WO2002080185A1

WO2002080185A1 - Stage device, exposure device, and method of manufacturing device

Info

Publication number: WO2002080185A1
Application number: PCT/JP2002/002928
Authority: WO
Inventors: Makoto Kondo
Original assignee: Nikon Corporation
Priority date: 2001-03-28
Filing date: 2002-03-26
Publication date: 2002-10-10
Also published as: TW548708B; JPWO2002080185A1

Abstract

A stage device, wherein the position of the gravity center of a wafer stage (WST) for loading a wafer (W) thereon is set on the point of application of a thrust caused when the wafer stage is driven by a linear motor (36X) in X-axis direction, whereby, when the wafer stage is driven in X-axis direction, an unnecessary torque causing a pitching and a yawing does not almost act on the wafer stage and, therefore, the vibration of the wafer stage resulting from the pitching and the yawing can be suppressed to increase the attitude stability and position controllability of the wafer stage.

Description

Specification

Stage apparatus, exposure apparatus, and device manufacturing method

The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method. More specifically, the present invention relates to a stage apparatus including a stage that holds and moves an object, and a driving apparatus that drives the stage, and the stage apparatus. The present invention relates to an exposure apparatus and a device manufacturing method using the exposure apparatus. Background art

2. Description of the Related Art Conventionally, various exposure apparatuses have been used in a lithography process for manufacturing a semiconductor device (integrated circuit) or a liquid crystal display device. In recent years, along with the high integration of semiconductor devices, a step-and-repeat type reduction projection exposure apparatus (a so-called stepper), and a step-and-scan type scanning projection exposure system with an improved version of this stepper. .Successively moving projection exposure equipment such as optical equipment (so-called scanning and stepper) is mainly used.

In this type of exposure apparatus, it is necessary to sequentially transfer a pattern formed on a mask or a reticle (hereinafter collectively referred to as a “reticle”) to a plurality of shot areas on a substrate such as a wafer. A stage device having a stage that moves one-dimensionally or two-dimensionally is used.

In such a stage apparatus, a high positioning performance of the stage is required to realize high-precision exposure, and a high acceleration and a high position controllability during high-speed movement are required to improve a throughput of the exposure operation. ing. Accordingly, in recent years, it has been necessary to control the position of the wafer reticle at a higher speed and with higher accuracy without being affected by the accuracy of the mechanical guide surface, and to extend the life by avoiding mechanical friction. In short, a stage device for driving a stage for holding a wafer or the like in a non-contact manner has been developed. As a driving source of such a stage device, a linear motor adopting an electromagnetic driving method is mainly used.

When this linear motor is used, for example, as a drive source for a substrate stage, a mover of a linear motor is arranged below a table on which a substrate is placed, and a linear guide is provided between the mover and a stator (linear guide). In general, the stage is driven by the Lorentz force generated by the electromagnetic interaction along the stator and along the guide surface formed on the upper surface of the stage base (platen).

By the way, in the past, in order to improve the position controllability of the stage, the stage drive method (for example, the drive control method of a linear motor) and the improvement of the flatness of the guide surface, which serves as the stage movement reference, etc. There are various ideas.

However, with the recent high integration of semiconductor devices, the position controllability of the substrate stage and the like has become more and more strict, and now there is a demand for methods of driving the stage and improving the flatness of the guide surface. It is becoming difficult to achieve the required position control of the stage.

In other words, factors that reduce the position controllability due to the stage device itself (stage or drive device, or a combination of both), which has rarely been regarded as a problem in the past, such as stage vibration generated when the stage is driven by the linear motor, are considered. It is becoming a level that cannot be ignored.

Problems similar to those described above may also occur with stage equipment for precision equipment other than exposure equipment.

The present invention has been made under such circumstances, and a first object of the present invention is to provide a stage device capable of improving the position controllability of a stage. A second object of the present invention is to provide an exposure apparatus capable of realizing highly accurate exposure.

A third object of the present invention is to improve the productivity of highly integrated devices. To provide a device manufacturing method. Disclosure of the invention

According to a first aspect of the present invention, there is provided a stage on which an object is placed; and a driving device for driving the stage in at least a predetermined one axis direction. A first stage device, wherein the device is set on a drive shaft for driving the stage in at least the predetermined one axis direction.

In this specification, "the drive shaft J does not mean a physical drive shaft such as a feed screw drive system, but is a point of action of a thrust applied to the stage by the drive device when driving the stage. (If there is more than one point of action, the virtual point of action is the sum of the points of action) and a virtual axis defined by the direction of the thrust. (Including when they match).

According to this, the position of the center of gravity of the stage on which the object is placed is set on the drive shaft when the stage is driven by the drive device in at least one predetermined axial direction. That is, when the stage is driven in the predetermined one-axis direction, the point of action of the thrust coincides with the position of the center of gravity of the stage.

It is possible to prevent the occurrence of rotational moment about an axis orthogonal to one axis. Thus, unnecessary rotation of the stage about an axis orthogonal to the one axis, and the occurrence of vibrations and the like due to the rotation can be effectively suppressed. Therefore, the stability of the posture of the stage and the controllability of the position can be improved.

In this case, the driving device moves the stage within the moving plane to the predetermined position.

It can be driven in one axis direction and another one axis direction orthogonal thereto. In this case, the drive axis and the center of gravity of the stage

-Desirably. In the first stage device of the present invention, as the driving device, various types such as a combination of a feed screw and a rotary motor and a flat motor can be considered. For example, the driving device is a linear motor. It can be.

In the first stage device of the present invention, the stage includes a table that holds the object, and a stage body that supports the table. The setting of the position of the center of gravity on the drive shaft is as follows: The adjustment may be performed by adjusting the position of the center of gravity of the stage body.

In this case, the apparatus may further include a weight member for adjusting the position of the center of gravity attached to the stage body.

In the first stage device of the present invention, when the stage includes the table and the stage main body, the adjustment of the position of the center of gravity of the stage main body is performed by adjusting the position of the stage main body. It can be realized by using a high-density member as the member of the part.

In this case, the stage further includes a hydrostatic bearing that levitates and supports the stage body and the table via a predetermined clearance with respect to a guide surface serving as a movement reference of the stage. It may be a bottom member provided with the gas static pressure bearing.

In this case, a recess having a predetermined depth may be formed on the bottom surface of the bottom member.

In the first stage device of the present invention, when the position of the stage is measured by an interferometer, the stage is fixed to the stage at at least two points in a state where a gap is formed between the stage and the stage. A moving mirror for the interferometer may be further provided.

According to a second aspect of the present invention, there is provided a stage on which an object is placed and which is levitated and supported via a predetermined clearance with respect to a guide surface serving as a movement reference; Along at least one specified axis. A second stage device, comprising: a driving device; and a concave portion having a predetermined depth is formed on a bottom surface of a bottom member constituting the stage.

