 2001-05-30 CA CA002425983A patent/CA2425983A1/en not_active Abandoned
- 2001-05-30 JP JP2002538447A patent/JP4547128B2/ja not_active Expired - Lifetime
- 2001-05-30 EP EP01934417A patent/EP1335389A4/en not_active Withdrawn
- 2001-05-30 CN CNB018178073A patent/CN1244112C/zh not_active Expired - Fee Related
- 2001-05-30 WO PCT/JP2001/004543 patent/WO2002035555A1/ja active Application Filing
- 2001-05-30 US US10/399,687 patent/US7252883B2/en not_active Expired - Lifetime
- 2001-05-30 KR KR10-2003-7005581A patent/KR20030051732A/ko not_active Application Discontinuation
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JP2003026813A (ja) * | 2001-07-13 | 2003-01-29 | Nippon Shokubai Co Ltd | 異方導電性材料 |
EP1426979A4 (en) * | 2001-09-14 | 2009-02-18 | Sekisui Chemical Co Ltd | COATED CONDUCTIVE PARTICLE, MANUFACTURING METHOD FOR COATED CONDUCTIVE CONDUCTIVE PARTICLES, ANISOTROPIC CONDUCTIVE MATERIAL AND CONDUCTIVE CONNECTION STRUCTURE |
KR100740920B1 (ko) * | 2003-07-04 | 2007-07-20 | 나토코 가부시키가이샤 | 피복도전성입자 , 도전성 재료, 이방성도전접착제 및이방성도전접합 구조 |
WO2005004171A1 (ja) * | 2003-07-04 | 2005-01-13 | Natoco Co., Ltd. | 被覆導電性粒子、導電性材料、異方性導電接着剤および異方性導電接合構造 |
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WO2005033159A1 (ja) * | 2003-10-06 | 2005-04-14 | Kaneka Corporation | ポリオレフィン系グラフト共重合体 |
JPWO2005035605A1 (ja) * | 2003-10-14 | 2007-11-22 | 株式会社村田製作所 | 樹脂被覆金属粉体の製造方法及び樹脂被覆金属粉体並びに回路形成用トナー |
CN100422232C (zh) * | 2003-10-14 | 2008-10-01 | 株式会社村田制作所 | 树脂涂布金属颗粒的制备方法、树脂涂布金属颗粒和形成电路的调色剂 |
WO2005035605A1 (ja) * | 2003-10-14 | 2005-04-21 | Murata Manufacturing Co., Ltd. | 樹脂被覆金属粉体の製造方法及び樹脂被覆金属粉体並びに回路形成用トナー |
US8053073B2 (en) | 2003-10-14 | 2011-11-08 | Murata Manufacturing Co., Ltd. | Process for producing resin-coated metal particles, resin-coated metal particles, and toner for forming circuit |
JP2005200652A (ja) * | 2004-01-15 | 2005-07-28 | Ivoclar Vivadent Ag | Romp組成物に基づく歯科材料 |
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JP2011219869A (ja) * | 2006-10-17 | 2011-11-04 | Hitachi Chem Co Ltd | 被覆粒子の製造方法 |
WO2008047600A1 (fr) * | 2006-10-17 | 2008-04-24 | Hitachi Chemical Company, Ltd. | particule revêtue et son procédé de fabrication, composition adhésive conductrice anisotrope utilisant la particule revêtue et film adhésif conducteur anisotrope |
JP4780197B2 (ja) * | 2006-10-17 | 2011-09-28 | 日立化成工業株式会社 | 被覆粒子及びその製造方法、並びに、被覆粒子を用いた異方導電性接着剤組成物及び異方導電性接着剤フィルム |
WO2009054387A1 (ja) * | 2007-10-22 | 2009-04-30 | Nippon Chemical Industrial Co., Ltd. | 被覆導電性粉体およびそれを用いた導電性接着剤 |
US8124232B2 (en) | 2007-10-22 | 2012-02-28 | Nippon Chemical Industrial Co., Ltd. | Coated conductive powder and conductive adhesive using the same |
KR101404274B1 (ko) | 2007-10-22 | 2014-06-05 | 니폰 가가쿠 고교 가부시키가이샤 | 피복 도전성 분체 및 그것을 이용한 도전성 접착제 |
JP2009280790A (ja) * | 2008-04-22 | 2009-12-03 | Hitachi Chem Co Ltd | 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤 |
JP2013016414A (ja) * | 2011-07-06 | 2013-01-24 | Sekisui Chem Co Ltd | 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 |
WO2018207627A1 (ja) * | 2017-05-08 | 2018-11-15 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
WO2018207628A1 (ja) * | 2017-05-08 | 2018-11-15 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
JP6458204B1 (ja) * | 2017-05-08 | 2019-01-23 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
JPWO2018207627A1 (ja) * | 2017-05-08 | 2020-03-12 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
US11407863B2 (en) | 2017-05-08 | 2022-08-09 | Nippon Chemical Industrial Co., Ltd. | Coated particles and production method therefor |
JP7160801B2 (ja) | 2017-05-08 | 2022-10-25 | 日本化学工業株式会社 | 被覆粒子及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1335389A1 (en) | 2003-08-13 |
KR100832282B1 (ko) | 2008-05-26 |
CN1471714A (zh) | 2004-01-28 |
JP4547128B2 (ja) | 2010-09-22 |
JPWO2002035555A1 (ja) | 2004-03-04 |
KR20070033468A (ko) | 2007-03-26 |
CN1244112C (zh) | 2006-03-01 |
EP1335389A4 (en) | 2006-08-02 |
CA2425983A1 (en) | 2003-04-15 |
US20040109995A1 (en) | 2004-06-10 |
KR20030051732A (ko) | 2003-06-25 |
KR20080027388A (ko) | 2008-03-26 |
US7252883B2 (en) | 2007-08-07 |
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