WO2002035586A3 - Monitoring substrate processing using reflected radiation - Google Patents

Monitoring substrate processing using reflected radiation Download PDF

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Publication number
WO2002035586A3
WO2002035586A3 PCT/US2001/049437 US0149437W WO0235586A3 WO 2002035586 A3 WO2002035586 A3 WO 2002035586A3 US 0149437 W US0149437 W US 0149437W WO 0235586 A3 WO0235586 A3 WO 0235586A3
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
substrate processing
substrate
reflected radiation
monitoring substrate
Prior art date
Application number
PCT/US2001/049437
Other languages
French (fr)
Other versions
WO2002035586A2 (en
Inventor
Zhifeng Sui
Hongqing Shan
Nils Johansson
Hamid Noorbakhsh
Yu Guan
Coriolan Frum
Jie Yuan
Chang-Lin Hsieh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/695,577 external-priority patent/US6831742B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to EP01988945A priority Critical patent/EP1352415A2/en
Priority to KR1020037005580A priority patent/KR100927557B1/en
Priority to JP2002538471A priority patent/JP4098621B2/en
Publication of WO2002035586A2 publication Critical patent/WO2002035586A2/en
Publication of WO2002035586A3 publication Critical patent/WO2002035586A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC

Abstract

A substrate processing apparatus has a chamber capable of processing a substrate, a radiation source to provide a radiation, a radiation polarizer adapted to polarize the radiation to one or more polarization angles that are selected in relation to an orientation of a feature being processed on the substrate, a radiation detector to detect radiation reflected from the substrate during processing and generate a signal, and a controller to process the signal.
PCT/US2001/049437 2000-10-23 2001-10-23 Monitoring substrate processing using reflected radiation WO2002035586A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP01988945A EP1352415A2 (en) 2000-10-23 2001-10-23 Monitoring substrate processing using reflected radiation
KR1020037005580A KR100927557B1 (en) 2000-10-23 2001-10-23 How to Monitor Substrate Processing Using Reflected Radiation
JP2002538471A JP4098621B2 (en) 2000-10-23 2001-10-23 Apparatus and method for processing a substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/695,577 2000-10-23
US09/695,577 US6831742B1 (en) 2000-10-23 2000-10-23 Monitoring substrate processing using reflected radiation
US09/803,080 US6559942B2 (en) 2000-10-23 2001-03-08 Monitoring substrate processing with optical emission and polarized reflected radiation
US09/803,080 2001-03-08

Publications (2)

Publication Number Publication Date
WO2002035586A2 WO2002035586A2 (en) 2002-05-02
WO2002035586A3 true WO2002035586A3 (en) 2003-08-07

Family

ID=27105602

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/049437 WO2002035586A2 (en) 2000-10-23 2001-10-23 Monitoring substrate processing using reflected radiation

Country Status (5)

Country Link
EP (1) EP1352415A2 (en)
JP (3) JP4098621B2 (en)
CN (1) CN100459027C (en)
TW (1) TW510008B (en)
WO (1) WO2002035586A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306696B2 (en) * 2002-11-01 2007-12-11 Applied Materials, Inc. Interferometric endpoint determination in a substrate etching process
US6829056B1 (en) * 2003-08-21 2004-12-07 Michael Barnes Monitoring dimensions of features at different locations in the processing of substrates
JP4400406B2 (en) 2004-10-08 2010-01-20 エルピーダメモリ株式会社 Manufacturing method of semiconductor device
FR2887072A1 (en) * 2005-06-08 2006-12-15 Alcatel Sa IMPROVED SPECTOGRAPHIC SYSTEM WITH PLASMA SOURCE
JP5149610B2 (en) * 2007-12-19 2013-02-20 株式会社日立ハイテクノロジーズ Plasma processing equipment
US8135560B2 (en) 2009-01-30 2012-03-13 Applied Materials, Inc. Sensor system for semiconductor manufacturing apparatus
JP5559505B2 (en) * 2009-09-30 2014-07-23 東京エレクトロン株式会社 Plasma processing equipment
JP5385875B2 (en) * 2010-08-26 2014-01-08 東京エレクトロン株式会社 Plasma processing apparatus and optical monitor apparatus
DE102014115708A1 (en) * 2014-10-29 2016-05-04 Aixtron Se Method for separating a carbon structure from a seed structure
JPWO2020157954A1 (en) 2019-02-01 2021-02-18 株式会社日立ハイテク Etching method and plasma processing equipment
KR102521816B1 (en) * 2019-12-20 2023-04-14 주식회사 히타치하이테크 Plasma processing device and wafer processing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552016A (en) * 1993-04-28 1996-09-03 Applied Materials, Inc. Method and apparatus for etchback endpoint detection
EP0756318A1 (en) * 1995-07-24 1997-01-29 International Business Machines Corporation Method for real-time in-situ monitoring of a trench formation process
JPH10239028A (en) * 1997-02-27 1998-09-11 Toshiba Corp Etching depth measuring method and its device
US6081334A (en) * 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes

