WO2002063686A2 - High performance silicon contact for flip chip - Google Patents

High performance silicon contact for flip chip Download PDF

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Publication number
WO2002063686A2
WO2002063686A2 PCT/US2002/002762 US0202762W WO02063686A2 WO 2002063686 A2 WO2002063686 A2 WO 2002063686A2 US 0202762 W US0202762 W US 0202762W WO 02063686 A2 WO02063686 A2 WO 02063686A2
Authority
WO
WIPO (PCT)
Prior art keywords
layer
coaxial
dielectric layer
sheath
integrated circuit
Prior art date
Application number
PCT/US2002/002762
Other languages
French (fr)
Other versions
WO2002063686A3 (en
Inventor
Leonard Forbes
Kie Y. Ahn
Original Assignee
Micron Technology, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology, Inc. filed Critical Micron Technology, Inc.
Priority to JP2002563532A priority Critical patent/JP4295509B2/en
Priority to KR1020037010440A priority patent/KR100552551B1/en
Priority to AU2002243735A priority patent/AU2002243735A1/en
Priority to EP02709238A priority patent/EP1360723A2/en
Publication of WO2002063686A2 publication Critical patent/WO2002063686A2/en
Publication of WO2002063686A3 publication Critical patent/WO2002063686A3/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
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    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10252—Germanium [Ge]
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    • H01L2924/10253—Silicon [Si]
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    • H01L2924/1026—Compound semiconductors
    • H01L2924/1027—IV
    • H01L2924/10271—Silicon-germanium [SiGe]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1432—Central processing unit [CPU]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1434—Memory
    • H01L2924/1435—Random access memory [RAM]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1434—Memory
    • H01L2924/145—Read-only memory [ROM]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Definitions

  • This invention relates to integrated circuitry interconnect lines
  • Semiconductor devices are typically fabricated on a wafer which
  • PCB printed circuit board
  • PCBs consume a large amount of physical space compared to the
  • circuitry devices particularly as device dimensions continue to shrink.
  • the present invention provides coaxial interconnect lines which
  • a semiconductive substrate which includes front and rear
  • the hole is defined in part by an interior wall
  • Conductive material is formed proximate at least some of the
  • This conductive material provides an outer coaxial
  • component is formed by forming a first conductive material within the
  • a second material is formed over the first material, with at least the second material being a seed layer. Subsequently, a metal-containing layer
  • the substrate may be used as a chip carrier, or the substrate may
  • circuit components fabricated thereon and itself be formed an
  • Figure 1 is a cross-sectional view of a semiconductor wafer
  • Figure 2 is a cross-sectional view of the semiconductor wafer
  • Figure 3 is a cross-sectional view of the semiconductor wafer
  • Figure 4 is a cross-sectional view of the semiconductor wafer
  • Figure 5 is a cross-sectional view of the semiconductor wafer
  • Figure 6 is a cross-sectional view of the semiconductor wafer
  • Figure 7 is a cross-sectional view of the semiconductor wafer
  • Figure 8 is a cross-sectional view of the semiconductor wafer
  • Figure 9 is a cross-sectional view of the semiconductor wafer
  • Figure 10 is a cross-sectional view of the semiconductor wafer
  • Figure 11 is a processor based system employing the through-
  • substrate used in the following description may be any material used in the following description.
  • SOS sapphire
  • doped and undoped semiconductors epitaxial layers
  • the semiconductor could be silicon-based.
  • the semiconductor could be silicon-germanium,
  • Substrate 12 includes a first or front surface 14 and a second or back
  • substrate 12 is a semi-conductor structure
  • the substrate may be formed of a monocrystalline silicon wafer.
  • Each hole or passageway is defined, at least in part, by a respective
  • Holes 18, 20, and 22 can be formed tlirough any suitable processing techniques, with one being described below with reference to
  • substrate 12 is shown at a processing step
  • FIG. 1 A layer 24 of masking material, such as photoresist,
  • Openings 26, 28, and 30 are formed
  • An alkaline etch can be conducted which is effective to form a
  • HDLP high density polyethylene
  • RIE reactive ion etching
  • a photoresist can be used as a mask for this etching.
