WO2002041335A3 - High quality printed inductor on a package - Google Patents
High quality printed inductor on a package Download PDFInfo
- Publication number
- WO2002041335A3 WO2002041335A3 PCT/US2001/043362 US0143362W WO0241335A3 WO 2002041335 A3 WO2002041335 A3 WO 2002041335A3 US 0143362 W US0143362 W US 0143362W WO 0241335 A3 WO0241335 A3 WO 0241335A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- package
- inductor
- high quality
- quality printed
- printed inductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
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- H01L2924/3025—Electromagnetic shielding
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71545400A | 2000-11-17 | 2000-11-17 | |
US09/715,454 | 2000-11-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2002041335A2 WO2002041335A2 (en) | 2002-05-23 |
WO2002041335A9 WO2002041335A9 (en) | 2002-07-18 |
WO2002041335A3 true WO2002041335A3 (en) | 2002-12-27 |
Family
ID=24874109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/043362 WO2002041335A2 (en) | 2000-11-17 | 2001-11-16 | High quality printed inductor on a package |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2002041335A2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5519582A (en) * | 1992-10-05 | 1996-05-21 | Fuji Electric Co., Ltd. | Magnetic induction coil for semiconductor devices |
US5521431A (en) * | 1993-12-24 | 1996-05-28 | Nec Corporation | Semiconductor device with lead frame of molded container |
DE19639650A1 (en) * | 1996-09-26 | 1998-04-02 | Sican Gmbh | Integrated circuit with an inductive component and method for producing this |
EP1091404A1 (en) * | 1999-10-06 | 2001-04-11 | Lucent Technologies Inc. | Multifunction lead frame and integrated circuit package incorporating the same |
-
2001
- 2001-11-16 WO PCT/US2001/043362 patent/WO2002041335A2/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5519582A (en) * | 1992-10-05 | 1996-05-21 | Fuji Electric Co., Ltd. | Magnetic induction coil for semiconductor devices |
US5521431A (en) * | 1993-12-24 | 1996-05-28 | Nec Corporation | Semiconductor device with lead frame of molded container |
DE19639650A1 (en) * | 1996-09-26 | 1998-04-02 | Sican Gmbh | Integrated circuit with an inductive component and method for producing this |
EP1091404A1 (en) * | 1999-10-06 | 2001-04-11 | Lucent Technologies Inc. | Multifunction lead frame and integrated circuit package incorporating the same |
Also Published As
Publication number | Publication date |
---|---|
WO2002041335A2 (en) | 2002-05-23 |
WO2002041335A9 (en) | 2002-07-18 |
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