WO2002050852A3 - Capacitor with extended surface lands and method of fabrication therefor - Google Patents

Capacitor with extended surface lands and method of fabrication therefor Download PDF

Info

Publication number
WO2002050852A3
WO2002050852A3 PCT/US2001/044822 US0144822W WO0250852A3 WO 2002050852 A3 WO2002050852 A3 WO 2002050852A3 US 0144822 W US0144822 W US 0144822W WO 0250852 A3 WO0250852 A3 WO 0250852A3
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor
extended surface
surface lands
fabrication therefor
lands
Prior art date
Application number
PCT/US2001/044822
Other languages
French (fr)
Other versions
WO2002050852A2 (en
Inventor
David Figueroa
Michael J Walk
Jorge P Rodriguez
Huong Do
Original Assignee
Intel Corp
David Figueroa
Michael J Walk
Jorge P Rodriguez
Huong Do
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, David Figueroa, Michael J Walk, Jorge P Rodriguez, Huong Do filed Critical Intel Corp
Priority to EP01271642A priority Critical patent/EP1344232A2/en
Priority to KR1020037008135A priority patent/KR100543853B1/en
Priority to JP2002551867A priority patent/JP2004531049A/en
Priority to AU2002217954A priority patent/AU2002217954A1/en
Publication of WO2002050852A2 publication Critical patent/WO2002050852A2/en
Publication of WO2002050852A3 publication Critical patent/WO2002050852A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/20—Arrangements for preventing discharge from edges of electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

A capacitor (Figures 6-9) includes one or more extended surface lands (604, 704, 804, 904, Figures 6-9). In one embodiment, each extended surface land is a land on a top or bottom surface of the capacitor, having a land length that is equal to at least 30% of the width (614, Figure 6) of the capacitor or 20% of the length (914, figure 9) of the capacitor. When embedded within an integrated circuit package (1102, Figure 11), two or more vias (1112) can be electrically connected to the extended surface lands (1108).
PCT/US2001/044822 2000-12-19 2001-11-27 Capacitor with extended surface lands and method of fabrication therefor WO2002050852A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01271642A EP1344232A2 (en) 2000-12-19 2001-11-27 Capacitor with extended surface lands and method of fabrication therefor
KR1020037008135A KR100543853B1 (en) 2000-12-19 2001-11-27 Capacitor with extended surface lands and method of fabrication therefor
JP2002551867A JP2004531049A (en) 2000-12-19 2001-11-27 Capacitor having extended surface land and method of manufacturing the same
AU2002217954A AU2002217954A1 (en) 2000-12-19 2001-11-27 Capacitor with extended surface lands and method of fabrication therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/741,302 US6483692B2 (en) 2000-12-19 2000-12-19 Capacitor with extended surface lands and method of fabrication therefor
US09/741,302 2000-12-19

Publications (2)

Publication Number Publication Date
WO2002050852A2 WO2002050852A2 (en) 2002-06-27
WO2002050852A3 true WO2002050852A3 (en) 2003-04-03

Family

ID=24980170

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/044822 WO2002050852A2 (en) 2000-12-19 2001-11-27 Capacitor with extended surface lands and method of fabrication therefor

Country Status (8)

