WO2002067325A2 - High-density flip-chip interconnect - Google Patents
High-density flip-chip interconnect Download PDFInfo
- Publication number
- WO2002067325A2 WO2002067325A2 PCT/US2002/002836 US0202836W WO02067325A2 WO 2002067325 A2 WO2002067325 A2 WO 2002067325A2 US 0202836 W US0202836 W US 0202836W WO 02067325 A2 WO02067325 A2 WO 02067325A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- signal
- connectors
- layer
- traces
- splines
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Geometry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02703307A EP1364403A2 (en) | 2001-02-20 | 2002-02-01 | High-density flip-chip interconnect |
KR1020037010895A KR100732123B1 (en) | 2001-02-20 | 2002-02-01 | High-density flip-chip interconnect |
JP2002566550A JP4156927B2 (en) | 2001-02-20 | 2002-02-01 | Multi-layer board device |
AU2002236936A AU2002236936A1 (en) | 2001-02-20 | 2002-02-01 | High-density flip-chip interconnect |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/789,401 US8125087B2 (en) | 2001-02-20 | 2001-02-20 | High-density flip-chip interconnect |
US09/789,401 | 2001-02-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002067325A2 true WO2002067325A2 (en) | 2002-08-29 |
WO2002067325A3 WO2002067325A3 (en) | 2003-05-30 |
Family
ID=25147535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/002836 WO2002067325A2 (en) | 2001-02-20 | 2002-02-01 | High-density flip-chip interconnect |
Country Status (7)
Country | Link |
---|---|
US (1) | US8125087B2 (en) |
EP (1) | EP1364403A2 (en) |
JP (1) | JP4156927B2 (en) |
KR (1) | KR100732123B1 (en) |
CN (1) | CN1331222C (en) |
AU (1) | AU2002236936A1 (en) |
WO (1) | WO2002067325A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8633875B2 (en) | 2008-01-21 | 2014-01-21 | Sony Corporation | Electroluminescent display panel and electronic apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100615606B1 (en) * | 2005-03-15 | 2006-08-25 | 삼성전자주식회사 | Memory module and signal line arrangement method of the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424492A (en) * | 1994-01-06 | 1995-06-13 | Dell Usa, L.P. | Optimal PCB routing methodology for high I/O density interconnect devices |
US5812379A (en) * | 1996-08-13 | 1998-09-22 | Intel Corporation | Small diameter ball grid array pad size for improved motherboard routing |
US5986893A (en) * | 1996-07-18 | 1999-11-16 | Compaq Computer Corporation | Apparatus for controlling the impedance of high speed signals on a printed circuit board |
US6011695A (en) * | 1998-11-02 | 2000-01-04 | Intel Corporation | External bus interface printed circuit board routing for a ball grid array integrated circuit package |
US6121554A (en) * | 1997-04-30 | 2000-09-19 | Kabushiki Kaisha Toshiba | Printed wiring board |
EP1098555A2 (en) * | 1999-11-02 | 2001-05-09 | Canon Kabushiki Kaisha | Printed-wiring board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0563029A (en) * | 1991-09-02 | 1993-03-12 | Fujitsu Ltd | Semiconductor device |
JPH05129366A (en) * | 1991-11-08 | 1993-05-25 | Fujitsu Ltd | Tab mounting structure for integrated circuit use |
US5545923A (en) * | 1993-10-22 | 1996-08-13 | Lsi Logic Corporation | Semiconductor device assembly with minimized bond finger connections |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
JP3386977B2 (en) * | 1997-06-05 | 2003-03-17 | 新光電気工業株式会社 | Multilayer circuit board |
JP3152180B2 (en) * | 1997-10-03 | 2001-04-03 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
US6310398B1 (en) * | 1998-12-03 | 2001-10-30 | Walter M. Katz | Routable high-density interfaces for integrated circuit devices |
-
2001
- 2001-02-20 US US09/789,401 patent/US8125087B2/en not_active Expired - Fee Related
-
2002
- 2002-02-01 JP JP2002566550A patent/JP4156927B2/en not_active Expired - Fee Related
- 2002-02-01 AU AU2002236936A patent/AU2002236936A1/en not_active Abandoned
- 2002-02-01 EP EP02703307A patent/EP1364403A2/en not_active Withdrawn
- 2002-02-01 KR KR1020037010895A patent/KR100732123B1/en not_active IP Right Cessation
- 2002-02-01 CN CNB028085736A patent/CN1331222C/en not_active Expired - Fee Related
- 2002-02-01 WO PCT/US2002/002836 patent/WO2002067325A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424492A (en) * | 1994-01-06 | 1995-06-13 | Dell Usa, L.P. | Optimal PCB routing methodology for high I/O density interconnect devices |
US5986893A (en) * | 1996-07-18 | 1999-11-16 | Compaq Computer Corporation | Apparatus for controlling the impedance of high speed signals on a printed circuit board |
US5812379A (en) * | 1996-08-13 | 1998-09-22 | Intel Corporation | Small diameter ball grid array pad size for improved motherboard routing |
US6121554A (en) * | 1997-04-30 | 2000-09-19 | Kabushiki Kaisha Toshiba | Printed wiring board |
US6011695A (en) * | 1998-11-02 | 2000-01-04 | Intel Corporation | External bus interface printed circuit board routing for a ball grid array integrated circuit package |
EP1098555A2 (en) * | 1999-11-02 | 2001-05-09 | Canon Kabushiki Kaisha | Printed-wiring board |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8633875B2 (en) | 2008-01-21 | 2014-01-21 | Sony Corporation | Electroluminescent display panel and electronic apparatus |
US8698707B2 (en) | 2008-01-21 | 2014-04-15 | Sony Corporation | Electroluminescent display panel and electronic apparatus |
US9001011B2 (en) | 2008-01-21 | 2015-04-07 | Sony Corporation | Electroluminescent display panel and electronic apparatus |
US10217405B2 (en) | 2008-01-21 | 2019-02-26 | Sony Corporation | Electroluminescent display panel and electronic apparatus |
US10467955B2 (en) | 2008-01-21 | 2019-11-05 | Sony Corporation | Electroluminescent display panel and electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20020113307A1 (en) | 2002-08-22 |
US8125087B2 (en) | 2012-02-28 |
CN1568544A (en) | 2005-01-19 |
KR100732123B1 (en) | 2007-06-25 |
EP1364403A2 (en) | 2003-11-26 |
WO2002067325A3 (en) | 2003-05-30 |
KR20040014460A (en) | 2004-02-14 |
CN1331222C (en) | 2007-08-08 |
JP4156927B2 (en) | 2008-09-24 |
JP2005505910A (en) | 2005-02-24 |
AU2002236936A1 (en) | 2002-09-04 |
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