According to this, a concave portion having a predetermined depth is formed on the bottom surface of the bottom member constituting the stage on which the object is placed. That is, the recessed portion with respect to the guide surface, which is the stage movement reference, has more clearance than other portions of the bottom surface member. For this reason, for example, when the stage is driven by the driving device in the predetermined one axis direction, and the stage vibrates due to the driving, the stage is moved between the concave portion of the stage and the guide surface. The existing gas dampens the stage's mainly gravitational vibration. That is, when the stage vibrates, for example, in the direction of gravity, gas (for example, air) existing between the concave portion and the guide surface moves in the concave portion or tries to escape from the concave portion. Due to the viscosity of the gas, the gas acts as a kind of damper, damping the vibration of the stage mainly in the direction of gravity. Therefore, the position controllability of the stage can be improved by the attenuation of the stage vibration.

In this case, when the position of the stage is measured by an interferometer, the interferometer is fixed to the stage at at least two points with a gap formed between the stage and the stage. May be further provided. In this case, at least two contact portions that come into contact with the stage and a non-contact portion that does not come into contact with the stage are provided at a portion of the movable mirror that faces the stage. can do.

In this case, the contact portion may be a protrusion provided on the stage facing surface of the movable mirror. Further, the movable mirror may be screwed to the stage at the contact portion, and a portion around a screwing position of the mirror may have lower rigidity than other portions. .

In the second stage device of the present invention, the position of the center of gravity of the stage may be set on a drive shaft of the stage. According to a third aspect of the present invention, there is provided a stage in which an object is placed and the position of which is measured by an interferometer; and a gap is formed between the stage and the stage. And a movable mirror for the interferometer fixed to a stage.

According to this, the movable mirror for the interferometer that measures the position of the stage is fixed to the stage at at least two points with a gap formed between the stage and the stage. Therefore, for example, when the stage vibrates when the stage is driven and the vibration is transmitted to the moving mirror, the vibration of the moving mirror is attenuated by gas (for example, air) existing between the moving mirror and the stage. Is done. That is, when the gas moves in the gap or tries to escape from the gap due to the vibration of the moving mirror, the gas functions as a damper of the kind due to its viscosity to attenuate the vibration of the moving mirror. Therefore, the position of the stage is measured by the interferometer via the movable mirror whose vibration is attenuated, so that highly accurate position measurement of the stage and, consequently, highly accurate position control can be performed.

In this case, at least two contact portions that come into contact with the stage and a non-contact portion that does not come into contact with the stage are set in a portion of the movable mirror facing the stage. Can be. '

In the third stage device of the present invention, the position of the center of gravity of the stage may be set on a drive shaft of the stage.

According to a fourth aspect of the present invention, there is provided an exposure apparatus for transferring a pattern formed on a first object onto a second object, wherein the exposure apparatus includes any one of the first to third stage apparatuses of the present invention. As a driving device for at least one of the first object and the second object. It is an exposure apparatus provided.

According to this, the stage device having high position controllability is provided as at least one of the first object and the second object as a driving device, so that the alignment accuracy of the first object and the second object and the second device can be improved. It is possible to improve the overlay accuracy of the pattern on the object. That is, it is possible to improve the exposure accuracy.

In addition, in the lithographic process, the pattern of the first object is transferred onto the second object using the exposure apparatus of the present invention, whereby a pattern can be formed on the second object with high accuracy. Thereby, a highly integrated microdevice can be manufactured with good yield. Therefore, from still another viewpoint of the present invention, it can be said that this is a device manufacturing method using the exposure apparatus of the present invention. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a view schematically showing a configuration of an exposure apparatus according to one embodiment of the present invention. FIG. 2A is a perspective view of the wafer stage as viewed obliquely from above, and FIG. 2B is a perspective view of the wafer stage as viewed obliquely from below.

FIG. 3 is a diagram for explaining a method of adjusting the position of the center of gravity of the wafer stage. 4A is an enlarged perspective view showing the movable mirror, FIG. 4B is an enlarged view showing the vicinity of a screw portion formed on the movable mirror, and FIG. FIG. 2 is a sectional view taken along line A-A of FIG.

FIG. 5 is a flowchart for explaining the device manufacturing method of the present invention. FIG. 6 is a flowchart showing a detailed example of step 2 16 in FIG. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 4C.

FIG. 1 shows a schematic configuration of an exposure apparatus 10 according to one embodiment. The exposure apparatus 10 is a step-and-scan projection exposure apparatus. This The exposure apparatus 10 includes an illumination system IOP, a reticle stage RST holding a reticle R as a mask (object, first object), a projection optical system PL, and a wafer W as substrate (object, second object). The apparatus includes a wafer stage device 50 as a stage device constituting the device, and a control system for controlling these devices.

The illumination system IOP is disclosed, for example, in Japanese Patent Application Laid-Open No.

As disclosed in US Pat. No. 3,497,701 and corresponding US Pat. No. 5,534,970, etc., a light source, an illuminance uniforming optical system including an optical integrator, and a relay It includes a lens, a variable ND filter, a variable field stop (also called a reticle blind or a masking blade), and a dichroic mirror (all not shown). Here, a fly-eye lens, an internal reflection type integrator (such as a rod integrator), or a diffractive optical element is used as the optical integrator. To the extent permitted by the national laws of the designated or designated elected States in this International Application, the disclosures in the above US patents will be incorporated herein by reference.

In this illumination system IOP, a slit-shaped illumination area (a rectangular illumination area elongated in the Y-axis direction) defined by a reticle blind on a reticle R on which a circuit pattern and the like are drawn is an illumination light as an energy beam. Illuminate with almost uniform illuminance. Here, the illumination light I is K r F excimer laser light (wavelength 2

4 8 nm) far ultraviolet light such as, A r F excimer laser beam (wavelength 1 9 3 nm), to some, it is a vacuum ultraviolet light such as F ₂ laser beam (wavelength 1 5 7 nm) is used. It is also possible to use ultraviolet emission lines (g-rays, ί-rays, etc.) from an ultra-high pressure mercury lamp as the illumination light I.

On the reticle stage RS, a reticle R is fixed, for example, by vacuum suction. The reticle stage RS 微 can be minutely driven by the reticle stage drive unit 22 in an XY plane perpendicular to the optical axis of the illumination system 一致 Ο 一致 (coincident with the optical axis AX of the projection optical system PL described later). , Predetermined scanning direction (here, (The X-axis direction, which is the horizontal direction in the paper plane in Fig. 1). The reticle stage drive unit 22 is a mechanism using a linear motor, a voice coil motor or the like as a drive source, but is shown as a simple block in FIG. 1 for convenience of illustration.