  • exemplary aspect ratios can be greater than about 100. More preferably, aspect ratios can be greater than
  • outer conductive sheaths 50 are formed
  • Sheaths 50 are preferably formed by depositing a
  • exemplary method includes a low-pressure chemical vapor deposition
  • the thickness of layer 54 is about 0.3 ⁇ m to about
  • Exemplary deposition rates are 1 micron per minute, at temperatures of about 300°C. and with a
  • a dielectric material layer 56 is formed
  • An exemplary dielectric material is Si0 2 .
  • dielectric layer 56 can comprise a nitride-containing layer, such
  • Si 3 ⁇ 4 which is disposed proximate respective interior wall portions 19,
  • An oxide-containing layer is formed over the nitride-
  • the nitride layer is formed by chemical vapor
  • implementation includes in-situ nitridation in an ammonia atmosphere at
  • a first layer of conductive material 58 is
  • such first conductive material constitutes
  • a second layer of conductive material 60 is formed over the substrate 12
  • second conductive material 60 is
  • material 58 Such material or film can be deposited through suitable
  • Second material 60 is preferably deposited over
  • front and back surfaces 14, 16 to a thickness of about 20 to about 40 nm.
  • a metal layer preferably a copper layer is electroplated onto seed- layer 60 to form layer 62 which completely fills in holes 18, 20 and 22.
  • layer 62 is formed to a thickness of about 2-3 ⁇ m.
  • layers 54, 55, 58, 60 and 62 are
  • Exemplary techniques include abrasion of the substrate as by
  • semiconductive substrate which includes front and back
  • the hole is defined in part by an
  • Conductive material is formed proximate at least
  • the latter conductive material constitutes an inner conductive coaxial line component.
  • the conductive material constitutes an inner conductive coaxial line component.
  • inner conductive coaxial line component is formed by forming a first
  • a second conductive material is
  • substrate 12 may also support
  • fabricated circuit devices 64 and multi-layer wiring patterns and may be
  • encapsulated by encapsulant 68 in a single integrated package.
  • substrate
  • 12 may be a carrier which is used to mount, support and interconnect other
  • FIG 11 illustrates a processor system 102, including central
  • CPU central processing unit
  • RAM random access memory
  • ROM read-only memory
  • I/O input/output
  • bus systems 118 One or more bus systems 118.
  • CPU central processing unit
  • RAM random access memory
  • ROM memory devices 108, 110 are fabricated on
  • substrate 12 or as IC chips which are mounted on a substrate 12 carrier, as
  • RAM 108 may be

Abstract

The present invention provides a semiconductive substrate (12) which includes front (14) and back surfaces (16) and a hole (18, 20, 22) which extends through the substrate and between the front (14) and back surfaces (16). The hole (18, 20, 22) is defined in part by an interior wall portion and forms an outer conductive sheath. Conductive material (54) is formed proximate at least some of the interior wall portion. Subsequently, a layer of dielectric material (56) is formed within the hole, over and radially inwardly of the conductive material. A second conductive material (60) is then formed within the hole over and radially inwardly of the dielectric material layer (56). The latter conductive material constitutes an inner conductive coaxial line component.

Description

HIGH PERFORMANCE SILICON CONTACT FOR FLIP CHIP
FIELD OF THE INVENTION
This invention relates to integrated circuitry interconnect lines,
in particular, to through- wafer, integrated circuitry interconnect lines.
DISCUSSION OF THE REI TED ART
Semiconductor devices are typically fabricated on a wafer which
is subsequently tested and separated into individual dies or chips.
