WO2002041507A3 - Two-level u-shaped groove and method of fabricating the same - Google Patents

Two-level u-shaped groove and method of fabricating the same Download PDF

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Publication number
WO2002041507A3
WO2002041507A3 PCT/US2001/043881 US0143881W WO0241507A3 WO 2002041507 A3 WO2002041507 A3 WO 2002041507A3 US 0143881 W US0143881 W US 0143881W WO 0241507 A3 WO0241507 A3 WO 0241507A3
Authority
WO
WIPO (PCT)
Prior art keywords
groove
side wall
fabricating
level
groove width
Prior art date
Application number
PCT/US2001/043881
Other languages
French (fr)
Other versions
WO2002041507A2 (en
Inventor
Glenn E Kohnke
Lu Chen
Yuri Suzuki
Original Assignee
Corning Inc
Cornell Res Foundation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc, Cornell Res Foundation Inc filed Critical Corning Inc
Priority to AU2002239320A priority Critical patent/AU2002239320A1/en
Publication of WO2002041507A2 publication Critical patent/WO2002041507A2/en
Publication of WO2002041507A3 publication Critical patent/WO2002041507A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device

Abstract

A structure is provided for coupling optical devices in an integrated optical microcircuit. The structure comprises a substrate (10) having a groove formed in one surface (12) thereof. The groove has a bottom substantially parallel to the surface. The grove also has an upper side wall adjacent the surface, the upper side wall being substantially perpendicular to the surface and defining an upper groove width (Wu). The groove also has a lower side wall adjacent the bottom, the lower side wall being substantially perpendicular to the surface and defiing a lower groove width (Wl). The upper groove width (Wu) is greater than the lower groove width (Wl). A process for fabricating the structure is also provided which uses Bosch etching to form the vertical sidewalls of the two-level U-shaped groove.
PCT/US2001/043881 2000-11-20 2001-11-15 Two-level u-shaped groove and method of fabricating the same WO2002041507A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002239320A AU2002239320A1 (en) 2000-11-20 2001-11-15 Two-level u-shaped groove and method of fabricating the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71803700A 2000-11-20 2000-11-20
US09/718,037 2000-11-20

Publications (2)

Publication Number Publication Date
WO2002041507A2 WO2002041507A2 (en) 2002-05-23
WO2002041507A3 true WO2002041507A3 (en) 2002-08-22

Family

ID=24884554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/043881 WO2002041507A2 (en) 2000-11-20 2001-11-15 Two-level u-shaped groove and method of fabricating the same

Country Status (2)

Country Link
AU (1) AU2002239320A1 (en)
WO (1) WO2002041507A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11262506B1 (en) * 2020-08-07 2022-03-01 Advanced Semiconductor Engineering, Inc. Recessed portion in a substrate and method of forming the same
US11774689B2 (en) 2021-10-25 2023-10-03 Globalfoundries U.S. Inc. Photonics chips and semiconductor products having angled optical fibers
US11650381B1 (en) 2022-02-12 2023-05-16 Globalfoundries U.S. Inc. PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239601A (en) * 1990-03-01 1993-08-24 Commissariat A L'energie Atomique Connection process between an optical fibre and an optical microguide
US5357593A (en) * 1993-10-12 1994-10-18 Alliedsignal Inc. Method of attaching optical fibers to opto-electronic integrated circuits on silicon substrates
US5579424A (en) * 1993-06-18 1996-11-26 Siemens Aktiengesellschaft Arrangement for an optical coupling of a fiber to a planar optical waveguide and a method of forming the arrangement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239601A (en) * 1990-03-01 1993-08-24 Commissariat A L'energie Atomique Connection process between an optical fibre and an optical microguide
US5579424A (en) * 1993-06-18 1996-11-26 Siemens Aktiengesellschaft Arrangement for an optical coupling of a fiber to a planar optical waveguide and a method of forming the arrangement
US5357593A (en) * 1993-10-12 1994-10-18 Alliedsignal Inc. Method of attaching optical fibers to opto-electronic integrated circuits on silicon substrates

Also Published As

Publication number Publication date
AU2002239320A1 (en) 2002-05-27
WO2002041507A2 (en) 2002-05-23

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