The position in the moving plane of the reticle stage RST is constantly detected by a reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 16 through a movable mirror 15 with a resolution of, for example, about 0.5 to 1 nm. Is done. Here, actually, a moving mirror having a reflecting surface orthogonal to the Y-axis direction and a moving mirror having a reflecting surface orthogonal to the X-axis direction are provided on the reticle stage RST. A reticle Y interferometer and a reticle X interferometer are provided, and these are typically shown in FIG. 1 as a movable mirror 15 and a reticle interferometer 16, respectively. For example, the end surface of reticle page RST may be mirror-finished to form a reflection surface (corresponding to the reflection surface of movable mirror 15). Also, at least one corner cube mirror may be used in place of the reflecting surface extending in the Y-axis direction used for detecting the position of the reticle stage RST in the scanning direction (the X-axis direction in the present embodiment). . Here, at least one of the reticle X interferometer and the reticle X interferometer, for example, the reticle X interferometer is a two-axis interferometer having two measurement axes, and the reticle is based on the measurement value of the reticle X interferometer. In addition to the X position of the stage RST, the rotation amount (jowing amount) in the 0 _Z direction (the rotation direction around the Z axis) can be measured. The position information of the reticle stage RST from the reticle interferometer 16 (including the rotation information such as the jogging amount) is supplied to the main controller 20. Main controller 20 drives and controls reticle stage RST via reticle stage drive section 22 based on the position information of reticle stage RST.

The projection optical system P is disposed below the reticle stage RST in FIG. 1, and the direction of the optical axis AX is the Z-axis direction. As the projection optical system PL, for example, both sides are telecentric and a predetermined reduction magnification (for example, 15 or 1 Z 4) Is used. Therefore, when the illumination area IL of the reticle R is illuminated by the illumination light IL from the illumination system IOP, a reduced image (partially inverted image) of the illumination area portion of the circuit pattern of the reticle R is transmitted through the projection optical system PL. The light is projected onto a projection area in the field of view of the projection optical system conjugate to the illumination area on the wafer W, and is transferred to a resist layer on the surface of the wafer W.

The wafer stage device 50 includes a stage base 40 supported substantially horizontally at three or four points on a floor surface (or a base plate, a frame caster, or the like) F through a vibration isolation unit 26. A wafer stage WS is provided as a stage disposed above the stage base 40, and a wafer stage drive section 24 is provided as a drive device for the wafer stage WST.

Each of the vibration isolation units 26 insulates minute vibration transmitted from the floor surface F to the stage base 40 at a micro G level. These anti-vibration units 26 are so-called active devices that actively suppress the vibration of the stage base 40 based on the output of a vibration sensor such as a semiconductor accelerometer fixed to a predetermined portion of the stage base 40. It is of course possible to use a vibration isolator.

The surface (upper surface) on the + Z side of the stage base 40 is processed so as to have a very high degree of flatness, and is used as a guide surface 40a which is a movement reference surface of the wafer stage WST. ing.

The wafer stage WST is driven by a wafer stage drive unit 24 below the projection optical system PL in FIG. 1, and holds the wafer W and moves two-dimensionally along the guide surface 40a in the XY direction. It has become.

The wafer stage WST includes a wafer table WT serving as a table for holding the wafer W, and a wafer Z supporting the wafer table WTB from below via a tilt drive mechanism (not shown) including a voice coil motor and the like. And a stage body 30.

The wafer W is placed on the upper surface of the wafer table WTB via the wafer holder 25. Is held by vacuum suction (or electrostatic suction). The z-tilt drive mechanism moves the wafer table WTB on the wafer stage main body 30 in three degrees of freedom directions of Z, ΘX (rotation direction around the X axis) and Θy (rotation direction around the Y axis). It is driven minutely and is also called a Z tilt stage.

A movable mirror 21 for reflecting a laser beam from a wafer laser interferometer (hereinafter, referred to as a “wafer interferometer”) 23 as an interferometer is fixed to a side surface of the wafer table WTB, and a wafer interference interferometer disposed outside is fixed. From the total 23, the positions of the wafer table WTB in the X direction, the Y direction, and the 0z direction (the rotation direction around the Z axis) are constantly detected with a resolution of, for example, about 0.5 to 1 nm.

Here, the wafer table WT B is actually provided with a movable mirror 21 X having a reflecting surface orthogonal to the X-axis direction at the end in the + X direction, as shown in FIG. 2A. A movable mirror 21Y having a reflecting surface orthogonal to the Y-axis direction is provided at one end in the Y-direction. Corresponding to this, the wafer interferometer also irradiates laser beams to the moving mirrors 21 X and 21 Y, respectively, and measures the X-axis and Y-axis positions of the wafer table WTB, respectively. And a Y-axis interferometer. In this embodiment, a plurality of X-axis and Y-axis interferometers are provided, respectively, or the X-axis and Y-axis interferometers are composed of multi-axis interferometers having a plurality of measurement axes. In addition to the Y position, rotation (rotation of the T axis (rotation of the z axis, 0 z rotation), pitching (rotation of the X axis, rotation of 0 x), rolling (rotation of the rotation of the y axis, 0 y rotation))) can be measured.

As described above, a plurality of wafer interferometers and a plurality of moving mirrors are provided, respectively. In FIG. 1, these are representatively shown as a moving mirror 21 and a wafer interferometer 23. Here, for example, an end surface of the wafer table WTB may be mirror-finished to form a reflection surface (corresponding to the reflection surfaces of the moving mirrors 21X and 21Y). The specific configuration of the movable mirrors 21X and 21Y will be described later in further detail. In addition, the aforementioned multi-axis interferometer is projected through a reflective surface installed on the wafer table WTB at an angle of 45 °. A laser beam may be applied to the reflection surface installed on the pedestal (not shown) on which the optical system PL is mounted, and the relative position information in the optical axis direction (Z-axis direction) of the projection optical system PL may be detected. good.

The position information (or speed information) of the wafer table WTB measured by the wafer interferometer 23 is sent to the main controller 20. The main controller 20 performs the wafer stage based on the position information (or speed information). The wafer stage WS is connected via the linear motors 36 X, 36 Y i, 36 Y ₂ constituting the drive unit 24 (the configuration of the wafer stage drive unit 24 including these linear motors will be further described later). Control the position of Τ in the X Υ plane.

As shown in FIGS. 2A and 2B, the wafer stage main body 30 has a rectangular plate-shaped bottom member 4 that is disposed to face the guide surface 40 a on the upper surface of the stage base 40. 6, a pair of support members 42A, 42B fixed to both ends of the upper surface of the bottom member 46 in the Y-axis direction, respectively, and a bottom surface formed by these support members 42A, 42B. A top plate 48 and the like are supported in parallel on the upper surface of the member.

The top plate 48 is formed of a rectangular plate-like member, and a wafer table WT is placed above the top plate 48 via a Z-tilt drive mechanism (not shown) including a voice coil motor and the like. Further, a mover 32X constituting a later-described X-axis linear motor 36X is fixed to a lower surface of the top plate 48. This will be described later. The bottom member 46 is formed of a flat plate member slightly smaller than the top plate 48, and as shown in FIG. 2B, the center of the bottom surface in the Y-axis direction has a depth number tm (for example, 7 A band-shaped recess 46a having a predetermined width of about m) is formed along the X-axis direction. In addition, the flat portions 46 b and 46 c located on both sides of the concave portion 46 a in the Y-axis direction each have a total of four vacuum preload-type gas static pressure bearings (hereinafter simply referred to as “gas static pressure bearings”). 102) are provided. As can be seen from FIG. 2B, these gas static pressure bearings 102 have an outlet 102 a for discharging a pressurized gas (in this case, an inert gas such as helium or nitrogen) into the center thereof, and Shape around the spout 1 0 2 a And a groove 102b communicating with a vacuum suction path (not shown).

