WO2002064496A3 - Method for forming microelectronic spring structures on a substrate - Google Patents
Method for forming microelectronic spring structures on a substrate Download PDFInfo
- Publication number
- WO2002064496A3 WO2002064496A3 PCT/US2002/003938 US0203938W WO02064496A3 WO 2002064496 A3 WO2002064496 A3 WO 2002064496A3 US 0203938 W US0203938 W US 0203938W WO 02064496 A3 WO02064496 A3 WO 02064496A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- spring
- sacrificial material
- layer
- meniscus
- substrate
- Prior art date
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4822—Beam leads
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- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
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- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- G01R1/06716—Elastic
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- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002243937A AU2002243937A1 (en) | 2001-02-12 | 2002-02-06 | Method for forming microelectronic spring structures on a substrate |
EP02709455A EP1362005B1 (en) | 2001-02-12 | 2002-02-06 | Method for forming electrically conductive contact structures |
JP2002564434A JP4278982B2 (en) | 2001-02-12 | 2002-02-06 | Method for fabricating a microelectronic spring structure on a substrate |
KR1020037010536A KR100880104B1 (en) | 2001-02-12 | 2002-02-06 | Method for forming microelectronic spring structures on a substrate |
DE60220022T DE60220022T2 (en) | 2001-02-12 | 2002-02-06 | METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE CONTACT STRUCTURES |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/781,833 | 2001-02-12 | ||
US09/781,833 US6939474B2 (en) | 1999-07-30 | 2001-02-12 | Method for forming microelectronic spring structures on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002064496A2 WO2002064496A2 (en) | 2002-08-22 |
WO2002064496A3 true WO2002064496A3 (en) | 2003-08-14 |
Family
ID=25124089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/003938 WO2002064496A2 (en) | 2001-02-12 | 2002-02-06 | Method for forming microelectronic spring structures on a substrate |
Country Status (9)
Country | Link |
---|---|
US (2) | US6939474B2 (en) |
EP (2) | EP1777194A3 (en) |
JP (1) | JP4278982B2 (en) |
KR (2) | KR100880104B1 (en) |
CN (2) | CN100579891C (en) |
AU (1) | AU2002243937A1 (en) |
DE (1) | DE60220022T2 (en) |
TW (1) | TW512129B (en) |
WO (1) | WO2002064496A2 (en) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
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US7435108B1 (en) * | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
US6780001B2 (en) * | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US7189077B1 (en) | 1999-07-30 | 2007-03-13 | Formfactor, Inc. | Lithographic type microelectronic spring structures with improved contours |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
US6627980B2 (en) | 2001-04-12 | 2003-09-30 | Formfactor, Inc. | Stacked semiconductor device assembly with microelectronic spring contacts |
US7168160B2 (en) * | 2001-12-21 | 2007-01-30 | Formfactor, Inc. | Method for mounting and heating a plurality of microelectronic components |
US6965244B2 (en) * | 2002-05-08 | 2005-11-15 | Formfactor, Inc. | High performance probe system |
US6911835B2 (en) * | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
TW575931B (en) * | 2002-10-07 | 2004-02-11 | Advanced Semiconductor Eng | Bridge connection type of chip package and process thereof |
US6900126B2 (en) * | 2002-11-20 | 2005-05-31 | International Business Machines Corporation | Method of forming metallized pattern |
DE10258094B4 (en) * | 2002-12-11 | 2009-06-18 | Qimonda Ag | Method of forming 3-D structures on wafers |
JP4050219B2 (en) * | 2003-11-18 | 2008-02-20 | アルプス電気株式会社 | Manufacturing method of connection device |
US7024763B2 (en) | 2003-11-26 | 2006-04-11 | Formfactor, Inc. | Methods for making plated through holes usable as interconnection wire or probe attachments |
US6956389B1 (en) * | 2004-08-16 | 2005-10-18 | Jem America Corporation | Highly resilient cantilever spring probe for testing ICs |
US7459795B2 (en) * | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
US7471094B2 (en) * | 2005-06-24 | 2008-12-30 | Formfactor, Inc. | Method and apparatus for adjusting a multi-substrate probe structure |
JP4823617B2 (en) * | 2005-09-09 | 2011-11-24 | 日本発條株式会社 | Conductive contact and method for manufacturing conductive contact |
JP4698374B2 (en) * | 2005-10-05 | 2011-06-08 | 日本電子材料株式会社 | Probe manufacturing method |
JP5024047B2 (en) * | 2005-10-07 | 2012-09-12 | 株式会社ニコン | Manufacturing method of microstructure |
US7444253B2 (en) * | 2006-05-09 | 2008-10-28 | Formfactor, Inc. | Air bridge structures and methods of making and using air bridge structures |
US20080063594A1 (en) * | 2006-09-13 | 2008-03-13 | Formfactor, Inc. | Rhodium sulfate production for rhodium plating |
JP5294227B2 (en) * | 2006-09-15 | 2013-09-18 | Hoya株式会社 | Mask blank and transfer mask manufacturing method |
JP4916893B2 (en) * | 2007-01-05 | 2012-04-18 | 株式会社日本マイクロニクス | Probe manufacturing method |
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EP1777194A2 (en) | 2007-04-25 |
US20010044225A1 (en) | 2001-11-22 |
KR100880104B1 (en) | 2009-01-21 |
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WO2002064496A2 (en) | 2002-08-22 |
CN101024480A (en) | 2007-08-29 |
TW512129B (en) | 2002-12-01 |
EP1777194A3 (en) | 2010-05-05 |
EP1362005A2 (en) | 2003-11-19 |
DE60220022T2 (en) | 2008-01-10 |
CN1527793A (en) | 2004-09-08 |
US6939474B2 (en) | 2005-09-06 |
US20060019027A1 (en) | 2006-01-26 |
JP4278982B2 (en) | 2009-06-17 |
DE60220022D1 (en) | 2007-06-21 |
CN1272234C (en) | 2006-08-30 |
JP2004528996A (en) | 2004-09-24 |
KR20090005230A (en) | 2009-01-12 |
AU2002243937A1 (en) | 2002-08-28 |
EP1362005B1 (en) | 2007-05-09 |
CN100579891C (en) | 2010-01-13 |
KR101005246B1 (en) | 2011-01-04 |
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