Individual dies are then packaged. Packaged chips are then assembled
together, typically on a printed circuit board (PCB), and electrically
interconnected to perform a desired function. The electrical
interconnection of separately fabricated chips generally takes place
externally of the individual chips. While PCB techniques are useful for
bringing together separately fabricated and assembled chips, doing so
brings with it some problems which are not so easily overcome. For
example, PCBs consume a large amount of physical space compared to the
circuitry of the chips which are mounted to them. It is desirable to reduce
the amount of physical space required by such PCBs. Further, assuring die electrical integrity of interconnections between chips mounted on PCBs is a
challenge. Moreover, in certain applications, it is desirable to reduce the
physical length of electrical interconnections between devices because of
concerns with signal loss or dissipation and interference widi and by other
integrated circuitry devices.
A continuing challenge in t e semiconductor industry is to find
new, innovative, and efficient ways of forming electrical connections with
and between circuit devices which are fabricated on the same and on
different dies. Relatedly, continuing challenges are posed to find and/or
improve upon the packaging techniques utilized to package integrated
circuitry devices, particularly as device dimensions continue to shrink.
SUMMARY OF THE INVENTION
The present invention provides coaxial interconnect lines which
are more reliable and better accommodate reduced circuitry dimensions
and a method of forming such coaxial interconnect lines.
A semiconductive substrate is provided which includes front and
back surfaces, and a hole which extends through the substrate and between
the front and back surfaces. The hole is defined in part by an interior wall
portion. Conductive material is formed proximate at least some of the
interior wall portion. This conductive material provides an outer coaxial
line component. Subsequently, a layer of dielectric material is formed
wit-hin the hole, over and radially inwardly of the conductive material. A
second conductive material is then formed within the hole over and radially
inwardly of the dielectric material layer. The latter conductive material
constitutes an inner conductive coaxial line component.
In a preferred implementation, the inner conductive coaxial line
component is formed by forming a first conductive material within the
hole. A second material is formed over the first material, with at least the second material being a seed layer. Subsequently, a metal-containing layer
is electroplated onto the seed layer.
The substrate may be used as a chip carrier, or the substrate may
have circuit components fabricated thereon and itself be formed an
integrated circuit chip.
BRIEF DESCRIPTION OP THE DRAWINGS
The above advantages and features of the invention will be more
clearly understood from the following detailed description which is
provided in connection with the accompanying drawings.
Figure 1 is a cross-sectional view of a semiconductor wafer
fragment at one processing step in accordance with the invention;
Figure 2 is a cross-sectional view of the semiconductor wafer
fragment at a processing step subsequent to that shown by Figure 1 ;
Figure 3 is a cross-sectional view of the semiconductor wafer
fragment at a processing step subsequent to that shown by Figure 1; Figure 4 is a cross-sectional view of the semiconductor wafer
fragment at a processing step subsequent to that shown by Figure 3;
Figure 5 is a cross-sectional view of the semiconductor wafer
fragment at a processing step subsequent to that shown by Figure 4;
Figure 6 is a cross-sectional view of the semiconductor wafer
fragment at an alternate processing step subsequent to that shown by
Figure 5;
Figure 7 is a cross-sectional view of the semiconductor wafer
fragment at a processing step subsequent to that shown by Figure 6;
Figure 8 is a cross-sectional view of the semiconductor wafer
fragment at a processing step subsequent to that shown by Figure 7;
Figure 9 is a cross-sectional view of the semiconductor wafer
fragment of Figure 8 including circuit devices fabricated on the wafer;
Figure 10 is a cross-sectional view of the semiconductor wafer
fragment of Figure 8 including integrated circuit chips mounted on the
wafer; and Figure 11 is a processor based system employing the through-
hole, coaxial interconnections in accordance with an exemplary
embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Exemplary embodiment of the present invention will be
described below in connection with the drawings. Other embodiments
may be utilized and structural or logical changes may be made without
departing from the spirit or scope of the present invention. Although
exemplary process conditions for forming various material layers are
described below, these are only representative and are not meant to be
considered as limiting the invention. Like items are referred to by like
reference numerals throughout the drawings.