Here, A r F excimer one laser light, to some, is used in the light flux of the wavelength range, called Wavelength 2 0 0 nm~ 1 5 0 nm vacuum ultraviolet belonging to the band, such as the F ₂ laser beam as the exposure light In such cases, the absorption by oxygen and organic substances (including water vapor, hydrocarbon gas, etc. in the case of F ₂ laser light) is extremely large, so these gases in the space on the optical path through which the exposure light passes In order to reduce the concentration of nitrogen to a concentration of several ppm or less, the gas in the space on the optical path should be reduced to an inert gas such as nitrogen or helium (hereinafter, not only helium but also nitrogen). (Collectively referred to as active gas). Therefore, in the present embodiment, not only the illumination system IOP and the projection optical system PL, but also the first space in which the reticle R is arranged between the illumination system IOP and the projection optical system PL, and the projection optical system PL and the wafer Purging (or simply blowing of inert gas) is also performed in the second space between the two. For this reason, in the present embodiment, as the pressurized gas, for example, of the space through which the exposure light I passes, at least the same type as the inert gas supplied to the second space or a different inert gas different in type is used. I have to do that.

However, when using illumination light having a wavelength of about 200 nm or more as the exposure light IL (for example, far ultraviolet light such as KrF excimer laser light, or ultraviolet light such as i-ray), the pressurized gas is used. For example, air from which impurities such as organic substances have been removed by a chemical filter, or chemically clean dry air can be used. Furthermore, even when the ArF excimer laser beam is used as the exposure light IL, the air or dry air described above is used unless at least the second space in the space through which the exposure light IL passes is supplied with an inert gas. It may be used as a pressurized gas. That is, when at least the inert gas is not supplied to the second space, any gas can be used as the pressurized gas. Conversely, when the inert gas is supplied, the pressurized gas is used. It is preferable to use an inert gas.

In addition, as a gas static pressure bearing, a vacuum is applied around the pressurized gas outlet on the bearing surface. When using a type that has a groove communicating with the suction path, the gas ejected from each gas static pressure bearing to the guide surface 40a is immediately evacuated and exhausted. Can be prevented from leaking. Therefore, it is necessary to maintain high purity of helium and the like, and even in an environment where the outflow of gas does not want to contaminate the surrounding gas, air (including dry air) as a pressurized gas or the space where the aforementioned purging is performed It is possible to use an inert gas having a relatively low purity as compared with that of the above, that is, a relatively high concentration of impurities (oxygen, organic substances, water vapor, etc.) that attenuate exposure light.

In this embodiment, the static pressure between the bearing surface of the pressurized gas ejected from the bearing surface of the four gas static pressure bearings 102 toward the guide surface 40a and the guide surface 40a is described. Due to the balance between the pressure (so-called gap pressure), the weight of the entire wafer stage WST, and the vacuum preload, the wafer stage WST is positioned several times above the guide surface 40a, which is the upper surface of the stage base 40. It is supported without contact through a clearance of about / m.

As shown in FIG. 1, the wafer stage drive unit 24 includes an X-axis linear motor 36 X for driving the wafer stage WST in the X-axis direction, which is the scanning direction, and an X-axis linear motor for the wafer stage WST. 3 comprises 6 X and the pair of the Y axis linear motor 3 6丫3 6 Y ₂ for driving the Y-axis direction, which is the integral non-scanning direction.

The Y-axis linear motor 36 is connected to a Y-axis linear guide 34 Yi as a stator extending in the Y-axis direction on the floor F at one X side of the stage base 40. And a Y mover 32 moving along the Y-axis linear guide 34 Yi. Armature coils (not shown) are arranged at predetermined intervals along the Y-axis direction inside the Y-axis linear guide 34. The Υmovable element 32 2 Υ ι has an inverted U-shaped cross section, and a plurality of field magnets (not shown) are arranged at predetermined intervals on a pair of inner opposed surfaces along the Υ axis direction. ing. That is, the Υ-axis linear motor 36 Y i is a moving magnet type electromagnetic motor driven linear motor. Therefore, Y In the axis linear motor 36 Yi, the Y mover 32 Yi is driven in the Y-axis direction by electromagnetic interaction between the Y axis linear guide 34 丫丄 and the Y mover 32 Yi. Generates driving force (Lorentz force).

The other 丫 -axis linear motor 36 Y ₂ has the same configuration as the Υ-axis linear motor 36. That, Y-axis linear motors 3 6 Y _2, the stage base 4 at 0 on the + X side on the floor surface F and Y Y-axis extending in the axial direction Riniagai de 3 4 Y _2, the Υ axis Riniagai de 3 4 Upsilon ₂ moves along the Upsilon and a mover 3 ₂ Υ 2. This Upsilon shaft linear motor 3 6 Υ _2, Υ axis as Riniagai de 3 4 Υ _2, Υ of Upsilon axial direction with respect to the movable element 3 ₂ Υ 2 Υ mover 3 2 Upsilon ₂ perform electromagnetic interaction between the Generates driving force (Lorentz force).

The X-axis linear motor 36X includes an X-axis linear guide 34X as a stator having the X-axis direction as a longitudinal direction, and an X-axis moving along the X-axis linear guide 34X. A mover 3 2 X is provided. One end of the X-axis linear guide 34 X in the longitudinal direction is fixed with the one movable element 32 Yi, and the other end is fixed with the other Y movable element 32 Y 2. I have. The X-axis linear guide 34X includes a stator yoke extending in the X-axis direction, and a plurality of armature coils disposed therein at predetermined intervals along the X-axis direction.

As shown in FIG. 2B, the X mover 32 X is a movable section extending in the X-axis direction in a rectangular frame shape in cross section fixed to the lower surface of the top plate 48 constituting the wafer stage main body 30 described above. And a plurality of field magnets 54 N and 54 S alternately arranged at predetermined intervals along the X-axis direction on the upper and lower opposing surfaces on the inner surface side of the mover yoke 52. I have. In this case, an alternating magnetic field is formed in the inner space of the mover yoke 52 along the X-axis direction. The X-axis linear motor 36 X in FIG. 1 is configured with the X-axis linear guide 34 X inserted into the inner space of the mover yoke 52 of the X mover 3 2 X.

In this case, electromagnetic interaction between the X mover 32 X and the X axis linear guide 34 X Depending on the application, a driving force (Lorentz force) for driving the X mover 32X in the X-axis direction is generated. The X-axis linear motor 36 X is a moving magnet type linear motor driven by electromagnetic force.

Also, as described above, both ends of the X-axis linear guide 34 X are Y movers 32 Υι,

Since 3 2 are respectively fixed to Upsilon _2, Upsilon shaft linear motor 3 6 Upushiron'iota, 3 the 6 Y ₂ generates a driving force of Upsilon axial, © E c stage WS along with X-axis linear motor 3 6 X T Are driven in the Υ-axis direction. In this case, by varying the Υ driving force generated by the shaft linear motor 3 6丫3 6 Y _2, to control the rotation around the Z-axis of the wafer stage WS T via X-axis linear motor 3 6 X It is possible.

