WO2002084720A3 - Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif - Google Patents

Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif Download PDF

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Publication number
WO2002084720A3
WO2002084720A3 PCT/JP2002/003318 JP0203318W WO02084720A3 WO 2002084720 A3 WO2002084720 A3 WO 2002084720A3 JP 0203318 W JP0203318 W JP 0203318W WO 02084720 A3 WO02084720 A3 WO 02084720A3
Authority
WO
WIPO (PCT)
Prior art keywords
main body
supported
unit
body unit
points
Prior art date
Application number
PCT/JP2002/003318
Other languages
English (en)
French (fr)
Other versions
WO2002084720A2 (fr
Inventor
Kenji Nishi
Original Assignee
Nippon Kogaku Kk
Kenji Nishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk, Kenji Nishi filed Critical Nippon Kogaku Kk
Priority to AU2002246319A priority Critical patent/AU2002246319A1/en
Publication of WO2002084720A2 publication Critical patent/WO2002084720A2/ja
Priority to US10/310,036 priority patent/US6853443B2/en
Publication of WO2002084720A3 publication Critical patent/WO2002084720A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
PCT/JP2002/003318 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif WO2002084720A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002246319A AU2002246319A1 (en) 2001-04-06 2002-04-03 Exposure device and substrate processing system and device producing method
US10/310,036 US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001108334A JP2002305140A (ja) 2001-04-06 2001-04-06 露光装置及び基板処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/310,036 Continuation US6853443B2 (en) 2001-04-06 2002-12-05 Exposure apparatus, substrate processing system, and device manufacturing method

Publications (2)

Publication Number Publication Date
WO2002084720A2 WO2002084720A2 (fr) 2002-10-24
WO2002084720A3 true WO2002084720A3 (fr) 2007-10-25

Family

ID=18960494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/003318 WO2002084720A2 (fr) 2001-04-06 2002-04-03 Dispositif d'exposition, systeme de traitement de substrat et procede permettant de produire ce dispositif

Country Status (6)

Country Link
US (1) US6853443B2 (ja)
JP (1) JP2002305140A (ja)
KR (1) KR20030011296A (ja)
CN (1) CN1636268A (ja)
AU (1) AU2002246319A1 (ja)
WO (1) WO2002084720A2 (ja)