Country Link
US (1) US6483692B2 (en)
EP (1) EP1344232A2 (en)
JP (1) JP2004531049A (en)
KR (1) KR100543853B1 (en)
CN (1) CN1327461C (en)
AU (1) AU2002217954A1 (en)
MY (1) MY124519A (en)
WO (1) WO2002050852A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6636416B2 (en) * 2001-06-14 2003-10-21 Intel Corporation Electronic assembly with laterally connected capacitors and manufacturing method
US6819543B2 (en) * 2002-12-31 2004-11-16 Intel Corporation Multilayer capacitor with multiple plates per layer
US6785118B1 (en) 2003-03-31 2004-08-31 Intel Corporation Multiple electrode capacitor
US6950300B2 (en) * 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
US6885539B1 (en) * 2003-12-02 2005-04-26 Presidio Components, Inc. Single layer capacitor
US7697262B2 (en) * 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
JP2008147349A (en) * 2006-12-08 2008-06-26 Murata Mfg Co Ltd Electronic component
US8094430B2 (en) * 2006-12-22 2012-01-10 Horowitz Harvey J Capacitors, couplers, devices including same and methods of manufacturing same
US20080165468A1 (en) * 2007-01-05 2008-07-10 Avx Corporation Very low profile multilayer components
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
US8045319B2 (en) * 2007-06-13 2011-10-25 Avx Corporation Controlled ESR decoupling capacitor
DE202008005708U1 (en) * 2008-04-24 2008-07-10 Vishay Semiconductor Gmbh Surface-mountable electronic component
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US20100188799A1 (en) * 2009-01-28 2010-07-29 Avx Corporation Controlled esr low inductance capacitor
US9949381B2 (en) 2013-07-15 2018-04-17 Stmicroelectronics (Grenoble 2) Sas Electronic device with at least one impedance-compensating inductor and related methods
KR101452131B1 (en) 2013-08-30 2014-10-16 삼성전기주식회사 Embedded multilayer capacitor and print circuit board having embedded multilayer capacitor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2622346A1 (en) * 1987-10-23 1989-04-28 Eurofarad Capacitor for electronic micro-circuit and arrangement incorporating such a capacitor
EP0335358A2 (en) * 1988-03-30 1989-10-04 Matsushita Electric Industrial Co., Ltd. Film capacitor, method of and apparatus for manufacturing the same
JPH06349678A (en) * 1993-06-07 1994-12-22 Tdk Corp Feed-through type capacitor, electronic device using it, and its mounting method
US5817543A (en) * 1993-11-03 1998-10-06 International Business Machines Corporation Method of constructing an integrated circuit memory
US5895966A (en) * 1995-09-29 1999-04-20 Analog Devices, Inc. Integrated circuit and supply decoupling capacitor therefor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048230U (en) * 1983-09-11 1985-04-04 株式会社村田製作所 multilayer capacitor
US5345361A (en) * 1992-08-24 1994-09-06 Murata Erie North America, Inc. Shorted trimmable composite multilayer capacitor and method
US5347423A (en) * 1992-08-24 1994-09-13 Murata Erie North America, Inc. Trimmable composite multilayer capacitor and method
US5576926A (en) * 1995-04-03 1996-11-19 American Technical Ceramics Corporation Capacitor with buried isolated electrode
JP3336954B2 (en) * 1998-05-21 2002-10-21 株式会社村田製作所 Multilayer capacitors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2622346A1 (en) * 1987-10-23 1989-04-28 Eurofarad Capacitor for electronic micro-circuit and arrangement incorporating such a capacitor
EP0335358A2 (en) * 1988-03-30 1989-10-04 Matsushita Electric Industrial Co., Ltd. Film capacitor, method of and apparatus for manufacturing the same
JPH06349678A (en) * 1993-06-07 1994-12-22 Tdk Corp Feed-through type capacitor, electronic device using it, and its mounting method
US5817543A (en) * 1993-11-03 1998-10-06 International Business Machines Corporation Method of constructing an integrated circuit memory
US5895966A (en) * 1995-09-29 1999-04-20 Analog Devices, Inc. Integrated circuit and supply decoupling capacitor therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 03 28 April 1995 (1995-04-28) *

Also Published As

Publication number Publication date
CN1327461C (en) 2007-07-18
KR100543853B1 (en) 2006-01-23
US6483692B2 (en) 2002-11-19
KR20030063433A (en) 2003-07-28
US20020075630A1 (en) 2002-06-20
MY124519A (en) 2006-06-30
WO2002050852A2 (en) 2002-06-27
CN1481563A (en) 2004-03-10
EP1344232A2 (en) 2003-09-17
JP2004531049A (en) 2004-10-07
AU2002217954A1 (en) 2002-07-01

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