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US4927485A (en) * 1988-07-28 1990-05-22 Applied Materials, Inc. Laser interferometer system for monitoring and controlling IC processing
JPH0997783A (en) * 1995-09-28 1997-04-08 Nec Corp Plasma processing device
JPH09126991A (en) * 1995-10-27 1997-05-16 Hitachi Ltd Spectral detection method and its device and ultra-fine machining method and device used for it
JPH10294305A (en) * 1997-04-18 1998-11-04 Hitachi Ltd Production of semiconductor and semiconductor device
JPH1167732A (en) * 1997-08-22 1999-03-09 Matsushita Electron Corp Monitoring method of plasma process and monitoring apparatus
US6060328A (en) * 1997-09-05 2000-05-09 Advanced Micro Devices, Inc. Methods and arrangements for determining an endpoint for an in-situ local interconnect etching process
US6483580B1 (en) * 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US6390019B1 (en) * 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
JP2000012527A (en) * 1998-06-25 2000-01-14 Sumitomo Metal Ind Ltd Method and apparatus for determining etching end point
EP1095264A1 (en) * 1998-07-11 2001-05-02 Vorgem Limited Improved process monitor
KR100275671B1 (en) * 1998-08-26 2001-02-01 윤종용 Plasma etching equipment
JP3383236B2 (en) * 1998-12-01 2003-03-04 株式会社日立製作所 Etching end point determining method and etching end point determining apparatus
US6052176A (en) * 1999-03-31 2000-04-18 Lam Research Corporation Processing chamber with optical window cleaned using process gas

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552016A (en) * 1993-04-28 1996-09-03 Applied Materials, Inc. Method and apparatus for etchback endpoint detection
EP0756318A1 (en) * 1995-07-24 1997-01-29 International Business Machines Corporation Method for real-time in-situ monitoring of a trench formation process
JPH10239028A (en) * 1997-02-27 1998-09-11 Toshiba Corp Etching depth measuring method and its device
US6081334A (en) * 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BIOLSI P ET AL: "AN ADVANCED ENDPOINT DETECTION SOLUTION FOR <1% OPEN AREAS", SOLID STATE TECHNOLOGY, COWAN PUBL.CORP. WASHINGTON, US, vol. 39, no. 12, 1 December 1996 (1996-12-01), pages 59,61 - 62,64,67, XP000632988, ISSN: 0038-111X *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) *

Also Published As

Publication number Publication date
CN1636261A (en) 2005-07-06
WO2002035586A2 (en) 2002-05-02
CN100459027C (en) 2009-02-04
TW510008B (en) 2002-11-11
EP1352415A2 (en) 2003-10-15
JP2004518272A (en) 2004-06-17
JP4098621B2 (en) 2008-06-11
JP4841507B2 (en) 2011-12-21
JP2007294987A (en) 2007-11-08
JP2007329485A (en) 2007-12-20

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