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KR20150036786A (ko) 2003-04-09 2015-04-07 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
SG194264A1 (en) 2003-04-11 2013-11-29 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
WO2004107416A1 (ja) 2003-05-27 2004-12-09 Nikon Corporation 露光装置及びデバイスの製造方法
DE602004024302D1 (de) * 2003-06-06 2010-01-07 Nippon Kogaku Kk Halteeinrichtung für optische elemente, objektivtubus, belichtungseinrichtung und herstellungsverfahren für bauelemente
TWI515769B (zh) * 2003-06-19 2016-01-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
EP1643543B1 (en) * 2003-07-09 2010-11-24 Nikon Corporation Exposure apparatus and method for manufacturing device
JP4835155B2 (ja) 2003-07-09 2011-12-14 株式会社ニコン 露光装置及びデバイス製造方法
WO2005010962A1 (ja) * 2003-07-28 2005-02-03 Nikon Corporation 露光装置及びデバイス製造方法、並びに露光装置の制御方法
TWI474132B (zh) 2003-10-28 2015-02-21 尼康股份有限公司 照明光學裝置、投影曝光裝置、曝光方法以及元件製造方法
TWI612338B (zh) 2003-11-20 2018-01-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
US8854602B2 (en) * 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
WO2005064382A1 (ja) * 2003-12-25 2005-07-14 Nikon Corporation 光学素子の保持装置、鏡筒、露光装置、及びデバイスの製造方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
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JP4710308B2 (ja) * 2004-10-29 2011-06-29 株式会社ニコン レチクル搬送装置、露光装置、及びレチクルの搬送方法
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KR101504765B1 (ko) 2005-05-12 2015-03-30 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
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US20070030462A1 (en) * 2005-08-03 2007-02-08 Nikon Corporation Low spring constant, pneumatic suspension with vacuum chamber, air bearing, active force compensation, and sectioned vacuum chambers
US8953148B2 (en) * 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
JP2007294594A (ja) * 2006-04-24 2007-11-08 Nsk Ltd 露光装置及び露光方法
US7936443B2 (en) * 2006-05-09 2011-05-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080073596A1 (en) * 2006-08-24 2008-03-27 Asml Netherlands B.V. Lithographic apparatus and method
US20080094592A1 (en) * 2006-08-31 2008-04-24 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US8908144B2 (en) * 2006-09-27 2014-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100779372B1 (ko) * 2006-12-06 2007-11-23 동부일렉트로닉스 주식회사 진동측정수단이 구비된 노광장치 및 진동저감방법
EP2998983B1 (en) * 2006-12-27 2018-03-21 Nikon Corporation Stage apparatus, exposure apparatus and device fabricating method
JP5013906B2 (ja) * 2007-03-05 2012-08-29 キヤノン株式会社 光学素子保持装置
KR100866447B1 (ko) * 2007-06-19 2008-10-31 주식회사 동부하이텍 반도체 장치 제조용 노광 장치
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5188135B2 (ja) * 2007-10-05 2013-04-24 キヤノン株式会社 露光装置及びデバイス製造方法
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179330A1 (en) 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
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US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
NL1036167A1 (nl) 2007-11-20 2009-05-25 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
CN101910817B (zh) 2008-05-28 2016-03-09 株式会社尼康 照明光学系统、曝光装置以及器件制造方法
EP2128703A1 (en) 2008-05-28 2009-12-02 ASML Netherlands BV Lithographic Apparatus and a Method of Operating the Apparatus
NL1036957A1 (nl) * 2008-06-13 2009-12-15 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5126076B2 (ja) * 2009-01-08 2013-01-23 富士通株式会社 位置測定装置、成膜方法並びに成膜プログラム及び成膜装置
JP5534910B2 (ja) * 2009-04-23 2014-07-02 ギガフォトン株式会社 極端紫外光源装置
DE102009026187A1 (de) * 2009-07-16 2011-01-27 Hseb Dresden Gmbh Inspektionssystem
EP2454031A4 (en) * 2009-07-17 2014-08-20 Diversitech Equipment And Sales 1984 Ltd EXTRACTOR SYSTEM WITH AUTOMATIC DUSTER POSITIONING
JP5655793B2 (ja) * 2009-12-18 2015-01-21 株式会社ニコン 基板処理装置のメンテナンス方法および安全装置
EP2447777B1 (en) * 2010-10-27 2019-08-07 ASML Netherlands BV Lithographic apparatus for transferring pattern from patterning device onto substrate, and damping method
CN102955368B (zh) * 2011-08-22 2015-09-30 上海微电子装备有限公司 一种步进光刻设备及光刻曝光方法
TWI463593B (zh) * 2012-01-18 2014-12-01 Himax Tech Ltd 對位系統
US9242313B2 (en) * 2012-07-30 2016-01-26 General Electric Company Welding furnace and viewport assembly
JP5398040B1 (ja) * 2012-08-03 2014-01-29 Ｎｅｃアクセステクニカ株式会社 画像読取装置および集光部材
JP6254180B2 (ja) * 2012-11-30 2017-12-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 振動が制御される基板ハンドリングロボット、システム及び方法
US9368378B2 (en) * 2013-12-31 2016-06-14 Sophia Wen Semiconductor wafer cleaning system
US9176070B2 (en) * 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
SG11201609642QA (en) 2014-06-16 2016-12-29 Asml Netherlands Bv Lithographic apparatus, method of transferring a substrate and device manufacturing method
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EP3285281A4 (en) * 2015-04-17 2019-05-08 Nikon Corporation EXPOSURE SYSTEM
JP7360308B2 (ja) * 2019-11-25 2023-10-12 キヤノン株式会社 露光装置、露光方法、および物品製造方法
CN111427148B (zh) * 2020-04-01 2022-02-22 北京航空航天大学 一种麦克斯韦力驱动的快速偏摆镜
CN117250832B (zh) * 2023-11-15 2024-02-23 福建安芯半导体科技有限公司 一种精密定位平台及光刻机

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JPH09297018A (ja) * 1996-05-07 1997-11-18 Nikon Corp 位置検出装置
WO2000014779A1 (fr) * 1998-09-03 2000-03-16 Nikon Corporation Appareil et procede d'exposition, dispositif et procede de production dudit appareil
JP2000206279A (ja) * 1999-01-11 2000-07-28 Canon Inc 位置決め装置、露光装置およびデバイス製造方法
JP2001023885A (ja) * 1999-07-08 2001-01-26 Nikon Corp 露光装置

Also Published As

Publication number Publication date
WO2002084720A2 (fr) 2002-10-24
JP2002305140A (ja) 2002-10-18
US20030117596A1 (en) 2003-06-26
AU2002246319A1 (en) 2002-10-28
US6853443B2 (en) 2005-02-08
KR20030011296A (ko) 2003-02-07
AU2002246319A8 (en) 2008-01-03
CN1636268A (zh) 2005-07-06

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