As shown in FIGS. 2A and 2B, a rectangular parallelepiped main member 4 having the same length as the length of the bottom member 46 in the X-axis direction is provided on the soil Y-side surface of the bottom member 46.

4 Ai, 44 A ₂ are fixed. These main members 44 Αι and 44 A ₂ have the same shape and the same mass (here, the mass (ΜιΖ2)). Weight member 44 Ai, 44 A ₂ each centroid Gi, Gi ', as shown in FIG. 3, at the same Z location, and from the center of gravity G _B of the bottom member 4 6 such that the same distance Is set.

That, as described above, from Rukoto 2 Tsunoomori member 44 44 A ₂ is not arranged, the total weight of the weight member 44 44 A2 (Mi X g) is a bottom member

It acts on the same Z axis as the center of gravity 08 of 46.

Further, at the center of the upper surface of the bottom member 46 in the Y-axis direction, as shown in FIG. 2A, a weight group 44B composed of a plurality of block-shaped weights is placed. In this case, as shown in FIG. 3, the center of gravity G ₂ of the weight group 44 B is set to be positioned on the same Z-axis and the center of gravity G _B of the bottom member 4 6. Incidentally, the mass of the contact forest group 44 B, in the following description is intended to refer to the mass M _2. In this embodiment, the total mass of the main members 44 A and 44 A ₂ and the main Mass M ₂ of the Li group 44B is set as follows.

That is, as shown in FIG. 3, the position in the Z direction of the axis (drive shaft) on which the driving force (thrust) of the X-axis linear motor 36 X that drives the wafer stage WST in the X-axis direction is P, bottom member 46 and the weight member 44 44A _2, the center of gravity of the wafer stage WS T excluding the weight group 44 B (this mass and Ms) and G _S, the distance between the center of gravity G _S this and the drive shaft (5, The distance between the drive shaft and the center of gravity G _B of the bottom member 46 is L _B , the distance in the height direction between the drive shaft and the center of gravity Gi is Li, and the distance between the drive shaft and the center of gravity G ₂ of the weight group 44 B is L ₂ . Sometimes, the mass MLM2 is set so as to satisfy the following equation (1).

Ms ■ ά = M _B ■ L _B + Mi ■ Li + M ₂ 'shi 2 ... (1)

Thus, so as to satisfy the above equation (1), the total mass IVh (weight member 44A 44 A ₂ each mass (I HZZ)) of the weight member 44 eight 44 A ₂ in our forest group 44B since the mass M ₂ is determined, resulting in the wafer stage WS T total center-of-gravity position is set on the drive shaft in driving the wafer stage WS T in the X-axis direction.

As can be seen from the above equation (1), the weight (weight) of each of the weight members 44 44A ₂ and the weight group 44B is reduced, that is, the weight of the entire wafer stage WS T (movable part). In order to reduce the distance, it is desirable to set the distances L _B and L _{2 as} large as possible.

Next, the configuration and the like of the movable mirrors 21X and 21Y provided on the side surface of the wafer table WTB will be described with reference to FIGS. 4A to 4C.

FIG. 4A shows a specific configuration of one movable mirror 21Y. As can be seen from FIG. 4A, the movable mirror 21Y is positioned with respect to the lower surface of the wafer table WT B so as to protrude from the lower side of the one Y-side end of the wafer table WT B in the one Y direction. It is placed on a seat plate 56Y fixed by screws or the like. The upper surface of the seat plate 56Y is processed so as to satisfy a predetermined flatness. The movable mirror 21Y has a substantially rectangular parallelepiped shape, and one surface 21Ym of the movable mirror 21Y is mirror-finished so that the laser from the interferometer 23 is reflected. In the following description, the one Y side surface 21 Ym is appropriately referred to as “mirror surface 21 YmJ”.

On the surface opposite to the mirror surface 21 Ym (the surface on the + Y side), a convex portion 2 1 m (for example, 7 jum) protruding in the + Y direction at a position near both ends in the X-axis direction. Ya, 21 Yb are formed from the upper end to the lower end of the movable mirror 21Y.

Further, on the lower surface of the movable mirror 21Y, at the same position in the X direction as the above-mentioned convex portions 21Ya and 21Yb, in a state protruding about several Um (for example, 7 im) in one Z direction. The convex portion 21YC21Yd is formed from the + Y end to the one Y end of the movable mirror 21Y.

Here, one Y side surface of the wafer table WT B and the movable mirror 21Y are configured so that only the convex portions 21Ya and 21Yb are in contact with each other. Similarly, only the convex portions 21Yc and 21Yd contact the upper surface of the seat plate 56Y and the movable mirror 21Y. That is, in the movable mirror 21Y, the + Y side surfaces other than the convex portions 21Ya and 21Yb have a clearance of about several / (for example, 7 m) with respect to the wafer table WTB. The lower surface portion other than 21 Yc and 21 Yd has a clearance of about several m with respect to the seat plate 56 Y.

Further, as shown in FIG. 4A, the movable mirror 21Y is provided near the convex portions 21c and 21d of the mirror surface 21Ym to fix the movable mirror 21Y to the wafer table WTB. Screwed portions 21Ye and 21Yf are formed.

FIG. 4B shows an enlarged view of the vicinity of one of the screwed portions 21 Ye and 21 Yf of the screwed portions 21 Ye and 21 Yf as viewed from the Y direction to the + Y direction. FIG. 4C shows a cross-sectional view taken along line AA in FIG. 4B with the screw 72 removed from the state in FIG. 4B.

As can be seen from these figures, the screwed portion 21 Y e is from the mirror surface 21 Ym to Y A rectangular groove 6 2 a dug down to a position slightly closer to the + Y side in the axial center, and a round hole 6 penetrating from the inner bottom surface of the rectangular groove 6 2 a to the + Y side surface. 2b and a rectangular hole 6 2c 6 2d located on the ± X side of the round hole 6 2b and penetrating from the bottom surface inside the rectangular groove 6 2a to the + Y side surface. ing.

The other screwed portion 21Yf has the same configuration as the screwed portion 21Ye. That is, the screwed portion 21 Yf has a rectangular groove portion dug down from the mirror surface 21 Ym to the center portion in the Y-axis direction and slightly closer to the + Y side, and further + Y from the inside of the rectangular groove portion. It is formed by a round hole penetrating to the side and two rectangular holes.

The movable mirror 21 Y has a round hole 6 2 formed in the screwed portion 21 Ye (and 21 Yf) as typically shown by a screwed portion 21 Ye in FIG. 4C. b and the wafer table WTB are screwed to the wafer table WTB by screws 72 through screw holes 80 formed on one Y side of the wafer table WTB.