The term "substrate" used in the following description may
include any semiconductor-based structure that has an exposed
semiconductor surface. Semiconductor-based structure must be
understood to include silicon, silicon-on insulator (SOI), silicon-on
sapphire (SOS), doped and undoped semiconductors, epitaxial layers of
silicon supported by a base semiconductor structure foundation, and other semiconductor structures. The semiconductor- based structures need not
be silicon-based. The semiconductor could be silicon-germanium,
germanium, or gallium arsenide. When reference is made to substrate in
the following description, previous process steps may have been utilized to
form regions or junctions in or over the base semiconductor or foundation.
Referring to Figure 1, a semiconductor wafer fragment is
indicated generally at 10 and includes a semiconductor substrate 12.
Substrate 12 includes a first or front surface 14 and a second or back
surface 16. In one aspect, substrate 12 is a semi-conductor structure
having first and second outwardly-facing surfaces 14, 16, at least one of
which is capable of supporting fabricated integrated circuitry. Substrate 12
may be formed of a monocrystalline silicon wafer.
Referring to Figure 2, a plurality of holes or passageways 18, 20,
and 22 are formed within substrate 12 between front and back surfaces 14,
16. Each hole or passageway is defined, at least in part, by a respective
interior wall portion 19, 21, and 23. The illustrated interior wall portions
constitute interior hole surfaces which join with first and second surfaces
14, 16. Holes 18, 20, and 22 can be formed tlirough any suitable processing techniques, with one being described below with reference to
Figures 3 and 4.
Referring to Figure 3, substrate 12 is shown at a processing step
which is applied to the Figure 1 construction and which precedes the
Figure 2 construction. A layer 24 of masking material, such as photoresist,
is formed over front surface 14 and is suitably patterned to define a
plurality of openings 26, 28, and 30. Openings 26, 28, and 30 are formed
over a substrate area in which holes 18, 20, and 22 (Figure 2) are to be
formed. An alkaline etch can be conducted which is effective to form a
pattern of pre-defined etch pits 32, 34, and 36. Subsequently, masking
material layer 24 is stripped away.
Referring to Figure 4, a through wafer silicon trench etch is next
performed to form holes 18, 20 and 22, using a high density low pressure
(HDLP) reactive ion etching (RIE) at a rate of about 2.2 μm/min. using
SF(-,/C4F8. A photoresist can be used as a mask for this etching.
Continuous etching/passivation cycles are used to achieve anisotropic, high
aspect ratio trenches. In one embodiment, exemplary aspect ratios can be greater than about 100. More preferably, aspect ratios can be greater than
about 200.
Referring to Figure 5, outer conductive sheaths 50 are formed
wit-hin holes or passageways 18, 20, and 22 and over respective interior wall
portions 19, 21, and 23. Sheaths 50 are preferably formed by depositing a
layer 54 of metal-containing material over the substrate, within the holes
and over the respective wall portions 19, 21, and 23 thereof. Any suitable
method of providing such metal-containing layer can be utilized. An
exemplary method includes a low-pressure chemical vapor deposition
(LPCVD) of tungsten in a self-limiting process which provides a tungsten
film by silicon reduction. Accordingly, silicon material within holes 18, 20,
and 22 is replaced by tungsten atoms in a WF6 reaction gas, with a reaction
product SiF4 being pumped out or otherwise removed from the deposition
chamber. Subsequently, such can be followed by silane or polysilane
reduction of the WF6 until a desired conductor thickness is reached. In a
preferred embodiment, the thickness of layer 54 is about 0.3 μm to about
0.5 μm. Deposition rates in accordance with die above are dependent
upon the temperature and the reaction gas flow rate. Exemplary deposition rates are 1 micron per minute, at temperatures of about 300°C. and with a
flow rate of WFή at 4 seem in a cold wall CND reactor.
Referring to Figure 6, a dielectric material layer 56 is formed
over layer 54 and wit-hin holes 18, 20, and 22. Portions of layer 56 are
thereby formed radially inwardly of interior wall portions 19, 21, and 23
and outer conductive sheath 50. An exemplary dielectric material is Si02.
