WO2002064496A3 - Method for forming microelectronic spring structures on a substrate - Google Patents

Method for forming microelectronic spring structures on a substrate Download PDF

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Publication number
WO2002064496A3
WO2002064496A3 PCT/US2002/003938 US0203938W WO02064496A3 WO 2002064496 A3 WO2002064496 A3 WO 2002064496A3 US 0203938 W US0203938 W US 0203938W WO 02064496 A3 WO02064496 A3 WO 02064496A3
Authority
WO
WIPO (PCT)
Prior art keywords
spring
sacrificial material
layer
meniscus
substrate
Prior art date
Application number
PCT/US2002/003938
Other languages
French (fr)
Other versions
WO2002064496A2 (en
Inventor
Benjamin N Eldridge
Stuart W Wenzel
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Stuart W Wenzel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Benjamin N Eldridge, Stuart W Wenzel filed Critical Formfactor Inc
Priority to AU2002243937A priority Critical patent/AU2002243937A1/en
Priority to EP02709455A priority patent/EP1362005B1/en
Priority to JP2002564434A priority patent/JP4278982B2/en
Priority to KR1020037010536A priority patent/KR100880104B1/en
Priority to DE60220022T priority patent/DE60220022T2/en
Publication of WO2002064496A2 publication Critical patent/WO2002064496A2/en
Publication of WO2002064496A3 publication Critical patent/WO2002064496A3/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
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    • GPHYSICS
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    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
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    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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    • GPHYSICS
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    • G01R1/06727Cantilever beams
    • GPHYSICS
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    • G01R1/06733Geometry aspects
    • GPHYSICS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base

Abstract

A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.
PCT/US2002/003938 2001-02-12 2002-02-06 Method for forming microelectronic spring structures on a substrate WO2002064496A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2002243937A AU2002243937A1 (en) 2001-02-12 2002-02-06 Method for forming microelectronic spring structures on a substrate
EP02709455A EP1362005B1 (en) 2001-02-12 2002-02-06 Method for forming electrically conductive contact structures
JP2002564434A JP4278982B2 (en) 2001-02-12 2002-02-06 Method for fabricating a microelectronic spring structure on a substrate
KR1020037010536A KR100880104B1 (en) 2001-02-12 2002-02-06 Method for forming microelectronic spring structures on a substrate
DE60220022T DE60220022T2 (en) 2001-02-12 2002-02-06 METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE CONTACT STRUCTURES

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/781,833 2001-02-12
US09/781,833 US6939474B2 (en) 1999-07-30 2001-02-12 Method for forming microelectronic spring structures on a substrate

Publications (2)

Publication Number Publication Date
WO2002064496A2 WO2002064496A2 (en) 2002-08-22
WO2002064496A3 true WO2002064496A3 (en) 2003-08-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/003938 WO2002064496A2 (en) 2001-02-12 2002-02-06 Method for forming microelectronic spring structures on a substrate

Country Status (9)

Country Link
US (2) US6939474B2 (en)
EP (2) EP1777194A3 (en)
JP (1) JP4278982B2 (en)
KR (2) KR100880104B1 (en)
CN (2) CN100579891C (en)
AU (1) AU2002243937A1 (en)
DE (1) DE60220022T2 (en)
TW (1) TW512129B (en)
WO (1) WO2002064496A2 (en)

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US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
US7168160B2 (en) * 2001-12-21 2007-01-30 Formfactor, Inc. Method for mounting and heating a plurality of microelectronic components
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
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US6900126B2 (en) * 2002-11-20 2005-05-31 International Business Machines Corporation Method of forming metallized pattern
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US6956389B1 (en) * 2004-08-16 2005-10-18 Jem America Corporation Highly resilient cantilever spring probe for testing ICs
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US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4823617B2 (en) * 2005-09-09 2011-11-24 日本発條株式会社 Conductive contact and method for manufacturing conductive contact
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