The reason why the screwing portions 21 Ye and 21 Yf are formed as described above is that when the movable mirror 21 Y is fixed to the side surface of the wafer table WTB by the screws 72, The force acts on the periphery of the screw 72, but the periphery of the screw 72 is formed as the screwed portions 21Ye and 21Yf as described above, and is lower than the other portions. Due to the rigidity, the stress of the screw 72 causes a stress concentration in the low-rigidity part (screwed part), and the mirror surface other than the screwed part 21 Ye and 21 Yf deforms to 21 Ym. This is because almost no occurrence occurs. Therefore, the flatness of the mirror surface 21Ym can be maintained high by forming the screwed portions 21Ye and 21Yf on the movable mirror 21Y.

Further, the above-described shape having a convex portion at a predetermined position as described above was adopted as movable mirror 21 Y because, even if the vibration accompanying the driving of wafer stage WST is transmitted to movable mirror 21 Y, movable mirror 2 1 The gas between Y and its fixed surface moves in the gap due to vibration, Alternatively, the vibration can be attenuated by the viscosity of the gas in order to escape from the gap.

Note that the other movable mirror 21X has the same configuration as the movable mirror 21Y.

That is, as shown in FIGS. 2A and 2B, the movable mirror 21 X is placed on a seat plate 56 X fixed near the + X end of the lower surface of the wafer table WTB, Like the movable mirror 21Y, the movable mirror 21X has two convex portions formed on the surfaces on the 1X side and the 1Z side, respectively. Then, the + X side surface of wafer table WTB and the upper surface (+ Z side surface) of seat plate 56X come into contact with each projection.

The movable mirror 21X is fixed to the wafer table WTB via a screw (not shown) formed from the + X side (mirror surface) of the movable mirror 21X to the rear surface thereof.

Also in this case, a few 〃 m (for example, m m) is excluded between the movable mirror 21 X and the wafer table WTB, and between the movable mirror 21 X and the seat plate 56 X except for a convex portion. ) Intervals.

The control system is mainly constituted by a main controller 20 in FIG. The main control unit 20 includes a so-called microcomputer (or workstation) including a CPU (central processing unit), a ROM (read only memory), a RAM (random access memory), and the like. Control and control the whole. Main controller 20 controls, for example, synchronous scanning of reticle R and wafer W, subbing of wafer W, and the like, for example, so that the exposure operation is performed appropriately.

Next, an exposure operation when the pattern of the reticle R is sequentially transferred to each shot area on the wafer W by the exposure apparatus 10 of the present embodiment configured as described above will be briefly described. It is assumed that a reticle microscope (not shown), a reference mark plate (not shown) on wafer table WTB, a reticle alignment using a wafer alignment system (not shown), baseline measurement of wafer alignment system, and Preparation work such as wafer alignment (EGA etc.) has been completed. I do.

The above-mentioned reticle alignment, baseline measurement, etc. are described in detail in, for example, Japanese Patent Application Laid-Open No. 7-176468 and U.S. Pat. Nos. 5,646,413 corresponding thereto. The EGA is disclosed in detail in Japanese Patent Application Laid-Open No. Sho 61-44429 and corresponding US Pat. Nos. 4,780,617. To the extent permitted by the national laws of the designated country or selected elected country specified in this international application, the disclosures in each of the above-mentioned publications and the corresponding U.S. patents are incorporated herein by reference to form a part thereof. .

First, main controller 20 starts relative scanning in the X-axis direction of reticle R and wafer W, ie, reticle stage RST and wafer stage WST. When both stages RST and WST reach their respective target scanning speeds and reach a constant speed synchronization state, the pattern area of reticle R starts to be illuminated by the ultraviolet pulse light from the illumination system IOP, and scanning exposure starts. . The relative scanning is performed by controlling the reticle driving unit 22 and the wafer stage driving unit 24 while monitoring the measured values of the wafer interferometer 23 and the reticle interferometer 16 described above. It is done.

Main control unit 20 determines, in particular during the above-described scanning exposure, that the moving speed Vr of reticle stage RS in the X-axis direction and the moving speed Vw of wafer stage WST in the X-axis direction are the projection magnification of projection optical system PL. (1X 4 times or 15 times) Performs synchronous control so that the speed ratio is maintained.

Then, different areas of the pattern area of the reticle R are sequentially illuminated with the ultraviolet pulse light, and the illumination of the entire pattern area is completed, thereby completing the scanning exposure of the first shot on the wafer W. Thereby, the pattern of the reticle R is reduced and transferred to the first shot via the projection optical system PL.

As described above, when the scanning exposure of the first shot is completed, the main controller 20 moves the wafer stage WST through the wafer stage driving unit 24 to the X and Y axes. In the direction, and is moved to the scanning start position (acceleration start position) for the exposure of the second shot.

Then, the operation of each unit is controlled by the main controller 20 in the same manner as described above, and the second shot on the wafer W is subjected to the same scanning exposure as described above.

In this manner, the scanning exposure of shots on the wafer W and the stepping operation between shots are repeatedly performed, and the pattern of the reticle R is sequentially transferred to all of the exposure target shots on the wafer W.

When the pattern transfer to all the shots to be exposed on the wafer W is completed, the wafer is replaced with the next wafer, and the alignment and the exposure operation are repeated as described above.

As described above, according to the exposure apparatus 10 of the present embodiment, when performing the above-described exposure operation, the wafer stage WST is driven by the linear motor, but the center of gravity of the wafer stage WST is Is set on the drive axis when driven in the X-axis direction, so that when the wafer stage WST is driven in the X-axis direction, unnecessary rotational moment does not act. Therefore, the occurrence of pitching (rotation about the Y-axis), shoring (rotation about the Z-axis), and the like in the wafer stage WST can be effectively suppressed. Position controllability can be improved.

In driving the wafer stage WST, in the present embodiment, the position of the wafer table WT is measured using the moving mirrors 21X and 21Y fixed to the wafer table WTB. Since the moving mirrors 21X and 21Y are fixed to the side of the wafer table WTB and the upper surface of the seat plates 56X and 56Y with a clearance of about several 〃m, Even if the WST vibrates with the drive and the vibration is transmitted to the movable mirrors 21 X and 21 Y, the gas existing between the movable mirrors 21 X and 21 Y and each fixed surface causes The vibrations of the moving mirrors 21X and 21Y are attenuated. This is the gas between the moving mirrors 21X and 21Y and each fixed surface. This is because when the material moves in the gap due to vibration or tries to get out of the gap, the vibration is attenuated by the viscosity of the gas. Therefore, since the vibration of the movable mirrors 21 X and 21 Y is suppressed as much as possible, the position control of the wafer stage WST (wafer table WTB) can be performed with high accuracy.

In addition, since the concave portion 46a for forming a void is formed on the bottom surface of the wafer stage main body 30 as well, due to the viscosity of the gas present in the void, the wafer is formed for the same reason as described above. Vibration of the entire stage can be suppressed. Therefore, it is possible to control the position of the wafer stage WST with high accuracy. Further, in the present embodiment, the wafer is moved using the wafer stage device 50 having high position control as described above. Therefore, especially in a scanning type exposure apparatus, the synchronization accuracy between the reticle and the wafer at the time of scanning exposure is improved. It has become possible to improve the transfer accuracy of the pattern onto the wafer, that is, the exposure accuracy.