Alternately, dielectric layer 56 can comprise a nitride-containing layer, such
as Si3Ν4, which is disposed proximate respective interior wall portions 19,
21, and 23. An oxide-containing layer is formed over the nitride-
containing layer to provide a dielectric SiON layer within the hole. In a
preferred implementation, the nitride layer is formed by chemical vapor
deposition, and the oxide layer by exposing the substrate to oxidizing
conditions. Specifically, in the preferred implementation, dielectric layers
56 constitute a reoxidized LPCVD nitride film which forms the illustrated
and preferred SiON dielectric layer. An exemplar}' processing
implementation includes in-situ nitridation in an ammonia atmosphere at
950°C. Low pressure chemical vapor deposition of nitride at 700()C. takes
place with dichlorosilane and ammonia until about two-thirds of the hole diameter is filled. Subsequently, reoxidation of the nitride takes place at a
temperature of between 900°C. to 950°C.
Referring to Figure 7, a first layer of conductive material 58 is
formed over dielectric layer 56 and within each respective hole 18, 20, and
22. In a preferred aspect, such first conductive material constitutes
polysilicon which is formed through suitable chemical vapor deposition
techniques. Accordingly, such first conductive material is formed over and
radially inwardly of dielectric material layer 56 within holes 18, 20, and 22.
A second layer of conductive material 60 is formed over the substrate 12
and first material 58. In one aspect, second conductive material 60
comprises a metal material which is different from the first conductive
material 58. In a preferred aspect, second conductive material 60
constitutes a copper seed layer which is formed over first conductive
material 58. Such material or film can be deposited through suitable
sputtering or evaporation techniques. Mechanical masks can be utilized to
define wid more particularity the area over which the preferred copper-
seed layer is deposited. Second material 60 is preferably deposited over
front and back surfaces 14, 16 to a thickness of about 20 to about 40 nm.
Next, a metal layer, preferably a copper layer is electroplated onto seed- layer 60 to form layer 62 which completely fills in holes 18, 20 and 22.
Preferably, layer 62 is formed to a thickness of about 2-3 μm.
Referring to Figure 8, layers 54, 55, 58, 60 and 62 are
planarized relative to substrate 12 and isolated within respective holes 18,
20, and 22. Such can be accomplished by any suitable processing
techniques. Exemplary techniques include abrasion of the substrate as by
chemical mechanical polishing.
Hence, a method of forming integrated circuitry lines such as
coaxial integrated circuitry interconnect lines is described. A
semiconductive substrate is provided which includes front and back
surfaces, and a hole is formed which extends through the substrate and
between the front and back surfaces. The hole is defined in part by an
interior wall portion. Conductive material is formed proximate at least
some of the interior wall portion to form an outer conductive layer.
Subsequendy, a layer of dielectric material is formed within the hole, over
and radially inwardly of the conductive material. A second conductive
material is dien formed within the hole over and radially inwardly of the
dielectric material layer. The latter conductive material constitutes an inner conductive coaxial line component. In a preferred implementation, the
inner conductive coaxial line component is formed by forming a first
conductive material within die hole. A second conductive material is
formed over the first conductive material, with at least d e second material
being a seed layer. Subsequentiy, a metal-containing layer is electroplated
onto the seed layer.
Referring to Figures 9 and 10, substrate 12 may also support
fabricated circuit devices 64 and multi-layer wiring patterns and may be
encapsulated by encapsulant 68 in a single integrated package. In such an
implementation multiple exterior terminals 70 are provided for connecting
interior packaged conductors to an external circuit. In addition, substrate
12 may be a carrier which is used to mount, support and interconnect other
integrated circuit chips 66 mounted over one or both of the surfaces 14,
16.
Figure 11 illustrates a processor system 102, including central
processing unit (CPU) 112, RAM and ROM memory devices 108, 110,
input/output (I/O). devices 104, 106, floppy disk drive 114 and CD ROM
drive 116. All of the above components communicate with each other over
one or more bus systems 118. One or more of the central processing unit (CPU) 112, RAM and ROM memory devices 108, 110 are fabricated on
substrate 12 or as IC chips which are mounted on a substrate 12 carrier, as
illustrated in Figures 9 and 10, wid dirough-hole, coaxial interconnections
in accordance with the invention. In addition, RAM 108 may be
constructed as one or more memory modules each containing one or more
memory circuits containing coaxial interconnections fabricated in
accordance with the invention.
