WO2002073661A3 - Extraction method of defect density and size distributions - Google Patents

Extraction method of defect density and size distributions Download PDF

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Publication number
WO2002073661A3
WO2002073661A3 PCT/US2002/007409 US0207409W WO02073661A3 WO 2002073661 A3 WO2002073661 A3 WO 2002073661A3 US 0207409 W US0207409 W US 0207409W WO 02073661 A3 WO02073661 A3 WO 02073661A3
Authority
WO
WIPO (PCT)
Prior art keywords
extraction method
defect density
size distributions
substrate
layer
Prior art date
Application number
PCT/US2002/007409
Other languages
French (fr)
Other versions
WO2002073661A2 (en
WO2002073661A9 (en
Inventor
Christopher Hess
David Stashower
Brian E Stine
Larg H Weiland
Richard Burch
Denis J Ciplickas
Original Assignee
Pdf Solutions Inc
Christopher Hess
David Stashower
Brian E Stine
Larg H Weiland
Richard Burch
Denis J Ciplickas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pdf Solutions Inc, Christopher Hess, David Stashower, Brian E Stine, Larg H Weiland, Richard Burch, Denis J Ciplickas filed Critical Pdf Solutions Inc
Priority to JP2002572613A priority Critical patent/JP3998577B2/en
Priority to AU2002247317A priority patent/AU2002247317A1/en
Priority to US10/471,775 priority patent/US7024642B2/en
Priority to EP02715098A priority patent/EP1379978A4/en
Publication of WO2002073661A2 publication Critical patent/WO2002073661A2/en
Publication of WO2002073661A3 publication Critical patent/WO2002073661A3/en
Publication of WO2002073661A9 publication Critical patent/WO2002073661A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A characterization vehicle includes a substrate having at least one layer (300), and a plurality of pairs of nested serpentine lines on a single surface of a single layer of the substrate (301a...301h, 302a...302h), each pair of nested serpentine lines having a shared pad between them (312a...312h).
PCT/US2002/007409 2001-03-12 2002-03-12 Extraction method of defect density and size distributions WO2002073661A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002572613A JP3998577B2 (en) 2001-03-12 2002-03-12 Characterization Vehicle and Design Method, Defect Identification Method, and Defect Size Distribution Determination Method
AU2002247317A AU2002247317A1 (en) 2001-03-12 2002-03-12 Extraction method of defect density and size distributions
US10/471,775 US7024642B2 (en) 2001-03-12 2002-03-12 Extraction method of defect density and size distributions
EP02715098A EP1379978A4 (en) 2001-03-12 2002-03-12 Extraction method of defect density and size distributions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27519001P 2001-03-12 2001-03-12
US60/275,190 2001-03-12

Publications (3)

Publication Number Publication Date
WO2002073661A2 WO2002073661A2 (en) 2002-09-19
WO2002073661A3 true WO2002073661A3 (en) 2002-11-14
WO2002073661A9 WO2002073661A9 (en) 2003-01-09

Family

ID=23051251

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/007409 WO2002073661A2 (en) 2001-03-12 2002-03-12 Extraction method of defect density and size distributions

Country Status (6)

Country Link
US (1) US7024642B2 (en)
EP (1) EP1379978A4 (en)
JP (1) JP3998577B2 (en)
CN (1) CN1262960C (en)
AU (1) AU2002247317A1 (en)
WO (1) WO2002073661A2 (en)

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JP4279782B2 (en) * 2002-10-10 2009-06-17 富士通株式会社 Layout method and apparatus, program thereof and recording medium
AU2003297025A1 (en) * 2002-12-11 2004-06-30 Pdf Solutions, Inc. Fast localization of electrical failures on an integrated circuit system and method
US7253436B2 (en) * 2003-07-25 2007-08-07 Matsushita Electric Industrial Co., Ltd. Resistance defect assessment device, resistance defect assessment method, and method for manufacturing resistance defect assessment device
WO2005040961A2 (en) * 2003-10-15 2005-05-06 Pdf Solutions, Inc. Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
US7187179B1 (en) 2005-10-19 2007-03-06 International Business Machines Corporation Wiring test structures for determining open and short circuits in semiconductor devices
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7487476B2 (en) * 2006-04-11 2009-02-03 International Business Machines Corporation Method for computing the sensitivity of a VLSI design to both random and systematic defects using a critical area analysis tool
US7749778B2 (en) * 2007-01-03 2010-07-06 International Business Machines Corporation Addressable hierarchical metal wire test methodology
WO2008086282A2 (en) 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7592827B1 (en) * 2007-01-12 2009-09-22 Pdf Solutions, Inc. Apparatus and method for electrical detection and localization of shorts in metal interconnect lines
US7494893B1 (en) 2007-01-17 2009-02-24 Pdf Solutions, Inc. Identifying yield-relevant process parameters in integrated circuit device fabrication processes
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US20080312875A1 (en) * 2007-06-12 2008-12-18 Yu Guanyuan M Monitoring and control of integrated circuit device fabrication processes
TWI469235B (en) * 2007-08-20 2015-01-11 Kla Tencor Corp Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101841897B1 (en) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US8623673B1 (en) 2012-08-13 2014-01-07 International Business Machines Corporation Structure and method for detecting defects in BEOL processing
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (en) 2013-02-01 2019-09-09 케이엘에이 코포레이션 Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US9706647B2 (en) * 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
EP3614389B1 (en) * 2018-08-23 2023-10-11 Tata Consultancy Services Limited Systems and methods for predicting structure and properties of atomic elements and alloy materials thereof

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Also Published As

Publication number Publication date
CN1262960C (en) 2006-07-05
EP1379978A2 (en) 2004-01-14
CN1496526A (en) 2004-05-12
US20040094762A1 (en) 2004-05-20
EP1379978A4 (en) 2005-06-08
AU2002247317A1 (en) 2002-09-24
JP3998577B2 (en) 2007-10-31
WO2002073661A2 (en) 2002-09-19
JP2004526316A (en) 2004-08-26
WO2002073661A9 (en) 2003-01-09
US7024642B2 (en) 2006-04-04

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