In the above embodiment, in order to set the position of the center of gravity of the wafer stage on the drive shaft, the weight member fixed to the wafer stage body is not limited to the configuration shown in FIGS. 2A and 2B. For example, the shape, the number, the mass, the material, and the installation location (position) may be arbitrarily set, and at least one member (such as the bottom member 46) constituting the wafer stage main body may be partially convex. It may be processed so as to be a part so that fixing of the main member is unnecessary. Further, in the above embodiment, the weight member and the weight group are fixed to the wafer stage main body in order to set the position of the center of gravity of the wafer stage on the drive shaft. However, the present invention is not limited to this. It is not something that can be done. In other words, when adjusting the position of the center of gravity of the wafer stage, the material of at least one member constituting the wafer stage main body (movable part) is changed without external addition such as using a main member. That is, at least one member is made of a heavy material different from other members. For example, the bottom member as a part of the wafer stage body is changed to a high-density member such as alloy steel such as stainless steel, nigel alloy, molybdenum, dangsten, and their alloys. It is good also as changing.

At this time, it is preferable that one or a plurality of members constituting the wafer stage main body are all made of high-density members or the like, but only a part thereof may be made of high-density members or the like. Further, in the above embodiment, a part of the wafer stage main body (movable part) is made heavy by adding a weight member, for example, and the position of the center of gravity is set on the drive shaft. Conversely, a part of the wafer stage main body is made lighter (at least one member constituting the wafer stage main body is made lighter). For example, the wafer table WTB or the like has a honeycomb structure, or at least one member thereof. The center of gravity of the wafer stage body may be set on the drive shaft by using a lighter material different from other members. Here, the at least one member to be heavier or lighter may be any member constituting the wafer stage main body (movable part). Further, in the above embodiment, the mass Ms of the wafer stage WST (movable part) in the above equation (1) is partly, for example, the moving mirrors 21 X and 21 Y provided on the wafer table WTB and a reference (not shown). Although the weight includes a mark plate and the like, the wafer stage WST moves while holding the wafer W, and therefore preferably includes the mass of the wafer W.

In the above embodiment, a gap is provided between the movable mirror and the surface to be fixed by forming a convex portion on the movable mirror. However, the present invention is not limited to this. A convex portion may be formed on the side to which the movable mirror is fixed, such as the side of the table or the upper surface of the seat plate, or a separate member may be provided in the gap between the movable mirror and the fixed target surface. It may be fixed. The point is that the moving mirror should be fixed to the wafer stage (wafer table) with a gap between the moving mirror and the surface to be fixed.

Note that, in the above embodiment, a force that employs screwing as means for fixing the movable mirror to the wafer table is not limited to this. For example, an adhesive such as an adhesive May be fixed. In this case, It is not necessary to provide a low-rigidity portion as in the above embodiment.

In the above-described embodiment, the case where the vibration mirror is provided on the wafer stage in which the center of gravity is set on the drive shaft is provided with the movable mirror and the concave portion is formed on the bottom surface of the bottom member of the wafer stage has been described. The present invention is not limited to this. That is, the stage device of the present invention has a first feature of setting the position of the center of gravity on the drive shaft, a second feature of providing a gap between the movable mirror and the surface to be fixed, and a wafer stage (bottom member). Among the third features in which the concave portion is provided on the bottom surface, a stage combining any two features or a stage having any one feature may be used. In particular, in a wafer stage having at least one of the first and third features without having the second feature, a part of the movable stage, such as a wafer table WTB, is not provided without the movable mirrors 21X and 21Y. The end surface may be mirror-finished to be a reflection surface. In the above embodiment, the case where the stage device of the present invention is used for a wafer stage for driving a wafer has been described. However, the present invention is not limited to this, and the stage device of the present invention can be used as a reticle stage. is there.

In the above embodiment, the case where a linear motor is used as the driving device for driving the stage has been described. However, the present invention is not limited to this. For example, a driving device of a feed screw system is used as the driving device. It is also possible. Although not shown in FIG. 1, the exposure apparatus according to the above-described embodiment uses a different vibration-proof mechanism for each of the wafer stage (stage base 40) and the projection optical system PL. Although the exposure apparatus is configured to hold the exposure apparatus, it goes without saying that the exposure apparatus of the present invention is not limited to this. For example, the column holding the projection optical system PL and the stage base may be supported by the same vibration isolation mechanism. In this case, the stage base may be suspended from the column described above. Alternatively, another anti-vibration mechanism may be provided on the stage base, and the column may be supported via the anti-vibration mechanism. That is, the body structure of the exposure apparatus is not limited to the one shown in FIG. 1, but may have any configuration. Further, in the exposure apparatus of the above-described embodiment, at least one of the wafer stage and the reticle stage has a reaction frame mechanism that arranges a part of the driving device on an installation surface different from the base on which the stage is arranged, or a counter mass. Therefore, a countermass mechanism that cancels the reaction force generated when the stage moves may be adopted, a twin-stage system in which two stages are arranged, or a twin-holder system that can hold two objects (reticle or wafer). Etc. may be adopted.

In the above embodiment, F ₂ laser as the light source, it is assumed to use a pulsed laser light source in the vacuum ultraviolet region, such as A r F excimer one The is not limited to this, a mercury lamp, K r F excimer one laser light source (output wavelength 2 4 8 nm) may be used ultraviolet or far ultraviolet light source or a r ₂ other vacuum ultraviolet light source such as a laser light source (output wavelength 1 2 6 nm), such as. Further, for example, not only the laser light output from each of the above light sources as vacuum ultraviolet light, but also a single-wavelength laser light in the infrared or visible range emitted from a DFB semiconductor laser or a fiber-laser, for example, erbium (E r) (or both erbium and ytterbium (Y b)) may be amplified by a fiber-coupled amplifier, and a harmonic converted to ultraviolet light using a nonlinear optical crystal may be used. Furthermore, not only ultraviolet light but also X-rays (including EUV light) or charged particle beams such as electron beams and ion beams may be used as the illumination light IL for exposure.

In the above embodiment, the case where the present invention is applied to a scanning exposure apparatus such as a step-and-scan method has been described, but the scope of the present invention is, of course, not limited to this. That is, the present invention can be suitably applied to a step-and-repeat type reduction projection exposure apparatus.

In addition, the illumination optical system and projection optical system composed of multiple lenses are incorporated in the main body of the exposure apparatus, optical adjustment is performed, and a reticle stage consisting of many mechanical parts and a wafer stage are attached to the main body of the exposure apparatus to perform wiring and Connect the piping and By performing comprehensive adjustment (electrical adjustment, operation check, etc.), the exposure apparatus of the above embodiment can be manufactured. It is desirable to manufacture the exposure equipment in a clean room where the temperature and cleanliness are controlled.