Although the invention has been described above in connection
with exemplary embodiments, it is apparent that many modifications and
substitutions can be made without departing from the spirit or scope of the
invention. Accordingly, the invention is not to be considered as limited by
the foregoing description, but is only limited by the scope of the appended
claims.

Claims

What is claimed ι's
1. A med od of forming coaxial integrated circuitry interconnect
lines comprising:
providing a substrate having front and back surfaces;
forming a hole with sidewalls extending through said substrate
from said front to said back surface;
forming an outer conductive coaxial sheath on said sidewalls;
forming a coaxial dielectric layer radially inward and over said
outer conductive coaxial sheath; and
forming an inner coaxial line radially inward and over said coaxial
dielectric layer.
2. The method of claim 1 wherein said act of forming an inner
coaxial line further comprises die act of:
forming an inner conductive layer; forming a seed layer over said inner conductive layer; and
electroplating a metal on said seed layer.
3. The metiiod of claim 1 wherein said conductive sheatii is a
tungsten sheath.
4. The method of claim 3 wherein said conductive sheath is
formed by low pressure chemical vapor deposition.
5. The method of claim 4 wherein said deposition is performed
at a rate of about 1 micron per minute.
6.. The method of claim 1 wherein said sheath is formed to a
thickness of about 0.3 μm to about 0.5 μm.
7. The method of claim 1 wherein said dielectric layer comprises
silicon dioxide.
8. The method of claim 1 wherein said dielectric layer is formed
to a thickness of about 0.5 μm to about 0.8 μm.
9. The method of claim 1 wherein said dielectric layer comprises
a nitride containing layer.
10. The method of claim 9 wherein said nitride containing layer
is formed by low pressure chemical vapor deposition.
11. The method of claim 2 wherein said inner conductive layer
is a polysilicon layer.
12. The method of claim 2 wherein said seed layer is formed to
a thickness of about 20 nm-40 nm.
13. The method of claim 2 wherein said metal is copper.
14. The method of claim 2 wherein said electroplated layer is
about 2-3 μm thick.
15. The method of claim 1 further comprising d e act of
fabricating circuit devices on said substrate.
16. The method of claim 1 further comprising the act of
mounting integrated circuit chips on said substrate.
17. The method of claim 16 further comprising the act of
encapsulating said integrated circuit chip and substrate.
18. An integrated circuitry interconnect line comprising: a substrate having front and back surfaces;
a hole witii sidewalls extending through said substrate from said
front to said back surface;
an outer conductive coaxial sheath formed on said sidewalls;
a coaxial dielectric layer formed radially inward and over said
outer coaxial line; and
a conductive inner coaxial line formed radially inward and over
said coaxial dielectric layer.
19. The interconnect line of claim 18 wherein said inner
conductive coaxial line further comprises:
an inner conductive layer;
a seed layer provided over said inner conductive layer; and
a electroplated metal layer on said seed layer.
20. The interconnect line of claim 18 wherein said conductive
sheath comprises a tungsten layer.
21.. The interconnect line of claim 18 wherein said sheath is
formed to a thickness of about 0.3 μm to about 0.5 μm.
22. The interconnect line of claim 18 wherein said dielectric
layer comprises silicon dioxide.
23. The interconnect line of claim 18 wherein said dielectric
layer is formed to a thickness of about 0.5 μm to about 0.8 μm.
24. The interconnect line of claim 18 wherein said dielectric
layer comprises a nitride containing layer.
25. The interconnect line of claim 18 wherein said dielectric
layer comprises silicon nitride.
26. The interconnect line of claim 19 wherein said inner
conductive layer is a polysilicon layer.
27. The interconnect line of claim 19 wherein said seed layer is
formed to a thickness of about 20 nm-40 nm.
