WO2002050901A3 - Electronic device using evaporative micro-cooling and associated methods - Google Patents

Electronic device using evaporative micro-cooling and associated methods Download PDF

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Publication number
WO2002050901A3
WO2002050901A3 PCT/US2001/047637 US0147637W WO0250901A3 WO 2002050901 A3 WO2002050901 A3 WO 2002050901A3 US 0147637 W US0147637 W US 0147637W WO 0250901 A3 WO0250901 A3 WO 0250901A3
Authority
WO
WIPO (PCT)
Prior art keywords
micro
pair
cooler
electronic device
integrated circuit
Prior art date
Application number
PCT/US2001/047637
Other languages
French (fr)
Other versions
WO2002050901A2 (en
Inventor
Charles M Newton
Randy T Pike
Richard A Gassman
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Priority to AU2002226065A priority Critical patent/AU2002226065A1/en
Priority to KR1020037008196A priority patent/KR100553170B1/en
Priority to EP01995486A priority patent/EP1362370A2/en
Priority to JP2002551905A priority patent/JP2005501392A/en
Publication of WO2002050901A2 publication Critical patent/WO2002050901A2/en
Publication of WO2002050901A3 publication Critical patent/WO2002050901A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

An electronic device includes a package surrounding at least one integrated circuit, a microfluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to teh at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The microfluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electomechanical (MEMs) pump. The electronic device may also include at least one heat exchanger crried by the package and connected in fluid communication with the micro-fluidic cooler. The package may have a parallelepiped shape with a first pair of opposing major surfaces, a second pair of opposing side surfaces and a third pair of opposing end surfaces. In these embodiments, the at least one heat exchanger may preferably comprise a pair of heat exchangers coupled to the second pair of opposing side surfaces.
PCT/US2001/047637 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods WO2002050901A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002226065A AU2002226065A1 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods
KR1020037008196A KR100553170B1 (en) 2000-12-19 2001-12-11 Electronic device using evaporateive micro-cooling and associated methods
EP01995486A EP1362370A2 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods
JP2002551905A JP2005501392A (en) 2000-12-19 2001-12-11 Electronic device using evaporative microcooling and associated method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/741,772 US6459581B1 (en) 2000-12-19 2000-12-19 Electronic device using evaporative micro-cooling and associated methods
US09/741,772 2000-12-19

Publications (2)

Publication Number Publication Date
WO2002050901A2 WO2002050901A2 (en) 2002-06-27
WO2002050901A3 true WO2002050901A3 (en) 2003-09-12

Family

ID=24982125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/047637 WO2002050901A2 (en) 2000-12-19 2001-12-11 Electronic device using evaporative micro-cooling and associated methods

Country Status (7)

Country Link
US (1) US6459581B1 (en)
EP (1) EP1362370A2 (en)
JP (1) JP2005501392A (en)
KR (1) KR100553170B1 (en)
CN (1) CN1322582C (en)
AU (1) AU2002226065A1 (en)
WO (1) WO2002050901A2 (en)

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Also Published As

Publication number Publication date
KR100553170B1 (en) 2006-02-21
EP1362370A2 (en) 2003-11-19
WO2002050901A2 (en) 2002-06-27
JP2005501392A (en) 2005-01-13
KR20040014438A (en) 2004-02-14
CN1502130A (en) 2004-06-02
CN1322582C (en) 2007-06-20
US6459581B1 (en) 2002-10-01
US20020075651A1 (en) 2002-06-20
AU2002226065A1 (en) 2002-07-01

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