In the above embodiment, the case where the present invention is applied to an exposure apparatus for manufacturing a semiconductor is described. However, the present invention is not limited to this. For example, the present invention is applied to a liquid crystal display device for transferring a liquid crystal display element pattern to a square glass plate. The present invention can be widely applied to an exposure apparatus, a display apparatus such as a plasma display and an organic EL, an exposure apparatus for manufacturing a thin-film magnetic head, an image sensor, a micromachine, a DNA chip, and the like.

In addition to micro devices such as semiconductor devices, glass substrates or silicon wafers are used to manufacture reticles or masks used in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a substrate. Here, a transmissive reticle is generally used in an exposure apparatus using DUV (far ultraviolet) light or VUV (vacuum ultraviolet) light, and quartz glass, quartz glass doped with fluorine, and the like are used as a reticle substrate. Fluorite, magnesium fluoride, quartz or the like is used.

The semiconductor device includes a step of designing the function and performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and a step of forming a reticle pattern by the exposure apparatus of the above embodiment. It is manufactured through the steps of transferring to a wafer, device assembling steps (including dicing, bonding, and packaging processes) and inspection steps. Hereinafter, this device manufacturing method will be described in detail.

《Device manufacturing method》

FIG. 5 shows a flowchart of an example of manufacturing devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). As shown in FIG. 5, first, in step 201 (design step), a function / performance design of a device (for example, a circuit design of a semiconductor device) is performed. A pattern is designed to realize the function. Subsequently, in step 202 (mask manufacturing step), a mask on which the designed circuit pattern is formed is manufactured. On the other hand, in step 203 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

Next, in step 204 (wafer processing step), using the mask and wafer prepared in steps 201 to 203, an actual circuit is formed on the wafer by lithography technology or the like as described later. Etc. are formed. Next, in step 205 (device assembling step), device assembling is performed using the wafer processed in step 204. Step 205 includes, as necessary, processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation).

Finally, in step 206 (inspection step), inspections such as an operation confirmation test and a durability test of the device created in step 205 are performed. After these steps, the device is completed and shipped.

FIG. 6 shows a detailed flow example of the above step 204 in the semiconductor device. In FIG. 6, in step 2 11 (oxidation step), the surface of the wafer is oxidized. In step 212 (CVD step), an insulating film is formed on the wafer surface. In step 2 13 (electrode formation step), electrodes are formed on the wafer by vapor deposition. In step 2 14 (ion implantation step), ions are implanted into the wafer. Each of the above-mentioned steps 21 1 to 21 4 constitutes a pre-processing step of each stage of wafer processing, and is selected and executed according to a necessary process in each stage.

In each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step 215 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step 2 16 (exposure step), the exposure apparatus and its The circuit pattern of the mask is transferred to the wafer by the exposure method described above. Next, in step 2 17 (development step), the exposed wafer is developed, and

In 18 (etching step), the exposed members other than the portion where the resist remains are removed by etching. Then, in step 219 (resist removing step), unnecessary resist after etching is removed.

By repeating these pre-processing and post-processing steps, multiple circuit patterns are formed on the wafer.

When the device manufacturing method of the present embodiment described above is used, the exposure apparatus of the above embodiment is used in the exposure step (step 2 16), so that the reticle as the first object is placed on the wafer as the second object. The pattern can be transferred with high precision, and as a result, the productivity (including the yield) of a highly integrated device can be improved. Industrial applicability

As described above, the first to third stage devices of the present invention are suitable for driving a stage with good posture stability and position controllability. Further, the exposure apparatus of the present invention is suitable for transferring a circuit pattern onto an object. Further, the device manufacturing method of the present invention is suitable for producing a highly integrated device.

Claims

The scope of the claims

1. a stage on which the object is placed;

And a driving device for driving the stage in at least a predetermined one axis direction. The position of the center of gravity of the stage is set on a driving axis when the driving device drives the stage in at least the predetermined one axis direction. A stage device characterized in that:

2. The stage device according to claim 1,

The stage device, wherein the driving device drives the stage in the predetermined one axis direction and another one axis direction orthogonal to the predetermined one axis direction in a moving plane.

3. The stage device according to claim 1,

The stage device, wherein the driving device is a linear motor.

4. The stage device according to claim 1,

The stage includes a table that holds the object, and a stage body that supports the table.

The stage apparatus, wherein the setting of the position of the center of gravity on the drive shaft is performed by adjusting the position of the center of gravity of the stage main body.

5. The stage device according to claim 4,

A stage apparatus further comprising a weight member for adjusting the position of the center of gravity attached to the stage body.

6. The stage device according to claim 4, A stage apparatus wherein the adjustment of the position of the center of gravity of the stage main body is realized by using a high-density member as a part of the stage main body.

7. The stage device according to claim 6,

The apparatus further includes a static gas pressure bearing that floats and supports the stage main body and the table via a predetermined clearance with respect to a guide surface serving as a movement reference of the stage,

The stage device according to claim 1, wherein the partial member is a bottom member provided with the static gas pressure bearing.

8. The stage device according to claim 7,

A stage device, wherein a concave portion having a predetermined depth is formed on a bottom surface of the bottom member.

9. The stage apparatus according to claim 1,

The position of the stage is measured by an interferometer,

A stage further comprising a movable mirror for the interferometer fixed to the stage at at least two points with a gap formed between the stage and the stage.

10. A stage on which an object is placed and which is levitated and supported via a predetermined clearance with respect to a guide surface serving as a movement reference;

A driving device for driving the stage in at least one predetermined axial direction along the guide surface;

A recess having a predetermined depth is formed on the bottom surface of the bottom member constituting the stage. A stage device.

11. The stage device according to claim 10, wherein

The position of the stage is measured by an interferometer,

1 2. In the stage device according to claim 11,

At least two contact portions that contact the stage and a non-contact portion that does not contact the stage are set on a portion of the movable mirror that faces the stage. apparatus.

13. The stage apparatus according to claim 12,

The stage device, wherein the contact portion is a convex portion provided on the stage facing surface of the movable mirror.

14. The stage device according to claim 12,

A stage, wherein the movable mirror is screwed to the stage at the contact portion, and a portion around a screwing position of the mirror has lower rigidity than other portions. apparatus.

15. The stage apparatus according to claim 10,

A stage apparatus, wherein the position of the center of gravity of the stage is set on a drive shaft of the stage.

16. A stage where the object is placed and its position is measured by an interferometer;

And a movable mirror for the interferometer fixed to the stage at at least two points in a state where a gap is formed between the stage and the stage.

17. The stage device according to claim 16,

18. The stage device according to claim 17,

1 9. The stage device according to claim 17,

20. The stage apparatus according to claim 16,

The stage apparatus, wherein the position of the center of gravity of the stage is set on a drive shaft of the stage.

21. An exposure apparatus for transferring a pattern formed on a first object onto a second object,

The stage device according to any one of claims 1 to 20, wherein An exposure apparatus provided as at least one drive unit for the second object.

22. A device manufacturing method including a lithographic process,

22. A device manufacturing method, wherein the pattern of a first object is transferred onto a second object using the exposure apparatus according to claim 21 in the lithographic process.