28. The interconnect line of claim 19 wherein said metal is
copper.
29. The interconnect line of claim 19 wherein said electroplated
layer is about 2-3 μm thick.
30. A processor system comprising:
a processor; and
an integrated circuit coupled to said processor, at least one of
said integrated circuit and processor comprising:
a substrate having front and back surfaces and a hole with
sidewalls extending through said substrate from said front to said back
surface;
a conductive outer coaxial sheath formed on said sidewalls;
a coaxial dielectric layer formed radially inward and over said
outer coaxial sheath; and
a inner conductive coaxial line formed radially inward and over
said coaxial dielectric layer.
31. The system of claim 30 wherein said inner coaxial line
further comprises: an inner conductive layer;
a seed layer provided over said inner conductive layer; and
a electroplated metal layer on said seed layer.
32. The system of claim 30 wherein said conductive sheath is a
tungsten sheath.
33.. The system of claim 30 wherein said sheath is formed to a
thickness of about 0.3 μm to about 0.5 μm.
34. The system of claim , 30 wherein said dielectric layer
comprises silicon dioxide.
35. The system of claim 30 wherein said dielectric layer is
formed to a thickness of about 0.5 μm to about 0.8 μm.
36. The system of claim 30 wherein said dielectric layer
comprises a nitride containing layer.
37. The- system of claim 30 wherein said dielectric layer
comprises silicon nitride.
38. The system of claim 31 wherein said inner conductive layer
is a polysilicon layer.
39. The system of claim 31 wherein said seed layer is formed to
a thickness of about 20 nm-40 nm.
40. The system of claim 31 wherein said metal is copper.
41. The system of claim 31 wherein said electroplated layer is
about 2-3 μm thick.
42. A integrated circuit package comprising:
a substrate supporting at least one integrated circuit chip, said
substrate having front and back surfaces and at least a hole witii sidewalls
extending through said substrate from said front to said back surface;
an outer conductive coaxial sheath formed on said sidewalls;
a coaxial dielectric layer formed radially inward and over said
outer conductive coaxial sheath; and
an inner conductive coaxial line formed radially inward and over
said coaxial dielectric layer; and a package which encases said substrate and said at least one chip.
43. The integrated circuit of claim 42 wherein said inner coaxial
line further comprises:
an inner conductive layer;
a seed layer provided over said inner conductive layer; and
a electroplated metal layer on said seed layer.
44. The integrated circuit of claim 42 wherein said conductive
sheath is a tungsten sheath.
45. The integrated circuit of claim 42 wherein said sheath is
formed to a thickness of about 0.3 μm to about 0.5 μm.
46. The integrated circuit of claim 42 wherein said dielectric
layer comprises silicon dioxide.
47. The integrated circuit of claim 42 wherein said dielectric
layer is formed to a d ickness of about 0.5 μm to about 0.8 μm.
48. The integrated circuit of claim 42 wherein said dielectric
layer comprises a nitride containing layer.
49. The integrated circuit of claim 42 wherein said dielectric
layer comprises silicon nitride.
50. The integrated circuit of claim 43 wherein said inner
conductive layer is a polysilicon layer.
51. The integrated circuit of claim 43 wherein said seed layer is
formed to a thickness of about 20 nm-40 nm.
52. The integrated circuit of claim 43 wherein said metal is
copper.
53. The integrated circuit of claim 43 wherein said electroplated
layer is about 2-3 μm thick.
PCT/US2002/002762 2001-02-08 2002-02-01 High performance silicon contact for flip chip WO2002063686A2 (en)

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AU2002243735A AU2002243735A1 (en) 2001-02-08 2002-02-01 High performance silicon contact for flip chip
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CN1528018A (en) 2004-09-08
US6812137B2 (en) 2004-11-02
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AU2002243735A1 (en) 2002-08-19
US20030207566A1 (en) 2003-11-06
US20020175423A1 (en) 2002-11-28
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US6737740B2 (en) 2004-05-18
US6828656B2 (en) 2004-12-07

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